Intel 945P manual

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Bom manual de uso

As regras impõem ao revendedor a obrigação de fornecer ao comprador o manual com o produto Intel 945P. A falta de manual ou informações incorretas fornecidas ao consumidor são a base de uma queixa por não conformidade do produto com o contrato. De acordo com a lei, pode anexar o manual em uma outra forma de que em papel, o que é frequentemente utilizado, anexando uma forma gráfica ou manual electrónicoIntel 945P vídeos instrutivos para os usuários. A condição é uma forma legível e compreensível.

O que é a instrução?

A palavra vem do latim "Instructio" ou instruir. Portanto, no manual Intel 945P você pode encontrar uma descrição das fases do processo. O objetivo do manual é instruir, facilitar o arranque, a utilização do equipamento ou a execução de determinadas tarefas. O manual é uma coleção de informações sobre o objeto / serviço, um guia.

Infelizmente, pequenos usuários tomam o tempo para ler o manual Intel 945P, e um bom manual não só permite conhecer uma série de funcionalidades adicionais do dispositivo, mas evita a formação da maioria das falhas.

Então, o que deve conter o manual perfeito?

Primeiro, o manual Intel 945P deve conte:
- dados técnicos do dispositivo Intel 945P
- nome do fabricante e ano de fabricação do dispositivo Intel 945P
- instruções de utilização, regulação e manutenção do dispositivo Intel 945P
- sinais de segurança e certificados que comprovam a conformidade com as normas pertinentes

Por que você não ler manuais?

Normalmente, isso é devido à falta de tempo e à certeza quanto à funcionalidade específica do dispositivo adquirido. Infelizmente, a mesma ligação e o arranque Intel 945P não são suficientes. O manual contém uma série de orientações sobre funcionalidades específicas, a segurança, os métodos de manutenção (mesmo sobre produtos que devem ser usados), possíveis defeitos Intel 945P e formas de resolver problemas comuns durante o uso. No final, no manual podemos encontrar as coordenadas do serviço Intel na ausência da eficácia das soluções propostas. Atualmente, muito apreciados são manuais na forma de animações interessantes e vídeos de instrução que de uma forma melhor do que o o folheto falam ao usuário. Este tipo de manual é a chance que o usuário percorrer todo o vídeo instrutivo, sem ignorar especificações e descrições técnicas complicadas Intel 945P, como para a versão papel.

Por que ler manuais?

Primeiro de tudo, contem a resposta sobre a construção, as possibilidades do dispositivo Intel 945P, uso dos acessórios individuais e uma gama de informações para desfrutar plenamente todos os recursos e facilidades.

Após a compra bem sucedida de um equipamento / dispositivo, é bom ter um momento para se familiarizar com cada parte do manual Intel 945P. Atualmente, são cuidadosamente preparados e traduzidos para sejam não só compreensíveis para os usuários, mas para cumprir a sua função básica de informação

Índice do manual

  • Página 1

    Document Number: 307504-004 Intel ® 945G/945GZ/945GC/ 945P/945PL Express Chipset Family Thermal and Mechanical De sign Guidelines (TMDG) - For the Intel ® 82945G/82945GZ/82945GC Graphics Memory Controller Hub (GMCH) and Intel ® 82945P/82945PL Memory Controller Hub (MCH) February 2008[...]

  • Página 2

    2 Thermal and Mechanical Design Guidelines INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNE CTION WITH INTEL® PRODUCTS . NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIAB[...]

  • Página 3

    Thermal and Mechanical Design Guidelines 3 Contents 1 Introduc tion ..................................................................................................... 7 1.1 Terminology .......................................................................................... 8 1.2 Reference Do cuments ............................................[...]

  • Página 4

    4 Thermal and Mechanical Design Guidelines Figures Figure 1. (G)MCH Non-Grid Array ...................................................................... 12 Figure 2. 0° Angle Attach Method ology (top view, not to scale).............................. 16 Figure 3. 0° Angle Attach Heatsink Modifi cations (generic heatsink side and bottom view shown[...]

  • Página 5

    Thermal and Mechanical Design Guidelines 5 Revision History Revision Number Description Date -001 • Initial Rel ease May 2005 -002 • Added Intel ® 82945PL specific ations October 2005 -003 • Added Intel ® 82945GZ specificati ons December 2005 -004 • Added Intel ® 82945GC specific ations F ebruary 2008 §[...]

  • Página 6

    6 Thermal and Mechanical Design Guidelines[...]

  • Página 7

    Introduction Thermal and Mechanical Design Guidelines 7 1 Introduction As the complexity of computer systems increases, so do power dissi pati on requirements. The additional power of next generati on systems must be properly dissipated. Heat can be dissi pated using improved system cooli ng, selective use of ducting, and/or active/passive heatsink[...]

