LG Electronics U250 manual

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Índice do manual

  • Página 1

    Date: June, 2007 / Issue 1.0 Service Manual Model : U250/KU250 Service Manual U250/KU250[...]

  • Página 2

    - 3 - 1. INTRODUCTION .............................. 5 1.1 Purpose................................................... 5 1.2 Regulatory Information............................ 5 2. PERFORMANCE ...............................7 2.1 System Overview .....................................7 2.2 Usable environment .................................8 2.3 Radi[...]

  • Página 3

    - 4 -[...]

  • Página 4

    - 5 - 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors[...]

  • Página 5

    E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F. Pictures The pictures in this manual are for illustrative purposes only; your[...]

  • Página 6

    2. PERFORMANCE - 7 - 2.1 System Overview 2. PERFORMANCE Item Specification Shape GSM900/1800/1900 and WCDMA2100 - Bar type Handset Size 110.9 X 46.7 X 15.6 mm Weight Under 83 g (with 950mAh Battery) Power 3.7 V normal, 950 mAh Li-Ion Talk Time Over 200 min (WCDMA, Tx=12 dBm, Voice) (with 950mAh) Over 180 min (GSM, Max Tx Power, Voice) Standby Time [...]

  • Página 7

    2.2 Usable environment 1) Environment 2) Environment (Accessory) * CLA : 12 ~ 24 V(DC) 2.3 Radio Performance 1) T ransmitter - GSM Mode * In case of DCS : [A] -> 1710, [B] -> 1785 * In case of PCS : [A] -> 1850, [B] -> 1910 2. PERFORMANCE - 8 - Item Specification Voltage 3.7 V(Typ), 3.2 V(Min), [Shut Down : 3.2 V] Operation Temp -20 ~ +[...]

  • Página 8

    2. PERFORMANCE - 9 - * In case of DCS : [A] -> 1710, [B] -> 1785 * In case of PCS : [A] -> 1850, [B] -> 1910 No Item GSM DCS & PCS 30M ~ 1GHz -36dBm 30M~1GHz -36dBm MS allocated 1G~[A]MHz -30dBm Channel 1G ~ 4GHz -30dBm [A]M~[B]MHz -36dBm Radiated [B]M~4GHz -30dBm 2S purious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm Emission 880M ~ 915M[...]

  • Página 9

    2. PERFORMANCE - 10 - No Item GSM DCS & PCS Frequency offset 800kHz 7 Intermodulation attenuation – Intermodulation product should be Less than 55dB below the level of Wanted signal Power control Power Tolerance Power control Power Tolerance Level (dBm) (dB) Level (dBm) (dB) 53 3 ± 3 0 3 0 ± 3 63 1 ± 3 1 2 8 ± 3 72 9 ± 3 2 2 6 ± 3 82 7 [...]

  • Página 10

    2. PERFORMANCE - 11 - 2) T ransmitter - WCDMA Mode No Item Specification 1 Maximum Output Power Class 3 : +24dBm(+1/-3dB) 2F requency Error ±0.1ppm 3 Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme Adjust output(TPC command) cmd 1dB 2dB 3dB +1 +0.5/1.5 +1/3 +1.5/4.5 4 Inner Loop Power control in uplink 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.[...]

  • Página 11

    3)Receiver - GSM Mode 2. PERFORMANCE - 12 - No Item Specification 13 Adjacent Channel Leakage Ratio(ACLR) 33dB@5MHz, ACP>-50dBm 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1K BW -36dBm@f=50KHz~30MHz, 10K BW -36dBm@f=30MHz~1000MHz, 100K BW 14 Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW (*: additional requirement) (*)-41dBm@f=1893.5~1919.6MHz, 3[...]

  • Página 12

    2. PERFORMANCE - 13 - 4) Receiver - WCDMA Mode No Item Specification 1 Reference Sensitivity Level -106.7 dBm(3.84 MHz) -25dBm(3.84MHz) 2M aximum Input Level -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(Class3) 3 Adjacent Channel Selectivity (ACS) 33dB UE@+20dBm output power(Class3) -56dBm/3.84MHz@10MHz 4I n-band Blocking UE@+20dBm output power(C[...]

  • Página 13

    2. PERFORMANCE - 14 - 2.4 Current Consumption 1) U250/KU250 Current Consumption (Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight off,Neighbor Cell off) (VT Test Condition : Speaker off, LCD backlight On) 2.5 RSSI BAR Stand by Voice Call VT WCDMA Under 2.80 mA Under 290 mA Under 410mA (DRX=1.28) (Tx=12dBm) (Tx=12dBm) Under 2.12[...]

  • Página 14

    2.6 Battery BAR 2. PERFORMANCE - 15 - Indication Standby Bar 4 Over 3.83 ± 0.05V Bar 4 → 3 3.82 ± 0.05V Bar 3 → 2 3.73 ± 0.05V Bar 2 → 1 3.68 ± 0.05V Bar 1 → Empty 3.58 ± 0.05V Low Voltage, 3.58± 0.05V (Stand-by) / 3.58 ± 0.05V (Talk) Warning message+ Blinking [Interval : 3min(Stand-by) / 1min(Talk)] Power Off 3.20 ± 0.05V[...]

  • Página 15

    2. PERFORMANCE - 16 - 2.7 Sound Pressure Level 2.8 Charging • Charging Method : CC & CV (Constant Current and Constant Voltage) • Maximum Charging Voltage : 4.2 V • Maximum Charging Current : 700 mA • Normal Battery Capacity : 950 mAh • Charging Time : Max 3 hours (except for trickle charging time) • Full charging indication current[...]

  • Página 16

    3. TECHNICAL BRIEF - 17 - 3.1 General Description The U250/KU250 supports UMTS-2100, GSM-900, DCS-1800, and PCS-1900 based GSM/GPRS/UMTS. All receivers and the UMTS transmitter use the radio One 1 Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The quad- band GSM transmitters use a ba[...]

  • Página 17

    A generic, high-level functional block diagram of U250/KU250 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a FEM(Front End Module). The UMTS receive path each include a LNA, a RF band-pass filter, and a downconver[...]

  • Página 18

    3. TECHNICAL BRIEF - 19 - 3.2 GSM Mode 3.2.1 GSM Receiver The Dual-mode U250/KU250’s receiver functions are split among the three RFIC’s as follows: • GSM-900, DCS-1800, and PCS-1900 UMTS-2100 modes use the RTR6275 IC only. Each mode has independent front-end circuits and down-converters, but they share common baseband circuits (with only one[...]

  • Página 19

    The GSM900, DCS, and PCS receiver inputs of RTR6275 are connected directly to the transceiver front-end circuits(filters and antenna switch module). The GSM900, DCS, and PCS receiver inputs use differential configurations to improve common-mode rejection and second-order non-linearity performance. The balance between the complementary signals is cr[...]

  • Página 20

    3. TECHNICAL BRIEF - 21 - [Fig 1.2] RTR6275 RX feature[...]

  • Página 21

    3.2.2 GSM T ransmitter The RTR6275 transmitter outputs(DA_HB2_OUT and DA_LB1_OUT)include on-chip output matching inductors. The 50ohm output impedance is achieved by adding a series capacitor at the output pins. The capacitor value may be optimized for specific applications and PCB characteristics based on pass- band symmetry about the band center [...]

  • Página 22

    3. TECHNICAL BRIEF - 23 - 3.3 UMTS Mode 3.3.1 Receiver The UMTS duplexer receiver output is routed to LNA circuits within the RTR6275 device. The UMTS Rx input is provided with an on-chip LNA that amplifies the signal before a second stage filter that provides differential downconverter. This second stage input is configured differentially to optim[...]

