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Intel 320028-001 manual

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Las leyes obligan al vendedor a entregarle al comprador, junto con el producto, el manual de instrucciones Intel 320028-001. La falta del manual o facilitar información incorrecta al consumidor constituyen una base de reclamación por no estar de acuerdo el producto con el contrato. Según la ley, está permitido adjuntar un manual de otra forma que no sea en papel, lo cual últimamente es bastante común y los fabricantes nos facilitan un manual gráfico, su versión electrónica Intel 320028-001 o vídeos de instrucciones para usuarios. La condición es que tenga una forma legible y entendible.

¿Qué es un manual de instrucciones?

El nombre proviene de la palabra latina “instructio”, es decir, ordenar. Por lo tanto, en un manual Intel 320028-001 se puede encontrar la descripción de las etapas de actuación. El propósito de un manual es enseñar, facilitar el encendido o el uso de un dispositivo o la realización de acciones concretas. Un manual de instrucciones también es una fuente de información acerca de un objeto o un servicio, es una pista.

Desafortunadamente pocos usuarios destinan su tiempo a leer manuales Intel 320028-001, sin embargo, un buen manual nos permite, no solo conocer una cantidad de funcionalidades adicionales del dispositivo comprado, sino también evitar la mayoría de fallos.

Entonces, ¿qué debe contener el manual de instrucciones perfecto?

Sobre todo, un manual de instrucciones Intel 320028-001 debe contener:
- información acerca de las especificaciones técnicas del dispositivo Intel 320028-001
- nombre de fabricante y año de fabricación del dispositivo Intel 320028-001
- condiciones de uso, configuración y mantenimiento del dispositivo Intel 320028-001
- marcas de seguridad y certificados que confirmen su concordancia con determinadas normativas

¿Por qué no leemos los manuales de instrucciones?

Normalmente es por la falta de tiempo y seguridad acerca de las funcionalidades determinadas de los dispositivos comprados. Desafortunadamente la conexión y el encendido de Intel 320028-001 no es suficiente. El manual de instrucciones siempre contiene una serie de indicaciones acerca de determinadas funcionalidades, normas de seguridad, consejos de mantenimiento (incluso qué productos usar), fallos eventuales de Intel 320028-001 y maneras de solucionar los problemas que puedan ocurrir durante su uso. Al final, en un manual se pueden encontrar los detalles de servicio técnico Intel en caso de que las soluciones propuestas no hayan funcionado. Actualmente gozan de éxito manuales de instrucciones en forma de animaciones interesantes o vídeo manuales que llegan al usuario mucho mejor que en forma de un folleto. Este tipo de manual ayuda a que el usuario vea el vídeo entero sin saltarse las especificaciones y las descripciones técnicas complicadas de Intel 320028-001, como se suele hacer teniendo una versión en papel.

¿Por qué vale la pena leer los manuales de instrucciones?

Sobre todo es en ellos donde encontraremos las respuestas acerca de la construcción, las posibilidades del dispositivo Intel 320028-001, el uso de determinados accesorios y una serie de informaciones que permiten aprovechar completamente sus funciones y comodidades.

Tras una compra exitosa de un equipo o un dispositivo, vale la pena dedicar un momento para familiarizarse con cada parte del manual Intel 320028-001. Actualmente se preparan y traducen con dedicación, para que no solo sean comprensibles para los usuarios, sino que también cumplan su función básica de información y ayuda.

Índice de manuales de instrucciones

  • Página 1

    Order Number: 320028-00 1 Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications Thermal Design Guide June 2008[...]

  • Página 2

    Intel® Core™ 2 Duo Mobile Processors on 45-nm process fo r Embedded Applications TDG June 2008 2 Order Number: 320028-001 INFORMA TION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL ’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUC TS, INTEL ASSUMES NO LIABILITY WHA TSOEVER, AND INTEL DISCLAIMS ANY [...]

  • Página 3

    Core™ 2 Duo Mobile Processors—Contents Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 3 Order Number: 320028-001 Contents 1.0 Introducti on ......... ........... ........ ........... .......... ........... .......... ........... .......... ........... ....... 6 1.1 Design Flow ......... ... .......[...]

  • Página 4

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 4 Figures—Core™ 2 Duo Mobile Processors Figures 1 Thermal Design P rocess ............ ........... .......... ........... .......... ............. ........... .......... ...... 7 2 Primary Side Keep Out Zone Requirements?[...]

