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Toshiba TLP848 manual

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Table of contents for the manual

  • Page 1

    TLP848 2007-10-01 1 TOSHIBA Photointerrupter In frared LED + Phototransistor TLP848 ○ Camera Module for Mobile Phone ○ Digital Still Camera and Video Camera ○ Personal Equipment and Sma ll-sized OA Equipment The TLP848 is a surface-moun t photointerrupter which is co mposed of a GaAs infrared LED and a Si phototransistor . It is an ultra comp[...]

  • Page 2

    TLP848 2007-10-01 2 Optical and Electrical Characteristics (T a = 25°C) Characteristics Symbol Test conditions Min Typ. Max Unit Forward voltage V F I F = 10 mA 1.10 1.23 1.40 V Reverse current I R V R = 5 V ⎯ ⎯ 10 μ A LED Peak emission wavelength λ P I F = 10 mA ⎯ 940 ⎯ nm Dark current I D (I CEO ) V CE = 12 V, I F = 0 ⎯ ⎯ 0.05 μ A[...]

  • Page 3

    TLP848 2007-10-01 3 Package Dimensions: TOSHIBA 1 1-3B1 Weight: 0.017 g (typ.) Pin Connection Unit: mm Tolerance : ± 0.1mm unless otherwise specified ( ): Reference value Gate position Center of sensor 1: Cathode 2: Anode 3: Collector 4: Emitter 2 1 3 4[...]

  • Page 4

    TLP848 2007-10-01 4 Handling and Mounting Precautions • Care must be taken in relation to the environment in which th e d e v i c e i s t o b e i n s t alled. Oil or chemicals may cause the package t o melt or crack. • The device should be mounted on an unwarped surface. • Do not apply stress to the resin at high temperature. • The resin pa[...]

  • Page 5

    TLP848 2007-10-01 5 Mounting Methods 1. The example of temperature profile (reflow soldering) • The first reflow process should be per formed under the above temp erature profile within 168 h after opening the bag. • If a second reflow process needs to be performed, it should be performed within 168 h of the fir st reflow under the above temper[...]

  • Page 6

    TLP848 2007-10-01 6 Packing Specification 1. T ape dimensions 1.75±0.1 φ 1.5 + 0.1 − 0 4.0±0.1 2.0±0.05 4.0±0.1 φ 1.1±0.1 3.5±0.05 (2.75) 8.0±0.2 A A' A A' B B' B B' max 5 ° 2.1±0.1 max 5 ° 0.3±0.05 2.7±0.1 3.1±0.1 max 5 ° max 5 ° Unit: mm Device direction[...]

  • Page 7

    TLP848 2007-10-01 7 2. Reel dimensions 3. Leader and trailer sections of t ape 2 ± 0.5 φ 13 ± 0.5 φ 21 ± 0.8 11.4 ± 1 9 ± 0.3 φ 60 φ 180 + 0 − 4 Unit: mm (Note 1) 100 mm or more Leading part: 400 mm or more 160 mm or more (Note 2) Note1: Empty trailer section Note2: Empty leader section[...]

  • Page 8

    TLP848 2007-10-01 8 4. Packing format (1) Packing quan tity Reel 1,500 pcs Carton 7,500 pcs (2) Packing form Each reel is sealed in an aluminu m bag that contains a desic cant with a humidity indic ator .[...]

  • Page 9

    TLP848 2007-10-01 9 0.01 0.1 1 10 1 10 100 1 10 100 1 10 100 1 10 100 0.9 1 1.1 1.2 1.3 1.4 1.5 0 0.5 1 1.5 2 2.5 3 3.5 4 02468 1 0 1 2 0 20 40 60 80 0 2 04 0 6 08 0 1 0 0 0 5 10 15 20 25 30 35 0 2 04 06 08 0 1 0 0 I F – T a Ambient temperature T a (°C) Allowable forward current I F (mA) I F – V F (typ. ) Forward voltage V F ( V ) Forward curr[...]

  • Page 10

    TLP848 2007-10-01 10 1 10 100 1000 11 0 1 0 0 0.00 0.04 0.08 0.12 0.16 0.20 -40 -20 0 20 40 60 80 100 0.1 1 10 100 1000 0.1 1 10 100 0.00001 0.0001 0.001 0.01 0.1 1 10 100 0 20 40 60 80 100 120 0.2 0.4 0.6 0.8 1 1.2 -40 -20 0 20 40 60 80 100 Relative I C – T a ( t y p . ) Ambient temperature T a (°C) Relative collector current V CE = 2V I F = 20[...]

  • Page 11

    TLP848 2007-10-01 11 Relative Positioning of Shutter and Device For normal operation, position the shutter and the devi ce as shown in the figure below . By considering the device's detection direction characteris tic and switching time, determine t he shutter slit width and pitch. 0 0.2 0.4 0.6 0.8 1 1.2 -2 -1 0 1 2 3 4 0 0.2 0.4 0.6 0.8 1 1.[...]

  • Page 12

    TLP848 2007-10-01 12 RESTRICTIONS ON PROD UCT USE 20070701-EN • The information contained herein is subject to change without notice. • TOSHIBA is continuall y working to improve the quality and reliabilit y of its products. Nevertheless, semiconductor devices in general can malfunction or fail d ue to their inherent electrical sensitivit y a n[...]