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Intel LGA 771 manual

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Table of contents for the manual

  • Page 1

    Reference Number: 31 3871-002 LGA771 Socket Mechanical Design Guide November, 2006[...]

  • Page 2

    2 LGA 771 Socket Mechanical Design Guide INFORMA TION IN THIS DOCUMENT IS PROVIDED IN CONNE CTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPL IED, BY ESTOPPEL OR O THERWISE, TO ANY INTELLECTUAL PROPER TY RIGHTS IS GRANTED BY THIS DOCUMENT . EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDIT IONS OF SALE FOR SUCH PR ODUCTS, INTEL ASSUMES NO [...]

  • Page 3

    LGA 771 Socket Mechanical Design Guide 3 Contents 1 Introduction.......... ............. .......... ........... ............ ........... ........... .......... ............. .......... .. 7 1.1 Document Goals and Scop e ........... ............ ........... ............. ............ ........... ............ 7 1.1.1 LGA771 Socket Ove rview ... .....[...]

  • Page 4

    4 LGA 771 Socket Mechanical Design Guide Figures 3-1 Cross-sectional view of Package / Socket stackup height 1 ... ........... .......... ........... .... 15 3-2 Definition of R ........... .......... ........... ............ ........... .......... ............. ........... ..........17 5-1 Flow Chart of Knowledge-Based Reliability Evaluation Metho[...]

  • Page 5

    LGA 771 Socket Mechanical Design Guide 5 Revision History § Revision Description Date 001 • Initial release of the document. June 2006 002 • Updated Dual-Core 5000 & 5 100 Series stackup heights • Added Quad-Core 5300 Series stackup height • Added Figure 3-1 • Remov ed Appendix B - V endor Information November 2006[...]

  • Page 6

    6 LGA 771 Socket Mechanical Design Guide[...]

  • Page 7

    LGA 771 Socket Mechanical Design Guide 7 Introduction 1 Introduction 1.1 Document Goals and Scope 1.1.1 LGA771 Socket Overview This document describes a surface mount, LGA (Land Grid Arr ay) socket intended for the Dual-Core Intel ® Xe on ® Processor 5000 Sequence F amily for Servers and W orkstations. The socket provides I/O, power and ground co[...]

  • Page 8

    Introduction 8 LGA 771 Socket Mechanical Design Guide 1.2 Terminology 1.3 Reference Documents Note: Contact your Intel representative for the latest revisions of these documents. § Term Description LGA771 Socket Processor in the 771-land package ma tes with the system board through a surface mount, 771-pin, LG A (land grid arr ay) socket. LGA771-L[...]

  • Page 9

    LGA 771 Socket Mechanical Design Guide 9 Assembled Component and Packa ge Description 2 Assembled Component and Package Description The LGA771 Socket dimensions and char acterist ics must be compatible with that of the processor package and related assembly components. Processors using Flip-Chip Land Grid Array package technology are targeted to be[...]

  • Page 10

    Assembled Component and Pa ckage Description 10 LGA 771 Socket Mechanical Design Guide[...]

  • Page 11

    LGA 771 Socket Mechanical Design Guide 11 Mechanical Requirements 3 Mechanical Requirements 3.1 Attachment The socket will be tested against the me chanical shock and vibr ation requirements listed in Section 5 under the expected use conditions with a heatsink and retention mechanism attached under the loading conditions outlined in Section 3.6 , a[...]

  • Page 12

    Mechanical Requirements 12 LGA 771 Socket Mechanical Design Guide operating temper ature, while mounted on an FR4-type motherboard material. The creep properties of the material must be such that the mechanical integrity of th e socket is maintained for the use condition outlined in Section 5 . The color of the socket housing will be dark as compar[...]

  • Page 13

    LGA 771 Socket Mechanical Design Guide 13 Mechanical Requirements 3.2.1.4.2 Lot Traceability Each socket will be mark ed with a lot identification code to allow traceability of all components, date of manufacture (y ear and week), and assembly location. The mark must be placed on a surface that is vi sible when mounted on the motherboard. 3.2.1.5 C[...]

  • Page 14

    Mechanical Requirements 14 LGA 771 Socket Mechanical Design Guide The stiffener plate is made of stainless steel SUS 301. The stiffener plate provides the interface to the load lever and the load plat e and creates the primary stiffening element to react to the load gener ated by the load plate. 3.2.3 Pick and Place Cover The pick and place cover i[...]

