Sony MDS-SD1 manual

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Bom manual de uso

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Primeiro, o manual Sony MDS-SD1 deve conte:
- dados técnicos do dispositivo Sony MDS-SD1
- nome do fabricante e ano de fabricação do dispositivo Sony MDS-SD1
- instruções de utilização, regulação e manutenção do dispositivo Sony MDS-SD1
- sinais de segurança e certificados que comprovam a conformidade com as normas pertinentes

Por que você não ler manuais?

Normalmente, isso é devido à falta de tempo e à certeza quanto à funcionalidade específica do dispositivo adquirido. Infelizmente, a mesma ligação e o arranque Sony MDS-SD1 não são suficientes. O manual contém uma série de orientações sobre funcionalidades específicas, a segurança, os métodos de manutenção (mesmo sobre produtos que devem ser usados), possíveis defeitos Sony MDS-SD1 e formas de resolver problemas comuns durante o uso. No final, no manual podemos encontrar as coordenadas do serviço Sony na ausência da eficácia das soluções propostas. Atualmente, muito apreciados são manuais na forma de animações interessantes e vídeos de instrução que de uma forma melhor do que o o folheto falam ao usuário. Este tipo de manual é a chance que o usuário percorrer todo o vídeo instrutivo, sem ignorar especificações e descrições técnicas complicadas Sony MDS-SD1, como para a versão papel.

Por que ler manuais?

Primeiro de tudo, contem a resposta sobre a construção, as possibilidades do dispositivo Sony MDS-SD1, uso dos acessórios individuais e uma gama de informações para desfrutar plenamente todos os recursos e facilidades.

Após a compra bem sucedida de um equipamento / dispositivo, é bom ter um momento para se familiarizar com cada parte do manual Sony MDS-SD1. Atualmente, são cuidadosamente preparados e traduzidos para sejam não só compreensíveis para os usuários, mas para cumprir a sua função básica de informação

Índice do manual

  • Página 1

    – 1 – MICROFILM MDS-SD1 SPECIFICA TIONS SERVICE MANUAL MINIDISC DECK Model Name Using Similar Mechanism MDS-JE520 MD Mechanism T ype MDM-5A Base Unit T ype MBU-5A Optical Pick-up T ype KMS-260A/J1N AEP Model UK Model E Model US and foreign patents licensed from Dolby Laboratories Licensing Corporation. MDS-SD1 is the minidisc dec k that can be [...]

  • Página 2

    – 2 – SELF-DIA GNOSIS FUNCTION The self-diagnosis function consists of error codes for customers which are displayed automatically when er rors occur, and erro r codes whic h sho w the error history in the test mode dur ing servicing. For details on ho w to vie w error codes for the customer , refer to the follo wing box in the instruction manu[...]

  • Página 3

    – 3 – ITEMS OF ERROR HIST OR Y MODE ITEMS AND CONTENTS Selecting the T est Mode Displa y total rec total play retry err total err err history er refresh tm refresh Details of History No error Disc error . PT OC cannot be read (DISC ejected) Disc error . UT OC error (DISC not ejected) Loading error Address cannot be read (Serv o has deviated) Di[...]

  • Página 4

    – 4 – CA UTION Use of controls or adjustments or performance of procedures other than those specified herein ma y result in hazardous ra- diation exposure. Notes on chip component replacement • Ne ver reuse a disconnected chip component. • Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Cir cuit Board Rep[...]

  • Página 5

    – 5 – T ABLE OF CONTENTS 1. SER VICING NO TE .......................................................... 6 2. GENERAL ........................................................................ 15 3. DISASSEMBL Y 3-1. Glass ASSY ......................................................................... 16 3-2. Front Panel ...........................[...]

  • Página 6

    – 6 – SECTION 1 SER VICING NO TE JIG FOR CHECKING BD BO ARD W A VEFORM The special jig (J-2501-149-A) is useful for checking the wa veform of the BD board. The names of terminals and the c hecking ite ms to be performed are sho wn as follows. GND : Ground I+3V : F or measuring IOP (Check the deterioration of the optical pick-up laser) IOP : F o[...]

