Sony MDS-PC2 manual

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Bom manual de uso

As regras impõem ao revendedor a obrigação de fornecer ao comprador o manual com o produto Sony MDS-PC2. A falta de manual ou informações incorretas fornecidas ao consumidor são a base de uma queixa por não conformidade do produto com o contrato. De acordo com a lei, pode anexar o manual em uma outra forma de que em papel, o que é frequentemente utilizado, anexando uma forma gráfica ou manual electrónicoSony MDS-PC2 vídeos instrutivos para os usuários. A condição é uma forma legível e compreensível.

O que é a instrução?

A palavra vem do latim "Instructio" ou instruir. Portanto, no manual Sony MDS-PC2 você pode encontrar uma descrição das fases do processo. O objetivo do manual é instruir, facilitar o arranque, a utilização do equipamento ou a execução de determinadas tarefas. O manual é uma coleção de informações sobre o objeto / serviço, um guia.

Infelizmente, pequenos usuários tomam o tempo para ler o manual Sony MDS-PC2, e um bom manual não só permite conhecer uma série de funcionalidades adicionais do dispositivo, mas evita a formação da maioria das falhas.

Então, o que deve conter o manual perfeito?

Primeiro, o manual Sony MDS-PC2 deve conte:
- dados técnicos do dispositivo Sony MDS-PC2
- nome do fabricante e ano de fabricação do dispositivo Sony MDS-PC2
- instruções de utilização, regulação e manutenção do dispositivo Sony MDS-PC2
- sinais de segurança e certificados que comprovam a conformidade com as normas pertinentes

Por que você não ler manuais?

Normalmente, isso é devido à falta de tempo e à certeza quanto à funcionalidade específica do dispositivo adquirido. Infelizmente, a mesma ligação e o arranque Sony MDS-PC2 não são suficientes. O manual contém uma série de orientações sobre funcionalidades específicas, a segurança, os métodos de manutenção (mesmo sobre produtos que devem ser usados), possíveis defeitos Sony MDS-PC2 e formas de resolver problemas comuns durante o uso. No final, no manual podemos encontrar as coordenadas do serviço Sony na ausência da eficácia das soluções propostas. Atualmente, muito apreciados são manuais na forma de animações interessantes e vídeos de instrução que de uma forma melhor do que o o folheto falam ao usuário. Este tipo de manual é a chance que o usuário percorrer todo o vídeo instrutivo, sem ignorar especificações e descrições técnicas complicadas Sony MDS-PC2, como para a versão papel.

Por que ler manuais?

Primeiro de tudo, contem a resposta sobre a construção, as possibilidades do dispositivo Sony MDS-PC2, uso dos acessórios individuais e uma gama de informações para desfrutar plenamente todos os recursos e facilidades.

Após a compra bem sucedida de um equipamento / dispositivo, é bom ter um momento para se familiarizar com cada parte do manual Sony MDS-PC2. Atualmente, são cuidadosamente preparados e traduzidos para sejam não só compreensíveis para os usuários, mas para cumprir a sua função básica de informação

Índice do manual

  • Página 1

    1 MICROFILM MDS-PC2 SPECIFICA TIONS SERVICE MANUAL MINIDISC DECK Model Name Using Similar Mechanism MDS-S40 MD Mechanism T ype MDM-5A Optical Pick-up T ype KMS-260B/J1N US Model Canadian Model AEP Model UK Model E Model — Continued on ne xt page —[...]

  • Página 2

    2 SELF-DIA GNOSIS FUNCTION The self-diagnosis function consists of error codes for customers which are displayed automa tically when error s occur , and erro r codes which show the error history in the test mode during servicing . For details on how to vie w error codes for the customer, r efer to the follo wing box in the instruction manual. For d[...]

  • Página 3

    3 Displays the recording time. Displayed as “r ππππππ h”. The displayed time is the total time the laser is set to the high po wer state. This is about 1/4 of the actual recording time. The time is displayed in decimal digits from 0h to 65535h. Displays the play time. Displayed as “p ππππππ h”. The time displayed is the total ac[...]

