Texas Instruments SM320F2812-HT manual

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  • Page 1

    SM320F2812-HT Digital Signal Processor Data Manual PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Literature Number: SGUS062A June 2009 – Revised April 2010[...]

  • Page 2

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com Contents 1 Features ........................................................................................................................... 11 1.1 SUPPORTS EXTREME TEMPERATURE APPLICATIONS ......................................................... 12 2 Introduction ..........[...]

  • Page 3

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 4 Peripherals ....................................................................................................................... 52 4.1 32-Bit CPU-Timers 0/1/2 ................................................................................................. 52 4.2 Event Man[...]

  • Page 4

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 6.20 SPI Slave Mode Timing ................................................................................................. 113 6.21 External Interface (XINTF) Timing ..................................................................................... 117 6.22 XINTF Signal Ali[...]

  • Page 5

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 List of Figures 2-1 SM320F2812 Die Layout ........................................................................................................ 15 2-2 SM320F2812 172-Pin HFG CQFP (Top View) ............................................................................... 16 3-1[...]

  • Page 6

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 6-23 General-Purpose Input Timing ................................................................................................ 109 6-24 SPI Master Mode External Timing (Clock Phase = 0) ..................................................................... 110 6-25 SPI Master[...]

  • Page 7

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 List of Tables 2-1 Hardware Features ............................................................................................................... 14 2-2 Bare Die Information ......................................................................................................[...]

  • Page 8

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 6-16 External ADC Start-of-Conversion – EVB – Switching Characteristics ................................................. 106 6-17 Interrupt Switching Characteristics ........................................................................................... 106 6-18 Interru[...]

  • Page 9

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 6-64 Minimum Required Wait-States at Different Frequencies ................................................................ 149 Copyright © 2009–2010, Texas Instruments Incorporated List of Tables 9[...]

  • Page 10

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 10 List of Tables Copyright © 2009–2010, Texas Instruments Incorporated[...]

  • Page 11

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Digital Signal Processor Check for Samples: SM320F2812-HT 1 Features 12 • High-Performance Static CMOS Technology • 128 Bit Security Key/Lock – 150 MHz (6.67 ns Cycle Time) – Protects Flash/ROM/OTP and L0/L1 SARAM – Low Power (1.8 V Core at 135 MHz, 1.9 V, – Prevents[...]

  • Page 12

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com xxx 1.1 SUPPORTS EXTREME TEMPERATURE APPLICATIONS • Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Available in Extreme (–55°C/220°C) Temperature Range (2) • Extended Product Life Cycle • Extended Product-Change Notification • Product Tra[...]

  • Page 13

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 2 Introduction This section provides a summary of the device features, lists the pin assignments, and describes the function of each pin. This document also provides detailed descriptions of peripherals, electrical specifications, parameter measurement information, and mechanica[...]

  • Page 14

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 2.2 Device Summary Table 2-1 provides a summary of the device features. Table 2-1. Hardware Features FEATURE F2812 Instruction Cycle (at 150 MHz) 6.67 ns Single-Access RAM (SARAM) (16 bit word) 18K 3.3 V On-Chip Flash (16 bit word) 128K On-Chip ROM (16-bit word) — Code Securit[...]

  • Page 15

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 2.3 Die Layout The SM320F2812 die layout is shown in Figure 2-1 . See Table 2-3 for a description of each pad's function. Figure 2-1. SM320F2812 Die Layout Table 2-2. Bare Die Information DIE PAD DIE PAD DIE BACKSIDE BACKSIDE DIE SIZE DIE PAD SIZE COMPOSITI COORDINATES THIC[...]

  • Page 16

    V DDAIO 1 130 172 ADCINB0 ADCINB1 ADCINB2 ADCINB3 ADCINB4 ADCINB5 ADCINB6 ADCINB7 ADCREFM ADCREFP A VSSREFBG A VDDREFBG V DDA1 V SSA1 ADCRESEXT MC XMP/ XA[0] MDRA XD[0] MDXA V DD XD[1] MCLKRA MFSXA XD[2] MCLKXA MFSRA XD[3] V DDIO V SS XD[4] SPICLKA SPISTEA XD[5] V DD V SS XD[6] SPISIMOA SPISOMIA XRD XA[1] XZCS0AND1 2 3 4 5 6 7 8 9 10 1 1 12 13 14 1[...]

  • Page 17

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 2.5 Signal Descriptions Table 2-3 specifies the signals on the F2812 device. All digital inputs are TTL-compatible. All outputs are 3.3 V with CMOS levels. Inputs are not 5 V tolerant. A 100 m A (or 20 m A) pullup/pulldown is used. Table 2-3. Signal Descriptions (1) PIN NO. DIE [...]

  • Page 18

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com Table 2-3. Signal Descriptions (1) (continued) PIN NO. DIE PAD DIE PAD DIE PAD NAME X-CENTER Y-CENTER I/O/Z (2) PU/PD (3) DESCRIPTION 172-PIN NO. ( m m) ( m m) HFG Microprocessor/Microcomputer Mode Select. Switches between microprocessor and microcomputer mode. When high, Zone 7[...]

  • Page 19

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Table 2-3. Signal Descriptions (1) (continued) PIN NO. DIE PAD DIE PAD DIE PAD NAME X-CENTER Y-CENTER I/O/Z (2) PU/PD (3) DESCRIPTION 172-PIN NO. ( m m) ( m m) HFG JTAG AND MISCELLANEOUS SIGNALS Oscillator Input – input to the internal oscillator. This pin is also used to feed[...]

  • Page 20

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com Table 2-3. Signal Descriptions (1) (continued) PIN NO. DIE PAD DIE PAD DIE PAD NAME X-CENTER Y-CENTER I/O/Z (2) PU/PD (3) DESCRIPTION 172-PIN NO. ( m m) ( m m) HFG JTAG test reset with internal pulldown. TRST, when driven high, gives the scan system control of the operations of [...]

  • Page 21

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Table 2-3. Signal Descriptions (1) (continued) PIN NO. DIE PAD DIE PAD DIE PAD NAME X-CENTER Y-CENTER I/O/Z (2) PU/PD (3) DESCRIPTION 172-PIN NO. ( m m) ( m m) HFG ADC ANALOG INPUT SIGNALS ADCINA7 163 186 42.6 1253.9 I ADCINA6 164 188 42.6 1094.3 I ADCINA5 165 190 42.6 954.0 I E[...]

  • Page 22

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com Table 2-3. Signal Descriptions (1) (continued) PIN NO. DIE PAD DIE PAD DIE PAD NAME X-CENTER Y-CENTER I/O/Z (2) PU/PD (3) DESCRIPTION 172-PIN NO. ( m m) ( m m) HFG POWER SIGNALS V DD 22 29 2927.6 42.6 V DD 36 43 4395.4 42.6 V DD 55 62 5361.5 1256.0 V DD 73 86 5361.5 3496.4 1.8-V[...]

  • Page 23

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Signal Descriptions (Continued) (1) PIN NO. PERIPHERAL DIE PAD DIE PAD GPIO DIE PAD NO. I/O/Z (2) PU/PD (3) DESCRIPTION 172-PIN SIGNAL X-CENTER Y-CENTER HFG GPIO OR PERIPHERAL SIGNALS GPIOA OR EVA SIGNALS GPIO or PWM GPIOA0 PWM1 (O) 90 104 4908.6 5057.5 I/O/Z PU Output Pin #1 GP[...]

  • Page 24

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com Signal Descriptions (Continued) (1) (continued) PIN NO. PERIPHERAL DIE PAD DIE PAD GPIO DIE PAD NO. I/O/Z (2) PU/PD (3) DESCRIPTION 172-PIN SIGNAL X-CENTER Y-CENTER HFG GPIO or Capture GPIOB8 CAP4_QEP3 (I) 56 64 5361.5 1428.4 I/O/Z PU Input #4 GPIO or Capture GPIOB9 CAP5_QEP4 (I[...]