  • Página 7

    – 7 – IOP DA T A RECORDING AND DISPLA Y WHEN PICKUP AND NON-V OLA TILE MEMOR Y (IC171 OF BD BO ARD) ARE REPLA CED The IOP value la beled on the pick-up can be recorded in the non-v olatile memory . By recording the value, it will eliminate the need to look at the value on the label of the optical pic k-up. When replacing the pick-up or non-vola[...]

  • Página 8

    – 8 – • 0.9 mW power Specified v alue : 0.84 to 0.92 mW • 7.0 mW power Specified v alue : 6.8 to 7.2 mW lop (at 7mW) • Labeled on the optical pickup Iop value ± 10mA • Tr aver se wave f or m Specified v alue : Below 10% of fset • Error rate check Specified v alue : For points a, b, and c C1 error : Below 220 AD error : Below 2 • Er[...]

  • Página 9

    – 9 – FORCED RESET The system microprocessor can be reset in the follo wing procedure. Use these procedure when the unit cannot be operated normally due to the ov errunning of the microprocessor, etc. Procedur e : Short-circuit jumper wire of JW40 and JW41 (RESET). [MAIN BO ARD] (Component Side) 1 3 JW40 IC821 JW42[...]

  • Página 10

    – 10 – CLEANING OF OBJECTIVE LENS OF OPTICAL PICKUP • When cleaning the objectiv e lens of the optical pickup, move the mechanism deck using the follo wing method. 1 If a disc is inside, eject it out. 2 Disconnect the power cord from the outlet, and set the non-conducted state. 3 Using a pair of tweezers, while pulling the claw at A to wards [...]

  • Página 11

    – 11 – ATT A CHING THE GLASS ASSEMBL Y • Attach according to steps 1 to 4 . 1 1 2 (Bottom side) 3 Bracket (shaft) 4 Screw (PTP2.6x6) When fixing this par t, secure at the center to allow f or some play . Open and close the glass window sev eral times, and chec k that the par ts do not touch each other . FLUORESCENT INDICA T OR TUBE, LED COMPL[...]

  • Página 12

    – 12 – SER VICING POSITION 1 Remove the four scre ws securing the upper cov er , and remove the upper co ver . 2 Undo the bound cables. 3 Remove the tw o screws A securing the rear panel. 4 Remove the four scre ws B securing the transformer . 5 Remove the scr ew C securing the MAIN board. 6 Remove the MAIN board with the rear panel. A B B C[...]

  • Página 13

    – 13 – RETR Y CA USE DISPLA Y MODE • In this test mode, the causes for retry of the unit during recording can be displayed on the fluorescent indicator tube. During playback, the “track mode” for obtaining track information will be set. This is useful for locating the faulty part of the unit. • The following will be displayed : During r[...]

  • Página 14

    – 14 – He xadecimal Bit Binar y Higher Bits Lower Bits 84218421 b7 b6 b5 b4 b3 b2 b1 b0 00000001 00000010 00000100 00001000 00010000 00100000 01000000 10000000 He xa- decimal Details 01 02 04 08 10 20 40 80 Emphasis OFF Monaural This is 2-bit display . Normall y 01. 01:Normal audio. Others:Inv alid Audio (Normal) Original Copyright Write prohib[...]

  • Página 15

    – 15 – Location of Parts and Contr ols 1 1/u (Po w er) b utton 2 MD disk compartment 3 § button 4 CLEAR button 5 ENTER/YES button 6 V OLUME knob 7 MENU/NO button 8 ±/) button SECTION 2 GENERAL Front P anel 1 23 4 5 6 12 11 7 8 9 10 13 15 14 9 ≠/0 button 10 π button 11 fl button 12 CD SYNC/MD WM SYNC b utton 13 r REC button 14 DISPLA Y but[...]

  • Página 16

    – 16 – SECTION 3 DISASSEMBL Y Note: Follo w the disassembly procedure in the numerical order given. 3-1. GLASS ASSY 3-2. FR ONT P ANEL 4 4 3 (Bottom side) 2 Bracket (shaft) 1 Screw (PTP2.6x6) 1 T wo screws (BVTP3x8) 2 Connector (CN792 ) 4 Connector (CN793) 5 F ront panel 3 Flat type wire (13core) (CN791)[...]

