HP nx6130 manual

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Bom manual de uso

As regras impõem ao revendedor a obrigação de fornecer ao comprador o manual com o produto HP nx6130. A falta de manual ou informações incorretas fornecidas ao consumidor são a base de uma queixa por não conformidade do produto com o contrato. De acordo com a lei, pode anexar o manual em uma outra forma de que em papel, o que é frequentemente utilizado, anexando uma forma gráfica ou manual electrónicoHP nx6130 vídeos instrutivos para os usuários. A condição é uma forma legível e compreensível.

O que é a instrução?

A palavra vem do latim "Instructio" ou instruir. Portanto, no manual HP nx6130 você pode encontrar uma descrição das fases do processo. O objetivo do manual é instruir, facilitar o arranque, a utilização do equipamento ou a execução de determinadas tarefas. O manual é uma coleção de informações sobre o objeto / serviço, um guia.

Infelizmente, pequenos usuários tomam o tempo para ler o manual HP nx6130, e um bom manual não só permite conhecer uma série de funcionalidades adicionais do dispositivo, mas evita a formação da maioria das falhas.

Então, o que deve conter o manual perfeito?

Primeiro, o manual HP nx6130 deve conte:
- dados técnicos do dispositivo HP nx6130
- nome do fabricante e ano de fabricação do dispositivo HP nx6130
- instruções de utilização, regulação e manutenção do dispositivo HP nx6130
- sinais de segurança e certificados que comprovam a conformidade com as normas pertinentes

Por que você não ler manuais?

Normalmente, isso é devido à falta de tempo e à certeza quanto à funcionalidade específica do dispositivo adquirido. Infelizmente, a mesma ligação e o arranque HP nx6130 não são suficientes. O manual contém uma série de orientações sobre funcionalidades específicas, a segurança, os métodos de manutenção (mesmo sobre produtos que devem ser usados), possíveis defeitos HP nx6130 e formas de resolver problemas comuns durante o uso. No final, no manual podemos encontrar as coordenadas do serviço HP na ausência da eficácia das soluções propostas. Atualmente, muito apreciados são manuais na forma de animações interessantes e vídeos de instrução que de uma forma melhor do que o o folheto falam ao usuário. Este tipo de manual é a chance que o usuário percorrer todo o vídeo instrutivo, sem ignorar especificações e descrições técnicas complicadas HP nx6130, como para a versão papel.

Por que ler manuais?

Primeiro de tudo, contem a resposta sobre a construção, as possibilidades do dispositivo HP nx6130, uso dos acessórios individuais e uma gama de informações para desfrutar plenamente todos os recursos e facilidades.

Após a compra bem sucedida de um equipamento / dispositivo, é bom ter um momento para se familiarizar com cada parte do manual HP nx6130. Atualmente, são cuidadosamente preparados e traduzidos para sejam não só compreensíveis para os usuários, mas para cumprir a sua função básica de informação

Índice do manual

  • Página 1

    Main tenan ce and Ser vice Gu id e HP C om paq nx613 0 Noteboo k P C Doc ument P art Number: 3 9 6 3 2 6 -001 June 200 5 This guide is a troubleshooting reference used for maintaining and servicing the notebook. It provides comprehensi v e information on identifying notebook features, components, and spare parts; troubleshooting notebook problems; [...]

  • Página 2

    © Copyright 2005 He wlett-P ackard Dev elopment Compan y , L.P . Microsoft and W indows are U.S. re gistered trademarks of Microsoft Corporation. Intel, Pentium, and Celeron are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Bluetooth is a trademark o wned by its proprietor an[...]

  • Página 3

    Maintenance and S ervi ce Guide iii Cont e nt s 1 Product Description 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 1.2 Resetting the Notebook . . . . . . . . . . . . . . . . . . . . . . . 1–4 1.3 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . 1–5 1.4 External Components . . . . .[...]

  • Página 4

    i v Maintenance and S ervi ce Guide Cont en ts 4 Illustrated Parts Catalog 4.1 Serial Number Location . . . . . . . . . . . . . . . . . . . . . . 4–1 4.2 Notebook Major Components . . . . . . . . . . . . . . . . . . 4–2 4.3 Miscellaneous Plastics Kit . . . . . . . . . . . . . . . . . . . . 4–8 4.4 Miscellaneous Cable Kit . . . . . . . . . . .[...]

  • Página 5

    Cont en ts Maintenance and S ervi ce Guide v 6.7 External Memory Module . . . . . . . . . . . . . . . . . . . . 6–12 6.8 Mini PCI Communications Card . . . . . . . . . . . . . . . 6–14 6.9 Optical Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–16 6.10 Keyboard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . [...]

  • Página 6

    v i Maintenance and S ervi ce Guide Cont en ts A Connector Pin Assignments B Power Cord Set Requirements C Screw Listing Index[...]

  • Página 7

    Maintenance and S ervi ce Guide 1–1 1 Pr oduc t D esc ription The HP Compaq nx6130 Notebook PC of fers adv anced modularity , Intel® Pentium® M and Celeron® M processors, and extensi ve multimedia support. HP Co mpaq nx6130 Notebook P C[...]

  • Página 8

    1–2 Maintenance and Serv ice Gui de Product D escr ipt ion 1.1 F e a t u r e s ■ The follo wing processors are a v ailable, v arying b y notebook model: ❏ Intel Pentium M 2.13-, 2.00-, 1.86-, 1.73-, 1.60-, or 1.30-GHz processor , ❏ Intel Celeron M 1.5- or 1.4-GHz ■ The follo wing displays are a v ailable, v arying by notebook model: ❏ 1[...]

  • Página 9

    Product D escr ipt ion Maintenance and S ervi ce Guide 1–3 ■ Integrated wireless support for Mini PCI IEEE 802.11b/g or 802.11a/b/g WLAN de vice ■ Support for one or two T ype II PC Card slots, with support for both 32-bit (CardBus) and 16-bit PC Cards, v arying by notebook model ■ External 65-watt A C adapter with 3-wire po wer cord, v ary[...]

  • Página 10

    1–4 Maintenance and Serv ice Gui de Product D escr ipt ion ■ Connectors: ❏ Audio-out (headphone) ❏ Audio-in (microphone) ❏ Uni versal Serial Bus (USB) v . 2.0 (4 ports) ❏ Po wer ❏ External monitor ❏ RJ-11 (modem) ❏ RJ-45 (network) ❏ IEEE 1394 ❏ T rav el battery ❏ Infrared ❏ Digital Media Slot ❏ Parallel port ❏ S-V ideo[...]

  • Página 11

    Product D escr ipt ion Maintenance and S ervi ce Guide 1–5 3. W ait approximately 5 minutes. 4. Replace the R TC battery and reassemble the notebook. 5. Connect A C power to the notebook. Do not reinsert an y battery packs at this time. 6. T urn on the notebook. All passwords and all CMOS settings ha v e been cleared. 1. 3 P o w e r M a n a g e m[...]

  • Página 12

    1–6 Maintenance and Serv ice Gui de Product D escr ipt ion 1 .4 Exter nal C om ponents The external components on the front of the notebook are sho wn belo w and described in T able 1-1. F r ont Component s Ta b l e 1 - 1 Fr ont Components Item Component Function 1 Infrared por t Provides wireless comm unication between the notebook and an option[...]

  • Página 13

    Product D escr ipt ion Maintenance and S ervi ce Guide 1–7 6 Batter y light ■ Amber : A batter y pac k is charging. ■ Green: A batter y pack is close to full charge capacity . ■ Blinking amber : A batter y pac k that is the only a vailab l e po wer source has reached a low-battery condition. When the batter y reaches a critical lo w-batter [...]

  • Página 14

    1–8 Maintenance and Serv ice Gui de Product D escr ipt ion The external components on the right side of the notebook are sho wn belo w and described in T able 1-2. R igh t -Si de Com ponents[...]

  • Página 15

    Product D escr ipt ion Maintenance and S ervi ce Guide 1–9 Ta b l e 1 - 2 Right-Side Components Item Component Function 1A u d i o - o u t (headphone) jack Connects optional headphones or pow ered stereo speake rs. Also connects the audio function of an audio/v ideo de vice such as a tele vision or VCR. 2A u d i o - i n (microphone) jack Connects[...]

  • Página 16

    1–10 Maintenance and Serv ice Gui de Product D escr ipt ion The external components on the left side of the notebook are sho wn belo w and described in T able 1-3. Left -Side Components Ta b l e 1 - 3 Left-Side Components Item Component Function 1 USB por ts (2) Connect USB 1.1- and 2.0-compliant de vices to the notebook using a standard USB cab [...]

  • Página 17

    Product D escr ipt ion Maintenance and S ervi ce Guide 1–11 3 Exhaust v ent Pro vides airflow to cool internal components. Ä T o pre vent ov erheating, do not obstruct vents . Do not allow a hard surf ace, such as a printer , or a soft surf ace, such as pillo ws , thick rugs, or clothing, to bloc k airflow . 4 RJ-11 (modem) jack Conn ects the mo[...]

  • Página 18

    1–12 Maintenance and Serv ice Gui de Product D escr ipt ion The external components on the rear panel of the notebook are sho wn belo w and described in T able 1-4. Re ar P a ne l Co mp o n en t s[...]