  • Page 25

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Signal Descriptions (Continued) (1) (continued) PIN NO. PERIPHERAL DIE PAD DIE PAD GPIO DIE PAD NO. I/O/Z (2) PU/PD (3) DESCRIPTION 172-PIN SIGNAL X-CENTER Y-CENTER HFG GPIOF OR CAN SIGNALS GPIO or eCAN GPIOF6 CANTXA (O) 85 99 5361.5 4758.0 I/O/Z PU transmit data GPIO or eCAN GP[...]

  • Page 26

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com Signal Descriptions (Continued) (1) (continued) PIN NO. PERIPHERAL DIE PAD DIE PAD GPIO DIE PAD NO. I/O/Z (2) PU/PD (3) DESCRIPTION 172-PIN SIGNAL X-CENTER Y-CENTER HFG GPIOG OR SCI-B SIGNALS GPIO or SCI GPIOG4 SCITXDB (O) 88 102 5098.0 5057.5 I/O/Z – asynchronous serial port [...]

  • Page 27

    M0 SARAM 1K x 16 CPU-T imer 0 CPU-T imer 1 INT[12:1] CLKIN Real-T ime JT A G CPU-T imer 2 Peripheral Bus C28x CPU H0 SARAM 8K ⋅ 16 INT14 NMI INT13 Memory Bus M1 SARAM 1K x 16 Flash 128K x 16 Boot ROM 4K ⋅ 16 eCAN SCIA/SCIB 12-Bit ADC External Interrupt Control (XINT1/2/13, XNMI) EV A/EVB Memory Bus O TP 1K x 16 McBSP System Control (Oscillator [...]

  • Page 28

    Block Start Address Low 64K (24x/240x Equivalent Data Space) 0x00 0000 M0 V ector − RAM (32 × 32) (Enabled if VMAP = 0) Data Space Prog Space M0 SARAM (1K × 16) M1 SARAM (1K × 16) Peripheral Frame 0 (2K × 16) 0x00 0040 0x00 0400 0x00 0800 PIE V ector - RAM (256 × 16) (Enabled if VMAP = 1, ENPIE = 1) Reserved Reserved Reserved L0 SARAM (4K ×[...]

  • Page 29

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Table 3-1. Addresses of Flash Sectors in F2812 ADDRESS RANGE PROGRAM AND DATA SPACE 0x3D 8000 Sector J, 8K × 16 0x3D 9FFF 0x3D A000 Sector I, 8K × 16 0x3D BFFF 0x3D C000 Sector H, 16K × 16 0x3D FFFF 0x3E 0000 Sector G, 16K × 16 0x3E 3FFF 0x3E 4000 Sector F, 16K × 16 0x3E 7F[...]

  • Page 30

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com memory such that the vector table is fetched externally. The Boot ROM is disabled in this mode. In microcomputer mode, Zone 7 is disabled such that the vectors are fetched from Boot ROM. This allows the user to either boot from on-chip memory or from off-chip memory. The state o[...]

  • Page 31

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 3.2 Brief Descriptions 3.2.1 C28x CPU The C28x™ DSP generation is the newest member of the TMS320C2000™ DSP platform. The C28x is source code compatible to the 24x/240x DSP devices, hence existing 240x users can leverage their significant software investment. Additionally, t[...]

  • Page 32

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com single step through non-time critical code while enabling time-critical interrupts to be serviced without interference. The F2812 implements the real-time mode in hardware within the CPU. This is a unique feature to the F2812, no software monitor is required. Additionally, speci[...]

  • Page 33

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Table 3-3. Boot Mode Selection GPIOF4 GPIOF12 GPIOF3 GPIOF2 BOOT MODE SELECTED (1) (SCITXDA) (MDXA) (SPISTEA) (SPICLK) (2) GPIO PU status (3) PU No PU No PU No PU Jump to Flash/ROM address 0x3F 7FF6 A branch instruction must have been programmed here prior to 1 x x x reset to re[...]

  • Page 34

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com IN NO EVENT SHALL TI BE LIABLE FOR ANY CONSEQUENTIAL, SPECIAL, INDIRECT, INCIDENTAL, OR PUNITIVE DAMAGES, HOWEVER CAUSED, ARISING IN ANY WAY OUT OF YOUR USE OF THE CSM OR THIS DEVICE, WHETHER OR NOT TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE[...]

  • Page 35

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 HALT: Turn off oscillator. This mode basically shuts down the device and places it in the lowest possible power consumption mode. Only a reset or XNMI wakes the device from this mode. 3.2.16 Peripheral Frames 0, 1, 2 (PFn) The F2812 segregates peripherals into three sections. Th[...]

  • Page 36

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 3.2.20 Serial Port Peripherals The F2812 supports the following serial communication peripherals: eCAN: This is the enhanced version of the CAN peripheral. It supports 32 mailboxes, time stamping of messages, and is CAN 2.0B-compliant. McBSP This is the multichannel buffered ser[...]

  • Page 37

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Table 3-4. Peripheral Frame 0 Registers (1) NAME ADDRESS RANGE SIZE (×16) ACCESS TYPE (2) 0x00 0880 Device Emulation Registers 384 EALLOW protected 0x00 09FF 0x00 0A00 reserved 128 0x00 0A7F 0x00 0A80 EALLOW protected FLASH Registers (3) 96 0x00 0ADF CSM Protected 0x00 0AE0 Cod[...]

  • Page 38

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com Table 3-6. Peripheral Frame 2 Registers (1) NAME ADDRESS RANGE SIZE (×16) ACCESS TYPE 0x00 7000 reserved 16 0x00 700F 0x00 7010 System Control Registers 32 EALLOW Protected 0x00 702F 0x00 7030 reserved 16 0x00 703F 0x00 7040 SPI-A Registers 16 Not EALLOW Protected 0x00 704F 0x0[...]

  • Page 39

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 3.4 Device Emulation Registers These registers are used to control the protection mode of the C28x CPU and to monitor some critical device signals. The registers are defined in Table 3-7 . Table 3-7. Device Emulation Registers NAME ADDRESS RANGE SIZE (×16) DESCRIPTION 0x00 0880[...]

  • Page 40

    XD(15:0) XA(18:0) XZCS6 XZCS7 XZCS6AND7 XZCS2 XWE XR/W XREADY XMP/MC XHOLD XHOLDA XCLKOUT XRD XINTF Zone 0 (8K × 16) XINTF Zone 1 (8K × 16) XINTF Zone 6 (512K × 16) XINTF Zone 7 (16K × 16) (mapped here if MP/MC = 1) 0x40 0000 0x3F C000 0x18 0000 0x10 0000 0x00 6000 0x00 4000 0x00 2000 0x00 0000 Data Space Prog Space XINTF Zone 2 (512K × 16) 0x[...]

  • Page 41

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 The operation and timing of the external interface, can be controlled by the registers listed in Table 3-8 . Table 3-8. XINTF Configuration and Control Register Mappings NAME ADDRESS SIZE (×16) DESCRIPTION XINTF Timing Register, Zone 0 can access as two 16-bit registers or one [...]

  • Page 42

    C28x CPU PIE TIMER 2 (for RT OS) TIMER 0 W atchdog Peripherals (SPI, SCI, McBSP , CAN, EV , ADC) (41 Interrupts) 96 Interrupts † TINT0 Interrupt Control XNMICR(15:0) XINT1 Interrupt Control XINT1CR(15:0) XINT2 Interrupt Control XINT2CR(15:0) GPIO MUX WDINT INT1 to INT12 INT13 INT14 NMI XINT1CTR(15:0) XINT2CTR(15:0) XNMICTR(15:0) TIMER 1 (for RT O[...]