  • Página 4

    4 CA UTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous r a- diation exposure. Notes on chip component replacement • Nev er reuse a disconnected chip component. • Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Cir cuit Board Repairing ?[...]

  • Página 5

    5 T ABLE OF CONTENTS 1. SER VICING NOTE .......................................................... 6 2. GENERAL ........................................................................ 12 3. DISASSEMBL Y 3-1. Case and Front Panel .......................................................... 14 3-2. MD Mechanism ........................................[...]

  • Página 6

    6 SECTION 1 SER VICING NO TE JIG FOR CHECKING BD BO ARD W A VEFORM The special jig (J-2501-149-A) is useful for checking the wa veform of the BD board. The names of terminals and the checking ite ms to be performed are sho wn as follows. GND : Ground I+3V : For measuring IOP (Check the deterioration of the optical pick-up laser) IOP : For measuring[...]

  • Página 7

    7 IOP DA T A RECORDING AND DISPLA Y WHEN OPTICAL PICK-UP AND NON-V OLA TILE MEMOR Y (IC171 OF BD BO ARD) ARE REPLA CED The IOP v alue labeled on the optical pick-up can be recorded in the non-v ola tile memory . By recording the value, it will elimin a te the need to look at the value on the label of the optical pic k-up. When replacing the optical[...]

  • Página 8

    8 CHECKS PRIOR T O PARTS REPLA CEMENT AND ADJUSTMENTS Before performing repairs, perform the follo wing checks to determine the faulty locations up to a certain extent. Details of the procedures are described in “5 Electrical Adjustments”. Note: The criteria for determination abov e is intended merely to determine if satisfactory or not, and do[...]

  • Página 9

    9 Back up board FLUORESCENT DISPLA Y TUBE ALL LIGHTING AND KEY CHECK MODE In this mode, the fluorescent display tube check and key c heck can be performed. Procedur e: 1. While pressing the INPUT button and r (REC) b utton, insert the power plug into the outlet. ” 2. The fluorescent display tube displays “FL ALL 10n Key” momentaril y and ligh[...]

  • Página 10

    10 Fig. 1 Reading the T est Mode Display (During recording and stop) R Ts@@c##c** Fluorescent display tube display @@ : Cause of retry ## : Number of retries ** : Number of retry errors Fig. 2 Reading the T est Mode Display (During playbac k) @@####**$$ Fluorescent display tube display @@ : Parts No. (name of area named on TOC) ## : Cluster ** : Se[...]

  • Página 11

    11 Reading the Display: Con vert the hexadecimal display into binary display . If more than two causes, they will be added. Example When 84 is displayed: Higher bit : 8 = 1000 n b7 Lo wer bit : 4 = 0100 n b2 In this case, as b2 and b7 are 1 and others are 0, it can be determined that the retry cause is combined of “emphasis OFF”, “monaural”[...]

  • Página 12

    12 This section is e xtracted from instruction manual. Location of Parts and Contr ols SECTION 2 GENERAL Front P anel 2 4 6 7 8 9 10 11 1 3 5[...]

  • Página 13

    13 SECTION 3 DISASSEMBL Y Note: Follo w the disassembly procedur e in the numerical order gi ven. 3-1. CASE AND FRONT P ANEL 3-2. MD MECHANISM 8 Front panel (Take not of two claws) 9 Flat type wire (CN701) 1 Two screw s (Flat head) 2 Two screws (Flat head) 3 Case 4 Two screws (BTT M3) 6 Screw (M2 x 6.0) 7 Screw (M2 x 6.0) 5 Screw (BTT M3) Claw Claw[...]

  • Página 14

    14 3-4. BASE UNIT (MB U-5A) AND BD BO ARD 3-3. SLIDER (CAM) 6 Slider (Cam) 2 Brack et (Guide L) 5 Brack et (Guide R) 3 Leaf spring 1 T wo screws (BTP 2.6 x 6) 4 T wo screws (BTP 2.6 x 6) Set the shaft of Lev er (O/C) to be at the position in the figure. Set the shaft of Cam gear to be at the position in the figure. • Note for Installation of Slid[...]