  • Página 8

    Introduction 8 Thermal and Mechanical Design Guidelines 1.1 Terminology Term Description BGA Ball Grid Array. A package type defined by a resin-fiber substrate where a die is mounted and bonded. The primary electrical interface is an array of solder balls attached to the substrate opposite the die and molding compound. FC-BGA Flip Chip Ball Grid Ar[...]

  • Página 9

    Introduction Thermal and Mechanical Design Guidelines 9 1.2 Reference Documents Document Comments Intel ® 945G/945GZ/945P/945PL Express Chi pset Family Datasheet http://developer.intel.com/des ign/chipset s/datashts/307502. htm Intel ® I/O Controller Hub 7 (ICH7) Datasheet http://developer.intel.com//de sign/chipsets/datashts/30701 3.htm Intel ®[...]

  • Página 10

    Introduction 10 Thermal and Mechanical Design Guidelines[...]

  • Página 11

    Product Specifications Thermal and Mechanical Design Guidelines 11 2 Product Specifications This ch apter p rovide s the pa ckage d escrip tion and loading specific ations. T he chap ter also provid es compon ent therma l specificat ions and th ermal desig n power de scriptions for the (G)MCH. 2.1 Package Description The (G) MCH is availab le in a [...]

  • Página 12

    Product Specifications 12 Thermal and Mechanical Design Guidelines Figure 1. (G)MCH Non-Grid Array 2.2 Package Loading Specifications Table 1 provides static lo ad spec ifications fo r the chip set pa ckage. T his mechan ical maximum load limit sh ould not be e xceeded during heat sink assembly, s hipping conditions, or standard use conditions. Als[...]

  • Página 13

    Product Specifications Thermal and Mechanical Design Guidelines 13 2.3 Thermal Specifications To ensur e proper operation a nd reliabilit y of the (G) MCH, the temp erature mu st be at or below th e maximum value sp ecified in Table 2. System and component level thermal enhancements are required to dissipate the heat generated and mai ntain the (G)[...]

  • Página 14

    Product Specifications 14 Thermal and Mechanical Design Guidelines 2.4.1 Methodology 2.4.1.1 Pre-Silicon To dete rmine TDP for pre-silic on produ cts in deve lopment, it is necessa ry to make estimates b ased on a nalytical models. T hese mode ls rely on exte nsive knowledg e of the past chipset power dissipation behavi or al ong with knowledge of [...]

  • Página 15

    Thermal Metrology Thermal and Mechanical Design Guidelines 15 3 Thermal Metrology The system designer must measure temperatures to accurately determine the thermal performance of the system. Intel has established gui del ines for proper techniques of measuring (G)MCH component case temperatures. 3.1 Case Temperature Measurements To ensu re function[...]

  • Página 16

    Thermal Metrology 16 Thermal and Mechanical Design Guidelines Figure 2. 0° Angle Attach Methodology (top view, not to scale) Figure 3. 0° Angle Attach Heatsink Modifi cations (generic heatsink side and bottom view shown, not to scale) 3.2 Airflow Characterization Figure 4 describes the recommended location for ai r temperature measurements measur[...]

  • Página 17

    Thermal Metrology Thermal and Mechanical Design Guidelines 17 Figure 4. Airflow Temperature Measurement Locations Airflow velocity should be me asured u sing industry standard air velocity sensors. Typical airflow sensor technol ogy may include hot wire anemometers. Figure 4 provide s guidance for airflow velo city measure ment locat ions. These lo[...]

  • Página 18

    Thermal Metrology 18 Thermal and Mechanical Design Guidelines[...]

  • Página 19

    Reference Thermal Solution Thermal and Mechanical Design Guidelines 19 4 Reference Thermal Solution The reference component thermal solution fo r the (G)MCH for ATX platforms uses two ramp retainers, a wire preload cli p, and four custom MB anchors. The Intel Balanced Technology Extended (BTX) reference design uses a Z-clip attach for the (G)MCH he[...]

  • Página 20

    Reference Thermal Solution 20 Thermal and Mechanical Design Guidelines Figure 5. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on an ATX Platform Proc _HS_Orient_ATX Airflow Direction Airflow Di rection Airflow Direction Airflo w Direc tion Airflow Di recti o n Airfl ow D irecti on Airflow Di recti o n Airfl ow Di rectio n (G[...]