  • Page 43

    INT12 MUX INT1 1 INT2 INT1 CPU (Enable) (Flag) INTx INTx.8 PIEIERx(8:1) PIEIFRx(8:1) MUX INTx.7 INTx.6 INTx.5 INTx.4 INTx.3 INTx.2 INTx.1 From Peripherals or External Interrupts (Enable) (Flag) IER(12:1) IFR(12:1) Global Enable INTM 1 0 PIEACKx (Enable/Flag) SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Figure 3-5. Multiple[...]

  • Page 44

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com Table 3-11. PIE Configuration and Control Registers (1) NAME ADDRESS SIZE (×16) DESCRIPTION PIECTRL 0x0000-0CE0 1 PIE, Control Register PIEACK 0x0000-0CE1 1 PIE, Acknowledge Register PIEIER1 0x0000-0CE2 1 PIE, INT1 Group Enable Register PIEIFR1 0x0000-0CE3 1 PIE, INT1 Group Fla[...]

  • Page 45

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 3.6.1 External Interrupts Table 3-12. External Interrupts Registers NAME ADDRESS SIZE (×16) DESCRIPTION XINT1CR 0x00 7070 1 XINT1 control register XINT2CR 0x00 7071 1 XINT2 control register 0x00 7072 reserved 5 0x00 7076 XNMICR 0x00 7077 1 XNMI control register XINT1CTR 0x00 70[...]

  • Page 46

    SeeNote A SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 3.7 System Control This section describes the F2812 oscillator, PLL and clocking mechanisms, the watchdog function and the low power modes. Figure 3-6 shows the various clock and reset domains in the F2812 device that are discussed. A. CLKIN is the clock input to th[...]

  • Page 47

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 The PLL, clocking, watchdog, and low-power modes are controlled by the registers listed in Table 3-13 . Table 3-13. PLL, Clocking, Watchdog, and Low-Power Mode Registers (1) NAME ADDRESS SIZE (×16) DESCRIPTION 0x00 7010 reserved 8 0x00 7017 reserved 0x00 7018 1 reserved 0x00 70[...]

  • Page 48

    X2 X1/XCLKIN On-Chip Oscillator (OSC) PLL Bypass /2 XF_XPLLDIS OSCCLK (PLL Disabled) Latch XPLLDIS XRS PLL 4-Bit PLL Select SYSCLKOUT 1 0 CLKIN CPU 4-Bit PLL Select XCLKIN PLL Block SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 3.8 OSC and PLL Block Figure 3-7 shows the OSC and PLL block on the F2812. Figure 3-7. OSC and PL[...]

  • Page 49

    External Clock Signal (T oggling 0 −V D D ) C b1 (see Note A) X2 X1/XCLKIN X1/XCLKIN X2 Crystal C b2 (see Note A) (a) (b) NC SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 3.8.1 Loss of Input Clock In PLL enabled mode, if the input clock XCLKIN or the oscillator clock is removed or absent, the PLL still issues a limp-mode [...]

  • Page 50

    /512 OSCCLK WDCR (WDPS(2:0)) WDCLK WDCNTR(7:0) WDKEY(7:0) Bad Key Good Key 101 WDCR (WDCHK(2:0)) Bad WDCHK Key WDCR (WDDIS) Clear Counter SCSR (WDENINT) W atchdog Prescaler Generate Output Pulse (512 OSCCLKs) 8-Bit W atchdog Counter CLR WDRST WDINT W atchdog 55 + AA Key Detector XRS Core-reset WDRST (See Note A) Internal Pullup SM320F2812-HT SGUS06[...]

  • Page 51

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 3.12 Low-Power Modes Block The low-power modes on the F2812 are similar to the 240x devices. Table 3-16 summarizes the various modes. Table 3-16. F2812 Low-Power Modes MODE LPM(1:0) OSCCLK CLKIN SYSCLKOUT EXIT (1) Normal X,X on on on – XRS, WDINT, IDLE 0,0 on on on (2) Any Ena[...]

  • Page 52

    Borrow Reset T imer Reload SYSCLKOUT TCR.4 (T imer Start Status) TINT 16-Bit T imer Divide-Down TDDRH:TDDR 32-Bit T imer Period PRDH:PRD 32-Bit Counter TIMH:TIM 16-Bit Prescale Counter PSCH:PSC Borrow SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 4 Peripherals The integrated peripherals of the F2812 are described in the fol[...]

  • Page 53

    INT1 to INT12 INT14 C28x TINT2 TINT0 PIE CPU-TIMER 0 CPU-TIMER 2 (Reserved for TI system functions) INT13 TINT1 CPU-TIMER 1 (Reserved for TI system functions) XINT13 SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 In the F2812 device, the timer interrupt signals (TINT0, TINT1, TINT2) are connected as shown in Figure 4-2 . A. [...]

  • Page 54

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com Table 4-1. CPU-Timers 0, 1, 2 Configuration and Control Registers NAME ADDRESS SIZE (×16) DESCRIPTION TIMER0TIM 0x00 0C00 1 CPU-Timer 0, Counter Register TIMER0TIMH 0x00 0C01 1 CPU-Timer 0, Counter Register High TIMER0PRD 0x00 0C02 1 CPU-Timer 0, Period Register TIMER0PRDH 0x00[...]

  • Page 55

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 4.2 Event Manager Modules (EVA, EVB) The event-manager modules include general-purpose (GP) timers, full-compare/PWM units, capture units, and quadrature-encoder pulse (QEP) circuits. EVA and EVB timers, compare units, and capture units function identically. However, timer/unit [...]

  • Page 56

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com Table 4-3. EVA Registers (1) NAME ADDRESS SIZE (×16) DESCRIPTION GPTCONA 0x00 7400 1 GP Timer Control Register A T1CNT 0x00 7401 1 GP Timer 1 Counter Register T1CMPR 0x00 7402 1 GP Timer 1 Compare Register T1PR 0x00 7403 1 GP Timer 1 Period Register T1CON 0x00 7404 1 GP Timer 1[...]

  • Page 57

    GPTCONA(12:4), CAPCONA(8), EXTCONA[0] EV A T O ADC (Internal) T imer 1 Compare Output Logic T1PWM_T1CMP GPTCONA(1,0) T1CON(1) GP T imer 1 TCLKINA Prescaler HSPCLK T1CON(10:8) T1CON(5,4) clock Full Compare 1 Full Compare 2 Full Compare 3 SVPWM State Machine Dead - Band Logic Output Logic PWM1 PWM2 PWM3 PWM4 PWM5 PWM6 T1CON(15:1 1,6,3,2) TDIRA dir T [...]

  • Page 58

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 4.2.1 General-Purpose (GP) Timers There are two GP timers. The GP timer x (x = 1 or 2 for EVA; x = 3 or 4 for EVB) includes: • A 16-bit timer, up-/down-counter, TxCNT, for reads or writes • A 16-bit timer-compare register, TxCMPR (double-buffered with shadow register), for r[...]

  • Page 59

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 4.2.6 PWM Characteristics Characteristics of the PWMs are as follows: • 16-bit registers • Wide range of programmable deadband for the PWM output pairs • Change of the PWM carrier frequency for PWM frequency wobbling as needed • Change of the PWM pulse widths within and [...]

  • Page 60

    Input Ana log Voltag e ADCLO 4096 , 3 - ´ SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 4.3 Enhanced Analog-to-Digital Converter (ADC) Module A simplified functional block diagram of the ADC module is shown in Figure 4-4. The ADC module consists of a 12-bit ADC with a built-in sample-and-hold (S / H) circuit. Functions of [...]