  • Página 15

    15 3-5. SW BO ARD AND LO ADING MOT OR (M103) 5 Three screws (BTP2.6 x 6) 4 Loading motor (M103 ) 6 SW board 2 Gear B 3 T wo screws (PWH 1.7 x 3) 1 Screw (PTPWH M2.6 x 6)[...]

  • Página 16

    16 SECTION 4 TEST MODE 4-1. PRECA UTIONS FOR USE OF TEST MODE • As loading related operations will be performed reg ar dless of the test mode operations being performed, be sure to check that the disc is stopped before setting and removing it. Even if the 6 (EJECT) button is pr essed while the disc is rotating during continuous playback, continuo[...]

  • Página 17

    17 4-5. SELECTING THE TEST MODE There are 27 types of test modes as sho wn belo w . The groups can be switched by pressing the = and = b uttons. After selecting the group to be used, press the ^ “PR OGRAM” button. After setting a certain group, pressing the = and = buttons s witches between these modes. Refer to “Group” in the table for det[...]

  • Página 18

    18 4-5-1. Operating the Continuous Playbac k Mode 1. Entering the continuous playback mode 1 Set the disc in the unit. (Whiche ver recordable discs or discs for playback only are av ailable.) 2 Press the + button and display “CPLA Y MODE”. 3 Press the ^ “PR OGRAM” button to change the display to “CPLA Y MID”. 4 When access completes, th[...]

  • Página 19

    19 4-6. FUNCTIONS OF O THER BUTT ONS Contents Sets continuous playback when pressed in the STOP state. When pressed during continuous playback, the tracking servo turns ON/OFF . Stops continuous playback and continuous recording. The sled moves to the outer circumf erence only w hen this is pressed. The sled moves to the inner circumf erence only w[...]

  • Página 20

    20 ( P REC SYNC L.SYNC O VER B A- TRA CK DISC SLEEP MONO When Off Contents Displa y When Lit During continuous playback (CL V : ON) T rac king servo OFF Recording mode ON CL V low speed mode ABCD adjustment completed T rac king of fset cancel ON T rac king auto gain OK Focus auto gain OK Pit High reflection CL V S CL V LOCK MEANINGS OF O THER DISPL[...]

  • Página 21

    21 5-1. PARTS REPLA CEMENT AND ADJUSTMENT • Check and adjust the MDM and MBU as follo ws. The procedure changes according to the part replaced SECTION 5 ELECTRICAL ADJUSTMENTS • Abbre viation OP : Optical pick-up O WH : Overwrite head • Temperature compensation offset check • Laser power check • Traverse check • Focus bias check • C P[...]

  • Página 22

    22 5-2. PRECA UTIONS FOR CHECKING LASER DIODE EMISSINON T o check the emission of the laser diode during adjustments, nev er vie w directl y from the top as this may lose your eye-sight. 5-3. PRECA UTIONS FOR USE OF OPTICAL PICK- UP (KMS-260A) As the laser diode in the optical pick-up is easily damaged by static electricity , solder the laser tap o[...]

  • Página 23

    23 5-6. CHECKS PRIOR TO REP AIRS These checks are performed before replacing parts according to “approximate specif ications” to determine the faulty locations. For details, refer to “Checks Prior to P arts Replacement and Adjustments” (See page 8). 5-6-1. T emperature Compensation Offset Check When performing adjustments, set the internal [...]

  • Página 24

    24 5-6-4. Focus Bias Check Change the focus bias and check the focus tolerance amount. Checking Procedur e : 1. Load a test disk (MD W -74/A U-1). 2. Rotate the + button and display “CPLA Y MODE”. 3. Press the ^ “PR OGRAM” button twice and display “CPLA Y MID”. 4. Press the p “PR OGRAM” button when “C1 = AD = ” is displayed. 5. [...]

  • Página 25

    25 5-7. INITIAL SETTING OF ADJUSTMENT VALUE Note: Mode which sets the adjustment results recorded in the non-vola tile memory to the initial setting value. Ho wev er the results of the temperature compensation offset adjustment will not change to the initial setting value. If initial setting is performed, perform all adjustments again excluding the[...]