  • Página 23

    3. TECHNICAL BRIEF - 24 - [Figure 1.4] RTR6275 IC functional block diagram WCDMA_2100_ TX WCDMA_2100_ RX[...]

  • Página 24

    3.4 LO generation and distribution circuits The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes to yield highly flexible quadrature LO outputs that drive all GSM and UMTS band upconverters and downconverters; with the help of these LO generation and distribution circuits, zero-IF architecture [...]

  • Página 25

    3.5.2 VCTCXO (X100 : DSA321SCE-19.2M) The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the MSM6245 IC. The oscillator frequency is controlled by the MSM6245 IC. TRK_LO_ADJ pulse density modulated signal in the same manne[...]

  • Página 26

    3. TECHNICAL BRIEF - 27 - 3.5.4 PMIC Functional Block Diagram (U300 : PM6650-2M) • Input power management - Valid external supply attachment and removal detection - Supports unregulated (closed-loop) external charger supplies and USB supplies as input power sources - Supports lithium-ion main batteries - Trickle, constant current, constant voltag[...]

  • Página 27

    • Integrated handset-level user interfaces - Four programmable current sinks recommended as keypad backlight, LCD backlight, camera flash, and general-purpose drivers - Vibration motor driver programmable from 1.2 to 3.1V in 100 mV increments - Speaker driver with programmable gain, turn-on time, and muting; differential operation (drives externa[...]

  • Página 28

    3. TECHNICAL BRIEF - 29 - [Figure1.7] PM6650 Block Diagram[...]

  • Página 29

    3.5.5 GSM P AM (U101 : SKY77318) The SKY77318 is an extremely small (6 x 6 mm), GSM PAM for handset applications. This module has been optimized for excellent efficiency and Pout while maintaining high GSM/GPRS efficiency. The small size and high performance is achieved with high-reliability GaAs HBT technology. With 50Ω and output, no external m[...]

  • Página 30

    3. TECHNICAL BRIEF - 31 - 3.5.6 UMTS Duplexer(FL104:ACMD-7602) A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include; • Insertion loss. this component is also in the receive and transmit paths ; In the U250/KU250 typical losses : UMTS2100_ Tx = 1.2 dB, UMTS2100_ Rx = 1.4 dB • [...]

  • Página 31

    3.5.7 UMTS Rx RF filter (FL103 : EFCH2140TDE1) • Frequency range : 2110 ~ 2170MHz An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical as losses before the LNA. The most important parameters of this component include: • Out-of-band rejection or attenuation levels, usually specified to meet the[...]

  • Página 32

    3. TECHNICAL BRIEF - 33 - 3.5.8 Bluetooth (M100 : LBRQ-2B43A) The MSM6245 includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are an bluetooth RF module and Antenna. Figure1.9 shows the bluetooth system architecture in the U250/KU250. [Figure1.9] Bluetooth system architecture MS M 6245 Bluetooth baseband[...]

  • Página 33

    3.6 Digital Baseband(DBB/MSM6245) 3.6.1 General Description A. Features(MSM6245) • Support for multimode operation - tri-band WCDMA (UMTS), quad-band GSM/GPRS/EDGE • Support for WCDMA (UMTS) uplink data rate up to 384 kbps • High-performance ARM926EJ-S running at up to 225 MHz • ARM Jazelle Java hardware acceleration for faster Java-based g[...]

  • Página 34

    3. TECHNICAL BRIEF - 35 - Front E nd Module Duplexer RTR6275 WCDMA PAM MSM6245 WCDMA TX SAW WCDMA RX SAW PM6650 -2M GSM PAM GSM TX SAW COUPLER VCTCXO Bluetooth RF Module U-SIM 1.3M CAM USB MIC SPK/RCV KEYPAD NAND, SDRAM FLASH MA IN LCD VGA CAM GS M900 Rx GS M1800 Rx GS M1900 Rx GS M900 Tx GS M1800/1900 Tx AntSW Logic WC DM A2100 Tx WC DM A2100 Rx G[...]

  • Página 35

    3. TECHNICAL BRIEF - 36 - 3.7 Block Diagram(MSM6245) MSM6245 CONNECTIVITY CAMERA PROCESSING (Def ault 8bit Interface) GRAPHICS VIDEO AUDIO DUAL MEMORY BUS Modem QDSP 4000 PLL QD SP 4000 ARM 926ejs With Jazelle UMTS, WCDMA BT 1.2 pro cessor Rx ADC Tx DAC MP3, AAC, EVRC, QCELP AMR, CMX, MI DI EBI 1 EBI 2 Open GL ES 3D, 2D MPEG-4 H.263, H.264 Keypad I[...]

  • Página 36

    3. TECHNICAL BRIEF - 37 - 3.8 Subsystem(MSM6245) 3.8.1. ARM Microprocessor Subsystem The MSM6245 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Thr[...]

  • Página 37

    3. TECHNICAL BRIEF - 38 - 3.8.3. GSM features The following GSM modes and data rates are supported by the MSM6245 device hardware. Support modes conform to release '99 specifications of the sub-feature. ■ Voice features ❏ FR ❏ EFR ❏ AMR ❏ HR ❏ A5/1, A5/2, and A5/3 ciphering ■ Circuit-switched data features ❏ 9.6k ❏ 14.4k ❏ [...]

  • Página 38

    3. TECHNICAL BRIEF - 39 - 3.8.6. MSM6245 device audio processing features ■ Integrated wideband stereo CODEC ❏ 16-bit DAC with typical 88 dB dynamic range ❏ Supports sampling rates up to 48 kHz on the speaker path and 16 kHz on the microphone path ■ VR- Voice mail + voice memo ■ Acoustic echo cancellation ■ Audio AGC ■ Audio Codecs: A[...]

  • Página 39

    3. TECHNICAL BRIEF - 40 - 3.8.9. Supported multimedia features ■ Provide additional general purpose MIPS by using: ❏ Two QDSP4000s ❏ Dedicated hardware accelerators and compression engines ■ Improve Java, BREW, and game performance ❏ Integrated Java and 2D/3D graphics accelerator with Sprite engine ■ Enable various accessories via USB h[...]

  • Página 40

    3. TECHNICAL BRIEF - 41 - ■ PNG decoder ■ Pitch bend range support ■ LED/vibrate support ■ Scalable Vector Graphics (SVG- Tiny 1.1 + SVG Tiny 1.2) ■ MLZ decoder ■ Integrated PNG/SAF A.T. Note: 1. At this time, only 32-bit SDRAM is supported on the MSM6245 device. There are potential MIPS issues when running Bluetooth and video telephony[...]

  • Página 41

    3. TECHNICAL BRIEF - 42 - Table 1-2 Description of RF configurations[...]

  • Página 42

    3. TECHNICAL BRIEF - 43 - 3.8.10. Stereo Wideband CODEC The MSM6245 device integrates a wideband voice/audio CODEC into the mobile station modem (MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface. The CODEC integrates the mic[...]

  • Página 43

    3. TECHNICAL BRIEF - 44 - 3.8.14. General-Purpose Input/Output Interface The MSM62450 device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART inter[...]

  • Página 44

    3. TECHNICAL BRIEF - 45 - 3.9 Power Block 3.9.1. General MSM6245, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of MSM6245, MSM memory, RF block, Bluetooth, USIM and TCXO. Major power components are : 3.9.2. PM6650 The PM6650 device (Figure 1-1) integrates all wireless handset power management. The power management [...]