  • Page 61

    Result Registers EVB S/W ADCSOC EV A S/W Sequencer 2 Sequencer 1 SOC SOC ADC Control Registers 70B7h 70B0h 70AFh 70A8h Result Reg 15 Result Reg 8 Result Reg 7 Result Reg 1 Result Reg 0 Module ADC 12-Bit Analog MUX ADCINA0 ADCINA7 ADCINB0 ADCINB7 System Control Block High-Speed Prescaler HSPCLK ADCENCLK C28x SYSCLKOUT S/H S/H SM320F2812-HT www.ti.co[...]

  • Page 62

    ADCINA[7:0] ADCINB[7:0] ADCLO ADCBGREFIN † ADC External Current Bias Resistor ADCRESEXT ADCREFP V DD A1 V DD A2 V SSA1 V SSA2 A VDDREFBG A VSSREFBG V DD AIO V SSAIO V DD 1 V SS1 T est Pin ADC Reference Positive Output ADCREFM ADC Reference Medium Output ADC Analog Power ADC Reference Power ADC Analog I/O Power ADC Digital Power Analog input 0−3[...]

  • Page 63

    ADCINA[7:0] ADCINB[7:0] ADCLO ADCBGREFIN ADC External Current Bias Resistor ADCRESEXT ADCREFP V DD A1 V DD A2 V SSA1 V SSA2 A VDDREFBG A VSSREFBG V DD AIO V SSAIO V DD 1 V SS1 T est Pin ADC Reference Positive Input ADCREFM ADC Reference Medium Input ADC Analog Power ADC Reference Power ADC Analog I/O Power ADC Digital Power Analog Input 0−3 V Wit[...]

  • Page 64

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com The ADC operation is configured, controlled, and monitored by the registers listed in Table 4-4 . Table 4-4. ADC Registers (1) NAME ADDRESS SIZE (×16) DESCRIPTION ADCTRL1 0x00 7100 1 ADC Control Register 1 ADCTRL2 0x00 7101 1 ADC Control Register 2 ADCMAXCONV 0x00 7102 1 ADC Ma[...]

  • Page 65

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 4.4 Enhanced Controller Area Network (eCAN) Module The CAN module has the following features: • Fully compliant with CAN protocol, version 2.0B • Supports data rates up to 1 Mbps • Thirty-two mailboxes, each with the following properties: – Configurable as receive or tra[...]

  • Page 66

    Mailbox RAM (512 Bytes) 32-Message Mailbox of 4 × 32-Bit W ords Memory Management Unit CPU Interface, Receive Control Unit, T imer Management Unit eCAN Memory (512 Bytes) Registers and Message Objects Control 32 32 Message Controller 32 32 32 32 32 32 eCAN Protocol Kernel Receive Buffer T ransmit Buffer Control Buffer Status Buffer Enhanced CAN Co[...]

  • Page 67

    Mailbox Enable − CANME Mailbox Direction − CANMD T ransmission Request Set − CANTRS T ransmission Request Reset − CANTRR T ransmission Acknowledge − CANT A Abort Acknowledge − CANAA Received Message Pending − CANRMP Received Message Lost − CANRML Remote Frame Pending − CANRFP Global Acceptance Mask − CANGAM Master Control − CA[...]

  • Page 68

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com The CAN registers listed in Table 4-6 are used by the CPU to configure and control the CAN controller and the message objects. eCAN control registers only support 32-bit read/write operations. Mailbox RAM can be accessed as 16 bits or 32 bits. 32-bit accesses are aligned to an e[...]

  • Page 69

    CLKSRG McBSP clock rat e CLKG , 1 CLKGDIV = = + SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 4.5 Multichannel Buffered Serial Port (McBSP) Module The McBSP module has the following features: • Compatible to McBSP in TMS320C54x™/ TMS320C55x™ DSP devices, except the DMA features • Full-duplex communication • Double[...]

  • Page 70

    McBSP Receive Interrupt Select Logic DX DR Expand Logic DRR1 Receive Buffer RX FIFO Interrupt DRR2 Receive Buffer RX FIFO Registers RBR1 Register RBR2 Register McBSP Registers and Control Logic CLKX FSX CLKR FSR 16 Compand Logic DXR2 T ransmit Buffer RSR1 XSR2 XSR1 Peripheral Read Bus 16 16 16 16 16 RSR2 DXR1 T ransmit Buffer 16 LSPCLK MRINT T o CP[...]

  • Page 71

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Table 4-7 provides a summary of the McBSP registers. Table 4-7. McBSP Register Summary ADDRESS TYPE RESET VALUE NAME DESCRIPTION 0x00 78xxh (R/W) (HEX) DATA REGISTERS, RECEIVE, TRANSMIT (1) – – – 0x0000 McBSP Receive Buffer Register – – – 0x0000 McBSP Receive Shift R[...]

  • Page 72

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com Table 4-7. McBSP Register Summary (continued) ADDRESS TYPE RESET VALUE NAME DESCRIPTION 0x00 78xxh (R/W) (HEX) FIFO MODE REGISTERS (applicable only in FIFO mode) FIFO Data Registers (1) McBSP Data Receive Register 2 – Top of receive FIFO DRR2 00 R 0x0000 –Read First FIFO poi[...]

  • Page 73

    LSPCLK , (BRR 1 ) 8 + · LSPCLK , 16 6 150 MHz Max b it rate 9.375 10 b / s 2 8 = = ´ ´ SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 4.6 Serial Communications Interface (SCI) Module The F2812 device include two serial communications interface (SCI) modules. The SCI modules support digital communications between the CPU a[...]

  • Page 74

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com NOTE All registers in this module are 8-bit registers that are connected to Peripheral Frame 2. When a register is accessed, the register data is in the lower byte (7–0), and the upper byte (15–8) is read as zeros. Writing to the upper byte has no effect. Enhanced features: [...]

  • Page 75

    TX FIFO _0 LSPCLK WUT Frame Format and Mode Even/Odd Enable Parity SCI RX Interrupt select logic BRKDT RXRDY SCIRXST .6 SCICTL1.3 8 SCICTL2.1 RX/BK INT ENA SCIRXD SCIRXST .1 TXENA SCI TX Interrupt select logic TX EMPTY TXRDY SCICTL2.0 TX INT ENA SCITXD RXENA SCIRXD RXW AKE SCICTL1.6 RX ERR INT ENA TXW AKE SCITXD SCICCR.6 SCICCR.5 SCITXBUF .7−0 SC[...]

  • Page 76

    LSPCLK , (SPIBRR 1 ) + L S P C L K , 4 SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 4.7 Serial Peripheral Interface (SPI) Module The F2812 device includes the four-pin serial peripheral interface (SPI) module. The SPI is a high-speed, synchronous serial I/O port that allows a serial bit stream of programmed length (one to [...]

  • Page 77

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Enhanced feature: • 16-level transmit/receive FIFO • Delayed transmit control The SPI port operation is configured and controlled by the registers listed in Table 4-10 . Table 4-10. SPI Registers (1) NAME ADDRESS SIZE (×16) DESCRIPTION SPICCR 0x00 7040 1 SPI Configuration C[...]

  • Page 78

    S SPICTL.0 SPI INT FLAG SPI INT E N A SPISTS.6 S Clock Polarity T alk LSPCLK 4 5 6 1 2 3 0 0 1 2 3 SPI Bit Rate State Control SPIRXBUF Buffer Register Clock Phase Receiver Overrun Flag SPICTL.4 Overrun INT ENA SPICCR.3 − 0 SPIBRR.6 − 0 SPICCR.6 SPICTL.3 SPIDA T .15 − 0 SPICTL.1 M S M Master/Slave SPISTS.7 SPIDA T Data Register M S SPICTL.2 SP[...]

