Philips TDA8783 manual

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Table of contents for the manual

  • Page 1

    DA T A SH EET Product specification Supersedes data of 1999 J un 25 2002 Oct 23 INTEGRA TED CIRCUITS TDA8783 40 Msps, 10-bit analog-to-digital interface for CCD cameras[...]

  • Page 2

    2002 Oct 23 2 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interface f or CCD cameras TD A8783 FEA TURES • Correlated Double Sampling (CDS), AGC, 10-bit ADC and reference regulator included, adjustable bandwidth (CDS and AGC) • Fully programmable via a 3-wire serial interface • Sampling frequency up to 40 MH[...]

  • Page 3

    2002 Oct 23 3 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 QUICK REFERENCE D A T A SYMBOL P ARAMETER CONDITIONS MIN. TYP . MAX. UNIT V CCA analog supply voltage 4.75 5 5.25 V V CCD digital supply voltage 4.75 5 5.25 V V CCO digital outputs supply voltage 2.5 3 5.25 V I CCA anal[...]

  • Page 4

    2002 Oct 23 4 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 BLOCK DIA GRAM Fig.1 Block diagram. handbook, full pagewidth MGM491 TRACK- AND-HOLD TRACK- AND-HOLD TRACK- AND-HOLD CLAMP ref1 CLAMP 8-BIT DAC 10-BIT DAC 9-BIT DAC 6 dB AGC CLOCK GENERATOR 10-BIT ADC REGULATOR SERIAL IN[...]

  • Page 5

    2002 Oct 23 5 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 PINNING SYMBOL PIN DESCRIPTION CLPOB 1 clamp pulse input at optical blac k A GND4 2 analog g round 4 OFDOUT 3 analog output of the additional 8-bit control D AC (controlled via the serial interf ace) AMPOUT 4 CDS ampli?[...]

  • Page 6

    2002 Oct 23 6 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 V CCO 37 digital output supply v oltage OE 38 output enable (activ e LOW: digital outputs activ e; active HIGH: digital outputs high impedance) V CCD2 39 digital supply v oltage 2 DGND2 40 digital ground 2 CLK 41 ADC cl[...]

  • Page 7

    2002 Oct 23 7 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 LIMITING V ALUES In accordance with the Absolute Maximum Rating System (IEC 60134). Note 1. The supply voltages V CCA , V CCD and V CCO may have any value between − 0.3 and +7.0 V provided that the supply voltage diff[...]

  • Page 8

    2002 Oct 23 8 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 CHARA CTERISTICS V CCA =V CCD =5V ; V CCO =3V ; f CLK = 27 MHz; T amb =2 5 ° C; unless otherwise specified. SYMBOL P ARAMETER CONDITIONS MIN. TYP . MAX. UNIT Supplies V CCA analog supply voltage 4.75 5 5.25 V V CCD di[...]

  • Page 9

    2002 Oct 23 9 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 t hd2 hold time of IND compared to control pulse SHD see Fig.5 − 1 − ns t set(CDS) CDS settling time see Fig.12; control D AC 4 bits input code; A GC gain = 0 dB; f cut(AGC) = 54 MHz; V i(CDS) = 600 mV (p-p) blac k-[...]

  • Page 10

    2002 Oct 23 10 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 Clamps g m(ADC) ADC clamp transconductance at clamp le vel − 7 − mS g m(CDS) CDS clamp transconductance at clamp le vel − 1.5 − mS Analog-to-Digital Con ver ter (ADC) f CLK(max) maximum cloc k frequency 40 −?[...]

  • Page 11

    2002 Oct 23 11 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 Notes 1. More information about CDS related signals is available in the following figures: The clamp current for pin CPCDS is given in Fig. 9, clamp current for pins IND and INP in Fig 10 and for clamp current for pin [...]

  • Page 12

    2002 Oct 23 12 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 Fig.3 Serial interface block diagram. handbook, full pagewidth OFD LATCHES AGC GAIN LATCHES FREQUENCY LATCHES PARTIAL STANDBY AND EDGE CLAMP REFERENCE LATCHES LATCH SELECTION D0 LSB MSB S D ATA SCLK SEN 8-bit D AC 10-b[...]

  • Page 13

    2002 Oct 23 13 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 T able 1 Serial interface progr amming Note 1. When CLPADC is HIGH (D4 = 1: serial interface), the ADC input is clamped to voltage level V ref . V ref is connected to ground via a capacitor. T able 2 Standby selection [...]