  • Página 45

    3. TECHNICAL BRIEF - 46 - Figure 1.12 PM6650 Functional Block Diagram[...]

  • Página 46

    3. TECHNICAL BRIEF - 47 - 3.9.3. Charging control A programmable charging block in PM6650 is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply [...]

  • Página 47

    T rickle Charging Trickle Charging of the main battery, enabled through SBI control and powered from V DD , is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from V DD to pin (VBAT). Trickle charging can be used for lithium-ion and nickelbased batteries, with its performance specified bel[...]

  • Página 48

    3. TECHNICAL BRIEF - 49 - Constant Current Charging The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V. Constant V oltage Charging Constant voltage charging begins when t[...]

  • Página 49

    3.10 External memory interface The MSM6245 device was designed to provide two distinct memory interfaces. EBI1 was targeted for supporting high speed synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous devices such as LCD, NAND flash, SDRAM, etc. • EBI1 Features - 16 bit static and dynamic memory interface - 32 bi[...]

  • Página 50

    3. TECHNICAL BRIEF - 51 - MSM6245 SDRAM 512Mb NAND 512Mb (64MB) DATA[31:0] ADDRESS[14 : 0] WE* CS* CAS* RAS* CLK_EN CLK DQM[3:0] NAND_CS* NAND_RE* NAND_WE* NAND_CLE NAND_WP* NAND_ALE NAND_READY DATA[7:0] EBI1 EBI2 Figure 1.14 Simplified Block Diagram of Memory Interface[...]

  • Página 51

    3.1 1 H/W Sub System 3.1 1.1. RF Interface A. RTR6275(WCDMA_Tx, GSM_Tx/Rx) MSM6245 controls RF part(RTR6275) using these signals. • SBST : SSBI I/F signals for control Sub-chipset • PA_ON1 : Power AMP on RF part • RX0_I/Q_M/P,TX_I/Q_M/P : I/Q for T/Rx of RF • TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier • DA[...]

  • Página 52

    3. TECHNICAL BRIEF - 53 - B. the others • TRK_LO_ADJ : TCXO(19.2M) Control • PA_ON : WCDMA(2100) TX Power Amp Enable • ANT_SEL[0-2] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx) • GSM_PA_BAND : GSM/DCS-PCS Band Selection of Power Amp • GSM_PA_RAMP : Power Amp Gain Control of APC_IC • GSM_PA_EN : Power Amp Gain Contro[...]

  • Página 53

    3.1 1.2. MSM Sub System 3.11.2.1. USIM Interface SIM interface scheme is shown in Figure. And, there control signals are followed • USIM_CLK : USIM Clock • USIM_Reset : USIM Reset • USIM_Data : USIM Data T/Rx 3.11.2.2. UART Interface UART signals are connected to MSM GPIO through IO connector with 115200 bps speed. 3. TECHNICAL BRIEF - 54 - F[...]

  • Página 54

    3. TECHNICAL BRIEF - 55 - 3.11.2.3. USB The MSM6245 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the MSM6245 was designed to comply with the definition of a peripheral as specified in USB Specification, Revision 1.1. Therefore,[...]

  • Página 55

    3.1 1.3 HKADC(House Keeping ADC) The MSM6245 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6245 device has six analog input pins which are multiplexed to the input of the internal HKADC. 3. TE[...]

  • Página 56

    3. TECHNICAL BRIEF - 57 - 3.1 1.4. Key Pad There are 23 main key buttons in Figure. Shows the Keypad circuit. ‘END’ Key is connected to PMIC(PM6650). Table. Key Matrix Mapping Table Figure 1.19 Main Keypad Circuit Figure 1.20 END Keypad Circuit COL0 COL1 COL2 COL3 COL4 ROW(0) - CLR MENU ROW(1) 1 2 3 LEFT UP ROW(2) 4 5 6 OK RIGHT ROW(3) 7 8 9 SE[...]

  • Página 57

    3.1 1.5 Camera Interface U250/KU250 Installed a 1.3M Pixel and 0.3Mega Camera. Below figure shows the camera socket type connector and camera I/F signal. 3. TECHNICAL BRIEF - 58 - Figure 1.21 Camera Socket Type Connector VT_CAMERA_CONNECTOR REV_1.0 REV_1.0 MEGA CAMERA CONNECTOR CAMERA REV_1.0 INOUT_A4 4 INOUT_B1 9 8 INOUT_B2 INOUT_B3 7 6 INOUT_B4 F[...]

  • Página 58

    3. TECHNICAL BRIEF - 59 - The MEGA Camera module is connected to socket type connector with 24 pin (F95M08). Its interface is dedicated camera interface port in MSM6245. The camera port supply 24.576MHz master clock to camera module and receive 49.152MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data [...]

  • Página 59

    3. TECHNICAL BRIEF - 60 - The VGA Camera module is connected to socket type connector with 20 pin (CLE9120-2761E). Its interface is dedicated camera interface port in MSM6245. The camera port supply 24.576MHz master clock to camera module and receive 12.288MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits[...]

  • Página 60

    3. TECHNICAL BRIEF - 61 - 3.1 1.6 Keypad Light There are 8 Blue LEDs in Main key backlight circuit, which are driven by KYDB_BACKLIGHT line from PM6650. Figure 1.22 Schematic of KEY back light circuit (KEY side) KEY_BACK_LIGHT LED(8EA) REV_B : EDLH0013501 --> EDLH0006001 R418 100ohm 100ohm R415 100ohm R411 R413 100ohm LD408 LEBB-S14H LEBB-S14H L[...]

  • Página 61

    3. TECHNICAL BRIEF - 62 - 3.1 1.7. LCD Module (NM176CN1 : T ovis) - The NM176CN1 model is a Color TFT Main supplied by Tovis. This LCD Module has a 1.76 inch diagonally measured active display area with 176(RGB)X220 resolution. each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in vertical stripes. * Features - Di[...]

  • Página 62

    3. TECHNICAL BRIEF - 63 - 3.1 1.8.1. Audio Signal Processing & Interface Audio signal processing is divided uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip (MSM6245). This transmitted signal is reformed to fit in GSM & WCDM[...]

  • Página 63

    3. TECHNICAL BRIEF - 64 - MSM6245 CODEC pins MSM pin W18 (CODEC VSS) AUDIO Place near Near to MSM 10% C201 47p F25 SDCC_DAT1_GPIO99 SDCC_DAT2_GPIO100 M25 M26 AF20 MIC1N AE20 MIC1P MIC2N AF21 AF22 MIC2P T15 MICBIAS AC21 LINE_L_IN LINE_L_IP AC22 LINE_ON AC18 AC17 LINE_OP LINE_R_IN AC20 AC19 LINE_R_IP W17 HPH_L HPH_R AA17 HPH_VREF AA19 AE18 EAR1ON AF1[...]

  • Página 64

    3. TECHNICAL BRIEF - 65 - REV_B AUDIO SELECT_SPK&RCV R422 10 R421 10 VA412 EVL14K02200 VA414 EVL14K02200 3 COM1 9 COM2 6 GND IN1 4 IN2 8 5 NC1 NC2 7 NO1 2 NO2 10 1 VCC U401 NLAS5223BMNR2G 0.01u C410 SPK_RCV+ RCV_EN_N SPK_RCV- RCV- RCV+ SPK- SPK+ +VPWR REV_B : EDTY0008606 --> EDTY0008601 MIC REV_B : SUMY0010301 --> SUMY0003802 C421 39p C42[...]