  • Page 79

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 4.8 GPIO MUX The GPIO Mux registers are used to select the operation of shared pins on the F2812 device. The pins can be individually selected to operate as Digital I/O or connected to Peripheral I/O signals (via the GPxMUX registers). If selected for Digital I/O mode, registers[...]

  • Page 80

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com Table 4-12. GPIO Data Registers (1) (2) NAME ADDRESS SIZE (×16) REGISTER DESCRIPTION GPADAT 0x00 70E0 1 GPIO A Data Register GPASET 0x00 70E1 1 GPIO A Set Register GPACLEAR 0x00 70E2 1 GPIO A Clear Register GPATOGGLE 0x00 70E3 1 GPIO A Toggle Register GPBDAT 0x00 70E4 1 GPIO B [...]

  • Page 81

    Peripheral I/O MUX 0 1 MUX 1 0 PIN Internal (Pullup or Pulldown) Digital I/O XRS High-Impedance Enable (1) High- Impedance Control GPxDIR Register Bit GPxMUX Register Bit GPxQUAL Register GPxDA T/SET/CLEAR/T OGGLE Register Bit(s) Input Qualification SYSCLKOUT SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Figure 4-12 shows h[...]

  • Page 82

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 5 Development Support Texas Instruments (TI) offers an extensive line of development tools for the C28x™ generation of DSPs, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software [...]

  • Page 83

    PREFIX SM 320 F 2812 HFG TMX = experimental de vice TMP = prototype dev ice TMS = qualified de vice SM = commercial processing SMJ = M IL-PRF-38535 (QML) DEVICE F AMIL Y 320 = TMS320  DSP Family TECHNOLOGY PACKAGETYPE † HFG = 172-pin CQFP KGD = Die DEVICE 2810 TEMPERA TURE RANGE M S = -55°C to 220°C F = Flash EEPROM (1.8-V/1.9-V Core/3.3-[...]

  • Page 84

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com TMS320x281x, 280x Enhanced Controller Area Network (eCAN) Reference Guide (literature number SPRU074) describes the eCAN that uses established protocol to communicate serially with other controllers in electrically noisy environments. With 32 fully configurable mailboxes and tim[...]

  • Page 85

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Updated information on the TMS320™ DSP controllers can be found on the worldwide web at: http://www.ti.com . To send comments regarding this TMS320F281x/TMS320C281x data manual (literature number SPRS174), use the commentsatbooks.sc.ti.com email address, which is a repository [...]

  • Page 86

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 6.2 Recommended Operating Conditions See (1) MIN NOM MAX UNIT V DDIO Device supply voltage, I/O 3.14 3.3 3.47 V 1.8 V (135 MHz) 1.71 1.8 1.89 V DD , V DD1 Device supply voltage, CPU V 1.9 V (150 MHz) 1.81 1.9 2 V SS Supply ground 0 V V DDA1 , V DDA2 , ADC supply voltage 3.14 3.3[...]

  • Page 87

    1.00E+06 1.00E+05 1.00E+04 1.00E+03 1.00E+02 70 150 200 220 Die Junction T emperature (°C) Hours SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Figure 6-1. SM320F2812-HT Life Expectancy Curve Notes: 1. See data sheet for absolute maximum and minimum recommended operating conditions. 2. Silicon operating life design goal is [...]

  • Page 88

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 6.4 Current Consumption by Power-Supply Pins Over Recommended Operating Conditions During Low-Power Modes at 150-MHz SYSCLKOUT T A = –55°C to 125°C T A = 220°C MODE TEST CONDITIONS I DD I DDIO I DD3VFL I DDA (1) I DD I DDIO I DD3VFL I DDA (1) TYP MAX (2) TYP MAX (2) TYP MAX[...]

  • Page 89

    0 50 100 150 200 250 0 20 40 60 80 100 120 140 160 SYSCLKOUT (MHz) IDD IDDIO IDD3VFL IDDA T otal 3.3−V current Current (mA) 0 100 200 300 400 500 600 700 0 20 40 60 80 100 120 140 160 SYSCLKOUT (MHz) TOT AL POWER Power (mW) SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 6.5 Current Consumption Graphs A. Test conditions are[...]

  • Page 90

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 6.6 Reducing Current Consumption 28x DSPs incorporate a unique method to reduce the device current consumption. A reduction in current consumption can be achieved by turning off the clock to any peripheral module which is not used in a given application. Table 6-1 indicates the [...]

  • Page 91

    SeeFigure6-8, SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Table 6-2. Recommended Low-Dropout Regulators SUPPLIER PART NUMBER Texas Instruments TPS767D301 NOTE The GPIO pins are undefined until V DD = 1 V and V DDIO = 2.5 V. Figure 6-4. F2812 Typical Power-Up and Power-Down Sequence – Option 2 6.8 Signal Transition[...]

  • Page 92

    0.4 V (V OL ) 20% 2.4 V (V OH ) 80% 0.8 V (V IL ) 10% 2.0 V (V IH ) 90% SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com Figure 6-5. Output Levels Output transition times are specified as follows: • For a high-to-low transition , the level at which the output is said to be no longer high is below 80% of the total voltage ran[...]

  • Page 93

    T ransmission Line 4.0 pF 1.85 pF Z0 = 50 Ω (see note) T ester Pin Electronics Data Sheet T iming Reference Point Output Under T est NOTE: The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line ef fects must be taken into account. A transmission line with a delay of 2 ns [...]

  • Page 94

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 6.12 Device Clock Table This section provides the timing requirements and switching characteristics for the various clock options available on the F2812 DSP. Table 6-3 lists the cycle times of various clocks. Table 6-3. Clock Table and Nomenclature MIN NOM MAX UNIT t c(OSC) , Cy[...]

  • Page 95

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Table 6-5. XCLKIN Timing Requirements – PLL Bypassed or Enabled (1) NO. MIN MAX UNIT C8 t c(CI) Cycle time, XCLKIN 6.67 250 ns Up to 30 MHz 6 C9 t f(CI) Fall time, XCLKIN ns 30 MHz to 150 MHz 2 Up to 30 MHz 6 C10 t r(CI) Rise time, XCLKIN ns 30 MHz to 150 MHz 2 C11 t w(CIL) Pu[...]

  • Page 96

    SeeNote A SeeNoteB SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com A. The relationship of XCLKIN to XCLKOUT depends on the divide factor chosen. The waveform relationship shown in Figure 6-8 is intended to illustrate the timing parameters only and may differ based on configuration. B. XCLKOUT configured to reflect SY[...]

  • Page 97

    t w(RSL 1) t h(XPL LD IS) t h(XM P/MC) t h(b oot-m ode) (See Note D) V DD IO , V DD3VF L V DD An , V DDA IO (3.3 V) (See Note B) XCLKIN 2.5 V 0.3 V X1 XRS XF/XPLLDIS XMP/MC Boot-Mode Pins V DD , V DD 1 (1.8 V (or 1.9 V)) XCLKOUT I/O Pins User-Code Dependent User-Code Dependent User-Code Dependent Boot-ROM Execution Starts Peripheral/GPIO Function B[...]

  • Page 98

    t w(RSL ) t h(XPL LD IS) t h(XM P/MC) t OSCST V DD IO , V DD3VF L V DD An , V DDA IO (3.3 V) XCLKIN X1 XRS XF/XPLLDIS XMP/MC V DD , V DD 1 (1.8 V (or 1.9 V)) I/O Pins XPLLDIS Sampling Address/Data/ Control XCLKOUT (Don’t Care) (Don’t Care) GPIOF14/XF (User-Code Dependent) XCLKIN/8 (See Note A) (Don’t Care) Input Configuration (State Depends o[...]