  • Página 17

    – 17 – 3-4. B ASE UNIT AND BD BO ARD 3-3. SLIDER (CAM) 1 Two screws (BTP2.6x6) 2 Bracket (Guide L) 3 Leaf spring 5 Bracket (Guide R) 6 Slider (Cam) 4 Two screws (BTP2.6x6) Set the shaft of Lev er (O/C) to be at the position in the figure. Set the shaft of Cam gear to be at the position in the figure. 1 Three screws (BTP2.6x6) 2 Base unit (MBU-5[...]

  • Página 18

    – 18 – 3-5. SW BO ARD AND LO ADING MO T OR (M103) 5 Two screws (BTP2.6x6) 6 SW board 4 Loading motor (M103 ) 3 Two screws (PWH1.7x4) 1 Screw (PTPWH M2.6x6) 2 Gear B[...]

  • Página 19

    – 19 – SECTION 4 TEST MODE 4-1. PRECAUTIONS FOR USE OF TEST MODE • As loading related operations will be performed reg ar dless of the test mode operations being performed, be sure to check that the disc is stopped before setting and removing it. Even if the § b utton is pressed while the disc is rotating during continuous playback, continuo[...]

  • Página 20

    – 20 – 4-5. SELECTING THE TEST MODE There are 31 types of test modes as sho wn belo w . The groups can be switched by rotating the – ˜ + knob . After selecting the group to be used, press the ENTER/YES b utton. After setting a certain group, rotating the – ˜ + knob switches between these modes. Refer to “Group” in the table for detail[...]

  • Página 21

    – 21 – “CPLAY MID” n “CPLAY OUT” n “CPLAY IN” “CPLAY MID” n “CPLAY OUT” n “CPLAY IN” 4-5-1. Operating the Continuous Playback Mode 1. Entering the continuous playback mode 1 Set the disc in the unit. (Whichev er recordable discs or discs for playback only are av ailable.) 2 Rotate the – ˜ + knob and display “CPLA Y [...]

  • Página 22

    – 22 – P SYNC LEVEL-SYNC O VER REPEA T 1 TRA CK DISC DA T E MONO When Off Contents Displa y When Lit During continuous playback (CL V : ON) T racking servo OFF CL V low speed mode ABCD adjustment completed T racking offset cancel ON T racking auto gain OK Focus auto gain OK Pit High reflection CL V -S CL V LOCK ¢ MEANINGS OF O THER DISPLA YS S[...]

  • Página 23

    – 23 – 5-1. PARTS REPLA CEMENT AND ADJUSTMENT • Check and adjust the MDM and MBU as follo ws. The procedure changes according to the part replaced SECTION 5 ELECTRICAL ADJUSTMENTS • Abbre viation OP : Optical pick-up O WH: Ov erwrite head • Temperature compensation offset check • Laser power check • Traverse check • Focus bias check[...]

  • Página 24

    – 24 – 5-2. PRECA UTIONS FOR CHECKING LASER DIODE EMISSINON T o check the emission of the laser diode during adjustments, nev er vie w directly from the top as this may lose your eye-sight. 5-3. PRECA UTIONS FOR USE OF OPTICAL PICK- UP (KMS-260A) As the laser diode in the optical pick-up is easily damaged by static electricity , solder the lase[...]

  • Página 25

    – 25 – 5-6. CHECKS PRIOR TO REP AIRS These checks are performed before replacing parts according to “approximate specifications” to determine the faulty loca tions. For details, refer to “Checks Prior to P arts Replacement and Adjustments” (See page 8). 5-6-1. T emperature Compensation Offset Check When performing adjustments, set the i[...]

  • Página 26

    – 26 – 10. Observe the wa veform of the oscilloscope, and check that the specified v alue is satisfied. Do not rotate the – ˜ + knob . (T rav erse W av ef orm) 11. Press the ENTER/YES button display “EF MO CHECK” The disc stops rotating automatically . 12. Press the § button and remo ve the disc. 13. Load the check disc (MD) TD YS-1. 14[...]

  • Página 27

    – 27 – 5-7. INITIAL SETTING OF ADJUSTMENT VALUE Note: Mode which sets the adjustment results recorded in the non-vola tile memory to the initial setting value. Ho wev er the results of the temperature compensation offset adjustment will not change to the initial setting value. If initial setting is performed, perform all adjustments again exclu[...]