  • Página 19

    Product D escr ipt ion Maintenance and S ervi ce Guide 1–13 T able 1-4 Rear P anel Components Item Component Function 1 Security cable slot Attaches an op tional security cable to the notebook. Ä Security solutions are designed to act as deterrents. These deterrents ma y not pre v ent a product from being mishandled or stolen. 2 Batter y ba y Ho[...]

  • Página 20

    1–14 Maintenance and Serv ice Gui de Product D escr ipt ion The standard ke yboard components of the notebook are sho wn belo w and described in T able 1-5. St andar d K ey board C omponen ts[...]

  • Página 21

    Product D escr ipt ion Maintenance and S ervi ce Guide 1–15 T able 1-5 Standar d Ke yboar d Components Item Component Function 1 f1 to f12 ke ys (12) P erform system and application tasks. When combined with the fn key , seve ra l ke ys and b uttons perf or m additional tasks as hotk eys . 2 caps lock ke y Enables caps loc k and turns on the caps[...]

  • Página 22

    1–16 Maintenance and Serv ice Gui de Product D escr ipt ion The notebook top components are sho wn belo w and described in T able 1-6. T op C omponents , P ar t 1 T able 1-6 T op Components, P ar t 1 Item Component Function 1 P ower/standb y b utton When the notebook is: ■ Off , press to turn on the notebook. ■ On, briefly press to initiate h[...]

  • Página 23

    Product D escr ipt ion Maintenance and S ervi ce Guide 1–17 2 Displa y lid s witch ■ If the notebook is closed while on, tur ns off the displa y . ■ If the notebook is opened while in standby , turns on the notebook (resumes from standby). 3 Inf o Center b utton Launches Inf o Center . 4 Wireless button T urns the wireless functionality on or[...]

  • Página 24

    1–18 Maintenance and Serv ice Gui de Product D escr ipt ion The notebook top components are continued belo w and described in T able 1-7. T op C omponents , P ar t 2[...]

  • Página 25

    Product D escr ipt ion Maintenance and S ervi ce Guide 1–19 T able 1-7 T op Components, P ar t 2 Item Component Function 1 V olume mute bu tton Mutes or restores system volume . 2 V olume down b utton Decreases system v olume. 3 V olume up button Increases system v olume. 4 T ouchP ad Mov es the pointer and selects or activates items on the scree[...]

  • Página 26

    1–20 Maintenance and Serv ice Gui de Product D escr ipt ion The external components on the bottom of the notebook are sho wn belo w and described in T able 1-8. Bot tom Component s Ta b l e 1 - 8 Bottom Components Item Component Function 1 Pr imary batter y bay Holds the primar y batter y pack. 2 Pr imary batter y locking latch Secures the primar[...]

  • Página 27

    Product D escr ipt ion Maintenance and S ervi ce Guide 1–21 4 Memor y module compar tment Mini PCI compar tment Contains 1 memor y sl ot that suppor ts a replaceable memory module. Holds an optional wireless LAN de vice. Ä T o pre vent an unresponsiv e system and the displa y of a warning message, install only a Mini PCI de vice authorized f or [...]

  • Página 28

    1–2 2 Maintenance and Serv ice Gui de Product D escr ipt ion 1. 5 D e s i g n O v e r v i e w This section presents a design ov ervie w of key parts and features of the notebook. Refer to Chapter 4, “Illustrated Pa rts Catalog, ” to identify replacement parts, and Chapter 6, “Remo v al and Replacement Procedures, ” for disassembly steps. [...]

  • Página 29

    Maintenance and S ervi ce Guide 2–1 2 T r oubl eshooting Å W ARN ING: Only author iz ed techni c ians tr ained by HP should r epair this equipmen t . All tr ouble shooting and r epair pr ocedur es ar e detailed to allo w onl y subass embly-/module-lev el r epair . Because o f the comple x ity of the indi v idual boar ds and subas sembli es , do [...]

  • Página 30

    2–2 Maintenance and Serv ice Gui de T r oublesh ooting Acce ssing Compute r Set up The information and settings in Computer Setup are accessed from the File, Security , T ools, and Adv anced menus. 1. Open Computer Setup by turning on or restarting the notebook. Press f10 while the F10 = Based Setup message is displayed in the lo wer -left corner[...]

  • Página 31

    T r oubleshooting Maintenance and S ervi ce Guide 2–3 4. T o confirm the restoration, press f10 . 5. Select File > Sa ve changes and exit , and then follo w the instructions on the screen. When the computer restarts, the factory settings are restored, and any identif ication information you hav e entered is sa ved. Sele c ti ng fr om the F ile[...]

  • Página 32

    2–4 Maintenance and Serv ice Gui de T r oublesh ooting Selec ting fr om t he Securit y Menu Ta b l e 2 - 2 Security Menu Select T o Do This Administrator pass word Enter , change , or delete an HP Administrator pass word. P ower-on pass word Enter , change , or delete a power-on pass word. P a ss word options ■ Enable/Disable stringent security[...]

  • Página 33

    T r oubleshooting Maintenance and S ervi ce Guide 2–5 Selec ting fr om t he T ools Menu Ta b l e 2 - 3 To o l s M e n u Select T o Do This HDD Self T est options Run a quick or comprehensiv e self-test on any hard drive in the system. Batter y Inf or mation Vie w inf or matio n about an y batter y packs in the notebook. Memor y Check ■ Run a se[...]

  • Página 34

    2–6 Maintenance and Serv ice Gui de T r oublesh ooting Selec ting from th e Ad v an ced Menu Ta b l e 2 - 4 Adv anced Menu Select T o Do This Language (or press f2 ) Change the Computer Setup language. Boot options ■ Enable/Disable MultiBoot, which sets a startup sequence that can include most bootable devices and media in the system. ■ Set t[...]

  • Página 35

    T r oubleshooting Maintenance and S ervi ce Guide 2–7 2.2 T roubl eshooting Flo wc har ts Ta b l e 2 - 5 T roubleshooting Flo wchar ts Overview Flowchart Description 2.1 “Flowchar t 2.1—Initial T roubleshooting” 2.2 “Flowchar t 2.2—No P owe r , P ar t 1” 2.3 “Flowchar t 2.3—No P owe r , P ar t 2” 2.4 “Flowchar t 2.4—No P owe[...]

  • Página 36

    2–8 Maintenance and Serv ice Gui de T r oublesh ooting Flowchart Description 2.14 “Flowchar t 2.14—No OS Loading, Optical Drive” 2.15 “Flowchar t 2.15—No A udio , P ar t 1” 2.16 “Flowchar t 2.16—No A udio , P ar t 2” 2.17 “Flowchar t 2.17—Nonfunctioning De vice” 2.18 “Flowchar t 2.18—Nonfunctioning K eyboard” 2.19 ?[...]

  • Página 37

    T r oubleshooting Maintenance and S ervi ce Guide 2–9 Flo wc h art 2. 1—Initi al T roubl eshooting Connecting to network or modem? Begin troubleshooting. Is there power? Is the OS loading? Is there video? (no boot) Is there sound? Beeps, LEDs, or error messages? Keyboard/ pointing device work- ing? Go to “Flowchart 2.17—Nonfunction- ing Dev[...]

  • Página 38

    2–10 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2.2—N o P o w er , P ar t 1 1. Reseat the power cables in the docking device and at the AC outlet. 2. Ensure the AC power source is active. 3. Ensure that the power strip is working. Done Remove from docking device (if applicable). Po we r u p on batter y power? Po we r u p on[...]

  • Página 39

    T r oubleshooting Maintenance and S ervi ce Guide 2–11 Flo wc h art 2.3—No P o w er , P ar t 2 Continued from “Flowchart 2.2—No Po we r , Par t 1 . ” Visually check for debris in batter y socket and cl ean if necessary . Done N Y Po we r o n ? Check batter y by recharging it, moving it to another notebook, or replacing it. Po we r o n ? D[...]

  • Página 40

    2–12 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2.4—N o P o w er , P ar t 3 Continued from “Flowchart 2.3—No Po we r , Par t 2 .” Reseat AC adapter in notebook and at po wer sou rc e. Internal or external AC adapter? Done Done Done Done Po we r o n ? Po we r o n ? Po we r o n ? Plug directly into AC outlet. Po we r L [...]

  • Página 41

    T r oubleshooting Maintenance and S ervi ce Guide 2–13 Flowc ha r t 2.5 —N o P o w er , P ar t 4 Y N Continued from “Flowchart 2.4—No Po we r , Par t 3 . ” Reseat loose components and boards and replace damaged items. Open notebook. Loose or damaged parts? Y Close notebook and retest. Po we r on ? Done N Replace the following items (if ap[...]

  • Página 42

    2–14 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2.6—N o Video, P ar t 1 A N Stand-alone or docking device? No video. Replace the following one at a time. T est after each replacement. 1. Cable between notebook and notebook display (if applicable) 2. Display 3. System board Internal or external display*? Adjust brightness. V[...]

  • Página 43

    T r oubleshooting Maintenance and S ervi ce Guide 2–15 Flo wc h art 2.7—N o Video, P ar t 2 Y N Continued from “Flowchart 2.6—No Video, Part 1.” Done Adjust external monitor display . Video OK? Adjust display brightness. Video OK? Video OK? Done Done Check that notebook is properly seated in docking device, for bent pins on cable, and for[...]