  • Página 21

    Reference Thermal Solution Thermal and Mechanical Design Guidelines 21 Figure 6. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on a Balanced Technology Extended (BTX) Platform Top Vi ew Balanced Tec hnol ogy Extende d (BTX ) Th ermal Mo d ule As s e mbly Ov er Process or (G)MCH Airf low D irection Proc _HS_O ri ent 4.2 Mechan[...]

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    Reference Thermal Solution 22 Thermal and Mechanical Design Guidelines Figure 7. ATX GMCH Heatsink Installed on Board[...]

  • Página 23

    Reference Thermal Solution Thermal and Mechanical Design Guidelines 23 Figure 8. Balanced Technology Extended (BTX) GMCH Heatsink Installed on Board[...]

  • Página 24

    Reference Thermal Solution 24 Thermal and Mechanical Design Guidelines 4.4 Environmental Reliability Requirements The envir onmental r eliability re quiremen ts for the referenc e thermal s olution are shown in Table 4. These s hould be conside red as genera l guidelin es. Validat ion test plans should be defined by the user based on antici pated u[...]

  • Página 25

    Enabled Suppliers Thermal and Mechanical Design Guidelines 25 Appendix A Enabled Suppliers Current suppliers for the Intel ® 945G/945GZ/945GC/945P/945PL Express chipset (G)MCH re ference thermal solu tion are list ed in Table 5 and Table 6. Table 5. (G)MCH ATX Intel Reference Heatsink Enabled Suppliers Supplier Intel Part Number Vendor Part Number[...]

  • Página 26

    Enabled Suppliers 26 Thermal and Mechanical Design Guidelines Table 6. (G)MCH Balanced Technology Extended (BTX) Intel Reference Heatsink Enabled Suppliers Supplier Intel Part Number Vendor Part Number Contact Information CCI (Chaun Choung Technology Corp.) C57359-001 00C863401A Monica Chih - +886 ( -2) - 29952666 monica_chih@ccic.com.tw Harry Lin [...]

  • Página 27

    Mechanical Drawings Thermal and Mechanical Design Guidelines 27 Appendix B Mechanical Drawings The following table list s the mec hanical dra wings availab le in this do cument. Drawing Name Page Number (G)MCH Package Drawing 28 (G)MCH Component Keep-Out Restrictions for ATX Platforms 29 (G)MCH Component Keep-Out Restrictions for Balanced Technolog[...]

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    Mechanical Drawings s 28 Thermal and Mechanical Design Guidelines Figure 9. (G)MCH Package Drawing[...]

  • Página 29

    Mechanical Drawings Thermal and Mechanical Design Guidelines 29 Figure 10. (G)MCH Component Keep-Out Restrictions for ATX Platf orms 8X PLATED THR U H O LE 8X 1.42[.056] T RA CE K E E P OUT 0.97 .038 [] 4 .1575 [] 74 2.9134 [] 47 1.85 [] 60.92 2.398 [] 4X 8 . 7 6 .345 [] 4X 8.76 .345 [] 4X 1.84 .072 [] 4X 5.08 .200 [] 81 3.189 [] 60.6 2.386 [] 26.7[...]

  • Página 30

    Mechanical Drawings s 30 Thermal and Mechanical Design Guidelines Figure 11. (G)MCH Component Keep-Out Restrictions for Balanced Technology Extended (BTX) Platforms 4X 8. 76 .3 4 5 [] 4X 4. 19 .1 6 5 [] 4X 1. 85 . 073 [] 4X 5. 08 .2 0 0 [] 4X 2. 1 . 08 3 [] 8X P L A T E D T HRU HO L E 0. 97 . 038 [] 48. 26 1. 900 [] 55. 8 8 2. 2 0 0 [] 2X 3. 3 .1 3[...]

  • Página 31

    Mechanical Drawings Thermal and Mechanical Design Guidelines 31 Figure 12. (G)MCH Reference Heatsink for ATX Platf orms – Sheet 1 2 X 58. 6 2.307 [] 2X 80 3. 150 [] 47 1.850 [] 36 1.417 [] 8X 2 . 7 0. 15 .1 0 6 .005 [] 7X E Q U A L SP A CING T YP 6 3. 7 5 0.15 .148 .00 5 [] T YP 3 5 .5 1.398 [] 2X 6 48 0.15 1.890 . 005 [] 2X 6 59. 28 0. 15 2.334 [...]

