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Intel E8501 manuale d’uso - BKManuals
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Intel E8501 manuale d’uso

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Le regole impongono al rivenditore l'obbligo di fornire all'acquirente, insieme alle merci, il manuale d’uso Intel E8501. La mancanza del manuale d’uso o le informazioni errate fornite al consumatore sono la base di una denuncia in caso di inosservanza del dispositivo con il contratto. Secondo la legge, l’inclusione del manuale d’uso in una forma diversa da quella cartacea è permessa, che viene spesso utilizzato recentemente, includendo una forma grafica o elettronica Intel E8501 o video didattici per gli utenti. La condizione è il suo carattere leggibile e comprensibile.

Che cosa è il manuale d’uso?

La parola deriva dal latino "instructio", cioè organizzare. Così, il manuale d’uso Intel E8501 descrive le fasi del procedimento. Lo scopo del manuale d’uso è istruire, facilitare lo avviamento, l'uso di attrezzature o l’esecuzione di determinate azioni. Il manuale è una raccolta di informazioni sull'oggetto/servizio, un suggerimento.

Purtroppo, pochi utenti prendono il tempo di leggere il manuale d’uso, e un buono manuale non solo permette di conoscere una serie di funzionalità aggiuntive del dispositivo acquistato, ma anche evitare la maggioranza dei guasti.

Quindi cosa dovrebbe contenere il manuale perfetto?

Innanzitutto, il manuale d’uso Intel E8501 dovrebbe contenere:
- informazioni sui dati tecnici del dispositivo Intel E8501
- nome del fabbricante e anno di fabbricazione Intel E8501
- istruzioni per l'uso, la regolazione e la manutenzione delle attrezzature Intel E8501
- segnaletica di sicurezza e certificati che confermano la conformità con le norme pertinenti

Perché non leggiamo i manuali d’uso?

Generalmente questo è dovuto alla mancanza di tempo e certezza per quanto riguarda la funzionalità specifica delle attrezzature acquistate. Purtroppo, la connessione e l’avvio Intel E8501 non sono sufficienti. Questo manuale contiene una serie di linee guida per funzionalità specifiche, la sicurezza, metodi di manutenzione (anche i mezzi che dovrebbero essere usati), eventuali difetti Intel E8501 e modi per risolvere i problemi più comuni durante l'uso. Infine, il manuale contiene le coordinate del servizio Intel in assenza dell'efficacia delle soluzioni proposte. Attualmente, i manuali d’uso sotto forma di animazioni interessanti e video didattici che sono migliori che la brochure suscitano un interesse considerevole. Questo tipo di manuale permette all'utente di visualizzare tutto il video didattico senza saltare le specifiche e complicate descrizioni tecniche Intel E8501, come nel caso della versione cartacea.

Perché leggere il manuale d’uso?

Prima di tutto, contiene la risposta sulla struttura, le possibilità del dispositivo Intel E8501, l'uso di vari accessori ed una serie di informazioni per sfruttare totalmente tutte le caratteristiche e servizi.

Dopo l'acquisto di successo di attrezzature/dispositivo, prendere un momento per familiarizzare con tutte le parti del manuale d'uso Intel E8501. Attualmente, sono preparati con cura e tradotti per essere comprensibili non solo per gli utenti, ma per svolgere la loro funzione di base di informazioni e di aiuto.

Sommario del manuale d’uso

  • Pagina 1

    Intel ® E8500/E8501 Chip set North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Guide May 2006 Document Number 306749-002[...]

  • Pagina 2

    2 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide INFORMA TION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHER WISE, T O ANY INTELLECTUAL PROPERTY RI GH TS IS GRANTED BY THIS DOCUMENT . EXCEPT AS P ROVIDED IN INTEL[...]

  • Pagina 3

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 3 Bridge (XMB) Thermal/Mechani cal Desig n Guide Contents 1 Introduction... ................ ................ ............. ................ ................ ................. ................ ........ 7 1.1 Design Flow ............ ... .............. .............. ..............[...]

  • Pagina 4

    4 Intel ® E8500/8501 Chipset North Bridge (NB) and eXtern al Memory Bridge (XMB) Thermal/Me chanical Design Guide 8.5 XMB Heatsink Thermal Solution Assembly ....... ......... .............. .............. .............. ............. 38 8.5.1 Heatsink Orientation ............. .............. ................. .............. .............. ........[...]