  • Página 65

    3. TECHNICAL BRIEF - 66 - Audio part schematics REV_C : 20K --> 3K Audio AMP REV_E : For Antenna Radiation 5.6K R430 C423 C428 1u 0.1u R427 1K R429 1K C431 NA C422 0.1u 2 4 INM INP 3 OUTA 5 8 OUTB VM 7 VP 6 1 _SD NCP2890DMR2 U402 BYPASS 5600p C426 RCVP 10u C425 C429 1000p R428 5.6K RCVN C430 1000p R426 20K 100nH L402 L401 100nH C427 5600p R431 2[...]

  • Página 66

    3. TECHNICAL BRIEF - 67 - 3.1 1.8.2. Audio Mode There are three audio modes (Voice call, speaker phone, MIDI/MP3). Audio & Sound Main Component There are 6 main components in U250/KU250. Table. Audio Mode Table. Audio main component list Headset MP3 Headset Headset MIDI Bell Headset Speaker MP3 Loud Mode MP3 Speaker MIDI Bel l Loud Mode MIDI Sp[...]

  • Página 67

    3. TECHNICAL BRIEF - 68 - 3.12 Main Features 1. LG-U250/KU250 Main features - Bar Type - WCDMA(2100) + GSM Tri-Band (900/1800/1900) - Color LCD (Main:262K TFT, 1.76”) - Dual Camera (1.3Mega + VGA(0.3M)) - 1810 speaker/receiver - Stereo Headset - Speaker phone (in GSM and WCDMA) - MP3/AAC decoder and play - MPEG4 encoder/decoder and play/save - JP[...]

  • Página 68

    3. TECHNICAL BRIEF - 69 - 2. U250/KU250 Main Component Main board (Bottom) Main board (Top) Logic /A udio RF Bluetoot h Logic[...]

  • Página 69

    3. TECHNICAL BRIEF - 70 - RF U101 X100 SW100 FL101 U103 U100 FL104 U500 Reference Description Reference Description SW100 Ant. Switch module FL104 W2100 Duplex U500 Front End module U103 WCDMA PAM U101 GSM PAM X100 VCTCXO FL101 GSM SAW BT module U100 RTR6275[...]

  • Página 70

    3. TECHNICAL BRIEF - 71 - Logic / Audio Reference Description Reference Description BAT300 Backup Battery CN401 MMI connector (18pin) U303 1.3M Cam. LDO CN403 1.3M Cam. Connector U402 Audio AMP CN401 CN403 BAT300 U402 U303[...]

  • Página 71

    3. TECHNICAL BRIEF - 72 - Logic U201 U301 U300 J300 CN400 S300 Reference Description Reference Description U201 MSM6245_A U300 PMIC U301 Memory MCP J300 U-SIM socket CN400 Main To LCD Connector S300 T-FLASH socket[...]

  • Página 72

    4. TROUBLE SHOOTING - 73 - 4.1 RF Component 4. TROUBLE SHOOTING LGMC[...]

  • Página 73

    4. TROUBLE SHOOTING - 74 - Block Diagram Block Ref. Name UMTS Part Name Function Comment[...]

  • Página 74

    4. TROUBLE SHOOTING - 75 - 4.2 SIGNAL P A TH_UMTS RF Common Tx/Rx UMTX 2100 Tx/Rx UMTX 2100 Tx UMTX 2100 Rx Tx I/Q LO RX I/Q[...]

  • Página 75

    4.3 SIGNAL P A TH_GSM RF 4. TROUBLE SHOOTING - 76 - Common Tx/Rx GSM9 00 Tx PCS Rx Tx I/Q LO RX I/Q DCS/PCS Tx EGSM900 RX DCS RX[...]

  • Página 76

    4. TROUBLE SHOOTING - 77 - 4.4 Checking VC-TCXO Block The reference frequency (19.2MHz) from X100 (VC-TCXO) is used in UMTS TX part, GSM part and BB part. TCXO 24 VCC 5 TC7SH04FU U104 GND 3 100p C185 0.1u C181 R124 100ohm 1000p C182 R128 100K C183 0.01u 1000p C186 DSA321SCE-19.2M X100 GND 2 5 NC1 NC2 6 7 NC3 NC4 8 OUTPUT 3 4 VCC 1 VCONT 19.2MHz 0.0[...]

  • Página 77

    4. TROUBLE SHOOTING - 78 - Check C312 of PMIC (U30 0) Check R213 o f MSM (U20 1) T[...]

  • Página 78

    4. TROUBLE SHOOTING - 79 - 4.5 Checking Front-End Module Block Rev.D Rev.B Rev.C R101 1K R100 1K L108 15nH C117 10p C110 33p 21 14 GSM18001900_TX GSM1800_RX1 1 GSM1800_RX2 2 GSM1900_RX1 3 4 GSM1900_RX2 GSM900_RX1 5 6 GSM900_RX2 16 GSM900_TX VDD 19 WCDMA2100 9 ANT 11 CTRL1 18 CTRL2 22 7 GND1 GND10 23 GND2 8 GND3 10 GND4 12 GND5 13 15 GND6 17 GND7 GN[...]

  • Página 79

    4. TROUBLE SHOOTING - 80 - Logic T able of the FEM TP 1 VREG RF SMPS GSM 1800 / GSM1900 RX GSM 900 RX GSM 900 TX / WCDMA GSM 1800 / GSM 1900 TX[...]

  • Página 80

    4. TROUBLE SHOOTING - 81 - 4.6 Checking UMTS Block 4.6.1 Checking Tx level TP1 TP2 TP3 TP4 Rev.D 1p C437 ANT101 NA L101 56p C101 ANT G1 G2 RF SW100 KMS-507 100nH L102 ANT102 C450 22p 11 U500 C102 NA 20dB Rev_1.0 Rev.B Rev_1.0 Rev.D WCDMA 7dB 0.5p L125 FL102 EFCH1950TDF 1 2 G1 3 G2 5 G3 1 IN 4 O1 U102 CP0402A1950DNTR 50OHM 4 3 COUP 2 IN 1 OUT L404 1[...]

  • Página 81

    4. TROUBLE SHOOTING - 82 -[...]

  • Página 82

    4. TROUBLE SHOOTING - 83 - 4.6.2 Checking UMTS P AM Control Block • P AM control signal 1. PWR_DET : UMTS Tx Power Detected value (Check R120) 2. TX_AGC_ADJ : UMTS RTR6275 Tx Amp Gain Control 3. VREG_TCXO_2.85V : UMTS PAM enable (C170) (about 2.85V) 4. +VPWR : UMTS PAM Main Voltage ( 3V < +VPWR < 4.2V) 5. PA_ON : Turns the PA on and off 6. [...]

  • Página 83

    4. TROUBLE SHOOTING - 84 - 4.6.3 Checking RF Rx Level TP1 TP2 TP4 TP3 Vbias RD 1p C437 ANT101 NA L101 56p C101 ANT G1 G2 RF SW100 KMS-507 100nH L102 ANT102 C450 22p U500 C102 NA Rev.D 20dB Rev_1.0 Rev.B Rev.D Rev_1.0 Rev.D Rev.D WCDMA 7dB L410 4.7nH 0.5p L125 L408 10nH C156 100p FL102 EFCH1950TDF1 2 G1 3 G2 5 G3 1 IN 4 O1 U102 CP0402A1950DNTR 50OHM[...]