  • Página 5

    Core™ 2 Duo Mobile Processors—Tables Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 5 Order Number: 320028-001 Revision History Date Revision Description June 2008 1.0 First Public release.[...]

  • Página 6

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 6 Introduction—Core™ 2 Duo Mobile Processors 1.0 Introduction The power dissipation of electronic components has risen along with the increase in complexity of computer systems. T o ensure quality , reliability , and perfo[...]

  • Página 7

    Core™ 2 Duo Mobile Processors—Introduction Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 7 Order Number: 320028-001 1.2 Definition of Terms Figure 1. Thermal Design Process Table 1. Definition of Terms (Sheet 1 of 2) Term Definition FCPGA Flip Chip Pin Grid Array . A pin grid ar ray packaging tec [...]

  • Página 8

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 8 Introduction—Core™ 2 Duo Mobile Processors 1.3 Reference Documents The reader of this specification should also be familiar with material and concepts presented in the following documents: • Intel® Core™2 Duo Proces[...]

  • Página 9

    Core™ 2 Duo Mobile Processors—Package Information Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 9 Order Number: 320028-001 2.0 Package Information The Intel® Core™2 Duo Processor (XE and SV) is av ailable in 478-pin Micro-FCPGA packages as well as 479-ball Micro-FCBGA packages. The Intel® Core[...]

  • Página 10

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 10 Thermal Specifications—Core™ 2 Duo Mobile Processors 3.0 Thermal Specifications 3.1 Thermal Design Power The Therm al Design P ower (TDP ) specification is listed in Ta b l e 2 . Heat transfer through the micro- FCBGA, [...]

  • Página 11

    Core™ 2 Duo Mobile Processors—Mechanical Specifications Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 11 Order Number: 320028-001 4.0 Mechanical Specifications 4.1 Package Mechanical Requirements 4.1.1 Die Pressure/Load Upper Limit From a die mechanical integrity standpoint, the m axi mum allowabl[...]

  • Página 12

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 12 Mechanical Specifications—Core™ 2 Duo Mobile Processors Notes: 1. Dimension in millimeters [inches]. Figure 2. Primary Side Keep Out Zone Requ ire ments— Micro-FCPGA[...]

  • Página 13

    Core™ 2 Duo Mobile Processors—Mechanical Specifications Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 13 Order Number: 320028-001 Notes: 1. Dimension in millimeters [inches]. Figure 3. Primary Side Keep Out Zone Requirements— Micr o-FCBGA[...]

  • Página 14

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 14 Mechanical Specifications—Core™ 2 Duo Mobile Processors Notes: 1. Dimension in millimeters [inches]. Figure 4. Se condar y Side Ke ep Out Zone Requirements[...]

  • Página 15

    Core™ 2 Duo Mobile Processors—Thermal Solution Requirements Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 15 Order Number: 320028-001 5.0 Thermal Solution Requirements 5.1 Thermal Solution Characterization The thermal characterization par ameter , Ψ (“psi”), is used to characterize thermal so[...]

  • Página 16

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 16 Thermal Solution Requirements—Core™ 2 Duo Mobile Processors 5.1.1 Calculating the Required Th ermal Performance for the Intel ® Core™2 Duo processor Overall thermal performance, Ψ JA, is then defined using the therm[...]

  • Página 17

    Core™ 2 Duo Mobile Processors—Thermal Solution Requirements Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 17 Order Number: 320028-001 It is evident from the above calculations that a reduction in the local ambient temperature can have a significant effect on the junction-to-ambient thermal resista[...]

  • Página 18

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 18 Reference Thermal Solutions—Core™ 2 Duo Mobile Processors 6.0 Reference Thermal Solutions Intel has developed reference thermal solutions de signed to meet the cooling needs of embedded form factor applications. This ch[...]

  • Página 19

    Core™ 2 Duo Mobile Processors—Reference Thermal Solutions Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 19 Order Number: 320028-001 6.2 Keep Out Zon e Requir ements The keep out zone requirements on the PC B to use this heatsink are detailed in Appendix B, “Mechanical Drawings” . Because it ex[...]

  • Página 20

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 20 Reference Thermal Solutions—Core™ 2 Duo Mobile Processors 6.4.1 Keep Out Zone Re qui r emen ts The keep out zone requ irements on the PCB to use this heatsink are detailed in Appendix B, “Mechanical Drawin gs” . Bec[...]

