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Intel E8501 manual

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As regras impõem ao revendedor a obrigação de fornecer ao comprador o manual com o produto Intel E8501. A falta de manual ou informações incorretas fornecidas ao consumidor são a base de uma queixa por não conformidade do produto com o contrato. De acordo com a lei, pode anexar o manual em uma outra forma de que em papel, o que é frequentemente utilizado, anexando uma forma gráfica ou manual electrónicoIntel E8501 vídeos instrutivos para os usuários. A condição é uma forma legível e compreensível.

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A palavra vem do latim "Instructio" ou instruir. Portanto, no manual Intel E8501 você pode encontrar uma descrição das fases do processo. O objetivo do manual é instruir, facilitar o arranque, a utilização do equipamento ou a execução de determinadas tarefas. O manual é uma coleção de informações sobre o objeto / serviço, um guia.

Infelizmente, pequenos usuários tomam o tempo para ler o manual Intel E8501, e um bom manual não só permite conhecer uma série de funcionalidades adicionais do dispositivo, mas evita a formação da maioria das falhas.

Então, o que deve conter o manual perfeito?

Primeiro, o manual Intel E8501 deve conte:
- dados técnicos do dispositivo Intel E8501
- nome do fabricante e ano de fabricação do dispositivo Intel E8501
- instruções de utilização, regulação e manutenção do dispositivo Intel E8501
- sinais de segurança e certificados que comprovam a conformidade com as normas pertinentes

Por que você não ler manuais?

Normalmente, isso é devido à falta de tempo e à certeza quanto à funcionalidade específica do dispositivo adquirido. Infelizmente, a mesma ligação e o arranque Intel E8501 não são suficientes. O manual contém uma série de orientações sobre funcionalidades específicas, a segurança, os métodos de manutenção (mesmo sobre produtos que devem ser usados), possíveis defeitos Intel E8501 e formas de resolver problemas comuns durante o uso. No final, no manual podemos encontrar as coordenadas do serviço Intel na ausência da eficácia das soluções propostas. Atualmente, muito apreciados são manuais na forma de animações interessantes e vídeos de instrução que de uma forma melhor do que o o folheto falam ao usuário. Este tipo de manual é a chance que o usuário percorrer todo o vídeo instrutivo, sem ignorar especificações e descrições técnicas complicadas Intel E8501, como para a versão papel.

Por que ler manuais?

Primeiro de tudo, contem a resposta sobre a construção, as possibilidades do dispositivo Intel E8501, uso dos acessórios individuais e uma gama de informações para desfrutar plenamente todos os recursos e facilidades.

Após a compra bem sucedida de um equipamento / dispositivo, é bom ter um momento para se familiarizar com cada parte do manual Intel E8501. Atualmente, são cuidadosamente preparados e traduzidos para sejam não só compreensíveis para os usuários, mas para cumprir a sua função básica de informação

Índice do manual

  • Página 1

    Intel ® E8500/E8501 Chip set North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Guide May 2006 Document Number 306749-002[...]

  • Página 2

    2 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide INFORMA TION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHER WISE, T O ANY INTELLECTUAL PROPERTY RI GH TS IS GRANTED BY THIS DOCUMENT . EXCEPT AS P ROVIDED IN INTEL[...]

  • Página 3

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 3 Bridge (XMB) Thermal/Mechani cal Desig n Guide Contents 1 Introduction... ................ ................ ............. ................ ................ ................. ................ ........ 7 1.1 Design Flow ............ ... .............. .............. ..............[...]

  • Página 4

    4 Intel ® E8500/8501 Chipset North Bridge (NB) and eXtern al Memory Bridge (XMB) Thermal/Me chanical Design Guide 8.5 XMB Heatsink Thermal Solution Assembly ....... ......... .............. .............. .............. ............. 38 8.5.1 Heatsink Orientation ............. .............. ................. .............. .............. ........[...]