  • Página 28

    – 28 – KMS 260A 27X40 B0825 N Iop = 82.5 mA in this case Iop (mA) = Digital voltmeter reading (mV)/1 ( Ω ) 7. Then, rotate the – ˜ + knob and display “LDPWR CHECK”. 8. Press the ENTER/YES b utton once and display “LD 0.9 mW $ ”. Check that the reading of the laser po wer meter become 0.85 to 0.91 mW . 9. Press the ENTER/YES button [...]

  • Página 29

    – 29 – 11. Rotate the – ˜ + knob until the wa veform of the oscillo- scope mov es closer to the specified v alue. In this adjustment, wa veform v aries at intervals of a pprox. 2%. Adjust the wa veform so that the specified v alue is satisfied as much as possible. (T rav erse W a vef orm) 12. Press the ENTER/YES button, and sa ve the adjustm[...]

  • Página 30

    – 30 – 5-13. ERROR RA TE CHECK 5-13-1. CD Error Rate Chec k Checking Procedur e : 1. Load a check disc (MD) TD YS-1. 2. Rotate the – ˜ + knob and display “CPLA Y MODE”. 3. Press the ENTER/YES button twice and display “CPLA Y MID”. 4. The display changes to “C1 = AD = ”. 5. Check that the C1 error rate is below 20. 6. Press the ME[...]

  • Página 31

    – 31 – NO TE: It is useful to use the jig. for checking the wav eform. (Refer to Servicing Note on page 6.) 5-15. ADJUSTING POINTS AND CONNECTING POINTS [BD BO ARD] (SIDE A) [BD BO ARD] (SIDE B) CN110 NO TE D101 I+3V IOP TE RF VC GND IC171 IC121 IC101 IC192 CN101[...]

  • Página 32

    – 32 – SECTION 6 DIA GRAMS 6-1. CIRCUIT BO ARDS LOCA TION MAIN board SW board P ANEL board P ANEL SW board ENCODER board BD board CONNECT OR boar d[...]

  • Página 33

    MDS-SD1 – 33 – – 34 – 6-2. BLOCK DIA GRAMS – BD SECTION – HR901 OVER WRITE HEAD HEAD DRIVE Q181,182 3 6 1 2 FILTER PCO FILI FILO CLTV PLL EFM, ACIRC, ENCODER/ DECODER RF AGC & EQ AGCI RFO MORFI MORFO RF AMP 1 2 BPF P-P AT AMP BPF ADAGC VC ANALOG MUX 27 16 17 18 SERIAL PARALLEL DECODER VICONV 20 25 22 23 4 5 6 7 8 9 IV AMP IV AMP E-F[...]

  • Página 34

    MDS-SD1 – 35 – – 36 – – MAIN SECTION – 1 27 73 72 17 16 18 12 19 4 6 2 26 8 14 13 24 15 80 79 75 78 82 81 35 37 36 58 63 66 53 51 59 57 74 60 54 65 67 88 56 55 77 87 69 22 12 1 49 100 19 45 29 15 13 44 43 1 3 30 12 38 39 31 95 97 18 34 33 50 5 6 8 7 1 4 DIN0 DIN1 DOUT ADDT BCK LRCK DADT 512FS SCTX XINT SQSY DQSY MNT3 MNT2 MNT1 MNT0 SENS[...]

  • Página 35

    MDS-SD1 – 37 – – 38 – WA VEFORMS – BD (1/2) SECTION – – MAIN SECTION – THIS NO TE IS COMMON FOR PRINTED WIRING BO ARDS AND SCHEMA TIC DIA GRAMS. (In addition to this, the necessary note is printed in each b lock.) For schematic diagrams. Note: • All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indi[...]

  • Página 36

    MDS-SD1 6-3. PRINTED WIRING BO ARD – BD SECTION – • See page 32 for Cir cuit Boards Location. – 39 – – 40 – D101 A-1 D181 D-3 D183 D-3 IC103 B-1 IC123 D-2 IC171 D-1 Q102 B-1 Q103 B-1 Q104 B-1 IC101 A-3 IC121 C-3 IC124 C-3 IC152 B-1 IC181 C-1 IC192 D-1 Q101 B-3 Q162 B-3 Q163 B-3 Q181 C-1 Q182 C-2 Ref . No. Location • Semiconductor Lo[...]