  • Página 21

    Core™ 2 Duo Mobile Processors—Reference Thermal Solutions Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 21 Order Number: 320028-001 6.5 Compact PCI Reference Heatsink The cPCI reference thermal solution is shown in Figure 10 . The maximum heatsink height is constrained to 8.7 mm. The heatsink uses[...]

  • Página 22

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 22 Reference Thermal Solutions—Core™ 2 Duo Mobile Processors 6.5.1 Keep Out Zone Re qui r emen ts The keep out zone requ irements on the PCB to use this heatsink are detailed in Appendix B, “Mechanical Drawin gs. ” Bec[...]

  • Página 23

    Core™ 2 Duo Mobile Processors—Reference Thermal Solutions Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 23 Order Number: 320028-001 Thermal interface materials have thermal impedance (resistance) that will increase as the material degrades ov er time. It is important for thermal solu tion designer[...]

  • Página 24

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 24 Thermal Metrology—Core™ 2 Duo Mobile Processors 7.0 Thermal Metrology The system designer must make temper ature measurements to accur ately determine the performance of the thermal solution. V alidation of the processo[...]

  • Página 25

    Core™ 2 Duo Mobile Proce ssors—Thermal Metrology Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 25 Order Number: 320028-001 It is worthwhile to determine the local ambient te mperature in the chassis around the processor to understand the effect it may ha ve on the case temperature. T LA is best me[...]

  • Página 26

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 26 Thermal Metrology—Core™ 2 Duo Mobile Processors Note: Drawing not to scale. Figure 13. Measuring T LA with an Active Heatsink[...]

  • Página 27

    Core™ 2 Duo Mobile Proce ssors—Thermal Metrology Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 27 Order Number: 320028-001 Note: Dra wing not to scale. Figure 14. Measuring T LA with a Passive Heatsink[...]

  • Página 28

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 28 Reliability Guidelines—Core™ 2 Duo Mobile Processors 8.0 Reliability Guidelines Each motherboard, heatsink, and attach combin ation ma y vary the mechanical loading of the component. The user should carefully evaluate t[...]

  • Página 29

    Core™ 2 Duo Mobile Processors—Thermal Solution Component Suppliers Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 29 Order Number: 320028-001 Appendix A Thermal Solution Compo nent Suppliers These vendors and devices are listed by Intel as a convenience to Intel’ s gener al customer base. Intel d[...]

  • Página 30

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 30 Mechanical Drawings—Core™ 2 Duo Mobile Processors Appendix B Mechanical Drawings Ta b l e 6 lists the mechanical drawings included in this appendix. Table 6. Mechanical Drawings Description Figure Advanced T CA* Referen[...]

  • Página 31

    Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 31 Order Number: 320028-001 Figure 15. AdvancedTCA* Refer ence Heatsink PCB Keep Out Zone Requireme nts (Sheet 1 of 2)[...]

  • Página 32

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 32 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 16. AdvancedTCA* Refere nce Heatsink PCB Keep Out Zone Require ments (Sheet 2 of 2)[...]

  • Página 33

    Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 33 Order Number: 320028-001 Figure 17. AdvancedT CA* Reference Heatsink A ssembly[...]

  • Página 34

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 34 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 18. AdvancedTCA* Re ference Heatsink[...]

  • Página 35

    Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 35 Order Number: 320028-001 Figure 19. CompactPCI* Refer ence Heatsink PCB Keep O ut Zone Requirements (Sheet 1 of 2)[...]

  • Página 36

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 36 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 20. CompactPCI* R eference Heatsink PCB Keep Out Zone Re quirements (She et 2 of 2)[...]

  • Página 37

    Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 37 Order Number: 320028-001 Figure 21. CompactPCI* Reference Heatsink Assembly[...]

  • Página 38

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 38 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 22. CompactPCI* R eference Heatsink[...]

  • Página 39

    Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 39 Order Number: 320028-001 Figure 23. 1U Reference He atsink PCB Keep Out Require ments (Sheet 1 of 2)[...]

  • Página 40

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 40 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 24. 1U Ref erence Heatsink PCB Keep Out Requirement s (Sheet 2 of 2)[...]

  • Página 41

    Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 41 Order Number: 320028-001 Figure 25. 1U Refe rence Heatsink Assembly[...]

  • Página 42

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 42 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 26. 1U Re fe rence Heatsink[...]