  • Página 5

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 5 Bridge (XMB) Thermal/Mechani cal Desig n Guide Tables 3-1 Intel ® E8500 Chipset NB Thermal Specifications ... ...................... .............. .............. .........15 3-2 Intel ® E8501 Chipset NB Thermal Specifications ... ...................... .............. ........[...]

  • Página 6

    6 Intel ® E8500/8501 Chipset North Bridge (NB) and eXtern al Memory Bridge (XMB) Thermal/Me chanical Design Guide Revision History § Document Number Revision Number Description Date 306749 001 • Initial release of this document March 2005 306749 002 • Added Intel® E8501 chipset specific information and re-titled document • Added updated In[...]

  • Página 7

    Intel ® E8500 /E8501Chipset North Bridg e (NB) an d eXternal Memory 7 Bridge (XMB) Thermal/Mechani cal Desig n Guide 1 Introduction As the complexity of computer systems increases, so do the power dissi patio n requirements. Care must be taken to ensure that the additional power is properl y dissipat ed. T ypical methods to improve heat dissipatio[...]

  • Página 8

    Introduction 8 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 001239 1.2 Definition of T erms BGA Ball grid array . A package type, defined by a resin-fiber substrate, onto which a die is mounted, bonded and encapsulated in m old ing com pound. The primary electrical interface is an [...]

  • Página 9

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 9 Bridge (XMB) Thermal/Mechani cal Desig n Guide Introduction XMB Intel ® E8500/E8501 chipset eXternal Mem ory Bridge Component. The chipset component that bridges th e IMI and DDR interfaces. 1.3 Reference Document s The reader of this specification sh ould also be fami liar wit[...]

  • Página 10

    Introduction 10 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide[...]

  • Página 11

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 11 Bridge (XMB) Thermal/Mechani cal Desig n Guide 2 Packaging T echnology The E8500/E8501 chi psets consist of four i ndi vidual components: the NB, the XMB, the Intel ® 6700PXH 64-bit PCI Hub and the I/O control l er hu b (ICH5R). The E8500/E8501 chipset NB component use a 42.5 [...]

  • Página 12

    Packaging T e chnology 12 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide NOTES: 1. All dimensions are in millimeter s. 2. All dimensions and tolerances confor m to ANSI Y14.5M-1994. Figure 2-3. NB Package Dimensions (Botto m View) 42.5 + 0.05 11 25 23 21 19 17 15 13 9 7 5 3 12 7 2 9 [...]

  • Página 13

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 13 Bridge (XMB) Thermal/Mechani cal Desig n Guide Packaging T e ch no lo gy Figure 2-4. XMB Package Dimensions (T op View) Figure 2- 5. XMB Package Dimensions ( Side View) XMB Die Die Keepout Area Handling Exclusion Area 37.50mm . 27.50mm. 23.50mm. 37.50mm . 27.50mm . 23.50mm . 14[...]

  • Página 14

    Packaging T e chnology 14 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 2.1 Package Mechanical Requirement s The E8500/E8501c chipset NB package has an IHS and the XMB package has an exposed bare die which is capable of sustaining a maximum static no rm al load of 15-lbf. The packag[...]

  • Página 15

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 15 Bridge (XMB) Thermal/Mechani cal Desig n Guide 3 Thermal Specifications 3.1 Thermal Design Power (TDP) Analysis indicates that real applications are unlikely t o cause the E8500/E8501 ch ipset NB/XMB components to co nsume maximum power dissipation for sustained time periods. T[...]

  • Página 16

    Thermal Specifications 16 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide NOTE: 1. These specifications are based on si lico n characterization, however, they may be updated as further data becomes available. § T able 3-2. Intel ® E8501 Chip set NB Thermal S pecifications Parameter [...]

  • Página 17

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 17 Bridge (XMB) Thermal/Mechani cal Desig n Guide 4 Thermal Simulation Intel provides thermal simulatio n mod els of the E8500/E8501 chipset NB/XM B compo nents and associated user's guides to aid system designers in simulating, analyzing, and optim izi ng their thermal solut[...]

  • Página 18

    Thermal Simulation 18 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide[...]