  • Página 44

    2–16 Maintenance and Serv ice Gui de T r oublesh ooting F lo wcha rt 2 . 8— No n f u nct io n i ng Do ck ing De v i c e (i f appl icable) Y N Reseat power cord in docking device and power outlet. N Check voltage setting on docking device. Reset monitor cable connector at docking device. Reinstall notebook into dock- ing device. Docking device o[...]

  • Página 45

    T r oubleshooting Maintenance and S ervi ce Guide 2–17 Flo wc h art 2.9—N o Opera ting S y stem (OS) Loadin g No OS loading from hard drive, go to “Flowchart 2.10—No OS Loading, Hard Drive, Part 1.” Reseat po wer cord in docking device and power outlet. No OS loading.* *NOTE: Before beginning troubleshooting, always check cable connection[...]

  • Página 46

    2–18 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2. 1 0—N o OS Loadin g, H ard Driv e, Pa r t 1 Go to “Flowchart 2.17—Non- functioning Device.” Y Done N OS not loading from hard drive. Nonsystem disk message? Go to “Flowchart 2.11—No OS Loading, Hard Drive, Part 2.” Reseat external hard drive. OS loading? Done Bo[...]

  • Página 47

    T r oubleshooting Maintenance and S ervi ce Guide 2–19 Flowc h ar t 2. 1 1—N o O S Lo a din g , H ard D rive, Pa r t 2 Load OS using Oper- ating System disc (if applicable). Continued from “Flowchart 2.10—No OS Loading, Hard Drive, Part 1.” Reseat hard drive. Done Disc or diskette in drive? 1. Replace hard drive. 2. Replace system board. [...]

  • Página 48

    2–20 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2. 1 2—No OS Loa ding , Ha rd Dri v e, Pa r t 3 Y System files on hard drive? Continued from “Flowchart 2.11—No OS Loading, Hard Drive, Part 2.” Clean virus. Done N Install OS and reboot. Virus on hard drive? OS loading from hard drive? Y N Y N Y N Diagnostics on disc or[...]

  • Página 49

    T r oubleshooting Maintenance and S ervi ce Guide 2–21 Flo wc h art 2. 1 3—No OS Loa ding , Disk et te Driv e Replace the following components individually , retesting after each replacement: ■ Diskette drive Done Y N Reseat diskette drive. OS not loading from diskette drive. Done Y Y Y Y Y Y Y N N N N N N N OS loading? Nonsystem disk message[...]

  • Página 50

    2–2 2 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2. 1 4—N o OS Loading , O ptical Driv e Y Done N Bootable disc in drive? Disc in drive? No OS loading from CD-ROM or DVD-ROM drive. Install bootable disc and reboot notebook. Go to “Flowchart 2.17—Non- functioning Device.” Go to “Flowchart 2.17—Non- functioning Devi[...]

  • Página 51

    T r oubleshooting Maintenance and S ervi ce Guide 2–2 3 Flo wc h ar t 2. 1 5—N o Audio, P art 1 No audio. N Notebook in docking device (if applicable)? Internal audio? Audio? Done Undock Audio? Done T urn up audio internally or externally . Go to “Flowchart 2.16—No Audio, Par t 2. ” Go to “Flowchart 2.17—Non- functioning Device.” Y [...]

  • Página 52

    2–2 4 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2. 1 6—No Au dio, P ar t 2 YN Continued from “Flowchart 2.15—No Audio, Part 1.” Reload audio drivers. Audio driver in OS configured? Audio? Y Y Y N N N Correct drivers for application? Connect to external speaker . Load drivers and set configuration in OS. Audio? Done R[...]

  • Página 53

    T r oubleshooting Maintenance and S ervi ce Guide 2–2 5 Flo wc h art 2. 1 7—N onfunc tioning De vice Done Any physical device detected? Y N Unplug the nonfunctioning device from the notebook and inspect cables and plugs for bent or broken pins or other damage. Reseat device. Clear CMOS. Done Fix o r replace broken item. Nonfunctioning device. R[...]

  • Página 54

    2–2 6 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2. 1 8—Nonfun c tioning K e yboar d Y N Keyboard operating properly? Keyboard not operating prop- erly . External device works? Replace system board. Replace system board. Connect notebook to good external key- board. Reseat internal key- board connector (if applicable). Repl[...]

  • Página 55

    T r oubleshooting Maintenance and S ervi ce Guide 2–2 7 Flo wc h art 2. 1 9—Nonfunc tionin g P oin ting De vic e Y N Pointing device not operating properly . External device works? Replace system board. Replace system board. Connect notebook to good external pointing device. Reseat internal pointing device connector (if applicable). Replace int[...]

  • Página 56

    2–2 8 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc har t 2.20—No N et w ork/Modem Con nectio n Y Disconnect all power from the notebook and open. No network or modem connec- tion. N Done Digital line? Network or modem jack active? Replace jack or have jack acti- vated. Connect to nondigital line. NIC/modem configured in OS? Reload [...]

  • Página 57

    Maintenance and S ervi ce Guide 3–1 3 Soft w are Upd a te and Rec o v er y Soft w are Upd ates T o stay current with the newest technolog y and maintain optimal performance, install the latest versions of HP softw are on your computer as they become a vailable. T o update HP software: 1. Identify your computer model, product category , and series[...]

  • Página 58

    3–2 Maintenance and Serv ice Gui de So ftwar e Update and R ecov ery Accessin g Com pu ter Inf orma tion Before you access the updates for your computer , collect the follo wing information: ■ The product cate gory is Notebook. ■ The product family name and series number are printed on the display bezel. ■ Model information is provided on t[...]

  • Página 59

    Softw ar e Update and R ecov er y Maintenance and S ervi ce Guide 3–3 Soft w ar e Upd a tes and t he HP W eb Site Most software on the HP W eb site is packaged in compressed f iles called SoftP aq s. Some BIOS updates may be packaged in compressed f iles called RO M P a q s. Most do wnload packages contain a f ile named Readme.txt. A Readme.txt f[...]

  • Página 60

    3–4 Maintenance and Serv ice Gui de So ftwar e Update and R ecov ery 3. At the do wnload area: a. Identify the BIOS update that is later than the BIOS version currently installed on your computer . Make a note of the date, name, or other identif ier . Y ou may need this information to locate the update later , after it has been do wnloaded to you[...]

  • Página 61

    Softw ar e Update and R ecov er y Maintenance and S ervi ce Guide 3–5 3. Double-click the f ile with an .ex e e xtension (for example, f ilename.ex e ). The BIOS installation begins. 4. Complete the installation by follo wing the instructions on the screen. ✎ After a message on the screen repor ts a successful installation, you may delete the d[...]

  • Página 62

    3–6 Maintenance and Serv ice Gui de So ftwar e Update and R ecov ery 3. Insert the correct R OMPaq diskette for the product being updated. The BIOS image f ile must to be located in the root directory of the diskette and must be in contiguous sectors. The easiest way to ensure this is to visit http://www .hp.com , do wnload the Softpaq, and let t[...]

  • Página 63

    Maintenance and S ervi ce Guide 4–1 4 I llus trated P ar ts C a talog This chapter provides an illustrated parts breakdo wn and a reference for spare part numbers. 4. 1 Seria l Number Loca tion When ordering parts or requesting information, provide the notebook serial number and model number located on the bottom of the notebook. Ser ial Number L[...]

  • Página 64

    4–2 Maintenance and Serv ice Gui de Illustr ated P arts Catalog 4.2 Notebook Major C omp onents Noteboo k Major Components[...]

  • Página 65

    Illustr ated P arts Catalog Maintenance and S ervi ce Guide 4–3 Ta b l e 4 - 1 Spare P arts: Notebook Major Components Item Description Spare P art Number 1 Display assemb lies (include wireless antenna boards and cables) 15.0-inch, SXGA+WV A, TFT 15.0-inch, XGA, TFT 14.1-inch, XGA, TFT 395459-001 395458-001 395457-001 2 Switch co ver 378232-001 [...]

  • Página 66

    4–4 Maintenance and Serv ice Gui de Illustr ated P arts Catalog Noteboo k Major Components[...]

  • Página 67

    Illustr ated P arts Catalog Maintenance and S ervi ce Guide 4–5 Ta b l e 4 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P art Number Miscellaneous Plastics Kit 378236-001 9a 9b 9c Includes: R TC batter y Memor y module/Mini PCI compar tment cov er (includes 1 captiv e screw) Hard drive co ver (includes 2 captiv e[...]

  • Página 68

    4–6 Maintenance and Serv ice Gui de Illustr ated P arts Catalog Noteboo k Major Components[...]

  • Página 69

    Illustr ated P arts Catalog Maintenance and S ervi ce Guide 4–7 Ta b l e 4 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P art Number 18 Mini PCI comm unications cards 802.11b/g WLAN card, f or us e in most of the world 802.11b/g WLAN card, f or us e in the rest of the world 381582-001 381583-001 802.11a/b/g combi[...]

  • Página 70

    4–8 Maintenance and Serv ice Gui de Illustr ated P arts Catalog 4.3 Miscell an eous P l a stic s Kit T able 4-2 Miscellaneous Plastics Kit Spare P art Number 378236-001 Item Description 1 Memor y module/Mini PC I compar tment cov er (includes 1 captiv e screw) 2 Hard drive co v er (includes 2 captive scre ws) 3 R TC batter y (includes cab le) 4 N[...]