  • Page 99

    XCLKIN/8 (XCLKIN * 5) t h(XPL LD IS) t h(XM P/MC) t h(b oot-m ode) (see Note A) t w(RSL 2) XCLKIN X1 XRS XF/XPLLDIS XMP/MC Boot-Mode Pins XCLKOUT I/O Pins Address/Data/ Control Boot-ROM Execution Starts User-Code Execution Starts User-Code Dependent User-Code Dependent User-Code Execution Phase (Don’t Care) (Don’t Care) (Don’t Care) (Don’t [...]

  • Page 100

    W AKE INT (see Note B) XCLKOUT (see Note A) A0−A15 t d(W A KE− IDLE) t w(W AK E− INT) SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 6.15 Low-Power Mode Wakeup Timing Table 6-10 is also the IDLE Mode Wake-Up Timing Requirements table. Table 6-10. IDLE Mode Switching Characteristics (1) PARAMETER TEST CONDITIONS MIN TYP[...]

  • Page 101

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Table 6-11 is also the STANDBY Mode Wake-Up Timing Requirements table. Table 6-11. STANDBY Mode Switching Characteristics (1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Delay time, IDLE instruction t d(IDLE-XCOH) 32 × t c(SCO) 12 × t c(CI) Cycles executed to XCLKOUT high Witho[...]

  • Page 102

    t w(W AK E-INT) t d(W A KE-ST BY) t d(IDL E−XC OH) 32 SYSCLKOUT Cycles W ake−up Signal X1/XCLKIN XCLKOUT † ST ANDBY Normal Execution ST ANDBY Flushing Pipeline A B C D E F Device Status NOTES: A. IDLE instruction is executed to put the device into ST ANDBY mode. B. The PLL block responds to the ST ANDBY signal. SYSCLKOUT is held for approxima[...]

  • Page 103

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Table 6-12. HALT Mode Switching Characteristics (1) PARAMETER MIN TYP MAX UNIT Delay time, IDLE instruction executed to XCLKOUT t d(IDLE-XCOH) 32 × t c(SCO) 45 × t c(SCO) Cycles high t w(WAKE-XNMI) Pulse duration, XNMI wakeup signal 2 × t c(CI) Cycles t w(WAKE-XRS) Pulse dura[...]

  • Page 104

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com A. IDLE instruction is executed to put the device into HALT mode. B. The PLL block responds to the HALT signal. SYSCLKOUT is held for another 32 cycles before the oscillator is turned off and the CLKIN to the core is stopped. This 32-cycle delay enables the CPU pipe and any othe[...]

  • Page 105

    t w(PWM ) t d(PW M)XC O PWMx XCLKOUT (see Note A) XCLKOUT (see Note A) t w(TD IR) TDIRx SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Table 6-13. PWM Switching Characteristics (1) (2) PARAMETER TEST CONDITIONS MIN MAX UNIT t w(PWM) (3) (4) Pulse duration, PWMx output high/low 25 ns t d(PWM)XCO Delay time, XCLKOUT high to PW[...]

  • Page 106

    XCLKOUT t d(XC OH-EV ASOCL ) EV ASOC t w(EV A SOCL ) XCLKOUT t d(XC OH-EVB SOCL ) EVBSOC t w(EVBSOC L) SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com Table 6-15. External ADC Start-of-Conversion – EVA – Switching Characteristics (1) (2) PARAMETER MIN MAX UNIT t d(XCOH-EVASOCL) Delay time, XCLKOUT high to EVASOC low 1 × [...]

  • Page 107

    PWM (see Note C) TxCTRIP , CxTRIP , PDPINTx (see Note B) XCLKOUT (see Note A) t w(PDP) , t w(C xTR IP) , t w(TxCT RIP) t d(PD P-PWM )HZ , t d(TR IP-PWM)H Z XNMI, XINT1, XINT2 t w(INT) Interrupt V ector t d(INT ) A0−A15 SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Table 6-18. Interrupt Timing Requirements MIN MAX UNIT wit[...]

  • Page 108

    t d(XC OH-GPO) GPIO XCLKOUT t r(GPO) t f(GPO) GPIO Signal 1 Sampling Window QUALPRD Output From Qualifier 1 1 111111111 0000000 000 SYSCLKOUT QUALPRD = 1 (2 x SYSCLKOUT cycles) x 5 NOTES: A. This glitch is ignored by the input qualifier . The QUALPRD bit field specifies the qualification sampling period. It can vary from 00 to 0xFF . Input qualific[...]

  • Page 109

    t c(SPC) + SPI clock cycle time + LSPCL K 4 or L SPCLK (SPIB RR ) 1) + t c(LCO) + L SPCLK cycle tim e GPIOxn XCLKOUT t w(GPI) (2) SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Figure 6-23. General-Purpose Input Timing NOTE The pulse width requirement for general-purpose input is applicable for the XBIO and ADCSOC pins as we[...]

  • Page 110

    9 4 SPISOMI SPISIMO SPICLK (clock polarity = 1) SPICLK (clock polarity = 0) Master In Data Must Be V alid Master Out Data Is V alid 8 5 3 2 1 SPISTE (see Note A) SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com NOTE Internal clock prescalers must be adjusted such that the SPI clock speed is not greater than the I/O buffer spee[...]

  • Page 111

    t c(SPC) + SPI clock cycle time + LSPCL K 4 or L SPCLK (SPIB RR ) 1) + t c(LCO) + L SPCLK cycle tim e (2) SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Table 6-22. SPI Master Mode External Timing (Clock Phase = 1) (1) (2) (3) SPI WHEN (SPIBRR + 1) SPI WHEN (SPIBRR + 1) IS EVEN OR IS ODD AND NO. UNIT SPIBRR = 0 OR 2 SPIBRR &[...]

  • Page 112

    Data V alid 1 1 SPISOMI SPISIMO SPICLK (clock polarity = 1) SPICLK (clock polarity = 0) Master In Data Must Be V alid Master Out Data Is V alid 1 7 6 10 3 2 SPISTE (see Note A) SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com A. In the master mode, SPISTE goes active 0.5tc(SPC) before valid SPI clock edge. On the trailing end [...]

  • Page 113

    t c(SPC) + SPI clock cycle time + LSPCL K 4 or L SPCLK (SPIB RR ) 1) + t c(LCO) + L SPCLK cycle tim e 20 15 SPISIMO SPISOMI SPICLK (clock polarity = 1) SPICLK (clock polarity = 0) SPISIMO Data Must Be V alid SPISOMI Data Is V alid 19 16 14 13 12 SPISTE (see Note A) (2) SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 6.20 SPI [...]

  • Page 114

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 114 Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): SM320F2812-HT[...]

  • Page 115

    t c(SPC) + SPI clock cycle time + LSPCL K 4 or L SPCLK (SPIB RR ) 1) + t c(LCO) + L SPCLK cycle tim e Data V alid 22 SPISIMO SPISOMI SPICLK (clock polarity = 1) SPICLK (clock polarity = 0) SPISIMO Data Must Be V alid SPISOMI Data Is V alid 21 12 18 17 14 13 SPISTE (see Note A) (2) SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 20[...]

  • Page 116

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 116 Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): SM320F2812-HT[...]

  • Page 117

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 6.21 External Interface (XINTF) Timing Each XINTF access consists of three parts: Lead, Active, and Trail. The user configures the Lead/Active/Trail wait states in the XTIMING registers. There is one XTIMING register for each XINTF zone. Table 6-25 shows the relationship between[...]

  • Page 118

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com NOTE Restriction does not include external hardware wait states These requirements result in the following XTIMING register configuration restrictions: Table 6-28. XTIMING Register Configuration Restrictions (1) (2) XRDLEAD XRDACTIVE XRDTRAIL XWRLEAD XWRACTIVE XWRTRAIL X2TIMING [...]

