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AMD 1207 manual

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As regras impõem ao revendedor a obrigação de fornecer ao comprador o manual com o produto AMD 1207. A falta de manual ou informações incorretas fornecidas ao consumidor são a base de uma queixa por não conformidade do produto com o contrato. De acordo com a lei, pode anexar o manual em uma outra forma de que em papel, o que é frequentemente utilizado, anexando uma forma gráfica ou manual electrónicoAMD 1207 vídeos instrutivos para os usuários. A condição é uma forma legível e compreensível.

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A palavra vem do latim "Instructio" ou instruir. Portanto, no manual AMD 1207 você pode encontrar uma descrição das fases do processo. O objetivo do manual é instruir, facilitar o arranque, a utilização do equipamento ou a execução de determinadas tarefas. O manual é uma coleção de informações sobre o objeto / serviço, um guia.

Infelizmente, pequenos usuários tomam o tempo para ler o manual AMD 1207, e um bom manual não só permite conhecer uma série de funcionalidades adicionais do dispositivo, mas evita a formação da maioria das falhas.

Então, o que deve conter o manual perfeito?

Primeiro, o manual AMD 1207 deve conte:
- dados técnicos do dispositivo AMD 1207
- nome do fabricante e ano de fabricação do dispositivo AMD 1207
- instruções de utilização, regulação e manutenção do dispositivo AMD 1207
- sinais de segurança e certificados que comprovam a conformidade com as normas pertinentes

Por que você não ler manuais?

Normalmente, isso é devido à falta de tempo e à certeza quanto à funcionalidade específica do dispositivo adquirido. Infelizmente, a mesma ligação e o arranque AMD 1207 não são suficientes. O manual contém uma série de orientações sobre funcionalidades específicas, a segurança, os métodos de manutenção (mesmo sobre produtos que devem ser usados), possíveis defeitos AMD 1207 e formas de resolver problemas comuns durante o uso. No final, no manual podemos encontrar as coordenadas do serviço AMD na ausência da eficácia das soluções propostas. Atualmente, muito apreciados são manuais na forma de animações interessantes e vídeos de instrução que de uma forma melhor do que o o folheto falam ao usuário. Este tipo de manual é a chance que o usuário percorrer todo o vídeo instrutivo, sem ignorar especificações e descrições técnicas complicadas AMD 1207, como para a versão papel.

Por que ler manuais?

Primeiro de tudo, contem a resposta sobre a construção, as possibilidades do dispositivo AMD 1207, uso dos acessórios individuais e uma gama de informações para desfrutar plenamente todos os recursos e facilidades.

Após a compra bem sucedida de um equipamento / dispositivo, é bom ter um momento para se familiarizar com cada parte do manual AMD 1207. Atualmente, são cuidadosamente preparados e traduzidos para sejam não só compreensíveis para os usuários, mas para cumprir a sua função básica de informação

Índice do manual

  • Página 1

    Advanced Micro Devices Thermal Design Guide for Socket F (1207) Processors 32800 Publicat ion # 3.00 Revision: August 200 6 Issue Date:[...]

  • Página 2

    © 2005 Advanced Micr o Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no represen tations or warranties with respect to the accuracy or completeness of the contents of th is publication and reserves the right to make changes to specificat[...]

  • Página 3

    Contents 3 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Contents Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Chapter 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . [...]

  • Página 4

    4 Content s 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors 5.3.4 Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 5.3.5 Fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 5.3.[...]

  • Página 5

    List of Figures 5 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 List of Figur es Figure 1. The 1207-Pin Socket . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 2. Motherboard Component Height Restrictions for Platforms Using the AMD PIB Thermal Solut[...]

  • Página 6

    6 List of Figures 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 26. Socket F (1207) 2U-4P Socket Outline and So cket Window . . . . . . . . . . . . . . . . . . . . . 56 Figure 27. Socket F (1207) 2U-4P Heat Sink Height Restri ction Zone . . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F (1207[...]

  • Página 7

    List of T ables 7 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 List of T ables Table 1. Mechanical and Thermal Specifications for Socket F (1207) Processors . . . . . . . . . . . . 13 Table 2. Thermal Solution Design Requirements for Platforms Using Socket F (1207) PIB processors . . . . . . . . . . . . . . . . .[...]