  • Página 71

    Illustr ated P arts Catalog Maintenance and S ervi ce Guide 4–9 4.4 Miscell an eous Ca bl e Kit Ta b l e 4 - 3 Miscellaneous Cable Kit Spare P art Number 395465-001 Item Description 1 Bluetooth board cable 2 LED board cable 3 RJ-11 connector module and cable 4 Audio board cab le 5 USB board cable 6 Ser ial connector module cable[...]

  • Página 72

    4–10 Maintenance and Serv ice Gui de Illustr ated P arts Catalog 4.5 Mas s Storag e De vices Ta b l e 4 - 4 Mass Storage Devices Spare P art Number Information Item Description Spare Part Number 1 Hard drives (include fr ame and connector) 5400-r pm 80-GB 60-GB 40-GB 380108-001 378215-001 380107-001 4200-r pm 60-GB 378213-001 2 Optical drives (in[...]

  • Página 73

    Illustr ated P arts Catalog Maintenance and S ervi ce Guide 4–11 4.6 Miscell an eous (Not I llus trated) Ta b l e 4 - 5 Miscellaneous (Not Illustrated) Spare P art Information Description Spare P art Number 65 watt A C adapter 239704-001 HP Adv anced Doc king Station 374804-001 HP Doc king Station 374803-001 Docking Station Miscellaneous Plastics[...]

  • Página 74

    4–12 Maintenance and Serv ice Gui de Illustr ated P arts Catalog Screw Kit (includes the f ollowing screws; ref er to Appendix C, “Screw Listing, ” f or more inf or mation on specifications and usage 378235-001 ■ He x sock e t HM5.0×9.0 scre w loc k ■ Phillips PM2.5×13.0 spring-loaded scre w ■ Phillips PM2.5×4.0 shoulder screw ■ Ph[...]

  • Página 75

    Illustr ated P arts Catalog Maintenance and S ervi ce Guide 4–13 4.7 Sequ enti al P ar t N umber Listin g Ta b l e 4 - 6 Sequential P art Number Listing Spare P art Number Description 239704-001 65 watt A C adapter 246959-001 P ower cord f or use in Can ada, F rench Canada, Latin America, T aiwan, Thailand, and the United States 246959-031 P ower[...]

  • Página 76

    4–14 Maintenance and Serv ice Gui de Illustr ated P arts Catalog 373900-021 802.11a/b/g combination WLAN Mini PCI communications card, f or use in the Asia P acific region 373901-002 802.11a/b/g co mbination WLAN card, f or use in the rest of the world 374803-001 HP Docking Station 374804-001 HP Adv anced Docking Station 378213-001 4200-r pm, 60-[...]

  • Página 77

    Illustr ated P arts Catalog Maintenance and S ervi ce Guide 4–15 378237-001 Speaker 379799-001 Heat sink (i ncludes ther mal paste) 380089-001 Docking Station Mi scellaneous Plastics Kit 380107-001 5400-r pm, 40-GB hard drive (includes fr ame and connector) 380108-001 5400-r pm, 80-GB hard drive (includes fr ame and connector) 380770-001 8X Max D[...]

  • Página 78

    4–16 Maintenance and Serv ice Gui de Illustr ated P arts Catalog 397243-001 K eyboard f or us e in the United States 397243-281 K eyboard f o r use in Thailand 397243-AB1 K eyboard f or use in T aiwan 397243-AD1 K eyboard f or use in Ko rea 397247-001 8X Max D VD±RW and CD-R W Dual Lay er Combo Drive , LightScribe (includes bezel) Ta b l e 4 - 6[...]

  • Página 79

    Maintenance and S ervi ce Guide 5–1 5 Remo v al and Repl a cement Preliminaries This chapter provides essential information for proper and safe remov al and replacement service. 5 . 1 T ools Required Y ou will need the follo wing tools to complete the remov al and replacement procedures: ■ Magnetic scre wdri ver ■ Phillips P0 scre wdri v er ?[...]

  • Página 80

    5–2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies 5 .2 Ser vice C onsid erations The follo wing sections include some of the considerations that you should keep in mind during disassembly and assembly procedures. ✎ As you remov e each subassembly from the notebook, place the subassembly (and all accompanying scre w[...]

  • Página 81

    R emo val and R eplacement Pr eliminar ie s Maintenance and S ervi ce Guide 5–3 5 . 3 P r e v enti ng Damage to R emo v able Dri v es Remov able driv es are fragile components that must be handled with care. T o prev ent damage to the notebook, damage to a remov able driv e, or loss of information, observ e the follo wing precautions: ■ Before [...]

  • Página 82

    5–4 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies 5 .4 Pre v entin g Elec trosta tic D ama ge Many electronic components are sensiti ve to electrostatic dischar ge (ESD). Circuitry design and structure determine the degree of sensiti vity . Networks b uilt into many inte grated circuits provide some protection, b ut [...]

  • Página 83

    R emo val and R eplacement Pr eliminar ie s Maintenance and S ervi ce Guide 5–5 5 .5 P a c k agin g and T ranspor tin g Precautions Use the follo wing grounding precautions when packaging and transporting equipment: ■ T o av oid hand contact, transport products in static-safe containers, such as tubes, bags, or boxes. ■ Protect all electrosta[...]

  • Página 84

    5–6 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies 5 .6 W orksta tion Precautions Use the follo wing grounding precautions at workstations: ■ Cov er the workstation with appro v ed static-shielding material (refer to T able 5-2, “Static-Shielding Materials” ). ■ Use a wrist strap connected to a properly ground[...]

  • Página 85

    R emo val and R eplacement Pr eliminar ie s Maintenance and S ervi ce Guide 5–7 ■ When standing, use foot straps and a grounded floor mat. Foot straps (heel, toe, or boot straps) can be used at standing workstations and are compatible with most types of shoes or boots. On conducti ve floors or dissipati ve floor mats, use foot straps on both fe[...]

  • Página 86

    5–8 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies T able 5-1 shows ho w humidity affects the electrostatic v oltage le ve ls generated by dif ferent activities. T able 5-2 lists the shielding protection provided b y antistatic bags and floor mats. Ta b l e 5 - 1 T ypical Electrostatic V oltage Levels Relative Humidit[...]

  • Página 87

    Maintenance and S ervi ce Guide 6–1 6 Remo v al and Repl a cement Pr ocedure s This chapter provides remo v al and replacement procedures. There are 64 scre ws and scre w locks, in 11 dif ferent sizes, that must be remov ed, replaced, or loosened when servicing the notebook. Make special note of each scre w and screw lock size and location during[...]

  • Página 88

    6–2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 Serial N umber Report the notebook serial number to HP when requesting information or ordering spare parts. The serial number is located on the bottom of the notebook. Ser ial Number L ocation 6 .2 D isassem bl y Seque nce C hart Use the chart belo w to determine th[...]

  • Página 89

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–3 6.4 Hard drive 2 loosened to remov e the hard drive co ver 1 loosened to remov e the hard drive 6 to disassemble the hard drive 6.5 Notebook f eet 0 6.6 Bluetooth board 0 6.7 Exter nal memor y module 1 loosened to remov e the memor y module/Mini PCI compar tment cov er 6[...]

  • Página 90

    6–4 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 3 Preparing t he Notebook for Di sassem bl y Before you begin an y remo v al or installation procedures: 1. Shut do wn the notebook. If you are unsure whether the notebook is of f or in hibernation, turn the computer on, and then shut it do wn through the operating sy[...]

  • Página 91

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–5 4. Remov e the battery pack b y follo wing these steps: a. T urn the notebook upside do wn with the rear panel to ward you. b . Slide and hold the battery pack lock latch 1 to the right. c. Slide the battery pack release latch 2 to the right. (The battery pack disengages[...]

  • Página 92

    6–6 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.4 Hard Driv e 1. Prepare the notebook for disassembly (refer to Section 6.3 ). 2. Loosen the two PM2.0×4.0 scre ws 1 that secure the hard dri v e cov er to the notebook. 3. Lift the left side of the hard dri ve co v er and swing it to the right 2 . 4. Remov e the hard[...]

  • Página 93

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–7 5. Loosen the PM2.5×13.0 spring-loaded hard dri v e retention scre w 1 . 6. Grasp the mylar tab 2 on the hard dri v e and slide the hard dri v e to the right 3 to disconnect it from the system board. 7. Remov e the hard dri ve from the hard dri ve bay 4 . R emo v ing th[...]

  • Página 94

    6–8 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 8. Remov e the two PM2.5×4.0 hard dri ve frame shoulder scre ws 1 from each side of the hard dri v e. 9. Remov e the two PM2.5×4.0 hard dri ve frame scre ws 2 from each side of the hard dri v e. 10. Remov e the two PM1.5×3.5 hard dri ve frame scre ws 3 from the front [...]

  • Página 95

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–9 6.5 Notebook F eet The notebook feet are adhesi v e-backed rubber pads. The feet are included in the Miscellaneous Plastics Kit, spare part number 378236-001. R eplac ing the Notebook F eet[...]

  • Página 96

    6–10 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.6 Bluetooth B oard 1. Prepare the notebook for disassembly (refer to Section 6.3 ). 2. Remov e the hard dri ve ( Section 6.4 ). Bluetooth Boar d Spare P art Number Information Broadcomm Bluetooth wireless board (includes Bluetooth board cab le) 367871-001[...]