  • Pagina 5

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 5 Bridge (XMB) Thermal/Mechani cal Desig n Guide Tables 3-1 Intel ® E8500 Chipset NB Thermal Specifications ... ...................... .............. .............. .........15 3-2 Intel ® E8501 Chipset NB Thermal Specifications ... ...................... .............. ........[...]

  • Pagina 6

    6 Intel ® E8500/8501 Chipset North Bridge (NB) and eXtern al Memory Bridge (XMB) Thermal/Me chanical Design Guide Revision History § Document Number Revision Number Description Date 306749 001 • Initial release of this document March 2005 306749 002 • Added Intel® E8501 chipset specific information and re-titled document • Added updated In[...]

  • Pagina 7

    Intel ® E8500 /E8501Chipset North Bridg e (NB) an d eXternal Memory 7 Bridge (XMB) Thermal/Mechani cal Desig n Guide 1 Introduction As the complexity of computer systems increases, so do the power dissi patio n requirements. Care must be taken to ensure that the additional power is properl y dissipat ed. T ypical methods to improve heat dissipatio[...]

  • Pagina 8

    Introduction 8 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 001239 1.2 Definition of T erms BGA Ball grid array . A package type, defined by a resin-fiber substrate, onto which a die is mounted, bonded and encapsulated in m old ing com pound. The primary electrical interface is an [...]

  • Pagina 9

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 9 Bridge (XMB) Thermal/Mechani cal Desig n Guide Introduction XMB Intel ® E8500/E8501 chipset eXternal Mem ory Bridge Component. The chipset component that bridges th e IMI and DDR interfaces. 1.3 Reference Document s The reader of this specification sh ould also be fami liar wit[...]

  • Pagina 10

    Introduction 10 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide[...]

  • Pagina 11

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 11 Bridge (XMB) Thermal/Mechani cal Desig n Guide 2 Packaging T echnology The E8500/E8501 chi psets consist of four i ndi vidual components: the NB, the XMB, the Intel ® 6700PXH 64-bit PCI Hub and the I/O control l er hu b (ICH5R). The E8500/E8501 chipset NB component use a 42.5 [...]

  • Pagina 12

    Packaging T e chnology 12 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide NOTES: 1. All dimensions are in millimeter s. 2. All dimensions and tolerances confor m to ANSI Y14.5M-1994. Figure 2-3. NB Package Dimensions (Botto m View) 42.5 + 0.05 11 25 23 21 19 17 15 13 9 7 5 3 12 7 2 9 [...]

  • Pagina 13

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 13 Bridge (XMB) Thermal/Mechani cal Desig n Guide Packaging T e ch no lo gy Figure 2-4. XMB Package Dimensions (T op View) Figure 2- 5. XMB Package Dimensions ( Side View) XMB Die Die Keepout Area Handling Exclusion Area 37.50mm . 27.50mm. 23.50mm. 37.50mm . 27.50mm . 23.50mm . 14[...]

  • Pagina 14

    Packaging T e chnology 14 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 2.1 Package Mechanical Requirement s The E8500/E8501c chipset NB package has an IHS and the XMB package has an exposed bare die which is capable of sustaining a maximum static no rm al load of 15-lbf. The packag[...]

  • Pagina 15

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 15 Bridge (XMB) Thermal/Mechani cal Desig n Guide 3 Thermal Specifications 3.1 Thermal Design Power (TDP) Analysis indicates that real applications are unlikely t o cause the E8500/E8501 ch ipset NB/XMB components to co nsume maximum power dissipation for sustained time periods. T[...]

  • Pagina 16

    Thermal Specifications 16 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide NOTE: 1. These specifications are based on si lico n characterization, however, they may be updated as further data becomes available. § T able 3-2. Intel ® E8501 Chip set NB Thermal S pecifications Parameter [...]

  • Pagina 17

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 17 Bridge (XMB) Thermal/Mechani cal Desig n Guide 4 Thermal Simulation Intel provides thermal simulatio n mod els of the E8500/E8501 chipset NB/XM B compo nents and associated user's guides to aid system designers in simulating, analyzing, and optim izi ng their thermal solut[...]