  • Página 84

    4. TROUBLE SHOOTING - 85 -[...]

  • Página 85

    4. TROUBLE SHOOTING - 86 - 4.7 Checking GSM Block 1 3 2[...]

  • Página 86

    4. TROUBLE SHOOTING - 87 - 4.7.1 Checking RF Tx level 4.7.2 Schematic of RF Tx level TP1 TP2 TP3 Rev.D Rev.D Rev.C R101 1K 10nH L116 R100 1K 100p C438 C124 100p 5.6p C441 L108 15nH 1.5nH L403 L115 18nH 100ohm R107 C123 0.01u C117 10p 56p C101 68p C139 C137 NA ANT G1 G2 RF SW100 KMS-507 C134 0.01u GND3 9 GND4 10 GND5 GND6 12 GND7 13 GND8 14 GND9 16 [...]

  • Página 87

    4.7.3 Checking RF Tx level 4. TROUBLE SHOOTING - 88 -[...]

  • Página 88

    4. TROUBLE SHOOTING - 89 - 4.7.4 Checking P AM Block TP1. GSM_P A_RAMP : Power Amp Gain Control. typically , 0.2V < Vramp < 1.6V TP2. GSM_P A_EN : Power Amp Enable (Power ON : higher than 1.25V , Power OFF : lower than 0.4V) TP3. GSM_P A_BAND : Power Amp Band Selection Control (GSM Mode : -0.2V < VBS < 0.4V , DCS/PCS Mode : 1.25V < V[...]

  • Página 89

    4.7.5 Checking RF Rx Block Schematic of GSM900/DCS/PCS Rx Block 4. TROUBLE SHOOTING - 90 - TP1. DCS RX INPUT TP2. PCS RX INPUT TP3. GSM RX INPUT TP1 TP2 TP3 Rev.C Rev.D EGSM DCS Rev.C PCS R101 1K NA C191 C442 5.6p 10nH 5p L116 R100 1K C440 L406 2.7nH C124 100p NA C120 0.5p C190 C105 NA 5p C439 NA C116 1.5nH L403 L115 18nH C123 0.01u L111 5.6nH 100n[...]

  • Página 90

    4. TROUBLE SHOOTING - 91 -[...]

  • Página 91

    4.8 Checking Bluetooth Block T est Point of the Bluetooth Block T est Point of the Bluetooth Block Schematic of the Bluetooth Block 4. TROUBLE SHOOTING - 92 - TP1. VREG_B T_2.85V TP2. VREG_M SMP_2.7V TP3. TCXO_BT TP4. BT ANT Output TP1 TP2 TP3 TP4 BLUETOOTH NA L126 1000p C171 R118 0 C169 NA 100p C178 1u C172 C179 100p ANT103 FEED NC1 NC2 ACS2450HBA[...]

  • Página 92

    4. TROUBLE SHOOTING - 93 - Start TP1,TP2 Si gnals exit s? TP3 Is clock ok? 19.2 M TP4 Si gnals exit s? Change the Main board Change the M100 NO YES YES YES NO Change the X100 NO Change the Main board[...]

  • Página 93

    4.9 Power ON T roubleshooting Power On sequence of U250/KU250 is : PWR key press → PM_ON_SW_N go to low, PM6650 KPDPWR_N (pin24) → PM6650 Power Up → VREG_MSMC_1.2V, VREG_MSME_1.8V, VREG_MSMP_2.7V, VREG_MSMA_2.6V, VREG_TCXO_2.85V power up and system reset assert to MSM6245 → Phone booting and PS_HOLD assert to PMIC 4. TROUBLE SHOOTING - 94 -[...]

  • Página 94

    4. TROUBLE SHOOTING - 95 - VREG_MSMP VREG_MSMA VREG_MSME VREG_MSMC X300 : 32.768Khz R306 : 19.2Mhz [U250/KU250 Main PCB BOTTOM][...]

  • Página 95

    4. TROUBLE SHOOTING - 96 - 4.10 Charger T roubleshooting Charging Procedure - Connect TA or USB Cable - Control the charging current by PM6650 IC - Charging current flows into the battery Troubleshooting Setup - Connect TA and battery to the phone Check Point - Connection of TA or USB Cable - Charging current path - Battery Troubleshooting Procedur[...]

  • Página 96

    4. TROUBLE SHOOTING - 97 - [ Charger Troubleshooting Flow ] Start Check the pin and battery Connect terminals of I/O connector Connection OK? Change I/O connector Is the TA (or USB Cable) voltage 5.1V (or 5.0V)? Change TA (o r USB Cable) Is it charg ing properly After turning on Q301(or Q302 ) , Q302? END Change the board NO Yes NO Yes NO Yes[...]

  • Página 97

    4. TROUBLE SHOOTING - 98 - R313 Q 301 Q 302 Q 300 [ Charging part ( Main PCB Front ) ][...]

  • Página 98

    4. TROUBLE SHOOTING - 99 - 4. BB T rouble Shooting 4.1 1 USB T roubleshooting USB Initial sequence of U250/KU250 is : USB connected to U250/KU250 power on → USB_VBUS(Q300) go to 5V → USB_D+ go to 3.3V → USB_DAT is triggered → USB work. Start Q400 pi n 4 is 5 V? USB_D+ i s 3.3V? Change the Ma in board Check Q300 (pin 4) Check VA401 NO YES YE[...]

  • Página 99

    4. TROUBLE SHOOTING - 100 - 4.12 SIM Detect T roubleshooting USIM Initial sequence of U250/KU250 is : USIM_CLK,USIM_RST,USIM_DATA triggered → VREG_UIM_2.85V go to 2.8V → USIM IF work Start Work well? VREG_UIM_2.85V is 2.85V? USIM_P_CLK is run? Change the Ma in board End Check J300 Yes No YES NO Re-insert th e SIM card Change SIM card Work well?[...]

  • Página 100

    4. TROUBLE SHOOTING - 101 - 1 VREG_USI M_2.85V 2 USIM_P_RST_ N USIM_P_CLK 3 7 USIM_P_DAT A 1 2 3 7 6 5 USIM VA302 EVLC18S02003 VA301 EVL14K02200 C353 0.1u smd_1005h_5_r C352 smd_1005h_5_r 33p R317 15K EVLC18S02003 VA300 6 CLK 3 5 GND1 GND2 9 10 GND3 GND4 12 11 GND5 IO 7 2 RST 4 RSV1 8 RSV2 1 VCC VPP J300 HSSC-8P-18 L302 56nH VREG_USIM_2.85V USIM_P_[...]

  • Página 101

    4. TROUBLE SHOOTING - 102 - 4.13 Camera T roubleshooting Camera control signals are generated by MSM6245. 4.13.1 MEGA CAMERA Start Yes NO END Ca mera is OK? Check the camera connector and reconnect the camera Change the Ma in board Ca mera is OK Check the CAM_MCLK Change the camera Yes Yes NO NO NO END Yes Change the Ma in board Change the Ma in bo[...]

  • Página 102

    4. TROUBLE SHOOTING - 103 - 4.13.2 VGA CAMERA Start Yes NO END Ca mera is OK? Check the camera connector and reconnect the camera Change the Ma in board Ca mera is OK Check the CAM_MCLK Change the camera Yes Yes NO NO NO END Yes Change the Ma in board Change the Ma in board[...]

  • Página 103

    4. TROUBLE SHOOTING - 104 - C349 U303 U501 C348 C347 C350 C447 CAMERA LDO REV_D 6 BGND 2 GND NC 5 STBY 1 3 VIN VOUT 4 BH15LB1WHFV U501 1u C348 1u C447 C349 1u 1u C350 NC2 6 9 PGND VIN 18 VOUT1 VOUT2 7 RT9011-MGPQW U303 2 EN1 3 EN2 5 GND NC1 4 1u C347 VREG_CAM_DVDD_1.5V CAM_LDO_EN +VPWR VREG_CAM_DVDD_1.8V VREG_CAM_AVDD_2.8V +VPWR CAM_LDO_EN[...]