  • Página 97

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–11 3. Slide the Bluetooth board out of the clip 1 in the hard dri ve compartment. 4. Disconnect the Bluetooth board cable 2 from the board. R emo v ing the Blueto oth Boar d Re v erse the abov e procedure to install a Bluetooth board.[...]

  • Página 98

    6–12 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.7 Ex ternal Memor y Module 1. Prepare the notebook for disassembly (refer to Section 6.3 ). 2. Position the notebook with the front to ward you. 3. Loosen the PM2.0×4.0 scre w 1 that secures the memory module/Mini PCI compartment cov er to the notebook. 4. Lift the r[...]

  • Página 99

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–13 6. Spread the retaining tabs 1 on each side of the memory module socket to release the memory module board. (The edge of the module opposite the socket rises a way from the notebook.) 7. Slide the module aw ay from the socket at an angle 2 . 8. Remov e the memory module[...]

  • Página 100

    6–14 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.8 Mini PCI Communi ca tions Card 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the memory module/Mini PCI compartment co ver ( Section 6.7 ). 3. Position the notebook with the front to ward you. Mini PCI Comm unications Card Spare P art Number In[...]

  • Página 101

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–15 4. Disconnect the auxiliary and main antenna cables 1 from the Mini PCI communications card. ✎ Make note of which antenna cable is attached to which antenna clip on the Mini PCI communications card before disconnecting the cables. 5. Spread the 2 retaining tabs 2 on e[...]

  • Página 102

    6–16 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.9 Optical Driv e 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the memory module/Mini PCI compartment co ver ( Section 6.7 ). 3. Position the notebook with the left side to ward you. Optical Drive Spare P art Number Information 8X Max D VD-ROM dr[...]

  • Página 103

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–17 4. Remov e the T8M2.0×9.0 scre w 1 that secures the optical dri v e to the notebook. 5. Insert a thin tool, such as an unbent paper clip 2 , into the media tray release hole and release the media tray . 6. Use the media tray to slide the optical dri ve to the left and [...]

  • Página 104

    6–18 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 0 K e yb oa rd 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the memory module/Mini PCI compartment co ver ( Section 6.7 ). 3. Remov e the tw o T8M2.0×9.0 scre ws that secure the ke yboard to the notebook. ✎ The left ke yboard retention scr[...]

  • Página 105

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–19 4. T urn the notebook display-side up with the front to ward you. 5. Open the notebook as far as possible. 6. Slide the 4 ke yboard retaining latches to ward you. R eleasing the K e y boar d L atc hes[...]

  • Página 106

    6–20 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 7. Lift the rear edge of the ke yboard up and swing it to ward you until it rests on the palm rest. R eleasing the K e y boar d[...]

  • Página 107

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–21 8. Release the zero insertion force (ZIF) connector 1 to which the ke yboard cable is attached and disconnect the ke yboard cable 2 . Disconnec ting the K e y boar d Cable 9. Remov e the ke yboard. Re v erse the abov e procedure to install the ke yboard.[...]

  • Página 108

    6–2 2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 1 S wit c h C o v er 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard ( Section 6.10 ). 3. Close the notebook. 4. T urn the notebook upside do wn with the rear panel to ward you. 5. Remov e the two T8M2.0×2.0 scre ws that secure t[...]

  • Página 109

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–2 3 6. T urn the notebook display-side up with front to ward you. 7. Open the notebook as far as possible. 8. Disconnect the LED board cable 1 from the system board. 9. Insert a flat-bladed scre wdri v er into the four notches 2 on the front edge of the switch cov er and l[...]

  • Página 110

    6–2 4 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 2 LED Board 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard ( Section 6.10 ). 3. Remov e the switch co ver ( Section 6.11 ). 4. T urn the notebook upside do wn with the rear panel to ward you. 5. T urn the switch cov er upside do [...]

  • Página 111

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–2 5 6. Remov e the four PM1.5×4.0 scre ws 1 that secure the LED board to the switch cov er . 7. Remov e the LED board 2 . R emo v ing the LED Boar d Re v erse the abov e procedure to install the LED board.[...]

  • Página 112

    6–2 6 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 3 Fan 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard ( Section 6.10 ). 3. Disconnect the fan cable 1 from the system board. 4. Loosen the 2 PM2.0×7.0 scre ws 2 that secure the fan to the notebook. 5. Remov e the f an 3 . R emo v[...]

  • Página 113

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–2 7 6. 1 4 Hea t Sink 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard ( Section 6.10 ). 3. Remov e the f an ( Section 6.13 ). Heat Sink Spare P art Number Information Heat sink (includes ther mal paste) 379799-001[...]

  • Página 114

    6–2 8 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 4. Loosen the four PM2.0×8.0 shoulder scre ws 1 that secure the heat sink to the notebook. 5. Lift the right side of the heat sink 2 to disengage it from the processor . 6. Slide the heat sink up and to the right 3 to remov e it. ✎ Due to the adhesi v e quality of t[...]

  • Página 115

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–29 ✎ The thermal paste should be thoroughly cleaned from the surfaces of the heat sink 1 and processor 2 each time the heat sink is remov ed. Thermal paste should be reapplied to both surfaces before the heat sink is reinstalled. Thermal paste is included with all heat s[...]

  • Página 116

    6–30 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 5 P roces s or 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard ( Section 6.10 ). 3. Remov e the f an ( Section 6.13 ). 4. Remov e the heat sink ( Section 6.14 ). Pr ocessor Spare P art Number Information Intel P entium M 2.13-GHz I[...]

  • Página 117

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–31 5. Use a flat-bladed scre wdri v er to turn the processor locking scre w one-quarter turn counterclockwise 1 until you hear ac l i c k . 6. Lift the processor straight up and remov e it 2 . ✎ The gold triangle 3 on the processor should be aligned in the front-right co[...]

  • Página 118

    6–3 2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 6 Internal Memor y Module 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard ( Section 6.10 ). Memory Module Spare P ar t Number Inf ormation 1024 MB 512 MB 256 MB 373121-001 373120-001 373119-001[...]

  • Página 119

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–33 3. Spread the retaining tabs 1 on each side of the memory module socket to release the memory module board. (The edge of the module opposite the socket rises a way from the notebook.) 4. Slide the module aw ay from the socket at an angle 2 . 5. Remov e the memory module[...]

  • Página 120

    6–3 4 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 7 RT C B a t te r y ✎ The R TC battery is included in the Miscellaneous Plastics Kit, spare part number 378236-001. 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard ( Section 6.10 ). 3. Disconnect the R TC battery cable 1 from th[...]

  • Página 121

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–35 6 . 1 8 Di spla y Assemb l y 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.7 ) b . Optical dri ve ( Section 6.9 ) c. K eyboard ( Section 6.10 ) d. Switch cov e[...]

  • Página 122

    6–3 6 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 5. Disconnect the display cable 1 from the system board. 6. Remov e the wireless antenna cables from the Mini PCI compartment and the top cov er clips 2 . 7. Remov e the two T8M2.0×9.0 scre ws 3 that secure the display assembly to the notebook. Disconnec ting the Disp[...]

  • Página 123

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–3 7 8. Swing the display assembly into a partially closed position. 9. Position the notebook with the rear panel to ward you. Ä CA UTION: Support the display as sembl y w hen r emo v ing the fo llo w ing sc r e ws . F ailure to su pport the display as sembl y can r esult [...]

  • Página 124

    6–3 8 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 9 T o p C ov e r 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.7 ) b . Optical dri ve ( Section 6.9 ) c. K eyboard ( Section 6.10 ) d. Switch cov er ( Se[...]

  • Página 125

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–3 9 3. Remov e the thirteen T8M2.0×9.0 scre ws that secure the top cov er to the notebook. R emo v ing the T op Co v er Sc re ws , P ar t 1[...]

  • Página 126

    6–40 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 4. T urn the notebook right-side up with the front to ward you. 5. Remov e the two T8M2.0×9.0 scre ws 1 that secure the top cov er to the notebook. 6. Disconnect the T ouchPad cable 2 from the system board. R emo v ing the T op Co v er Sc re ws , P ar t 2[...]

  • Página 127

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–41 7. Lift up the rear edge of the top cov er 1 until it disengages from the base enclosure. 8. Swing the top cov er to ward you 2 until the left and right sides of the top cov er disengage from the base enclosure. 9. Lift up on the left 3 and right sides 4 of the top cov [...]

  • Página 128

    6–4 2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.2 0 S pe ak er 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.7 ) b . Optical dri ve ( Section 6.9 ) c. K eyboard ( Section 6.10 ) d. Switch cov er ( Section[...]

  • Página 129

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–43 3. Remov e the six T8M2.0×4.0 scre ws 1 that secure the speaker to the notebook. 4. Lift the speaker up 2 until it clears the system board. 5. Slide the speaker to ward you 3 and remov e it. R emo v ing the S peak er Re v erse the abov e procedure to install the speake[...]

  • Página 130

    6–44 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.2 1 Mod e m B o ar d 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.7 ) b . Optical dri ve ( Section 6.9 ) c. K eyboard ( Section 6.10 ) d. Switch cov er ( Se[...]

  • Página 131

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–45 2. Remov e the two PM2.0×3.0 scre ws 1 that secure the modem board to the notebook. 3. Lift the front edge of the modem board 2 to disconnect it from the system board. 4. Disconnect the modem cable 3 from the modem board. 5. Remov e the modem board. R emo v ing the Mod[...]