  • Página 26

    26 6. Press the = , + buttons so tha t the reading of the laser po w er meter becomes 6.9 to 7.1 mW , press the ^ “PR O- GRAM” button and sa ve it. Note : Do not perform the emission with 7.0 mW more than 15 seconds continuously . 7. Then, press the + button and display “PWR CHECK”. 8. Press the ^ “PR OGRAM” button once and display “0[...]

  • Página 27

    27 11. Press the = , + buttons until the w av eform of the oscil- loscope mov es closer to the specified v alue. In this adjustment, wa veform v aries at intervals of a pprox. 2%. Adjust the wa veform so that the specified value is satisf ied as much as possible. (T ra verse W av eform) 12. Press the ^ “PR OGRAM” button, and sav e the adjustmen[...]

  • Página 28

    28 5-13. ERROR RA TE CHECK 5-13-1. CD Error Rate Chec k Checking Pr ocedure : 1. Load a check disc (MD) TD YS-1. 2. Press the + b utton and display “CPLA Y MODE”. 3. Press the ^ “PR OGRAM” button twice and display “CPLA Y MID”. 4. The display changes to “C1 = AD = ”. 5. Check that the C1 error rate is below 20. 6. Press the p “PR [...]

  • Página 29

    29 NO TE: It is useful to use the jig. for checking the wa veform. (Refer to Ser - vicing Note on page 6.) 5-15. ADJUSTING POINTS AND CONNECTING POINTS [BD BO ARD] (SIDE A) [BD BO ARD] (SIDE B) CN110 NO TE D101 I+3V IOP TE VC GND IC171 IC121 IC101 IC192 CN101 RF[...]

  • Página 30

    30 SECTION 6 DIA GRAMS 6-1. CIRCUIT BO ARDS LOCA TION Back up board SW board BD board P anel board Main board P ower boar d[...]

  • Página 31

    31 31 MDS-PC2 6-2. BLOCK DIA GRAM – BD SECTION – HR901 OVER WRITE HEAD HEAD DRIVE Q181,182 3 6 1 2 FILTER PCO FILI FILO CLTV PLL EFM, ACIRC, ENCODER/ DECODER RF AGC & EQ AGCI RFO MORFI MORFO RF AMP 1 2 BPF P-P AT AMP BPF ADAGC VC ANALOG MUX 27 16 17 18 SERIAL PARALLEL DECODER VICONV 20 25 22 23 4 5 6 7 8 9 IV AMP IV AMP E-F BALANCE 14 15 3 [...]

  • Página 32

    32 32 MDS-PC2 – MAIN SECTION – 1 RM 5 23 80 17 16 18 12 19 4 2 26 14 13 24 15 74 66 18 71 78 72 31 33 32 69 77 75 53 51 68 70 59 60 54 76 67 65 56 55 73 79 47 30 28 49 15 13 12 35 97 19 34 37 50 3 10 DIN0 DIN1 DOUT ADDT BCK LRCK DADT 512FS SCTX XINT SQSY DQSY MNT3 RXDI CLKI TXDI MNT2 MNT1 MNT0 SENS SRDT SCLK SWDT XLATCH LIMIT-IN REFLECT PROTECT[...]

  • Página 33

    33 33 MDS-PC2 – MAIN SECTION – IC701 !£ (XOUT) IC201 !™ (SYSCLK) IC201 !¶ (LRCK1) IC201 !§ (BCK) – P ANEL SECTION – IC901 %• (OSCO) 3.4Vp-p 2.822MHz 3.0Vp-p 22.581MHz 3.9Vp-p 2.4MHz 3.2Vp-p 10MHz 3.8Vp-p 44.1kHz WA VEFORMS 1 IC101 1 , 2 (I, J) (PLA Y mode) – BD (1/2) SECTION – 2 3 IC101 4 (A) (PLA Y mode) IC101 8 , 9 (E, F) (PLA [...]