  • Página 104

    4. TROUBLE SHOOTING - 105 - 4.14 Keypad Backlight T roubleshooting Key Pad Back Light is on as below : Key pressing → KYBD_BACKLIGHT go to 0V → MAIN Key Backlight LED On Figure.Keypad backlight LED part Start Change the Main boa rd Check battery NO Yes Yes Key press Change the Main boa rd Yes NO +VPWR is abo ve 3.2V? KYBD_BACKLIGHT is 0V ? Back[...]

  • Página 105

    4. TROUBLE SHOOTING - 106 - 4.15 Main LCD T roubleshooting Main LCD control signals are generated by MSM6245. The signal path is : MSM6245 → CN400 → LCD Module Start GO to power on trouble s hooting Key LED is on? Change the LCD module Yes NO Press END key Disconnect and reconnec t The LCD connector END LCD display OK? No Yes END LCD display OK[...]

  • Página 106

    4. TROUBLE SHOOTING - 107 - 4.16 Receiver Path MSM6245 EAR1ON/EAR1OP → R421,R422 → Analog Switch(U401) → Receiver Start Connect the phone to network Equipment and setu p call Setup 1KHz tone out NO The sine wav e appears at L401, L402? YES NO Can you hear the ton e? Ch ange receiver YES END Ch ange the Main b oard The sine wave ap pears at R [...]

  • Página 107

    4. TROUBLE SHOOTING - 108 - R422 R421 U401[...]

  • Página 108

    4. TROUBLE SHOOTING - 109 - 4.17 Headset path MSM6245 HPH_R, HPH_L → C402/C401 → R407/R406 → CN401 (MMI Connector) Start Connect the phone to network equipment and s etup call. Setup 1KHz tone out and insert heads et. Can you hear the ton e? Ch ange the Hea dset YES NO END Sine wave app ears at R 407/R406? Ch ange the Main b oard YES NO[...]

  • Página 109

    4. TROUBLE SHOOTING - 110 - C401 C402 R406 C407 CN401[...]

  • Página 110

    4. TROUBLE SHOOTING - 111 - 4.18 Speaker phone path MSM6245 LINE_P,LINE_N → R429/R427, C423/C422, R431/R426 → Audio AMP(U402) → Analog Switch(U401) → Speaker Start Connect the phone to network equipment and s etup call Setup 1KHz tone out Sine wave appear s at R 429/R427 and C 423/C422 Ch ange the Main b oard NO SPK_AMP_EN is 2.6V? Ch ange [...]

  • Página 111

    4. TROUBLE SHOOTING - 112 - Analog Switch Audio Amp SPK+[...]

  • Página 112

    4. TROUBLE SHOOTING - 113 - 4.19 Main microphone MIC400 → MIC1P, MIC1N (MSM6245) Start MI C_BIAS(C416) is 1.8V Change main board NO M ake a call Change the MIC NO YES Ch ange the Main b oard M ake sound to M IC Work well? END YES NO YES Sine wave app ears at C 418/C419?[...]

  • Página 113

    4. TROUBLE SHOOTING - 114 - MIC400 C417 R424[...]

  • Página 114

    4. TROUBLE SHOOTING - 115 - 4.20 Headset microphone Headset → C210/C211 → MIC2P, MIC2N (MSM6245) Start H OOK _KEY is detected? Yes END M ake a call Change the MAIN board MICBIAS is biased by 1.8V? Ch ange the Main b oard Yes OK NO NO NO Change the heads et and retry YES Sine wave appear s at C210 /C211 ? Change the heads et or Ma in board and r[...]

  • Página 115

    4. TROUBLE SHOOTING - 116 - Ear_Sense_N MIC Input[...]

  • Página 116

    4. TROUBLE SHOOTING - 117 - 4.21 V ibrator The Vibrator is connected between +VPWR and VIB_DRV_N (PM6650 25 pin). The Vibrator motor driver is an SBI-programmable voltage out that is reference to +VPWR. Start Op erate the Vibrator NO Change vibrator or PM6650 Work well? End Yes RB521S-30 D400 TP401 L400 56nH TP400 +VPWR MOTOR_PWR-[...]

  • Página 117

    4. TROUBLE SHOOTING - 118 - +VPW R MOTOR_PWR-[...]

  • Página 118

    5. DOWNLOAD - 119 - 5.1 U250/KU250 DOWNLOAD 5.1.1 Introduction LGMDP is a LGE application that allow users to download images from PC to handset. LGMDP is a download tool with capabilities to upload image files to the handset. LGMDP is designed to be simple to use and easy enough for the beginner to upload executable images to the handset. LGMDP su[...]

  • Página 119

    5. DOWNLOAD - 120 - 5.1.2.1 Connecting to PC • Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable for the port to be connected for downloading images. Then click on the Connect button. (The port number(COM7) shall be different from that of the port number in the snapshot.) • The status Ready is disp[...]

  • Página 120

    5. DOWNLOAD - 121 - 1) Image Folder indicates loot path where all image files are placed. To change location of the default image path, select Browse… button. The edit box shows the file path where images are located. Please note that all images should be located in a selected folder. 2) Click on the Browse… button to select image files to be d[...]

  • Página 121

    5.1.2.2 Choosing image files • Select the image folder, where all the image files are located, by clicking on the Browse…. (The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.) 5. DOWNLOAD - 122 - U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/K[...]

  • Página 122

    5. DOWNLOAD - 123 - • Select the path on the Image Folder by clicking on the Browse..., then the LGMDP will automatically load images accordingly. Also you can select images by manually. For instance, select the path of AMSS Modem Image file by clicking on the Browse… button. The selected AMSS image will be downloaded to the handset from the pa[...]

  • Página 123

    • If NV restore is failed, then the NV Data(*.nv2) is erased permanently. In this case, choose the desired NV file to be downloaded on the handset. To enable this simply check the box or select the NV file from the LGMDP installation directory by clicking on the Browse… button. • Click on the START button to start downloading. A summary of th[...]

  • Página 124

    5. DOWNLOAD - 125 - • This message box informs that a new file for NV backup will be created in the displayed file name in the LGMDP installation directory. • Backing up NV data and backed up NV data will be stored in the LGMDP installation directory. • Erasing the existing directories and files before the Module image is downloaded. • Down[...]

  • Página 125

    5. DOWNLOAD - 126 - • Rebooting the handset and re-establishing the connection • Restoring NV data which backed up in the Backing up process. User can also restore NV data using NV Default image selection. • Rebooting the handset and re-establishing the connection • Erasing the existing directories and files before downloading the selected [...]

  • Página 126

    5. DOWNLOAD - 127 - • Downloading Media image in progress • Downloading Module image in progress • Downloading process has completed successfully U250/KU250 U250/KU250 U250/KU250[...]

  • Página 127

    5. DOWNLOAD - 128 - 5.1.2.4 T ools • Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is designed to monitor USB connectivity and check where the COM has been installed . Select Device Manager from the Tools of the file menu.[...]

  • Página 128

    5. DOWNLOAD - 129 - 5.1.3 T roubleshooting Download Errors 1) When the phone does not work after downloading has been completed. 2) Media Erasing Error 3) NV Restore Error 5.1.3.1 When the phone does not work • Reboot the phone in the emergency mode (Simultaneously press 2, 5, and PWR red keys) and then try to download all the images up to AMSS. [...]

  • Página 129

    5. DOWNLOAD - 130 - • The below dialog shows parameters of Select Port when phone is booted in Emergency mode. Click on the Connect button to continue. • Choose Image file after clicking on the Browse… button. Make sure that you have chosen the right image file. After choosing valid images, then click on the Start button to start downloading [...]