  • Página 132

    6–4 6 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6.2 2 Digital M edia B oard 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.7 ) b . Optical dri ve ( Section 6.9 ) c. K eyboard ( Section 6.10 ) d. Switch cov e[...]

  • Página 133

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–4 7 2. Release the ZIF connector to which the digital media board cable is attached and disconnect the digital media board cable 1 from the system board. 3. Remov e the digital media board 2 . R emo v ing the Digit al Media Boar d Re v erse the abov e procedure to install [...]

  • Página 134

    6–4 8 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6.2 3 US B/Audio B oard 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.7 ) b . Optical dri ve ( Section 6.9 ) c. K eyboard ( Section 6.10 ) d. Switch cov er ( [...]

  • Página 135

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–4 9 2. Position the notebook with the rear panel to ward you. 3. Disconnect the USB cable 1 and audio cable 2 from the system board. 4. Remov e the PM1.5×3.0 scre w 3 that secures the USB/audio board and shield to the base enclosure. 5. Remov e the cables from the clips 4[...]

  • Página 136

    6–5 0 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6.24 S y s te m B o ard ✎ When replacing the system board, ensure that the follo wing components are remov ed from the defecti ve system board and installed on the replacement system board: ■ Memory modules ( Section 6.7 and Section 6.16 ) ■ Mini PCI communicatio[...]

  • Página 137

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–51 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Hard dri ve ( Section 6.4 ) b . Bluetooth board ( Section 6.6 ) c. Optical dri v e ( Section 6.9 ) d. K e yboard ( Section 6.10 ) e. Switch cov er ( Section 6.11 ) f. [...]

  • Página 138

    6–5 2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 3. Disconnect the serial connector cable 1 and the Bluetooth cable 2 from the system board. 4. Remov e the T8M2.0×4.0 scre w 3 that secures the system board to the base enclosure next to the RJ-11 connector . 5. Remov e the two HM5.0×9.0 scre w locks 4 on each side o[...]

  • Página 139

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–5 3 7. Use the optical dri ve connector to lift the system board up 1 until the po wer connector 2 is clear of the base enclosure. 8. Slide the system board to the left 3 at an angle and remov e it. R emo v ing the S ys tem Boar d[...]

  • Página 140

    6–5 4 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 9. If necessary , disconnect the RJ-11 connector module cable from the system board and remov e the RJ-11 connector module and cable. R emo v ing the RJ-11 C onnect or Module and Ca ble Re v erse the abov e procedures to install the system board.[...]

  • Página 141

    R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–5 5 6.2 5 Serial C onnec tor Modul e 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Hard dri ve ( Section 6.4 ) b . Bluetooth board ( Section 6.6 ) c. Optical dri v e ( Section 6.9 ) d. K e yboard ( Section 6.10 ) e. [...]

  • Página 142

    6–5 6 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 3. Remov e the two HM5.0×9.0 scre w locks 1 on each side of the serial connector . 4. Lift the serial connector module and cable out of the base enclosure 2 . 5. Disconnect the serial connector module cable from the system board 3 . R emo v ing the Se ri al C onnect o[...]

  • Página 143

    Maintenance and S ervi ce Guide 7–1 7 Spec ifica tions This chapter provides physical and performance specif ications. Ta b l e 7 - 1 Notebook Dimensions Metric U .S. Height Width Depth 32.8 cm 26.7 cm 3.1 cm 12.91 10.51 1.22 W eight 2.66 kg 5.86 lbs Input P ower Operating v oltage Operating current 18.5 V dc @ 3.5 A - 65 W 3.5 A T emperature Ope[...]

  • Página 144

    7–2 Maintenance and Serv ice Gui de Spe cificat ion s Maximum altitude (unpressurized) Operating (14.7 to 10.1 psia) Nonoperating (14.7 to 4.4 psia) -15 m to 3,048 m -15 m to 12,192 m -50 ft to 10,000 ft -50 ft to 40,000 ft Shock Operating Nonoperating 125 g, 2 ms, half-sine 200 g, 2 ms, half-sine Random Vibration Operating Nonoperating 0.75 g ze[...]

  • Página 145

    Spe cificat ion s Maintenance and S ervi ce Guide 7–3 Ta b l e 7 - 2 15.0-inch, SXGA+WV A, TFT Displa y Dimensions Height Width Diagonal 30.0 cm 22.9 cm 38.1 cm 11.8 in 9.0 in 15.0 in Number of colors Up to 16.8 million Contrast ratio 300:1 Brightness 180 nits typical Pixel resolution Pitch Fo r m a t Configuration 0.264 × 0.264 mm 1400 × 1050 [...]

  • Página 146

    7–4 Maintenance and Serv ice Gui de Spe cificat ion s Ta b l e 7 - 3 15.0-inch, XGA, TFT Displa y Dimensions Height Width Diagonal 30.0 cm 22.9 cm 38.1 cm 11.8 in 9.0 in 15.0 in Number of colors Up to 16.8 million Contrast ratio 250:1 Brightness 150 nits typical Pixel resolution Pitch Fo r m a t Configuration 0.264 × 0.264 mm 1024 × 768 RGB v e[...]

  • Página 147

    Spe cificat ion s Maintenance and S ervi ce Guide 7–5 Ta b l e 7 - 4 14.1-inch, XGA, TFT Displa y Dimensions Height Width Diagonal 28.5 cm 21.3 cm 35.8 cm 11.2 in 8.4 in 14.1 in Number of colors Up to 16.8 million Contrast ratio 250:1 Brightness 150 nits typical Pixel resolution Pitch Fo r m a t Configuration 0.279 × 0.279 mm 1024 × 768 RGB v e[...]

  • Página 148

    7–6 Maintenance and Serv ice Gui de Spe cificat ion s Ta b l e 7 - 5 Har d Drives 80-GB* 60-GB* 60-GB* 40-GB* Dimensions Height Width We i g h t 9.5 mm 70 mm 99 g 9.5 mm 70 mm 99 g 9.5 mm 70 mm 99 g 9.5 mm 70 mm 99 g Interface type ATA - 6 ATA - 6 ATA - 6 ATA - 6 T ransfer rate Synchronous (maximum) Security 100 MB/sec A T A security 100 MB/sec A[...]

  • Página 149

    Spe cificat ion s Maintenance and S ervi ce Guide 7–7 Ta b l e 7 - 6 Primary 6-cell, Li-Ion Batter y P ack Dimensions Height Width Depth We i g h t 2.00 cm 5.30 cm 20.30 cm 0.34 kg 0.79 in 2.10 in 8.00 in 0.74 lb Energ y V oltage Amp-hour capacity W att-hour capacity 10.8 V 4.8 Ah 51 Wh T emperature Operating Nonoperating 0°C to 45°C -20°C to [...]

  • Página 150

    7–8 Maintenance and Serv ice Gui de Spe cificat ion s Ta b l e 7 - 7 DV D - RO M D r i v e Applicable disc DV D - R O M ( DV D - 5 , DV D - 9 , DV D - 1 0 , DV D - 1 8 ) CD-R OM (Mode 1 and 2) CD Digital A udio CD-XA ready (Mode 2, F orm 1 and 2) CD-I ready (Mode 2, F or m 1 and 2) CD-R CD-R W Photo CD (single and multisession) CD-Bridge Center h[...]

  • Página 151

    Spe cificat ion s Maintenance and S ervi ce Guide 7–9 Ta b l e 7 - 8 D VD/CD-R W Combo Drive Applicable disc Read: D VD-R, D VD-R W , D VD-ROM (D VD-5, D VD-9, D VD-10, DV D - 1 8 ) , CD-ROM (Mode 1 and 2) CD Digital A udio CD-XA ready (Mode 2, F or m 1 and 2) CD-I ready (Mode 2, F or m 1 and 2) CD-R, CD-R W Photo CD (single and mult ise ssio n) [...]

  • Página 152

    7–10 Maintenance and Serv ice Gui de Spe cificat ion s Disc thickness 1.2 mm (0.047 in) T rack pitch 0.74 µm Access time CD media D VD media Random Full strok e < 110 ms < 210 ms < 130 ms < 225 ms A udio output level Line-out, 0.7 V r ms Cache b uffer 2 MB Data transfer rate CD-R (24X) CD-R W (10X) CD-R OM (24X) DV D ( 8 X ) Multiwor[...]

  • Página 153

    Spe cificat ion s Maintenance and S ervi ce Guide 7–11 Ta b l e 7 - 9 D VD±R W and CD-R W Combo Drive Applicable disc Read: DV D - R , DV D - R W, D VD-ROM (D VD-5, DV D - 9 , DV D - 1 0 , DV D - 1 8 ) , CD-R OM (Mode 1 and 2) CD Digital A udio CD-XA ready (Mode 2, F orm 1 and 2) CD-I ready (Mode 2, F or m 1 and 2) CD-R, CD-R W Photo CD (single [...]

  • Página 154

    7–12 Maintenance and Serv ice Gui de Spe cificat ion s Disc thickness 1.2 mm (0.047 in) T rack pitch 0.74 µm Access time CD D VD Random Full strok e < 175 ms < 285 ms < 230 ms < 335 ms A udio output level Audio-out, 0.7 Vrms Cache b uffer 2 MB Data transfer rate CD-R (16X) CD-R W (8X) CD-R OM (24X) DV D ( 8 X ) D VD-R (4X) DV D - R W[...]