  • Página 37

    MDS-SD1 – 41 – – 42 – 6-4. SCHEMA TIC DIA GRAM – BD (1/2) SECTION – • See page 38 f or W a veforms. • See page 61 f or IC Block Diagrams. • See page 64 f or IC Pin Functions. (Page 43) (Page 43) (Page 43) (Page 44) (Page 44) (Page 44) (Page 44) RT1P441M-TP-1 RT1P441M- TP-1 RT1P441M-TP-1 RT1P441M-TP-1[...]

  • Página 38

    MDS-SD1 – 43 – – 44 – 6-5. SCHEMA TIC DIA GRAM – BD (2/2) SECTION – • See page 38 for W aveforms. • See page 39 for Printed Wiring Board. (Page 41) (Page 41) (Page 41) (Page 42) (Page 42) (Page 42) (Page 42) (Page 45) (Page 45) S-24CO2AFJA-TB[...]

  • Página 39

    MDS-SD1 – 45 – – 46 – 6-6. SCHEMA TIC DIA GRAM – MAIN (1/2) SECTION – • See page 38 f or W avef orms. • See page 49 for Printed Wiring Board. • See page 65 for IC Pin Functions. (Page 59) (Page 43) (Page 43) (Page 60) (Page 47) (Page 47) (Page 48) (Page 55, 56)[...]

  • Página 40

    MDS-SD1 – 47 – – 48 – 6-7. SCHEMA TIC DIA GRAM – MAIN (2/2) SECTION – • See page 38 for W aveforms. • See page 62 for IC Bloc k Diagrams. (Page 52) (Page 45) (Page 45) (Page 46)[...]

  • Página 41

    MDS-SD1 – 49 – – 50 – • Semiconductor Location 6-8. PRINTED WIRING BO ARD – MAIN SECTION – • See page 32 for Cir cuit Boards Location. Ref. No . Location D172 C-1 D173 C-1 D811 D-5 D812 D-5 D815 D-6 D816 D-6 D821 C-4 D823 B-4 D824 B-3 D831 E-6 D832 E-5 D833 E-6 D851 D-7 D852 D-7 D861 D-6 IC101 B-1 IC201 C-1 IC301 F-7 IC501 A-2 IC502[...]

  • Página 42

    MDS-SD1 – 51 – – 52 – 6-9. SCHEMA TIC DIA GRAM – P ANEL SECTION – • See page 38 for W avef orms. (Page 47) 470p DTC143TKA-T146 DTC144EKA-T146 DTC144EKA-T146[...]

  • Página 43

    MDS-SD1 – 53 – – 54 – D941 C-7 D942 C-6 D943 C-3 D944 C-3 D945 C-4 D946 C-5 IC901 B-5 Q921 B-3 Q941 C-7 Q942 C-6 6-10. PRINTED WIRING BOARD – P ANEL SECTION – • See page 32 for Cir cuit Boards Location. • Semiconductor Location Ref. No. Location (Page 49)[...]

  • Página 44

    MDS-SD1 – 55 – – 56 – 6-11. SCHEMA TIC DIA GRAM – CONNECT OR SECTION – • See page 63 f or IC Block Diagrams. (Page 46)[...]

  • Página 45

    MDS-SD1 – 57 – – 58 – 6-12. PRINTED WIRING BO ARD – CONNECTOR SECTION – • See page 32 for Cir cuit Boards Location. • Semiconductor Location Ref. No. Location D781 A-1 D782 A-2 IC771 B-2 IC772 B-2 IC774 B-1 Q771 A-3 Q772 A-4 Q774 A-2 Q775 A-4 Q781 B-1 Q782 A-2 Q783 B-3 (Page 49) CONTROL TO HCD-SD1 SYSTEM CONTROL TO TC-SD1[...]

  • Página 46

    MDS-SD1 6-14. PRINTED WIRING BO ARD – BD SWITCH SECTION – • See page 32 f or Cir cuit Boards Location. 6-13. SCHEMA TIC DIA GRAM – BD SWITCH SECTION – – 59 – – 60 – (Page 45) (Page 45) 6-15. SCHEMA TIC DIA GRAM – ENCODER SECTION – 6-16. PRINTED WIRING BO ARD – ENCODER SECTION – • See page 32 for Cir cuit Boards Location.[...]