  • Pagina 18

    Thermal Simulation 18 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide[...]

  • Pagina 19

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 19 Bridge (XMB) Thermal/Mechani cal Desig n Guide 5 Thermal Metrology The system designer must make temperature measurements to accura tely determine the thermal performance of the system. Intel has established gu idelines for proper tech niques to measure the NB/XMB die temperatu[...]

  • Pagina 20

    Thermal Metrolo gy 20 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 001240 NOTE: Not to scale. 001321 NOTE: Not to scale. Figure 5-1. Thermal Solution De cision Flowchart Figure 5-2. Zero Degree Angle Att ach Heatsink Modifications Figure 5-3. Zero Degree Angle Att ach Methodology ([...]

  • Pagina 21

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 21 Bridge (XMB) Thermal/Mechani cal Desig n Guide Thermal Metrology 5.2 Power Simulation Sof tware The power simulation software is a utility designed to dissipate the thermal design power on an E8500/E8501 chipset NB compon ent or XMB comp onent when used in conjunction with the [...]

  • Pagina 22

    Thermal Metrolo gy 22 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide[...]

  • Pagina 23

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 23 Bridge (XMB) Thermal/Mechani cal Desig n Guide 6 NB Reference Thermal Solution #1 Intel has developed two different reference thermal solu tions designed to meet th e cooling needs of the E8500/E8501 chipset NB com ponent under oper ating environmen ts and specifications define[...]

  • Pagina 24

    NB Reference Thermal Solution #1 24 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 6.3 Mechanical Design Envelope While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on t[...]

  • Pagina 25

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 25 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #1 6.4 Board-Level Component s Keepout Dimensions The location of hole pattern and keepout zones fo r the reference thermal solution are shown in Figure 6-3 . Figure 6-2. First NB Reference Heat sink V[...]

  • Pagina 26

    NB Reference Thermal Solution #1 26 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 6.5 First NB Heat sink Thermal Solution Assembly The reference thermal solution for the chipset NB component is a passive extruded heatsink with thermal interface. It is attached to the bo ard by using[...]

  • Pagina 27

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 27 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #1 6.5.1 Heat s ink Orientation Since this solution is based on a unidirectional heatsin k, mean airflo w direction must be aligned with the direction of the heatsink fins. 6.5.2 Extruded Heat sink Pro[...]

  • Pagina 28

    NB Reference Thermal Solution #1 28 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide the thermal resistance of the Chomeric s THERMFLOW T710 TIM is shown in Ta b l e 6 - 1 The heatsink clip provides enough pressu re for the TIM to achieve a thermal conductivity of 0.17 ° Ci n c h 2 /W[...]

  • Pagina 29

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 29 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #1 6.6 Reliability Guidelines Each motherboard, heatsink a nd attach combination may vary the mechanical loading of the component. Based on the end user envi ronment, the user should define th e approp[...]

  • Pagina 30

    NB Reference Thermal Solution #1 30 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide[...]

  • Pagina 31

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 31 Bridge (XMB) Thermal/Mechani cal Desig n Guide 7 NB Reference Thermal Solution #2 Intel has developed two different reference thermal solu tions designed to meet th e cooling needs of the E8500/E8501 chipset NB com ponent under oper ating environmen ts and specifications define[...]

  • Pagina 32

    NB Reference Thermal Solution #2 32 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 7.3 Mechanical Design Envelope While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on t[...]

  • Pagina 33

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 33 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #2 7.4 Board-Level Component s Keepout Dimensions Please refer to Section 6.4 for detail. 7.5 Second NB Heat sink Thermal Solution Assembly The reference thermal solution for the chipset NB component i[...]

  • Pagina 34

    NB Reference Thermal Solution #2 34 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 7.5.1 Heat sink Orient ation Since this solution is based on a unidirectional heatsink , mean airflow direction must be align ed with the direction of the heatsink fins. 7.5.2 Extruded Heat sink Profil[...]

  • Pagina 35

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 35 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #2 7.6 Reliability Guidelines Please refer to Section 6.6 for detail. §[...]