  • Page 14

    2002 Oct 23 14 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 handbook, full pagewidth MGR395 N IND SHP 1.4 V SHD CLK ADCIN DATA N + 3 N + 2 N + 1 N − 1 N N t CDS t CPH t d(s) t d t o(d) t o(h) t n(IN; SHP) t n(IN; SHD) 90% 10% 1.4 V 1.4 V N − 3N − 2 Fig.5 Pixel frequency t[...]

  • Page 15

    2002 Oct 23 15 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 Fig.6 Line frequency timing diagram. (1) When dummy pixels are not available. handbook, full pagewidth MGR396 CLP ADC (active HIGH) CLPDM (active HIGH) CLPOB (active HIGH) OPTICAL BLACK HORIZONT AL FL YBLA CK DUMMY VID[...]

  • Page 16

    2002 Oct 23 16 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 Fig.7 AGC gain as a function of DAC input code. handbook, halfpage MGM507 G AGC (dB) 34.5 4.5 0 319 511 AGC control DAC input code Fig.8 DAC voltage output as a function of DAC input code. handbook, full pagewidth 0 AD[...]

  • Page 17

    2002 Oct 23 17 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 Fig.9 Typical clamp current for pin CPCDS. handbook, halfpage MGR397 + 100 0 − 100 I ( µ A) V (V) 200 mV 2.00 Fig.10 Typical clamp current for pins IND and INP. handbook, halfpage MGR398 + 300 0 − 300 I ( µ A) V [...]

  • Page 18

    2002 Oct 23 18 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 Fig.12 CDS settling time and bandwidth. (1) f cut . (2) t set (10 bits accuracy). (3) t set (9 bits accuracy). (4) t set (8 bits accuracy). handbook, full pagewidth 160 120 40 0 80 MGR441 F 05 A 16 B 27 C 38 D 49 E 4-b[...]

  • Page 19

    2002 Oct 23 19 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 Fig.13 AGC bandwidth. handbook, full pagewidth F 60 40 20 0 05 A 16 B 27 C 38 D 49 E MGR401 4-bit control DAC input code f cut (MHz) Fig.14 CDS output. handbook, full pagewidth 1.6 1.6 1.2 0.4 0 0 0.4 1.2 0.8 0.8 0.2 0[...]

  • Page 20

    2002 Oct 23 20 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 Fig.15 Output noise (RMS value). (1) f pix = 27 MHz; control DAC = 00H; f cut(CDS) = 120 MHz; f cut(AGC) = 54 MHz. (2) f pix = 18 MHz; control DAC = 10H; f cut(CDS) = 120 MHz; f cut(AGC) = 40 MHz. (3) f pix = 10 MHz; c[...]

  • Page 21

    2002 Oct 23 21 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 APPLICA TION INFORMA TION Fig.16 Application diagram. Depending on the application, the following connections must be made: (1) The clamp level of the signal input at ADCIN can be tuned from code 00 to code 511 in 0.5 [...]

  • Page 22

    2002 Oct 23 22 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 P ower and grounding recommendations Care must be tak en to minimize noise when designing a printed-circuit board for applications such as PC cameras , sur veillance camer as, camcorders and digital still cameras. For [...]

  • Page 23

    2002 Oct 23 23 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 P A CKA GE OUTLINE UNIT A max. A 1 A 2 A 3 b p cE (1) eH E LL p Z y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 1.60 0.20 0.05 1.45 1.35 0.25 0.27 0.17 0.18 0.12 7.1 6.9 0.5 9.15 [...]

  • Page 24

    2002 Oct 23 24 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 SOLDERING Introduction to soldering surface mount pac kages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated C[...]

  • Page 25

    2002 Oct 23 25 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 Suitability of surface mount IC packa ges for wave and reflo w soldering methods Notes 1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note ” (AN01026); order a copy from you[...]

  • Page 26

    2002 Oct 23 26 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 D A T A SHEET ST A TUS Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since th[...]

  • Page 27

    2002 Oct 23 27 Philips Semiconductors Product specification 40 Msps, 10-bit analog-to-digital interf ace f or CCD cameras TD A8783 NOTES[...]

  • Page 28

    © Koninklijke Philips Electronics N.V. 2002 SCA74 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No[...]