  • Página 34

    34 34 MDS-PC2 6-3. PRINTED WIRING BO ARD – BD SECTION – • See page 30 for Cir cuit Boards Location. D101 A-1 D181 D-3 D183 D-3 IC103 B-1 IC123 D-2 IC171 D-1 Q102 B-1 Q103 B-1 Q104 B-1 • SEMICONDUCT OR LOCA TION Ref. No. Location IC101 A-3 IC121 C-3 IC124 C-3 IC152 B-1 IC181 C-1 IC192 D-1 Q101 B-3 Q162 B-3 Q163 B-3 Q181 C-1 Q182 C-2 • SEMI[...]

  • Página 35

    35 35 MDS-PC2 6-4. SCHEMA TIC DIA GRAM – BD (1/2) SECTION – • See page 33 for Wa veform. • See page 45 for IC Bloc k Diagrams. • See page 48 for IC Pin Function. (Page 36) (Page 36) (Page 36) (Page 36) (Page 36) (Page 36) (Page 36)[...]

  • Página 36

    36 36 MDS-PC2 6-5. SCHEMA TIC DIA GRAM – BD (2/2) SECTION – • See page 33 for Wa veform. • See page 34 for Printed Wiring Board. (Page 35) (Page 35) (Page 35) (Page 35) (Page 35) (Page 35) (Page 35) (Page 37) (Page 42) BA033FP-E2 MAIN BOARD (1/2) POWER BOARD[...]

  • Página 37

    37 37 MDS-PC2 6-6. SCHEMA TIC DIA GRAM – MAIN (1/2) SECTION – • See page 33 for Wa veform. • See page 39 for Printed Wiring Board. (Page 44) (Page 36) (Page 42) (Page 38) (Page 38) (Page 38) (Page 38) SW BOARD BD BOARD (2/2) POWER BOARD • See page 51 for IC Pin Function.[...]

  • Página 38

    38 38 MDS-PC2 6-7. SCHEMA TIC DIA GRAM – MAIN (2/2) SECTION – • See page 33 for Wa veform. • See page 47 for IC Bloc k Diagrams. (Page 37) (Page 37) (Page 37) (Page 37) (Page 40) PANEL BOARD IN L R L R OUT LINE (ANALOG)[...]

  • Página 39

    39 39 MDS-PC2 6-8. PRINTED WIRING BO ARD – MAIN SECTION – • See page 30 for Cir cuit Boards Location. IN OUT L L R R LINE (ANALOG) • SEMICONDUCT OR LOCA TION D390 A-2 D391 A-2 IC301 A-3 IC308 A-1 IC351 A-4 IC381 A-2 IC382 A-2 IC441 A-5 IC501 B-7 Q191 A-1 Q192 A-1 Q291 A-1 Q292 A-1 Q390 A-2 Q441 B-6 Ref. No. Location (Page 43) (Page 44) (Pag[...]

  • Página 40

    40 40 MDS-PC2 6-9. SCHEMA TIC DIA GRAM – P ANEL SECTION – • See page 33 for Wa veform. (Page 38) MAIN BOARD (2/2)[...]

  • Página 41

    41 41 MDS-PC2 6-10. PRINTED WIRING BOARD – P ANEL SECTION – • See page 30 for Cir cuit Boards Location. (Page 39) MAIN BOARD[...]

  • Página 42

    42 42 MDS-PC2 6-11. SCHEMA TIC DIA GRAM – PO WER SECTION – (Page 37) (Page 36) BD BOARD (2/2) MAIN BOARD (1/2) IN 1 IN 2 OUT DIGITAL (OPTICAL) RESET[...]

  • Página 43

    43 43 MDS-PC2 6-12. PRINTED WIRING BOARD – PO WER SECTION – • See page 30 for Cir cuit Boards Location. • SEMICONDUCT OR LOCA TION D431 C-2 D432 C-2 D433 C-2 D466 B-2 D467 B-2 D801 E-1 IC601 C-1 Ref. No. Location • SEMICONDUCT OR LOCA TION D411 C-4 D412 C-3 D421 C-2 D422 C-1 D451 B-2 D452 B-2 D461 B-4 D462 B-4 D911 B-4 D912 C-2 Ref. No . [...]