  • Page 119

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 or Table 6-31. XTIMING Register Configuration Restrictions (1) (2) XRDLEAD XRDACTIVE XRDTRAIL XWRLEAD XWRACTIVE XWRTRAIL X2TIMING ≥ 2 ≥ 1 0 ≥ 2 ≥ 1 0 0, 1 (1) Not production tested. (2) No hardware to detect illegal XTIMING configurations Examples of valid and invalid ti[...]

  • Page 120

    XTIMING0 XTIMING1 XTIMING2 XTIMING6 XTIMING7 XBANK LEAD/ACTIVE/TRAIL 1 † 0 XCLKOUT /2 XTIMCLK 1 † 0 /2 C28x CPU XINTCNF2 (CLKMODE) XINTCNF2 (XTIMCLK) † Default V alue after reset SYSCLKOUT XINTCNF2 (CLKOFF) 1 0 0 SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com The relationship between SYSCLKOUT and XTIMCLK is shown in F[...]

  • Page 121

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 6.22 XINTF Signal Alignment to XCLKOUT For each XINTF access, the number of lead, active, and trail cycles is based on the internal clock XTIMCLK. Strobes such as XRD, XWE, and zone chip-select (XZCS) change state in relationship to the rising edge of XTIMCLK. The external clock[...]

  • Page 122

    Lead Active T rail DIN t d(XC OHL -XRDL ) t d(XC OH-XA ) t d(XC OH-XZ CSL) t d(XC OHL -XRDH ) t h(XD )XRD t d(XC OHL -XZCSH ) XCLKOUT=XTIMCLK XCLKOUT= 1/2 XTIMCLK XZCS0AND1 , XZCS2 , XZCS6AND7 XA[0:18] XRD XWE XR/W XD[0:15] NOTES: A. All XINTF accesses (lead period) begin on the rising edge of XCLKOUT . When necessary , the device inserts an alignm[...]

  • Page 123

    Lead Active T rail t d(XC OH-XZ CSL) t d(XC OH-XA ) t d(XC OHL -XWEL) t d(XCOH L-XW EH) t d(XC OHL -XZCSH ) t en(XD )XWEL t h (XD)XW EH t dis(XD)XR NW XCLKOUT=XTIMCLK XCLKOUT= 1/2 XTIMCLK XZCS0AND1 , XZCS2 , XZCS6AND7 XA[0:18] XRD XWE XR/W XD[0:15] NOTES: A. All XINTF accesses (lead period) begin on the rising edge of XCLKOUT . When necessary , the[...]

  • Page 124

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com XTIMING register parameters used for this example: XRDLEAD XRDACTIVE XRDTRAIL USEREADY X2TIMING XWRLEAD XWRACTIVE XWRTRAIL READYMODE N/A (1) N/A (1) N/A (1) 0 0 ≥ 1 ≥ 0 ≥ 0 N/A (1) (1) N/A = "Don't care" for this example 124 Electrical Specifications Copyrig[...]

  • Page 125

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 6.25 External Interface Ready-on-Read Timing With One External Wait State Table 6-37. External Memory Interface Read Switching Characteristics (Ready-on-Read, 1 Wait State) (1) PARAMETER MIN MAX UNIT t d(XCOH-XZCSL) Delay time, XCLKOUT high to zone chip-select active low 1 ns t [...]

  • Page 126

    Lead Active T rail DIN t d(XC OH-XZ CSL) t d(XC OH-XA ) t d(XC OHL -XRDL ) t d(XC OHL -XZCSH ) t d(XC OHL -XRDH ) WS (Synch) XCLKOUT=XTIMCLK XCLKOUT= 1/2 XTIMCLK XZCS0AND1 , XZCS2 , XZCS6AND7 XA[0:18] XRD XWE XR/W XD[0:15] XREADY(Synch) NOTES: A. All XINTF accesses (lead period) begin on the rising edge of XCLKOUT . When necessary , the device inse[...]

  • Page 127

    t su(XD )XRD Lead Active T rail DIN t d(XC OH-XZ CSL) t d(XC OH-XA ) t d(XC OHL -XRDL ) t d(XC OHL -XZCSH ) t d(XC OHL -XRDH ) WS (Asynch) XCLKOUT=XTIMCLK XCLKOUT= 1/2 XTIMCLK XZCS0AND1 , XZCS2 , XZCS6AND7 XA[0:18] XRD XWE XR/W XD[0:15] XREADY(Asynch) NOTES: A. All XINTF accesses (lead period) begin on the rising edge of XCLKOUT . When necessary , [...]

  • Page 128

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 6.26 External Interface Ready-on-Write Timing With One External Wait State Table 6-41. External Memory Interface Write Switching Characteristics (Ready-on-Write, 1 Wait State) (1) PARAMETER MIN MAX UNIT t d(XCOH-XZCSL) Delay time, XCLKOUT high to zone chip-select active low 1 ns[...]

  • Page 129

    Lead 1 Active T rail XCLKOUT = XTIMCLK XCLKOUT = 1/2 XTIMCLK XA[0:18] XD[0:15] XREADY(Synch) t d(XCO HL-XWE L) t d(XCO HL-XW EH) t d(XCO HL-XZCSH) t d(XCO H-XA) WS (Synch) XZCS0AND1 , XZCS2 , XZCS6AND7 XRD XWE XR/W t d(XCO H-XZCSL) NOTES: A. All XINTF accesses (lead period) begin on the rising edge of XCLKOUT . When necessary , the device inserts a[...]

  • Page 130

    Lead 1 Active T rail XCLKOUT = XTIMCLK XCLKOUT = 1/2 XTIMCLK XA[0:18] XD[0:15] t d(XCO HL-XWE H) t d(XCO HL-XZCSH) t d(XCO H-XA) WS (Asynch) XZCS0AND1 , XZCS2 , XZCS6AND7 XRD XWE XR/W t d(XCO H-XZCSL) NOTES: A. All XINTF accesses (lead period) begin on the rising edge of XCLKOUT . When necessary , the device inserts an alignment cycle before an acc[...]

  • Page 131

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 6.27 XHOLD and XHOLDA f the HOLD mode bit is set while XHOLD and XHOLDA are both low (external bus accesses granted), the XHOLDA signal is forced high (at the end of the current cycle) and the external interface is taken out of high-impedance mode. On a reset (XRS), the HOLD mod[...]

  • Page 132

    XCLKOUT (/1 Mode) XHOLD XR/W , XZCS0AND1 , XZCS2 , XZCS6AND7 XD[15:0] V alid XHOLDA t d(H L-Hiz) t d(H H-HA H) High-Impedance XA[18:0] V alid V alid High-Impedance t d(H H-BV ) t d(H L-HA L) See Note A See Note B SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 6.28 XHOLD/XHOLDA Timing Table 6-44. XHOLD/XHOLDA Timing Requireme[...]

  • Page 133

    SeeNote A SeeNoteB SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Table 6-45. XHOLD/XHOLDA Timing Requirements (XCLKOUT = 1/2 XTIMCLK) (1) (2) (3) (4) MIN MAX UNIT t d(HL-HiZ) Delay time, XHOLD low to Hi-Z on all Address, Data, and Control 4t c(XTIM) + t c(XCO) ns t d(HL-HAL) Delay time, XHOLD low to XHOLDA low 4t c[...]

  • Page 134

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 6.29 On-Chip Analog-to-Digital Converter 6.29.1 ADC Absolute Maximum Ratings VALUE (1) UNIT V SSA1 /V SSA2 to V DDA1 /V DDA2 /AV DDREFBG –0.3 to 4.6 V Supply voltage range V SS1 to V DD1 – 0.3 to 2.5 V Analog Input (ADCIN) Clamp Current, total (max) (2) ±20 mA (1) Unless ot[...]