  • Página 8

    8 List of T ables 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors[...]

  • Página 9

    Revision History 9 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Revision History Date Revision Descript ion July 2006 3.00 Initial Public release.[...]

  • Página 10

    10 Revision History 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors[...]

  • Página 11

    Chapter 1 Introduction 1 1 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Chapter 1 Intr oduction This document specifies performance requirements for the design of thermal and mechanical solutions for socket F (1207) processors, uti lizing AMD 64-bit technology . Detailed drawings, descriptions, and design targets[...]

  • Página 12

    12 Introduction Chapter 1 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors[...]

  • Página 13

    Chapter 2 Processor Thermal Solutions 13 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Chapter 2 Pr ocessor Thermal Solutions This chapter describes the thermal solutions fo r systems based on socket F (1207) processors. 2.1 Pr ocessor Specifications The objective of thermal solutions is to maintain the proc essor[...]

  • Página 14

    14 Processor Thermal Solutions Chapter 2 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors 2.2 Socket Description Figure 1 shows a three-dimensional view of th e 1207-pin socket used with socket F (1207) processors. This socket is base d on LGA (land-grid array) technology . The LGA socket has 35 pads x 35 pads on a 1[...]

  • Página 15

    Chapter 3 Thermal Design of Platfo rms Using the AMD Processor-In-a- Box (PIB) Thermal Solution 15 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Chapter 3 Thermal Design of Platforms Using the AMD Pr ocessor -In-a-Box (PIB) Thermal Solution This chapter describes the motherboard component height restrictions, ther[...]

  • Página 16

    16 Thermal Design of Platforms Using the AMD Processor-In-a- Box (PIB) Thermal Solution Chapter 3 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Depending on the system features and layout, more space around the socket ma y be available for the thermal solution than is shown in Figure 2 on pa ge 15. This space perm[...]

  • Página 17

    Chapter 3 Thermal Design of Platfo rms Using the AMD Processor-In-a- Box (PIB) Thermal Solution 17 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 T a ble 3 lists the parts used in the thermal reference design for the AMD PIB thermal solution for socket F (1207) processors. Figure 3 on page 18 shows an exploded view[...]

  • Página 18

    18 Thermal Design of Platforms Using the AMD Processor-In-a- Box (PIB) Thermal Solution Chapter 3 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 3. Exploded V iew of Thermal Solution AMD PIB Platforms based on Socket F (1207) Processors 3.3.1 Backplate Assembly The backplate is mounted on the ba ckside of th[...]

  • Página 19

    Chapter 3 Thermal Design of Platfo rms Using the AMD Processor-In-a- Box (PIB) Thermal Solution 19 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Note: Do not cut entir ely thr ough the center rib. Doin g so will compr omise the stiffness of the backplate. The plate uses two PennEngineering (PEM) sta ndof fs that s[...]

  • Página 20

    20 Thermal Design of Platforms Using the AMD Processor-In-a- Box (PIB) Thermal Solution Chapter 3 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors[...]

  • Página 21

    Chapter 4 Thermal Design of Custom 1U-2P Systems 21 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 3.00 August 2006 Chapter 4 Thermal Design of Custom 1U-2P Systems This chapter describes the motherboard compone nt-height restrictions, thermal-solution design requirements, sample heat sinks, and attachment methods for custom 1[...]

  • Página 22

    22 Thermal Design of Custom 1U-2P Systems Chapter 4 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Depending on the system features and layout, more space around the socket ma y be available for the thermal solution than is shown in Figure 4 on pa ge 21. This space permits heat sink designs with better thermal perf[...]

  • Página 23

    Chapter 4 Thermal Design of Custom 1U-2P Systems 23 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 3.00 August 2006 Figure 5 on page 24 shows an explode d view of the components used in the thermal reference design solution for custom 1U-2P systems ba sed on socket F (1207) processors. T able 5. Components for the Pr ocessor T[...]

  • Página 24

    24 Thermal Design of Custom 1U-2P Systems Chapter 4 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 5. Exploded V iew of Thermal Solution for Custom 1U-2P Systems The following sections describe the mechanical requirements of the components shown in Figure 5. 4.3.1 Backplate Assembly For details on the backpl[...]