  • Pagina 36

    NB Reference Thermal Solution #2 36 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide[...]

  • Pagina 37

    Intel ® E8500 /E8501 Chipset North Bridge (NB) and eXternal Memo ry 37 Bridge (XMB) Thermal/Mechani cal Desig n Guide 8 XMB Reference Thermal Solution Intel has developed one different reference thermal solution designed to meet the cooling needs of the E8500/E8501 chipset XMB component under operating environments and specifi cations defined in t[...]

  • Pagina 38

    XMB Reference Thermal Solution 38 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 8.3 Mechanical Design Envelope While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width and depth constr aints typically placed on the[...]

  • Pagina 39

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 39 Bridge (XMB) Thermal/Mechani cal Desig n Guide XMB Reference Thermal Solution Full mechanical drawings of the therm al soluti on assembly and the heatsink are provided in Appendix B . Appendix A contains vendor information fo r each thermal solution component. 8.5.1 Heat s ink [...]

  • Pagina 40

    XMB Reference Thermal Solution 40 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 8.5.2 Extruded Heat sink Profiles The reference XMB thermal solution uses an extruded heatsink for cooling the chipset XMB. Figure 8-5 shows the heatsink profile. Appendix A lists a sup plier for this ex[...]

  • Pagina 41

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 41 Bridge (XMB) Thermal/Mechani cal Desig n Guide XMB Reference Thermal Solution 8.6 Reliability Guidelines Please refer to Section 6.6 for details. § Figure 8-5. XMB Heat sink Extrusion Profile[...]

  • Pagina 42

    XMB Reference Thermal Solution 42 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide[...]

  • Pagina 43

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 43 Bridge (XMB) Thermal/Mechani cal Desig n Guide A Thermal Solution Component Suppliers T able A-1. NB Heat sink Thermal Solution #1 Part Intel Part Number Sup plier (Part Numb er) Contact Information Heatsink Assembly includes: • Unidirectional Fin Heatsink • Thermal Interfa[...]

  • Pagina 44

    Thermal Solution Compone nt Suppliers 44 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide T able A-2. NB Heat sink Thermal Solution #2 Part Intel Part Number Supplier (Part Number) Contact Information Heatsink Assembly includes: • Unidirectional Fin Heatsink • Thermal Interface Mat[...]

  • Pagina 45

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 45 Bridge (XMB) Thermal/Mechani cal Desig n Guide Thermal Solution Component Suppliers NOTE: The enabled components may not be currently available from all suppl iers. Contact the supplier directly to verify time of component availability . § T able A-3. XMB Heat sink Thermal Sol[...]

  • Pagina 46

    Thermal Solution Compone nt Suppliers 46 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide[...]

  • Pagina 47

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 47 Bridge (XMB) Thermal/Mechani cal Desig n Guide B Mechanical Drawings T able B-1. Mechanic al Drawing List Drawing Description Figure Number NB Heatsink #1 Assembly Drawing Figure B-1 NB Heatsink #1 Drawing Figure B-2 NB Heatsink #2 Assembly Drawing Figure B-3 NB Heatsink #2 Dra[...]

  • Pagina 48

    Mechanical Drawings 48 Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Gu ide Figure B-1. NB Heatsink #1 Assembl y Drawing[...]

  • Pagina 49

    Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory 49 Bridge (XMB) Thermal/Me chanical Design Guide Mechanical Drawings Figure B-2. NB Heat sink #1 Drawing[...]

  • Pagina 50

    Mechanical Drawings 50 Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Gu ide Figure B-3. NB Heatsink #2 Assembl y Drawing[...]

  • Pagina 51

    Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory 51 Bridge (XMB) Thermal/Me chanical Design Guide Mechanical Drawings Figure B-4. NB Heat sink #2 Drawing[...]

  • Pagina 52

    Mechanical Drawings 52 Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Gu ide Figure B-5. XMB Heatsink Assembly Drawing[...]

  • Pagina 53

    Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory 53 Bridge (XMB) Thermal/Me chanical Design Guide Mechanical Drawings Figure B-6. XMB Heat sink Drawing[...]

  • Pagina 54

    Mechanical Drawings 54 Intel ® E8500/E8501 Chi pset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mech anical Design Guide §[...]