  • Página 155

    Spe cificat ion s Maintenance and S ervi ce Guide 7–13 T able 7-10 System DMA Hard ware DMA System Function DMA0 Not applicable DMA1* Not applicable DMA2* Not applicable DMA3 SMC IrCC - F ast Infrared P or t DMA4 Direct memor y access controller DMA5* A vailab le f or PC Card DMA6 Not assigned DMA7 Not assigned *PC Card controller ca n use DMA 1,[...]

  • Página 156

    7–14 Maintenance and Serv ice Gui de Spe cificat ion s T able 7-11 System Interrupts IRQ System Function IRQ0 System timer IRQ1 Standard 101-/102-K ey or Microsoft Natural K eyboard IRQ2 Cascaded IRQ3 SMC IrCC - F ast Infrared P or t IRQ4 COM1 IRQ5* Not assigned IRQ6 Diskette driv e IRQ7* P arallel por t IRQ8 System CMOS/real-time clock IRQ9* Mic[...]

  • Página 157

    Spe cificat ion s Maintenance and S ervi ce Guide 7–15 IRQ11* Intel 82801FB/FBM USB Univ ersal Host Controller - 2659 Intel 82801FB/FBM USB Univ er sal Host Controller - 265A Broadcom NetXtreme Gigabit Ether net #2 SoundMAX Integrated Digital A udio IRQ12 Synaptics PS/2 T ouchP ad IRQ13 Numer ic data processor IRQ14 Primar y IDE channel IRQ15* No[...]

  • Página 158

    7–16 Maintenance and Serv ice Gui de Spe cificat ion s I/O Address (he x) System Function (shipping configuration) 054 - 059 U nused 060 K eyboard controller 061 System speak er 062 MS A CPI-Compliant embedded controller 063 System board resources 064 K eyboard controller 065 System board resources 066 MS A CPI-Compliant embedded controller 067 S[...]

  • Página 159

    Spe cificat ion s Maintenance and S ervi ce Guide 7–17 I/O Address (he x) System Function (shipping configuration) 100 - 10F SMC IrCC - F ast Infrared P or t 110 - 1EF Unused 1F0 - 1F7 Pr imar y IDE channel 1F8 - 377 Unused 378 - 37F P arallel por t (LPT1/defa ult) 380 - 3AF Unused 3B0 - 3BB V GA 3BC - 3BF Unused 3C0 - 3DF V GA 3E0 - 3E7 Unused 3[...]

  • Página 160

    7–18 Maintenance and Serv ice Gui de Spe cificat ion s T able 7-13 System Memory Map Size Memory Address System Function 640 KB 00000000 - 0009FFFF Base memor y 128 KB 000A0000 - 000BFFFF Video memor y 128 KB 000C0000 - 000DFFFF Video BIOS and other Optional R OM 128 KB 000E0000 - 000FFFFF System BIOS 2047 MB 00010000 - 7FFFFFFF Extended memor y [...]

  • Página 161

    Maintenance and S ervi ce Guide A–1 A Co nnec tor P in As signm en ts Ta b l e A - 1 A udio-Out (Headphone) Pin Signal Pin Signal 1 A udio out, left channel 3 Ground 2 A udio out, right channel[...]

  • Página 162

    A–2 Maintenance and Serv ice Gui de Connec tor P in Assignments Ta b l e A - 2 A udio-In (Micr ophone) Pin Signal Pin Signal 1 A udio signal in 3 Ground 2 A udio signal in Ta b l e A - 3 Universal Serial Bus Pin Signal Pin Signal 1 +5 VDC 3 Data + 2 Data – 4 Ground[...]

  • Página 163

    Connec tor P in Assignments Maintenance and S ervi ce Guide A–3 Ta b l e A - 4 Serial Pin Signal Pin Signal 1 Carrier detect 6 Data set ready 2 Receive data 7 Ready to send 3 T ransmit data 8 Clear to send 4 Data ter minal ready 9 Ring indicator 5G r o u n d[...]

  • Página 164

    A–4 Maintenance and Serv ice Gui de Connec tor P in Assignments Ta b l e A - 5 P arallel P or t Pin Signal Pin Signal 1 Strobe 14 Auto linef eed 2 Data bit 0 15 Error 3 Data bit 1 16 Initialize printer 4 Data bit 2 17 Select in 5 Data bit 3 18 Ground 6 Data bit 4 19 Ground 7 Data bit 5 20 Ground 8 Data bit 6 21 Ground 9 Data bit 7 22 Ground 10 Ac[...]

  • Página 165

    Connec tor P in Assignments Maintenance and S ervi ce Guide A–5 Ta b l e A - 6 7-Pin S-Video-Out Pin Signal Pin Signal 1 C (chrominance) 5 Composite video 2 Ground 6 Unused 3 Y (luminance) 7 Ground 4G r o u n d[...]

  • Página 166

    A–6 Maintenance and Serv ice Gui de Connec tor P in Assignments Ta b l e A - 7 External Monitor Pin Signal Pin Signal 1 Red analog 9 +5 VDC 2 Green analog 10 Ground 3 Blue analog 11 Monitor detect 4 Not connected 12 DDC 2B data 5 Ground 13 Hor iz ontal sync 6 Ground analog 14 V er tical sync 7 Ground analog 15 DDC 2B clock 8 Ground analog[...]

  • Página 167

    Connec tor P in Assignments Maintenance and S ervi ce Guide A–7 Ta b l e A - 8 RJ-11 (Modem) Pin Signal Pin Signal 1 Unused 4 Unused 2T i p 5U n u s e d 3 Ring 6 Unused[...]

  • Página 168

    A–8 Maintenance and Serv ice Gui de Connec tor P in Assignments Ta b l e A - 9 RJ-45 (Netw ork) Pin Signal Pin Signal 1 T ransmit + 5 Unused 2 T ransmit – 6 Receiv e – 3 Receive + 7 Unused 4 Unused 8 Unused[...]

  • Página 169

    Maintenance and S ervi ce Guide B–1 B P o w er Cord S et R eq uirements 3-Con duc tor P o w er Cord Set The wide range input feature of the notebook permits it to operate from any line v oltage from 100 to 120 or 220 to 240 volts A C. The po wer cord set included with the notebook meets the requirements for use in the country where the equipment [...]

  • Página 170

    B–2 Maintenance and Se rvi ce Guide P o w er Cor d Set R equirements Gen eral R equiremen ts The requirements listed belo w are applicable to all countries. ■ The length of the po wer cord set must be at least 1.5 m (5.0 ft) and a maximum of 2.0 m (6.5 ft). ■ All po wer cord sets must be approv ed by an acceptable accredited agency responsibl[...]

  • Página 171

    P ow er Cor d Set Requir ement s Maintenance and S ervi ce Guide B–3 Coun tr y-Spec ific Requirements 3-Conductor P ower Cor d Set Requirements Country/Region Accredited Agency Applicable Note Number A ustralia EANSW 1 Au s t r i a OVE 1 Belgium CEBC 1 Canada CSA 2 Denmark DEMK O 1 Finland FIMK O 1 F rance UTE 1 Ger many VDE 1 Italy IMQ 1 Jap a n[...]

  • Página 172

    B–4 Maintenance and Se rvi ce Guide P o w er Cor d Set R equirements Ko r e a E K 4 The Netherlands KEMA 1 Norwa y NEMK O 1 P eople’ s Repub lic of China CCC 5 Sweden SEMK O 1 Switzerland SEV 1 T aiwan BSMI 4 United Kingdom BSI 1 United States UL 2 ✎ NOTES: 1. The fle xible cord m ust be <HAR> T ype HO5VV -F , 3-conductor , 1.0 mm² con[...]

  • Página 173

    Maintenance and S ervi ce Guide C–1 C Sc r e w Li sting This appendix provides specif ication and reference information for the scre ws and scre w locks used in the notebook. All scre ws and scre w locks listed in this appendix are a v ailable in the Scre w Kit, spare part number 378235-001.[...]

  • Página 174

    C–2 Maintenance and S ervi ce Guide Scr e w Listi ng Phillips P M2 . 0×4. 0 Scr ew L ocati ons Ta b l e C - 1 Phillips PM2.0×4.0 Screw Color Qty . Length Thread Head Width Black 3 4.0 mm 2.0 mm 4.0 mm Where used: 1 One scre w that secures the memor y module/Mini PCI compar tment cov er to the notebook (screw is captured on the co v er b y a C c[...]

  • Página 175

    Scr ew L isti ng Maintenance and S ervi ce Guide C–3 Philli ps P M2 .5×13 . 0 Scr ew L ocat ion Ta b l e C - 2 Phillips PM2.5×13.0 Spring-Loaded Har d Drive Retention Screw Color Qty . Length Thread Head Width Silv er 1 13.0 mm 2.5 mm 5.5 mm Where used: One screw that secures the hard driv e to the notebook (scre w is captured on the hard drive[...]

  • Página 176

    C–4 Maintenance and S ervi ce Guide Scr e w Listi ng Phillips P M2 . 5×4. 0 Shoulder Sc r e w , Phillips P M2 .5×4. 0 Scr ew , and Phillips P M1. 5×3 . 5 Sc r ew L ocati ons Ta b l e C - 3 Phillips PM2.5×4.0 Shoulder Screw , Phillips PM2.5×4.0 Screw , and Phillips PM1.5×3.5 Screw Color Qty . Length Thread Head Width Silv er 2 4.0 mm 2.5 mm [...]