  • Página 25

    Chapter 4 Thermal Design of Custom 1U-2P Systems 25 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 3.00 August 2006 Lifting the heat sink away from the processor can re sult in damage to the processor contact pads, the socket contacts, or the socket solder-ball joints . Ma intaining the spring force is important for the life o[...]

  • Página 26

    26 Thermal Design of Custom 1U-2P Systems Chapter 4 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Other fan and heat sink co mbinations may yield adequate ther mal performance. The system designer must ensure that the thermal solution provides requ ired cooling for the proce ssor for the given system layout and fl[...]

  • Página 27

    Chapter 4 Thermal Design of Custom 1U-2P Systems 27 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 3.00 August 2006 4.3.5 Thermal Interface Material The heat sink contacts the top surface of the processor package and utilizes the thermal interface material between the processor lid and the heat sink. AMD recommends us ing a hi[...]

  • Página 28

    28 Thermal Design of Custom 1U-2P Systems Chapter 4 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors[...]

  • Página 29

    Chapter 5 Thermal Design of Custom 2U-4P Systems 29 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 August 2006 Chapter 5 Thermal Design of Custom 2U-4P Systems This chapter describes the motherboard compone nt-height restrictions, thermal-solution design requirements, sample heat sinks, and attachment methods for custom 2U-4P [...]

  • Página 30

    30 Thermal Design of Custom 2U-4P Systems Chapter 5 32800 Rev . 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Depending on the system features and layout, more space around the socket ma y be available for the thermal solution than is shown in Figure 8 on pa ge 29. This space permits heat sink designs with better thermal perf[...]

  • Página 31

    Chapter 5 Thermal Design of Custom 2U-4P Systems 31 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 August 2006 Figure 9 on page 32 shows an explode d view of the components used in the thermal reference design solution for custom 2U-4P systems ba sed on socket F (1207) processors. T able 8. Components for the Pr ocessor Therma[...]

  • Página 32

    32 Thermal Design of Custom 2U-4P Systems Chapter 5 32800 Rev . 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 9. Exploded V iew of Thermal Solution for Custom 2U-4P System Based on Socket F (1207) Processors The following sections describe the mechanical requirements of the components shown in Figure 9. 5.3.1 Backplate[...]

  • Página 33

    Chapter 5 Thermal Design of Custom 2U-4P Systems 33 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 August 2006 5.3.2 Spring Clip The spring clip is designed to apply 75 lbs of for ce to the center of the heat sink. This force is necessary to help prevent the heat sink from lifting of f of the package during shock or vibration-[...]

  • Página 34

    34 Thermal Design of Custom 2U-4P Systems Chapter 5 32800 Rev . 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors the center to 2.5 mm at the edges. The heat sink al so has three heat pipes soldered to the base and connected to the top of the fin stack to improve fin ef ficiency . This design provides optimum heat spreading perfo[...]

  • Página 35

    Chapter 5 Thermal Design of Custom 2U-4P Systems 35 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 August 2006 on flow simulations of an AMD reference 2U system, the flow-through of the heat sink is approximately 18 CFM. Figure 1 1 sh ows that this flow rate corres ponds to a case-to-ambient thermal resistance of 0.22°C/W . T[...]

  • Página 36

    36 Thermal Design of Custom 2U-4P Systems Chapter 5 32800 Rev . 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors[...]

  • Página 37

    Appendix A Keep-Out Drawings for Platforms Us ing the PIB Thermal Solution for Socket F (1207) Processors 37 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Appendix A Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Pr ocessors Appendix A contains detaile d recommended keep-out dra[...]

  • Página 38

    38 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors Appendix A 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 12. Socket F (1207) PIB Boar d Component Height Restrictions 7 3 . 8 1 1 9 . 9 1 D C B A A B C D 1 2 3 4 5 6 7 8 8 7 5 6 4 3 2 1 S E C I V E D O R C I M D[...]