  • Página 47

    – 61 – 6-17. IC BLOCK DIA GRAMS – BD Section – IC101 CXA2523AR –1 –2 + – IVR BB + – IVR AA + – IVR CC + – IVR DD + – IVR + – EE EE' EFB TESW PTGR 48 MORFO 47 MORFI 46 RFO 45 OPN 44 OPO 43 ADDC 42 COMPP 41 COMPO 40 AGCI 39 RF AGC 38 RF 37 PEAK 36 BOTM 35 ABCD 34 FE 33 AUX 32 ADFG 31 ADAGC 30 ADIN 29 ADFM 28 SE 27 CSLED 2[...]

  • Página 48

    – 62 – IC152 BH6511FS-E2 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 123456789 10 11 12 13 14 15 16 GND VG IN4R IN4F VM4 OUT4F PGND4 OUT4R VM34 OUT3R PGND3 OUT3F VM3 IN3F IN3R PSB CAPA– CAPA+ IN2R IN2F VM2 OUT2F PGND2 OUT2R VM12 OUT1R PGND1 OUT1F VM1 IN1F IN1R V DD CHARGE PUMP. OSC INTERFACE AMP INTERFACE AMP AMP INTERFACE PREDRIVE PREDRI[...]

  • Página 49

    – 63 – – CONNECT OR Section – IC822 M62016FP-E1 IC774 P82B715TD .118 + – + – 3 4 5 6 2 8 7 1 VCC NC NC NC RESET GND CD INT INTERRUPT SIGNAL GENERATOR RESET SIGNAL GENERATOR COM R1 R2 R3 R4 COM IC851 M5293L 2 5 5k + – 27k OVERCURRENT LIMITTER OVERHEAT PROTECTION REFERENCE VOLTAGE GND ON/OFF IN REFERENCE VOLTAGE OUT 3 4 1 GND NC NC VCC [...]

  • Página 50

    – 64 – 6-18. IC PIN FUNCTIONS • IC101 CXA2523AR (RF Amplifier) (BD Board) Pin No . 1 I I I-V con verted RF signal I input from the optical pick-up block detector 2 J I I-V con verted RF signal J input from the optical pick-up block detector 3 VC O Middle point voltage (+1.65V) generation output terminal 4 to 9 A to F I Signal input from the o[...]

  • Página 51

    – 65 – • IC701 M30610MC-A01FP (SYSTEM CONTR OL µ CON) (MAIN BO ARD) Pin No . Pin Name I/O Function 1 WMOUT O MD WM LINK data out 2 WMCLK I MD WM LINK clock in 3 LEVEL-L O LEVEL-L D A output (Not used) 4 LEVEL-R O LEVEL-R D A output (Not used) 5 LEDD A T A O LED DRIVER D A T A output (Not used) 6 NC O Not used 7 LEDCLK O LED DRIVER CLOCK outp[...]

  • Página 52

    – 66 – Pin No . Pin Name I/O Function 51 CHAK-IN I Detection signal from IN switch 52 HOME I Detection signal form HOME switch 53 P A CK-OUT I Detection signal from OUT switch 54 LDIN O Loading motor in control 55 LDOUT O Loading motor out control 56 LD-LO W O Loading motor v oltage control output 57 LDON O Laser po wer ON/OFF 58 REFLECT I Disc[...]

  • Página 53

    – 67 – SECTION 7 EXPLODED VIEWS 7-1. CASE AND B A CK P ANEL SECTION NOTE: • Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. • The mechanical parts with no reference number in the exploded vie ws are not supplied. • Hardware (# mark) list a[...]

  • Página 54

    – 68 – 7-2. FR ONT P ANEL SECTION Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 61 4-951-620-01 SCREW (2.6X8), +BVTP * 62 1-671-539-11 P ANEL SW BOARD 63 X-4950-998-1 BRACKET (L) ASSY 64 4-996-690-91 LID (CARTRIDGE) 65 4-976-593-01 SPRING (LID), TORSION 66 1-751-086-11 WIRE (FLA T TYPE) (13 CORE) * 67 A-4724-619-A P [...]

  • Página 55

    – 69 – 7-3. MECHANISM DECK SECTION (MDM-5A) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 215 4-996-227-01 LEVER (HEAD) 216 4-996-229-01 SPRING (HEAD LEVER), TORSION 217 4-996-212-01 LEVER (LIMITTER) 218 4-996-213-01 SPRING (LIMITTER), TORSION 219 4-996-214-01 SPRING (SLIDER), TENSION 220 4-996-216-01 SPRING (HOLDER)[...]