  • Página 19

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 19 Bridge (XMB) Thermal/Mechani cal Desig n Guide 5 Thermal Metrology The system designer must make temperature measurements to accura tely determine the thermal performance of the system. Intel has established gu idelines for proper tech niques to measure the NB/XMB die temperatu[...]

  • Página 20

    Thermal Metrolo gy 20 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 001240 NOTE: Not to scale. 001321 NOTE: Not to scale. Figure 5-1. Thermal Solution De cision Flowchart Figure 5-2. Zero Degree Angle Att ach Heatsink Modifications Figure 5-3. Zero Degree Angle Att ach Methodology ([...]

  • Página 21

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 21 Bridge (XMB) Thermal/Mechani cal Desig n Guide Thermal Metrology 5.2 Power Simulation Sof tware The power simulation software is a utility designed to dissipate the thermal design power on an E8500/E8501 chipset NB compon ent or XMB comp onent when used in conjunction with the [...]

  • Página 22

    Thermal Metrolo gy 22 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide[...]

  • Página 23

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 23 Bridge (XMB) Thermal/Mechani cal Desig n Guide 6 NB Reference Thermal Solution #1 Intel has developed two different reference thermal solu tions designed to meet th e cooling needs of the E8500/E8501 chipset NB com ponent under oper ating environmen ts and specifications define[...]

  • Página 24

    NB Reference Thermal Solution #1 24 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 6.3 Mechanical Design Envelope While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on t[...]

  • Página 25

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 25 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #1 6.4 Board-Level Component s Keepout Dimensions The location of hole pattern and keepout zones fo r the reference thermal solution are shown in Figure 6-3 . Figure 6-2. First NB Reference Heat sink V[...]

  • Página 26

    NB Reference Thermal Solution #1 26 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 6.5 First NB Heat sink Thermal Solution Assembly The reference thermal solution for the chipset NB component is a passive extruded heatsink with thermal interface. It is attached to the bo ard by using[...]

  • Página 27

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 27 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #1 6.5.1 Heat s ink Orientation Since this solution is based on a unidirectional heatsin k, mean airflo w direction must be aligned with the direction of the heatsink fins. 6.5.2 Extruded Heat sink Pro[...]

  • Página 28

    NB Reference Thermal Solution #1 28 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide the thermal resistance of the Chomeric s THERMFLOW T710 TIM is shown in Ta b l e 6 - 1 The heatsink clip provides enough pressu re for the TIM to achieve a thermal conductivity of 0.17 ° Ci n c h 2 /W[...]

  • Página 29

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 29 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #1 6.6 Reliability Guidelines Each motherboard, heatsink a nd attach combination may vary the mechanical loading of the component. Based on the end user envi ronment, the user should define th e approp[...]

  • Página 30

    NB Reference Thermal Solution #1 30 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide[...]

  • Página 31

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 31 Bridge (XMB) Thermal/Mechani cal Desig n Guide 7 NB Reference Thermal Solution #2 Intel has developed two different reference thermal solu tions designed to meet th e cooling needs of the E8500/E8501 chipset NB com ponent under oper ating environmen ts and specifications define[...]

  • Página 32

    NB Reference Thermal Solution #2 32 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 7.3 Mechanical Design Envelope While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on t[...]

  • Página 33

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 33 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #2 7.4 Board-Level Component s Keepout Dimensions Please refer to Section 6.4 for detail. 7.5 Second NB Heat sink Thermal Solution Assembly The reference thermal solution for the chipset NB component i[...]

  • Página 34

    NB Reference Thermal Solution #2 34 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 7.5.1 Heat sink Orient ation Since this solution is based on a unidirectional heatsink , mean airflow direction must be align ed with the direction of the heatsink fins. 7.5.2 Extruded Heat sink Profil[...]

  • Página 35

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 35 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #2 7.6 Reliability Guidelines Please refer to Section 6.6 for detail. §[...]

  • Página 36

    NB Reference Thermal Solution #2 36 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide[...]