  • Página 130

    5. DOWNLOAD - 131 - 5.1.3.2 NV Restore Error • Snapshot showing the NV Restore error. Next slide shows the remedial procedure to adopt. • Connect the handset and Press the Connect button in the Select Port window. (Enable state in the window indicates that the Phone has been detected and is ready to download.) U250/KU250 U250/KU250 U250/KU250[...]

  • Página 131

    5. DOWNLOAD - 132 - • Click on Browse… . Select the LGMDP installation directory and a list of NV Backup files(*.nv2) will be shown. These nv files were saved every time NV Backup option was selected, and the name of the nv file is determined based on the time when NV Backup was done. Choose the desired NV file to be downloaded on the handset, [...]

  • Página 132

    5. DOWNLOAD - 133 - 5.1.4 Caution 1) Multi-downloading using the USB hub is not recommendable. 2) If you see the message ‘cal mode’ after ‘completing download’, you must do NV restore and image (media and module) download. 3) The NV data saved at LGMDP folder as following format. 4) Recommended that the Module and Media Image have to be dow[...]

  • Página 133

    6. BLOCK DIAGRAM - 134 - 6.1 GSM & UMTS RF Block 6. BLOCK DIAGRAM [Fig 2.1] U250/KU250 RF Functional Block Diagram[...]

  • Página 134

    6. BLOCK DIAGRAM - 135 - [Table 2.1] RF Block Component[...]

  • Página 135

    6. BLOCK DIAGRAM - 136 - 6.2 Interface Diagram 6.2.1 RTR6275 & MSM6245 Interface Diagram [Fig 2.2] RTR6275 & MSM6245 Interface Diagram[...]

  • Página 136

    6. BLOCK DIAGRAM - 137 - 6.2.2 Memory Interface [Fig 2.3] Memory Interface Diagram ADDRESS[14:0][...]

  • Página 137

    6. BLOCK DIAGRAM - 138 - 6.2.3 USB,UART ,SIM,JT AG Interface [Fig 2.4] USB, UART, SIM, JTAG Interface[...]

  • Página 138

    6. BLOCK DIAGRAM - 139 - Main RF signal Control signal Control signal Description Comment UM TS P A _CTL signal PA _ R 0 UMTS Tx High/Low Power Control GSM P A_CTL signal GS M_ PA _B AND DCS or PCS /G SM Mod e Selection GS M_ PA _E N Power A mp Gain Control Enable GSM_P A _R A M P Po wer A mp Gain Co ntrol AN T_ SEL 0,1 Ant Switch M odule M ode Sel[...]

  • Página 139

    6. BLOCK DIAGRAM - 140 - 6.2.4 Placement *T op Side LGMC[...]

  • Página 140

    6. BLOCK DIAGRAM - 141 - *Bottom Side LGMC[...]

  • Página 141

    - 142 -[...]

  • Página 142

    - 143 - LGMC Sign & Name Sheets Checked Sheet/ Approved Rev.D 1 2 GSM 1800/GSM 1900 TX HIGH F E LOW Rev.D Date BLUETOOTH REV_1.2 Rev.D 5 GSM_PA_BAND D 14 MODE F DRAWING GSM/EDGE 9 20dB 8.86dB D C Designer 4 GSM 1800/GSM 1900 RX TCXO VTUNE-Connected directly to GND A 6 LG Electronics Inc. 7 KU250 MODEL LG Electronics Inc. DRAWING HIGH LOW (1%) 1[...]

  • Página 143

    - 144 - LGMC VBAT PWR URXD UTXD 3G 2.5G GND RX TX UFLS ON_SW 150K : 470K : 1.97V Sheets 16-bit, NAND, Trusted Native, ARM JTAG MSM pin W18 DRAWING NAME A KEYPAD Designer 10 E 6 BOOT_MODE3 BOOT_MODE2 BOOT_MODE1 150K : 300K : 1.73V PMIC_AUXIN[1] 9 Checked (CODEC VSS) 14 D12(VDDA1) and F12(DAC_REF) NO. B ADC 12 A 12 Near to B18 (VDD_PLL) 1% 150K : 68K[...]

  • Página 144

    - 145 - LGMC NAME VDD_RF : 0.1uF A 3 2 6 1608 4 13 VDD_ANA : 0.1uF 7 VDD_MSMC : 4.7uF E 9 MCP(512Mb NAND + 512Mb 1 piece SDRAM) 5 15 Draw the Artwork_line thickly !!!!! REV_B 1 C 1608 --->> USB_VBUS , FLASH_DRV_N , KPD_DRV_N , KEY_ON_SW_N , MOT_PWR- LCD LDO D VDD_MAIN : 0.1uF REV_D REV_B 8 Checked VDD_RUIM : 0.1uF VDD_MSME : 4.7uF Sign & [...]

  • Página 145

    - 146 - LGMC D REV_B : EDTY0008606 --> EDTY0008601 LG Electronics Inc. VT_CAMERA_CONNECTOR REV_B F Sheet/ 2 5 1 B E MIC Sign & Name 15 DRAWING 7 HOT3 A 7 D MODEL 4 REV_1.0 REV_C : 20K --> 3K 2 E REV_1.2 4 Sheets REV_B D LG Electronics Inc. LG(42)-A-5505-10:01 B 16 NAME Audio AMP I/O CONNECTOR REV_B : SUMY0010301 --> SUMY0003802 VBAT Se[...]

  • Página 146

    - 147 - LGMC 8. PCB LA YOUT U250/KU250[...]

  • Página 147

    - 148 - LGMC 8. PCB LA YOUT U250/KU250[...]

  • Página 148

    9. Calibration & RF Auto T est Program (Hot Kimchi) - 149 - 9. Calibration & RF Auto T est Program (Hot Kimchi) 9.1 Configuration of HOT KIMCHI 9.1.1 Configuration of directory Cm_Grut Debug Common d ll_serialat Log LG_CL_009.dll Auto Cal CalAuto : Dir ectory : File C: At_Serial_Cmd.xml Diag_NV6250_RevB.dll Diag_NV.dll Diag_NV6275.dll DLL_E[...]

  • Página 149

    9. Calibration & RF Auto T est Program (Hot Kimchi) - 150 - Hot_Kimchi M odel Debug KU250 : Dir ectory : File image Log Log AutoSetup_110.xml Cal_Setup_Test.xml Ezlooks.xml LG_RfCal_Q3G6280N _Polar_006.d ll Procedure_KU250_103.xml script_auto_001.xml script_cal_003.xml Spec_3GPP_030.xml LG _RfTest_E5515C_211.dll ComLMPLib_11.dll Dll_EzLooksMQ_0[...]

  • Página 150

    9. Calibration & RF Auto T est Program (Hot Kimchi) - 151 - Result UI Auto image : Dir ectory : File Cal CalAuto result.bmp LG_UI_Ad6500_002.dll KU250 KU250 KU250 LG_UI_EmKU250_001.dll LG_UI_Qu6250_003.dll LG_UI_Qu6275_004.dll dll,ocx MFCO42D.DLL MSVCP60D.DLL (Win98)MFCD DLL COPY.bat (W in2000)MFCD DLL COPY.bat (WinXP)MFCD DLL COPY.bat MFC42D.D[...]

  • Página 151

    9. Calibration & RF Auto T est Program (Hot Kimchi) - 152 - 9.2 How to use HOT KIMCHI * Procedure 1. Click “Logic Operation” of “SETTING” menu bar 2. Select “UART Port” that PC can communicate with the phone 3. Select “LOGIC MODE” that you want - Logic Mode -> 1: Calibration Only ➀ ➁ ➂[...]