  • Página 56

    – 70 – 7-4. B ASE UNIT SECTION (MBU-5A) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 265 4-996-261-01 GEAR (SL-B) 266 4-996-264-01 SPRING (SHAFT), LEAF 267 4-996-265-01 SHAFT , MAIN 268 4-996-256-11 SL (BASE) 269 4-996-257-01 RACK (SL) 270 4-996-263-01 SPRING (CL V), TORSION 271 4-988-560-01 SCREW (+P 1.7X6) 272 4-2[...]

  • Página 57

    – 71 – • SEMICONDUCTORS In each case, u: µ , for example: uA...: µ A..., uP A...: µ P A..., uPB...: µ PB..., uPC...: µ PC..., uPD...: µ PD... • CAP ACIT ORS uF : µ F • COILS uH : µ H • Abbreviation HK : Hong K ong model SP : Singapore model • Due to standardization, replacements in the parts list may be different from the part[...]

  • Página 58

    – 72 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark BD CONNECT OR L122 1-414-813-11 FERRITE 0uH L151 1-412-029-11 INDUCTOR CHIP 10uH L152 1-412-029-11 INDUCTOR CHIP 10uH L153 1-412-032-11 INDUCTOR CHIP 100uH L154 1-412-032-11 INDUCTOR CHIP 100uH L161 1-414-813-11 FERRITE 0uH L162 1-414-813-11 FERRITE 0uH L181 1-216-[...]

  • Página 59

    – 73 – ENCODER Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C792 1-163-121-00 CERAMIC CHIP 150PF 5% 50V < CONNECTOR > * CN771 1-568-832-11 SOCKET , CONNECTOR 13P < GROUND TERMINAL > * EPT771 1-537-738-21 TERMINAL, EARTH < FERRITE BEAD > FB771 1-500-445-21 FERRITE 0UH FB772 1-500-445-21 FERRITE 0UH [...]

  • Página 60

    – 74 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark MAIN C503 1-163-038-91 CERAMIC CHIP 0.1uF 25V C504 1-163-121-00 CERAMIC CHIP 150PF 5% 50V C505 1-163-121-00 CERAMIC CHIP 150PF 5% 50V C506 1-163-038-91 CERAMIC CHIP 0.1uF 25V C507 1-163-038-91 CERAMIC CHIP 0.1uF 25V C508 1-126-934-11 ELECT 220uF 20% 10V C509 1-163-[...]

  • Página 61

    – 75 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark < COIL > L501 1-414-396-21 INDUCTOR 4.7uH < LINE FIL TER > LF801 1-424-485-11 FIL TER, LINE < TRANSISTOR > Q101 8-729-107-45 TRANSISTOR 2SC3624A-L16 Q151 8-729-107-45 TRANSISTOR 2SC3624A-L16 Q171 8-729-027-59 TRANSISTOR DTC144EKA-T146 Q301 8-729-6[...]

  • Página 62

    – 76 – The components identif ied by mark ! or dotted line with mark ! are critical for safety . Replace only with part number specified . Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark P ANEL SW * A-4724-619-A P ANEL BOARD, COMPLETE ********************* < CAP ACITOR > C901 1-163-038-91 CERAMIC CHIP 0.1uF 25V C[...]

  • Página 63

    – 77 – Ref. No. Part No. Description Remark ACCESSORIES & P ACKING MA TERIALS ******************************* 1-543-793-11 FIL TER, CLAMP (FERRITE CORE) 1-558-271-11 CORD, CONNECTION (AUDIO, 108cm) 1-574-264-11 CORD, OPTICAL PLUG (OPTICAL PLUG, 60cm) (AEP ,UK) 1-790-034-11 CORD (WITH CONNECTOR) (5 CORE) (SYSTEM CABLE, 50cm) 1-790-137-11 COR[...]

  • Página 64

    – 78 – Sony Corporation Home A&V Products Compan y 9-922-970-11 98L0953-1 Printed in Japan © 1998. 12 Published by Quality Assurance Dept. (Shibaura) MDS-SD1[...]