  • Página 44

    44 44 MDS-PC2 6-13. SCHEMA TIC DIA GRAM – BD SWITCH SECTION – 6-14. PRINTED WIRING BOARD – BD SWITCH SECTION – • See page 30 for Cir cuit Boards Location. (Page 37) MAIN BOARD (1/2) 6-15. IC BLOCK DIA GRAM • BD section IC101 CXA2523AR –1 –2 + – IVR BB + – IVR AA + – IVR CC + – IVR DD + – IVR + – EE EE' EFB TESW PTGR[...]

  • Página 45

    45 100 99 98 97 96 95 94 93 EFMO DVSS TEST3 TEST2 TEST1 TEST0 SPFD SPRD 92 SFDR 91 SRDR 90 FS4 89 FRDR 88 FFDR 87 DVDD 86 TFDR 85 TRDR 84 LDDR 83 APCREF 82 DTRF 81 CKRF 80 XLRF 79 F0CNT 78 ADFG 77 APC 76 DCHG 75 TE 74 SE 73 AVSS 72 ADRB 71 ADRT 70 AVDD 69 ADIO 62 CLTV 61 FILO 60 FILI 59 PCO 57 RFI 58 AVSS 56 BIAS 55 AVDD 54 ASYI 53 ASYO 52 MVCI 51 [...]

  • Página 46

    46 • MAIN section 3 4 5 6 2 8 7 1 VADCN VADCP VINL2 PGA PGA 0DB/6DB SWITCH NOISE SHAPER INTERPOLATION FILTER DSP FEATURES PRAK DETECTOR L3-BUS INTERFACE DECIMATION FILTER DIGITAL INTERFACE DIGITAL MIXER DIGITAL AGC ADC1L ADC2L ADC2R ADC1R DAC DAC 0DB/6DB SWITCH VSS(AD) VDD(AD) VINL1 VDDD VSSD 18 16 19 17 26 25 27 24 13 15 14 9 22 10 11 23 28 12 2[...]

  • Página 47

    47 6-16. IC PIN FUNCTIONS • IC101 RF Amplifier (CXA2523AR) (BD board) Pin No . Pin Name I/O Function I J VC A to F PD APC APCREF GND TEMPI TEMPR SWDT SCLK XLA T XSTBY F0CNT VREF EQADJ 3T ADJ Vcc WBLADJ TE CSLED SE ADFM ADIN AD AGC ADFG AU X FE ABCD BO TM PEAK RF RF AGC A GCI COMPO COMPP ADDC OPO OPN RFO MORFI MORFO I I O I I O I — I O I I I I I[...]

  • Página 48

    48 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 to 34 35 36 to 40 41 42 43 44 45 46 47 • IC121 Digital Signal Processor , Digital Serv o Signal Processor , EFM/A CIRC Encoder/Decoder , Shock-pr oof Memory Controller , A TRAC Encoder/Decoder , 2M Bit DRAM (CXD2654R) (BD board) Function Pin No . Pin Name I/O M[...]

  • Página 49

    49 Function Pin No . Pin Name I/O 48 49 50, 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 D1 D0 D2, D3 MVCI ASY O ASYI A VDD BIAS RFI A VSS PCO FILI FILO CL TV PEAK BO TM ABCD FE A UX1 VC ADIO A VDD ADR T ADRB A VSS SE TE DCHG APC ADFG F0CNT XLRF CKRF DTRF APCREF TEST0 TRDR Data input/outpu[...]

  • Página 50

    50 Function Pin No . Pin Name I/O 86 87 88 89 90 91 92 93 94 95 96 to 98 99 100 TFDR D VDD FFDR FRDR FS4 SRDR SFDR SPRD SPFD FGIN TEST1 to TEST3 D VSS EFMO O — O O O O O O O I (S) I — O Trac king servo driv e PWM output (+) +3V power suppl y (Digital) Focus serv o drive PWM output (+) Focus servo dr ive PWM output (–) 176.4 kHz clock signal o[...]

  • Página 51

    51 1, 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 to 27 28 29 30 31 32 33 34 35 36 37 38 to 41 42, 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57, 58 59 Pin No . Pin Name I/O Function • IC501 System Contr ol (M30620MC-406FP) (MAIN board) O O O I I I I — O O I O — I — I I I O O — I O O O O O I O O O O O O I O O O O O O O I I[...]