  • Página 39

    Appendix A Keep-Out Drawings for Platforms Us ing the PIB Thermal Solution for Socket F (1207) Processors 39 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 13. Socket F (1207) PIB Mounting Ho les, Contact Pads, and No-Routing Zone x 2 0 5 4 . 0 0. 000 0. 00 x 2 2 3 . 5 2 2 4 . 1 1 1. 441 36. 59 0. 787 0. 39 [...]

  • Página 40

    40 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors Appendix A 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 14. Socket F (1207) PIB So cket Outline and Socket Window 0.000 0.00 0.724 18. 3 9 2.189 55. 6 1 0 0 0 . 0 0 0 . 0 19. 9 1 0. 784 8 5 4 . 0 3 6 . 1 1 6 3 [...]

  • Página 41

    Appendix A Keep-Out Drawings for Platforms Us ing the PIB Thermal Solution for Socket F (1207) Processors 41 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 15. Socket F (1207) PIB Heat Sink Height Restriction Zone x 2 4 1 . 0 5 4 7 9 . 1 0. 000 0.00 1. 44 1 2 x 36. 59 1. 26 5 2 x 32. 13 1. 08 6 2 x 27. 59 2.[...]

  • Página 42

    42 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors Appendix A 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 16. Socket F (1207) PIB Board No-Through-Hole Keep-Out 7 9 4 . 0 3 6 . 2 1 0. 000 0. 00 1. 318 33. 47 2. 885 73. 29 0 0 0 . 0 0 0 . 0 4 4 9 . 1 7 3 . 9 4 [...]

  • Página 43

    Appendix A Keep-Out Drawings for Platforms Us ing the PIB Thermal Solution for Socket F (1207) Processors 43 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 17. Socket F (1207) PIB Board Bottom Side Keep-Out x 2 0 7 5 . 1 0. 000 0. 39 7 2 x 0. 966 24. 54 10. 09 0. 00 1. 318 33. 47 0. 233 1. 33 5 2 x 33. 91 1.[...]

  • Página 44

    44 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors Appendix A 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors[...]

  • Página 45

    Appendix B Keep-Out Drawings for Cu stom 1U-2P Systems Based on the Socket F (1207) Processor 45 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Appendix B Keep-Out Drawings for Custom 1U- 2P Systems Based on the Socket F (1207) Pr ocessor Appendix B contains detailed recommended keep-out drawings for processo r hea[...]

  • Página 46

    46 Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor Appendix B 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 18. Socket F (1207) 1U-2P B oard Component Height Restrictions 0 0 . 3 4 . d n u o r g o t e i T ; t h g i e h t n e n o p m o c x a M ] ' ' 0 0 0 . 0 [ 0 0[...]

  • Página 47

    Appendix B Keep-Out Drawings for Cu stom 1U-2P Systems Based on the Socket F (1207) Processor 47 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 19. Socket F (1207) 1U-2P Mounting Ho les, Contact Pads, and No-Routing Zone x 2 2 3 . 5 2 7 9 9 . 0 0. 000 0. 00 0. 96 6 2 x 24. 54 2. 53 4 2 x 0 0 0 . 0 7 3 . 6 4 [...]

  • Página 48

    48 Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor Appendix B 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 20. Socket F (1207) 1U-2P So cket Outline and Socket Window 19.9 1 0.784 0 0 0 . 0 0 0 . 0 8 5 4 . 0 3 6 . 1 1 0.000 0.00 1 8 9 . 1 3 3 . 0 5 0.724 18. 39 2.189 55. 6[...]

  • Página 49

    Appendix B Keep-Out Drawings for Cu stom 1U-2P Systems Based on the Socket F (1207) Processor 49 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 21. Socket F (1207) 1U-2P He at Sink Height Restriction Zone 7 2 8 . 0 0 0 . 1 2 0.000 0. 00 2. 83 4 2 x 0 0 0 . 0 0 0 . 0 71. 98 1. 26 6 2 x 1.681 42. 71 3.249 82. [...]

  • Página 50

    50 Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor Appendix B 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 22. Socket F (1207) 1U-2P Board No-Through-Hole Keep-Out 6 7 5 . 0 3 6 . 4 1 0. 000 0. 00 1. 598 40 .59 3. 166 80 .41 0 0 0 . 0 0 0 . 0 2 2 0 . 2 7 3 . 1 5 . s t n e [...]