  • Página 37

    Intel ® E8500 /E8501 Chipset North Bridge (NB) and eXternal Memo ry 37 Bridge (XMB) Thermal/Mechani cal Desig n Guide 8 XMB Reference Thermal Solution Intel has developed one different reference thermal solution designed to meet the cooling needs of the E8500/E8501 chipset XMB component under operating environments and specifi cations defined in t[...]

  • Página 38

    XMB Reference Thermal Solution 38 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 8.3 Mechanical Design Envelope While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width and depth constr aints typically placed on the[...]

  • Página 39

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 39 Bridge (XMB) Thermal/Mechani cal Desig n Guide XMB Reference Thermal Solution Full mechanical drawings of the therm al soluti on assembly and the heatsink are provided in Appendix B . Appendix A contains vendor information fo r each thermal solution component. 8.5.1 Heat s ink [...]

  • Página 40

    XMB Reference Thermal Solution 40 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 8.5.2 Extruded Heat sink Profiles The reference XMB thermal solution uses an extruded heatsink for cooling the chipset XMB. Figure 8-5 shows the heatsink profile. Appendix A lists a sup plier for this ex[...]

  • Página 41

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 41 Bridge (XMB) Thermal/Mechani cal Desig n Guide XMB Reference Thermal Solution 8.6 Reliability Guidelines Please refer to Section 6.6 for details. § Figure 8-5. XMB Heat sink Extrusion Profile[...]

  • Página 42

    XMB Reference Thermal Solution 42 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide[...]

  • Página 43

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 43 Bridge (XMB) Thermal/Mechani cal Desig n Guide A Thermal Solution Component Suppliers T able A-1. NB Heat sink Thermal Solution #1 Part Intel Part Number Sup plier (Part Numb er) Contact Information Heatsink Assembly includes: • Unidirectional Fin Heatsink • Thermal Interfa[...]

  • Página 44

    Thermal Solution Compone nt Suppliers 44 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide T able A-2. NB Heat sink Thermal Solution #2 Part Intel Part Number Supplier (Part Number) Contact Information Heatsink Assembly includes: • Unidirectional Fin Heatsink • Thermal Interface Mat[...]

  • Página 45

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 45 Bridge (XMB) Thermal/Mechani cal Desig n Guide Thermal Solution Component Suppliers NOTE: The enabled components may not be currently available from all suppl iers. Contact the supplier directly to verify time of component availability . § T able A-3. XMB Heat sink Thermal Sol[...]

  • Página 46

    Thermal Solution Compone nt Suppliers 46 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide[...]

  • Página 47

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 47 Bridge (XMB) Thermal/Mechani cal Desig n Guide B Mechanical Drawings T able B-1. Mechanic al Drawing List Drawing Description Figure Number NB Heatsink #1 Assembly Drawing Figure B-1 NB Heatsink #1 Drawing Figure B-2 NB Heatsink #2 Assembly Drawing Figure B-3 NB Heatsink #2 Dra[...]

  • Página 48

    Mechanical Drawings 48 Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Gu ide Figure B-1. NB Heatsink #1 Assembl y Drawing[...]

  • Página 49

    Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory 49 Bridge (XMB) Thermal/Me chanical Design Guide Mechanical Drawings Figure B-2. NB Heat sink #1 Drawing[...]

  • Página 50

    Mechanical Drawings 50 Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Gu ide Figure B-3. NB Heatsink #2 Assembl y Drawing[...]

  • Página 51

    Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory 51 Bridge (XMB) Thermal/Me chanical Design Guide Mechanical Drawings Figure B-4. NB Heat sink #2 Drawing[...]

  • Página 52

    Mechanical Drawings 52 Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Gu ide Figure B-5. XMB Heatsink Assembly Drawing[...]

  • Página 53

    Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory 53 Bridge (XMB) Thermal/Me chanical Design Guide Mechanical Drawings Figure B-6. XMB Heat sink Drawing[...]

  • Página 54

    Mechanical Drawings 54 Intel ® E8500/E8501 Chi pset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mech anical Design Guide §[...]