  • Page 135

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 6.29.2 ADC Electrical Characteristics Over Recommended Operating Conditions Table 6-46. DC Specifications (1) (2) T A = –55°C to 220°C PARAMETER UNIT MIN TYP MAX Resolution 12 Bits ADC clock (3) 1 kHz 25 MHz ACCURACY INL (Integral nonlinearity) (4) 1–18.75 MHz ADC clock ±[...]

  • Page 136

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com Table 6-47. AC Specifications (1) (2) T A = –55°C to 125°C T A = 220°C PARAMETER UNIT MIN TYP MAX MIN TYP MAX SINAD Signal-to-noise ratio + distortion 62 57 dB SNR Signal-to-noise ratio 62 57 dB THD Total harmonic distortion -68 -68 dB ENOB (SNR) Effective number of bits 10[...]

  • Page 137

    ac R s ADCIN0 C p 10 pF R on 1 k Ω 1.25 pF C h Switch T ypical V alues of the Input Circuit Components: Switch Resistance (R on ): 1 k Ω Sampling Capacitor (C h ): 1.25 pF Parasitic Capacitance (C p ): 10 pF Source Resistance (R s ): 50 Ω 28x DSP Source Signal ADC Power Up Delay ADC Ready for Conversions PWDNBG PWDNREF PWDNADC Request for ADC[...]

  • Page 138

    Analog Input on Channel Ax or Bx ADC Clock Sample and Hold SH Pulse SMODE Bit t dsch x_n t dsch x_n+1 Sample n Sample n+1 Sample n+2 t SH ADC Event T rigger from EV or Other Sources t d(SH ) SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 6.29.5 Detailed Description 6.29.5.1 Reference Voltage The on-chip ADC has a built-in re[...]

  • Page 139

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Table 6-50. Sequential Sampling Mode Timing (1) AT 25–MHz ADC SAMPLE n SAMPLE n + 1 CLOCK, REMARKS t c(ADCCLK) = 40 ns Delay time from event trigger to t d(SH) 2.5t c(ADCCLK) sampling (1 + Acqps) × Acqps value = 0-15 t SH Sample/Hold width/Acquisition width 40 ns with Acqps =[...]

  • Page 140

    Analog Input on Channel Ax Analog Input on Channel Bv ADC Clock Sample and Hold SH Pulse t SH t dsch A0_n t dsch B0_n t dsch B0_n +1 Sample n Sample n+1 Sample n+2 t dsch A0_n +1 t d(SH ) ADC Event T rigger from EV or Other Sources SMODE Bit SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 6.29.7 Simultaneous Sampling Mode (Du[...]

  • Page 141

    (SINAD 1. 76) N 6.02 - = SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Table 6-51. Simultaneous Sampling Mode Timing (1) (continued) AT 25-MHz ADC SAMPLE n SAMPLE n + 1 CLOCK, REMARKS t c(ADCCLK) = 40 ns Delay time for successive (3 + Acqps) × t d(schB0_n+1) results to appear in Result 120 ns t c(ADCCLK) register 6.29.8 De[...]

  • Page 142

    CLKG + CL KSRG (1 ) CLKGDV ) (2) 2P = 1/CLKG in ns. CLKG is the output of sample rate generator mux. SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com 6.30 Multichannel Buffered Serial Port (McBSP) Timing 6.30.1 McBSP Transmit and Receive Timing Table 6-52. McBSP Timing Requirements (1) (2) (3) NO. MIN MAX UNIT 1 kHz McBSP modu[...]

  • Page 143

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Table 6-53. McBSP Switching Characteristics (1) (2) (3) NO. PARAMETER MIN MAX UNIT M1 t c(CKRX) Cycle time, CLKR/X CLKR/X int 2P ns M2 t w(CKRXH) Pulse duration, CLKR/X high CLKR/X int D – 5 (4) D + 5 (4) ns M3 t w(CKRXL) Pulse duration, CLKR/X low CLKR/X int C – 5 (4) C + 5[...]

  • Page 144

    (n−2) Bit (n−1) (n−3) (n−2) Bit (n−1) (n−4) (n−3) (n−2) Bit (n−1) M18 M17 M18 M17 M17 M18 M16 M15 M4 M4 M14 M13 M3, M12 M1, M1 1 M2, M12 (RDA TDL Y= 10b) DR (RDA TDL Y= 01b) DR (RDA TDL Y= 00b) DR FSR (ext) FSR (int) CLKR M8 M7 M7 M8 M6 M7 M9 M10 (XDA TDL Y= 10b) DX (XDA TDL Y= 01b) DX (XDA TDL Y= 00b) DX (n−2) Bit (n−1) Bit 0[...]

  • Page 145

    Bit 0 Bit(n-1) (n-2) (n-3) (n-4) Bit 0 Bit(n-1) (n-2) (n-3) (n-4) CLKX FSX DX M30 M31 DR M28 M24 M29 M25 LSB MSB M32 M33 SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 6.30.2 McBSP as SPI Master or Slave Timing Table 6-54. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0) (1) MASTER SLAVE NO. UNIT MI[...]

  • Page 146

    Bit 0 Bit(n-1) (n-2) (n-3) (n-4) Bit 0 Bit(n-1) (n-2) (n-3) (n-4) CLKX FSX DX DR M35 M37 M40 M39 M38 M34 LSB MSB M41 M42 SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com Table 6-56. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0) (1) MASTER SLAVE NO. UNIT MIN MAX MIN MAX M39 t su(DRV-CKXH) Setup time[...]

  • Page 147

    M51 M50 M47 Bit 0 Bit(n-1) (n-2) (n-3) (n-4) Bit 0 Bit(n-1) (n-2) (n-3) (n-4) CLKX FSX DX DR M44 M48 M49 M43 LSB MSB M52 SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 Table 6-58. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1) (1) MASTER SLAVE NO. UNIT MIN MAX MIN MAX M49 t su(DRV-CKXH) Setup time[...]

  • Page 148

    Bit 0 Bit(n-1) (n-2) (n-3) (n-4) Bit 0 Bit(n-1) (n-2) (n-3) (n-4) CLKX FSX DX DR M54 M58 M56 M53 M55 M59 M57 LSB MSB M60 M61 SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com Table 6-60. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1) (1) MASTER SLAVE NO. UNIT MIN MAX MIN MAX M58 t su(DRV-CKXL) Setup [...]

  • Page 149

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 6.31 Flash Timing 6.31.1 Recommended Operating Conditions (4) MIN NOM MAX UNIT N f Flash endurance for the array (Write/erase cycles) 0°C to 85°C 100 1000 cycles Maximum One-Time Programmable (OTP) endurance for the array (Write N OTP 0°C to 85°C 1 write cycles) (4) Flash Ti[...]

  • Page 150

    SM320F2812-HT SGUS062A – JUNE 2009 – REVISED APRIL 2010 www.ti.com Table 6-64. Minimum Required Wait-States at Different Frequencies (1) (continued) SYSCLKOUT (MHz) SYSCLKOUT (ns) PAGE WAIT-STATE (2) RANDOM WAIT STATE (2) (3) 4 250 0 1 150 Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Fe[...]

  • Page 151

    SM320F2812-HT www.ti.com SGUS062A – JUNE 2009 – REVISED APRIL 2010 7 Mechanical Data The following mechanical package diagram(s) reflect the most current released mechanical data available for the designated device(s). Copyright © 2009–2010, Texas Instruments Incorporated Mechanical Data 151 Submit Documentation Feedback Product Folder Link([...]

  • Page 152

    PACKAGE OPTION ADDENDUM www.ti.com 28-May-2010 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) SM320F2812HFGS150 ACTIVE CFP HFG 172 1 TBD AU N / A for Pkg Type Contact TI Distributor or Sales Office SM320F2812KGD[...]

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    IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders[...]