  • Página 177

    Scr ew L isti ng Maintenance and S ervi ce Guide C–5 T orx T8M2 . 0×9 . 0 Sc r ew L ocatio n Ta b l e C - 4 T orx T8M2.0×9.0 Screw Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: One screw that secures the optical dr iv e to the notebook (documented in Section 6.9 ) mm[...]

  • Página 178

    C–6 Maintenance and S ervi ce Guide Scr e w Listi ng T orx T8M2 . 0×9 . 0 Sc r ew L ocatio ns Ta b l e C - 4 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: 2 screws that secure the k eyboard to the notebook (documented in Section 6.10 ) mm[...]

  • Página 179

    Scr ew L isti ng Maintenance and S ervi ce Guide C–7 T orx T8M2 . 0×9 . 0 Sc r ew L ocatio ns Ta b l e C - 4 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: 2 screws that secure the displa y asse mbly to the notebook (documented in Section 6.18 ) mm[...]

  • Página 180

    C–8 Maintenance and S ervi ce Guide Scr e w Listi ng T orx T8M2 . 0×9 . 0 Sc r ew L ocatio ns Ta b l e C - 4 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: 4 screws that secure the displa y asse mbly to the notebook (documented in Section 6.18 ) mm[...]

  • Página 181

    Scr ew L isti ng Maintenance and S ervi ce Guide C–9 T orx T8M2 . 0×9 . 0 Sc r ew L ocatio ns Ta b l e C - 4 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: 13 screws that secure the top co v er to the notebook (documented in Section 6.19 ) mm[...]

  • Página 182

    C–10 Maintenance and S ervi ce Guide Scr e w Listi ng T orx T8M2 . 0×9 . 0 Sc r ew L ocatio ns Ta b l e C - 4 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: 2 screws that secure the top co v e r to the notebook (documented in Section 6.19 ) mm[...]

  • Página 183

    Scr ew L isti ng Maintenance and S ervi ce Guide C–11 T orx T8M2 . 0×2 .0 S cr ew L o cati ons Ta b l e C - 5 T orx T8M2.0×2.0 Screw Color Qty . Length Thread Head Width Black 2 2.0 mm 2.0 mm 6.0 mm Where used: 2 screws that secure the s witch co v er to the notebook (documented in Section 6.11 ) mm[...]

  • Página 184

    C–12 Maintenance and S ervi ce Guide Scr e w Listi ng Phillips P M1. 5×4. 0 Sc r e w L ocati ons Ta b l e C - 6 Phillips PM1.5×4.0 Screw Color Qty . Length Thread Head Width Silv er 4 4.0 mm 1.5 mm 4.0 mm Where used: 4 screws that secure the LED board to the s witch cov er (documented in Section 6.12 ) mm[...]

  • Página 185

    Scr ew L isti ng Maintenance and S ervi ce Guide C–13 Phill ips P M2 . 0×7 . 0 Scr e w Locations Ta b l e C - 7 Phillips PM2.0×7.0 Screw Color Qty . Length Thread Head Width Silv er 2 7.0 mm 2.0 mm 4.5 mm Where used: 2 screws that secure the f an to the notebook (screws are captured on the f an assembly b y an O clip; documented in Section 6.13[...]

  • Página 186

    C–14 Maintenance and S ervi ce Guide Scr e w Listi ng Phillips P M2 .0×8. 0 Shoulder Sc r e w L ocati ons Ta b l e C - 8 Phillips PM2.0×8.0 Shoulder Screw Color Qty . Length Thread Head Width Silv er 4 8.0 mm 2.0 mm 5.0 mm Where used: 4 screws that secure the hea t sink to the notebook ( screws are captured on the heat sink by C clips; document[...]

  • Página 187

    Scr ew L isti ng Maintenance and S ervi ce Guide C–15 Philli ps P M2 .0×3 .0 Sc r e w Locations Ta b l e C - 9 Phillips PM2.0×3.0 Screw Color Qty . Length Thread Head Width Black 2 3.0 mm 2.0 mm 4.0 mm Where used: 2 screws that secure the modem boar d to the notebook (documented in Section 6.21 ) mm[...]

  • Página 188

    C–16 Maintenance and S ervi ce Guide Scr e w Listi ng T or x T8M2 .0×4. 0 Sc r e w L ocations T able C-10 T orx T8M2.0×4.0 Screw Color Qty . Length Thread Head Width Black 8 4.0 mm 2.0 mm 4.0 mm Where used: 6 screws that secure the speak er to the notebook (documented in Section 6.20 ) mm[...]

  • Página 189

    Scr ew L isti ng Maintenance and S ervi ce Guide C–17 T or x T8M2 .0×4. 0 Sc r e w L ocation T able C-10 T orx T8M2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 4.0 mm 2.0 mm 4.0 mm Where used: One screw that secures the USB/audio board the notebook (documented in Section 6.23 ) mm[...]

  • Página 190

    C–18 Maintenance and S ervi ce Guide Scr e w Listi ng T or x T8M2 .0×4. 0 Sc r e w L ocation T able C-10 T orx T8M2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 4.0 mm 2.0 mm 4.0 mm Where used: One screw that secures the system board the notebook (documented in Section 6.24 ) mm[...]

  • Página 191

    Scr ew L isti ng Maintenance and S ervi ce Guide C–19 He x Soc k et HM5 . 0×9 .0 S cr ew L ock L ocations T able C-11 Hex Soc ket HM5.0×9.0 Screw Lock Color Qty . Length Thread Head Width Silv er 6 9.0 mm 2.5 mm 5.0 mm Where used: 1 T wo screw loc ks that secure the system board to the notebook (documented in Section 6.24 ) 2 T wo screw loc ks [...]

  • Página 192

    C–20 Maintenance and S ervi ce Guide Scr e w Listi ng He x Soc k et HM5 . 0×9 .0 S cr ew L ock L ocations T able C-11 Hex Soc ket HM5.0×9.0 Screw Loc k (Continued) Color Qty . Length Thread Head Width Silv er 6 9.0 mm 2.5 mm 5.0 mm Where used: 2 screw loc ks that secure the ser ial connector board to the system board (documented in Section 6.25[...]

  • Página 193

    Maintenance and S ervi ce Guide Inde x–1 In de x 1394 port 1–11 6-in-1 Digital Media Slot 1–7 6-in-1 Digital Media Slot light 1–7 A AC adapter, spare part numbers 4–11 , 4–13 arrow keys 1–15 audio board removal 6–48 spare part number 6–48 audio board cable 4–9 audio troubleshooting 2–23 audio-in jack location 1–9 pin assignm[...]

  • Página 194

    Inde x–2 Mainten ance and Servi ce Guide Inde x Computer Setup Advanced Menu 2–6 File Menu 2–3 overview 2–1 Security Menu 2–4 Tools Menu 2–5 Computer Setup defaults 2–2 connector pin assignments audio-in A–2 audio-out A–1 external monitor A–6 headphone A–1 microphone A–2 modem A–7 monitor A–6 network A–8 parallel A–4[...]

  • Página 195

    Inde x Maintenance and S ervi ce Guide Inde x–3 DVD-ROM drive OS loading problems 2–17 precautions 5–3 removal 6–16 spare part number 4–7 , 4–10 , 4–15 , 6–16 specifications 7–8 E electrostatic discharge 5–4 , 5–8 exhaust vents 1–11 external monitor port location 1–10 pin assignments A–6 External MultiBay II, spare part [...]

  • Página 196

    Inde x–4 Mainten ance and Servi ce Guide Inde x heat sink removal 6–27 spare part number 4–3 , 4–15 , 6–27 I I/O address specifications 7–15 Info Center button 1–17 infrared port 1–6 interrupt specifications 7–14 K keyboard removal 6–18 spare part numbers 4–3 , 4–16 , 6–18 troubleshooting 2–26 keyboard components 1–12 [...]

  • Página 197

    Inde x Maintenance and S ervi ce Guide Inde x–5 modem cable illustrated 4–9 removal 6–54 modem jack location 1–11 pin assignments A–7 modem, troubleshooting 2–28 monitor port location 1–10 pin assignments A–6 N network jack location 1–11 pin assignments A–8 network, troubleshooting 2–28 nonfunctioning device, troubleshooting 2[...]

  • Página 198

    Inde x–6 Mainten ance and Servi ce Guide Inde x RJ-11 connector module and cable illustrated 4–9 removal 6–54 RJ-11 jack location 1–11 pin assignments A–7 RJ-45 jack location 1–11 pin assignments A–8 RTC battery illustrated 4–8 removal 6–34 S Screw Kit contents C–1 spare part number 4–12 , 4–14 , C–1 screw listing C–1 se[...]

  • Página 199

    Inde x Maintenance and S ervi ce Guide Inde x–7 top cover removal 6–38 spare part number 4–3 , 4–15 , 6–38 TouchPad 1–19 TouchPad buttons 1–19 TouchPad scroll zone 1–19 transporting precautions 5–5 travel battery connector 1–21 travel battery pack, spare part number 4–11 , 4–13 troubleshooting audio 2–23 Computer Setup 2?[...]