  • Página 52

    52 Pin No. Pin Name I/O Function 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 PB-P REC/PB +3.3V NC GND SD A MNT3 (SLOCK) WR PWR PR OTECT REFLECT LDON SENS NMT1 (SHOCK) DIG-RST MNT2 (XBUSY) XLA TCH MOD LIMIT -IN MNT0 (FOK) SCL SCTX CLKSET0 CLKSET1 LED0 LED1 OPT DEL OPT SE[...]

  • Página 53

    53 3 2 7 7 2 1 9 26 26 4 FL701 T901 5 6 5 5 12 11 11 5 MDM-5A not supplied not supplied not supplied not supplied not supplied #1 #1 #1 #1 #1 #1 #1 #1 # 7 #1 not supplied 7 7 10 11 11 8 7 7 22 14 16 7 18 25 24 13 15 12 20 21 (AEP ,SP) 21 (UK) 13 (SP) 21 (US,CND) 19 17 23 23 22 SECTION 7 EXPLODED VIEWS 7-1. CABINET SECTION NO TE: • Items marked ?[...]

  • Página 54

    54 7-2. MECHANISM SECTION (MDM-5A) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 515 4-996-227-01 LEVER (HEAD) 516 4-996-229-01 SPRING (HEAD LEVER), TORSION 517 4-996-212-01 LEVER (LIMITTER) 518 4-996-213-01 SPRING (LIMITTER), TORSION 519 4-996-214-01 SPRING (SLIDER), TENSION 520 4-996-216-01 SPRING (HOLDER), TENSION 521[...]

  • Página 55

    55 7-3. BASE UNIT SECTION (MB U-5A) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 565 4-996-261-01 GEAR (SL-B) 566 4-996-264-01 SPRING (SHAFT), LEAF 567 4-996-265-01 SHAFT , MAIN 568 4-996-256-01 SL(BASE) 569 4-996-257-01 RACK (SL) 570 4-996-263-01 SPRING (CL V), TORSION 571 4-988-560-01 SCREW (+P 1.7X6) 572 4-211-036-01[...]

  • Página 56

    56 SECTION 8 ELECTRICAL P ARTS LIST Note: Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark • SEMICONDUCTORS In each case, u: µ , for example: uA...: µ A..., uP A...: µ P A..., uPB...: µ PB..., uPC...: µ PC..., uPD...: µ PD... • CAP A CITORS uF : µ F • COILS uH : µ H • Abbreviation CND : Canadian model SP : S[...]

  • Página 57

    57 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark IC152 8-759-430-25 IC BH6511FS-E2 IC171 8-759-487-04 IC BR24C02F-E2 IC181 8-759-481-17 IC MC74ACT08DTR2 IC192 8-759-460-72 IC BA033FP-E2 < COIL > L101 1-414-813-11 FERRITE 0uH L102 1-414-813-11 FERRITE 0uH L103 1-414-813-11 FERRITE 0uH L105 1-414-813-11 FERRITE 0uH L[...]

  • Página 58

    58 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C102 1-124-779-00 ELECT CHIP 10uF 20% 16V C181 1-126-395-11 ELECT 22uF 20% 16V C182 1-163-017-00 CERAMIC CHIP 0.0047uF 5% 50V C183 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V C184 1-126-603-11 ELECT CHIP 4.7uF 20% 35V C185 1-163-117-00 CERAMIC CHIP 100PF 5% 50V C201 1-163-00[...]

  • Página 59

    59 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark P ANEL R189 1-216-037-00 MET AL CHIP 330 5% 1/10W R191 1-216-057-00 MET AL CHIP 2.2K 5% 1/10W R192 1-216-057-00 MET AL CHIP 2.2K 5% 1/10W R201 1-216-049-91 RES,CHIP 1K 5% 1/10W R202 1-216-097-91 RES,CHIP 100K 5% 1/10W R206 1-216-075-00 MET AL CHIP 12K 5% 1/10W R281 1-216-0[...]

  • Página 60

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