  • Página 152

    9. Calibration & RF Auto T est Program (Hot Kimchi) - 153 - * Procedure 4. Select the model name “U250/KU250” 5. Click “Start” button KU 250 Select "U250/KU250" Click "Star t" ➃ ➄[...]

  • Página 153

    10. Factory T est Mode - 154 - 10.1. T est Program Setting 1) Open “LG FTM GUI” 2) Click “Options >> Port Settings” 3) Select Com Port and click “OK” 10. Factory T est Mode[...]

  • Página 154

    10. Factory T est Mode - 155 - 10.2. WCDMA T est Mode 1) Click “T ools >> FTM GUI WCDMA” 2) Select “FTM” Mode 3) Select RF Frequencies, insert “9750” in “Uplink chan” and push “Enter”. Then “2140” is written at Rx UHF automatically . 4) For Deciding to “TX AGC”, insert 380 as a maximum value . And then WCDMA Power [...]

  • Página 155

    10. Factory T est Mode - 156 - 10.3. GSM T est Mode 1) T o switch GSM Mode, Select Mode -> GSM mode at menu commands 2) Select RF Mode, Click “GSM” or “GSM1800” or “GSM1900” 3) Write wanted channel. W e usually set “1” 4) For Deciding to “P A DAC V alue”, insert 14300 as a maximum value 5) Click “Tx On” or “Tx Off”. 6[...]

  • Página 156

    - 157 - 1 2 3 4 5 6 7 8 12 13 15 16 17 18 19 20 22 28 29 30 31 32 35 34 33 36 23 24 25 26 27 37 14 11 10 9 1 1. EXPLODED VIEW & REPLACEMENT P ART LIST 1 1.1 EXPLODED VIEW[...]

  • Página 157

    - 158 -[...]

  • Página 158

    11 . EXPLODED VIEW & REPLACEMENT P ART LIST - 159 - 1 1.2 Replacement Parts <Mechanic component> Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Level Location No. Description Part Number Spec Color Remark 1I MT,BAR/FLIP TIMT0000614 Black 2 AAAY00 ADDITION AAAY0219401 Black 3 MCJA00 COVER,BATTERY M[...]

  • Página 159

    11 . EXPLODED VIEW & REPLACEMENT P ART LIST - 160 - Level Location No. Description Part Number Spec Color Remark 4 MTAB01 TAPE,PROTECTION MTAB0178301 COMPLEX, (empty), , , , , Without Color 32 4 MTAD00 TAPE,WINDOW MTAD0065901 COMPLEX, (empty), 0.2, , , , Without Color 30 4 MWAE00 WINDOW,CAMERA MWAE0024501 COMPLEX, (empty), 1.0, , , , Without Co[...]

  • Página 160

    11 . EXPLODED VIEW & REPLACEMENT P ART LIST - 161 - Level Location No. Description Part Number Spec Color Remark 3 GMEY00 SCREW MACHINE,BIND GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK Without Color 33 3 SAFY00 PCB ASSY,MAIN SAFY0196602 15 4 SAFB00 PCB ASSY,MAIN,INSERT SAFB0072901 5 ACKA00 CAN ASSY,SHIELD ACKA0002101 Without Color 17 5 SUMY0[...]

  • Página 161

    11 . EXPLODED VIEW & REPLACEMENT P ART LIST - 162 - Level Location No. Description Part Number Spec Color Remark 6 C123 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C124 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C126 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP 6 C127 CAP,CERAMIC,CHIP ECCH000018[...]

  • Página 162

    11 . EXPLODED VIEW & REPLACEMENT P ART LIST - 163 - Level Location No. Description Part Number Spec Color Remark 6 C173 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 6 C174 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP 6 C176 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C177 CAP,CHIP,MAKER ECZH000440[...]

  • Página 163

    11 . EXPLODED VIEW & REPLACEMENT P ART LIST - 164 - Level Location No. Description Part Number Spec Color Remark 6 C222 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C223 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C225 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C226 CAP,CERAMIC,CHIP ECCH0000155 10 n[...]

  • Página 164

    11 . EXPLODED VIEW & REPLACEMENT P ART LIST - 165 - Level Location No. Description Part Number Spec Color Remark 6 C319 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C320 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C321 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C322 CAP,CERAMIC,CHIP EC[...]

  • Página 165

    11 . EXPLODED VIEW & REPLACEMENT P ART LIST - 166 - Level Location No. Description Part Number Spec Color Remark 6 C357 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 6 C358 CAP,CERAMIC,CHIP ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP 6 C389 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 6 C400 CAP,CERAMIC,CHIP[...]

  • Página 166

    11 . EXPLODED VIEW & REPLACEMENT P ART LIST - 167 - Level Location No. Description Part Number Spec Color Remark 6 C436 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP 6 C437 CAP,CHIP,MAKER ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 C438 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C439 CAP,CHIP,MAKER ECZH[...]

  • Página 167

    11 . EXPLODED VIEW & REPLACEMENT P ART LIST - 168 - Level Location No. Description Part Number Spec Color Remark 6 FL405 FILTER,EMI/POWER SFEY0007103 SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free 6 FL406 FILTER,EMI/POWER SFEY0007103 SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free 6 FL407 FILTER,EMI/POWER SFEY0007103 SM[...]

  • Página 168

    11 . EXPLODED VIEW & REPLACEMENT P ART LIST - 169 - Level Location No. Description Part Number Spec Color Remark 6 Q301 TR,FET,P-CHANNEL EQFP0004701 TSOP6 ,1.5 W,20 V,-5 A,R/TP ,P-CHANNEL 20-V(D-S) MOSFET, Pb free 6 Q302 TR,BJT,PNP EQBP0009901 TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680 6 R100 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1[...]

  • Página 169

    11 . EXPLODED VIEW & REPLACEMENT P ART LIST - 170 - Level Location No. Description Part Number Spec Color Remark 6 R214 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP 6 R215 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP 6 R300 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP 6 R301 RES,CHIP,MAKER ERHZ0000406 100 Kohm[...]

  • Página 170

    11 . EXPLODED VIEW & REPLACEMENT P ART LIST - 171 - Level Location No. Description Part Number Spec Color Remark 6 R429 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP 6 R430 RES,CHIP,MAKER ERHZ0000499 5600 ohm,1/16W ,J ,1005 ,R/TP 6 R431 RES,CHIP,MAKER ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP 6 R433 RES,CHIP ERHY0013101 2.7 ohm,1/16W ,J[...]

  • Página 171

    11 . EXPLODED VIEW & REPLACEMENT P ART LIST - 172 - Level Location No. Description Part Number Spec Color Remark 6 VA302 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005 6 VA303 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005 6 VA304 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005 6 VA305 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005 6 VA306 VARISTOR SEVY0004001 [...]

  • Página 172

    11 . EXPLODED VIEW & REPLACEMENT P ART LIST - 173 - Level Location No. Description Part Number Spec Color Remark 6 R417 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R418 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R419 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R423 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/T[...]

  • Página 173

    11 . EXPLODED VIEW & REPLACEMENT P ART LIST - 174 - 1 1.3 Accessory Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Level Location No. Description Part Number Spec Color Remark 3 SBPL00 BATTERY PACK,LI-ION SBPL0090501 3.7 V,950 mAh,1 CELL,PRISMATIC ,KU250 Europe BATT, IP, Pb-Free ,; ,3.7 ,950 ,0.2C ,PRIS[...]

  • Página 174

    Note[...]

  • Página 175

    Note[...]