  • Página 51

    Appendix B Keep-Out Drawings for Cu stom 1U-2P Systems Based on the Socket F (1207) Processor 51 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 23. Socket F (1207) 1U -2P Backplate Contact Zone 5. 9 1 2 x 0. 233 0. 000 0. 00 1. 598 40.59 3. 166 80.41 1. 266 32.16 2. 834 71.98 0 0 0 . 0 0 0 . 0 6 7 5 . 0 3 6 [...]

  • Página 52

    52 Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor Appendix B 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors[...]

  • Página 53

    Appendix C Keep-Out Drawings for Cu stom 2U-4P Systems Based on the Socket F (1207) Processor 53 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Appendix C Keep-Out Drawings for Custom 2U- 4P Systems Based on the Socket F (1207) Pr ocessor Appendix C contains detailed recomm ended keep out drawings for pr ocessor he[...]

  • Página 54

    54 Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor Appendix C 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 24. Socket F (1207) 2U-4P B oard Component Height Restrictions 0 0 . 3 4 4 2 . 5 1 D C B A A B C D 1 2 3 4 5 6 7 8 8 7 5 6 4 3 2 1 S E C I V E D O R C I M D E C N A V[...]

  • Página 55

    Appendix C Keep-Out Drawings for Cu stom 2U-4P Systems Based on the Socket F (1207) Processor 55 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 25. Socket F (1207) 2U-4P Mounting Ho les, Contact Pads, and No-Routing Zone 3 2 .1 6 1 .2 6 6 0. 000 0. 00 0. 96 6 2 x 1. 866 47.40 24. 54 2. 53 4 2 x 64. 36 x 2 0 [...]

  • Página 56

    56 Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor Appendix C 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 26. Socket F (1207) 2U-4P So cket Outline and Socket Window 1 9 .9 1 0 .7 8 4 0. 000 0.00 0. 724 18. 39 1. 520 38. 61 2. 189 55. 61 0 0 0 . 0 0 0 . 0 8 5 4 . 0 3 6 . [...]

  • Página 57

    Appendix C Keep-Out Drawings for Cu stom 2U-4P Systems Based on the Socket F (1207) Processor 57 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 27. Socket F (1207) 2U-4P He at Sink Height Restriction Zone 1.266 0. 000 0. 00 2.83 4 2 x 2.260 57.4 1 0. 693 17.59 0 0 0 . 0 0 0 . 0 7 2 6 . 0 2 9 . 5 1 71.98 2 x [...]

  • Página 58

    58 Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor Appendix C 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 28. Socket F (1207) 2U-4P Board No-Through-Hole Keep-Out 7 9 4 . 0 3 6 . 2 1 0. 000 0.00 1. 598 40.59 3. 166 80.41 0 0 0 . 0 0 0 . 0 4 4 9 . 1 7 3 . 9 4 D C B A A B C[...]

  • Página 59

    Appendix C Keep-Out Drawings for Cu stom 2U-4P Systems Based on the Socket F (1207) Processor 59 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 29. Socket F (1207) 2U -4P Backplate Contact Zone 3 2 1 . 0 0.000 0.00 1.598 40. 59 x 2 3.166 80. 41 0 0 0 . 0 0 0 . 0 6 6 5 . 0 7 3 . 4 1 7 9 4 . 0 3 6 . 2 1 1 8 8 [...]

  • Página 60

    60 Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor Appendix C 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors[...]

  • Página 61

    Appendix D Flow Simulation Result s for Custom 2U-4P Systems Based on Socket F (1207) Processors 61 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 August 2006 Appendix D Flow Simulation Results for Custom 2U-4P Systems Based on Socket F (1207) Pr ocessors Appendix D describes the flow simulation result s for 2U-4P systems base[...]

  • Página 62

    62 Flow Simulation Results for Custom 2U-4P Systems Based on Socket F (1207) Processors Appendix D 32800 Rev . 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 31. S treamline Plot of AM D Refer ence Custom 2U-4P System Thermal simulation of the 2U-4P system shown in Figure 30 on page 61 with the heat sink and fan describ[...]