  • Página 32

    Mechanical Drawings s 32 Thermal and Mechanical Design Guidelines Figure 13. (G)MCH Reference Heatsink for ATX Platf orms – Sheet 2 2X 6 0.6 .0 2 4 [] TYP 6 2.75 0. 1 .108 . 003 [] 6 1. 5 0. 15 . 059 .00 5 [] 6 6. 72 0.15 . 265 .005 [] R0 . 5 .02 0 [] 2X 15 .59 1 [] 16 .63 0 [] 25. 5 1. 004 [] 66 2. 5984 [] TYP 4 .1575 [] TY P 135 TYP R 1 .03 9 [[...]

  • Página 33

    Mechanical Drawings Thermal and Mechanical Design Guidelines 33 Figure 14. (G)MCH Reference Heatsink for ATX Platf orms – A nchor 6 5. 21 0. 12 .20 5 . 004 [] 4X 6 7. 83 0.12 .30 8 . 004 [] 2X 10. 13 0. 12 .3 9 9 .004 [] 2X 6 0.77 0.1 .03 0 . 003 [] 7. 62 0. 15 .3 00 .005 [] 2.5 0.15 .098 .00 5 [] 0. 64 0 -0.07 .0 25 +. 0 0 0 -.002 [] 6 5.08 0.12[...]

  • Página 34

    Mechanical Drawings s 34 Thermal and Mechanical Design Guidelines Figure 15. (G)MCH Reference Heatsink for ATX Platf orms – R amp Retainer Sheet 1 2X 31.1 1.225 [] 6 2 0.05 .0 7 9 .0 01 [] 6 61. 51 2.422 [] 6 70.49 2. 775 [] 2X 27.95 1.1 00 [] 3 .11 8 [] NOT ES: 1. T HIS DRA W ING T O BE U S E D IN CO NJUNCT IO N W IT H SUP P LIED 3D DATABASE FIL[...]

  • Página 35

    Mechanical Drawings Thermal and Mechanical Design Guidelines 35 Figure 16. (G)MCH Reference Heatsink for ATX Platf orms – R amp Retainer Sheet 2 B B 6 1. 75 .06 9 [] 2.7 5 .108 [] 6 0.5 .02 0 [] 4 .15 7 [] 6 5. 56 . 219 [] 2X 6 2.9 . 114 [] 6.4 . 252 [] 6 3. 15 . 124 [] 6 4. 7 5 . 187 [] 3 .118 [] 5.2 . 205 [] 1. 19 . 047 [] 6.5 5 .25 8 [] 2X 6 5[...]

  • Página 36

    Mechanical Drawings s 36 Thermal and Mechanical Design Guidelines Figure 17. (G)MCH Reference Heatsink fo r ATX Platforms – Wire Preload Clip A A A A 46. 6 0. 5 1. 8 3 5 .0 19 [] 2X 90 TYP R 1 . 8 .07 1 [] 19.3 0. 5 .76 0 .0 19 [] 27.3 0. 5 1.075 .01 9 [] 4 27. 7 1. 090 [] 61.74 0. 5 2. 431 .019 [] 37.06 1.459 [] 2. 65 . 104 [] NOT ES: 1 . T HI S[...]

  • Página 37

    Mechanical Drawings Thermal and Mechanical Design Guidelines 37 Figure 18. (G)MCH Reference Heatsink for Bala nced Technology Extended (BTX) Platforms A 24.2 .953 [] 47.8 8 1.885 [] 15 X EQ U AL SPAC ES () 1.94 .08 [] 2X 1.17 .046 [] 3.4 0. 2 .134 .007 [] () 15 .59 1 [] 19 .748 [] 19 .74 8 [] 2X 1.2 .04 7 [] 2X 7.25 0.2 .28 5 .0 07 [] 3 0.2 .118 .0[...]

  • Página 38

    Mechanical Drawings s 38 Thermal and Mechanical Design Guidelines Figure 19. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms – Clip A A A A B B 2X 90 27. 3 1. 075 [] 47. 36 1. 865 [] R TYP 1. 3 . 051 [] 8. 87 1. 25 .3 4 9 .0 4 9 [] 4 X R 1 .8 .0 7 1 [] 3. 8 . 150 [] 62. 6 1 2. 465 . 039 [] 25. 14 . 990 [] W IR E T E R M[...]

  • Página 39

    Mechanical Drawings Thermal and Mechanical Design Guidelines 39 Figure 20. (G)MCH Reference Heatsink for Balanced Tec hnology Extended (BTX) Platforms – Heatsink Assembly () 55.88 2.200 [] C () 33 1.299 [] B () 19 .748 [] () 19 .748 [] N O TES: 1 . THIS DRAWIN G TO BE USE D IN C O NJ UN CT IO N WITH SUP P L IED 3 D DATABASE F I L E. AL L D IMENS [...]