  • Page 15

    LGA 771 Socket Mechanical Design Guide 15 Mechanical Requirements 3.5 Package/Socket Stac kup Height Ta b l e 3 - 1 pro vides the stackup height of the processor package and LGA771 socket. Notes: 1. Preliminary Guidance. This data is provide d for information only , and should be der ived from: (a) the height of the socket seating plane abo ve the [...]

  • Page 16

    Mechanical Requirements 16 LGA 771 Socket Mechanical Design Guide Notes: 1. These specifications ap ply to un iform compressive loading in a dire ction perpendicular to the IHS top surface. 2. This is the minimum and maximum static force that ca n be applied b y the heatsink and retention sol ution to maintain the heatsink and processor int erface.[...]

  • Page 17

    LGA 771 Socket Mechanical Design Guide 17 Mechanical Requirements § Figure 3-2. Definition of R[...]

  • Page 18

    Mechanical Requirements 18 LGA 771 Socket Mechanical Design Guide[...]

  • Page 19

    LGA 771 Socket Mechanical Design Guide 19 Electrical Requirements 4 Electrical Requirements Ta b l e 4 - 1 provides the L GA771 Socket electrical requirements. Socket electrical requirements are measured from the socket -seating plane of the processor to the component side of the PCB to which it is attached. All specifications are maximum values (u[...]

  • Page 20

    Electrical Requirements 20 LGA 771 Socket Mechanical Design Guide[...]

  • Page 21

    LGA 771 Socket Mechanical Design Guide 21 Environmental Requirements 5 Environmental Requirements Design, including materials, shall be consiste nt with the manufacture of units that meet the following environmental reference points. The reliability targets in this section are based on the expected field use environment for a server product. The te[...]

  • Page 22

    Environmental Requirements 22 LGA 771 Socket Mechanical Design Guide Note: These reliability requirements are given as examples only based on speculative use condition as sumptions. Table 5-1. Us e Conditions Environment Use Environment Speculativ e Stress Condition Example Use condition Example 7 Year stress equivalent Example 10 Year stress equiv[...]

  • Page 23

    LGA 771 Socket Mechanical Design Guide 23 Environmental Requirements 5.1 Solvent Resistance R equirement: No damage to ink markings if applicable. EIA 364-11A. 5.2 Durability Use per EIA-364, test procedure 09. Measure contact resistance when mated in 1st and 30th cycles. The package should be removed at the end of each de- actuation cycle and rein[...]

  • Page 24

    Environmental Requirements 24 LGA 771 Socket Mechanical Design Guide[...]

  • Page 25

    LGA 771 Socket Mechanical Design Guide 25 Mechanical Drawings A Mechanical Drawings The following table lists the mechanical drawings included in this section. These drawings refer to the LGA771 socket. Note: Intel reserves the right to mak e changes and modifications to the design as necessary . See figures beginning on following page. Drawing Des[...]

  • Page 26

    Mechanical Drawings 26 LGA 771 Socket Mechanical Design Guide Figure A-1. LGA Socket Asse mbly Drawing (Sheet 1 of 4)[...]

  • Page 27

    LGA 771 Socket Mechanical Design Guide 27 Mechanical Drawings Figure A-2. LGA Socket Assembly Drawing (Sheet 2 of 4)[...]

  • Page 28

    Mechanical Drawings 28 LGA 771 Socket Mechanical Design Guide Figure A-3. LGA Socket Asse mbly Drawing (Sheet 3 of 4)[...]

  • Page 29

    LGA 771 Socket Mechanical Design Guide 29 Mechanical Drawings Figure A-4. LGA Socket Assembly Drawing (Sheet 4 of 4)[...]

  • Page 30

    Mechanical Drawings 30 LGA 771 Socket Mechanical Design Guide Figure A-5. LGA771 Socket Moth erboard Footprint (Sheet 1 of 7)[...]

  • Page 31

    LGA 771 Socket Mechanical Design Guide 31 Mechanical Drawings Figure A-6. LG A771 Socket Motherboard Fo otprint (Sheet 2 of 7)[...]

  • Page 32

    Mechanical Drawings 32 LGA 771 Socket Mechanical Design Guide Figure A-7. LGA771 Socket Moth erboard Footprint (Sheet 3 of 7)[...]

  • Page 33

    LGA 771 Socket Mechanical Design Guide 33 Mechanical Drawings Figure A-8. LG A771 Socket Motherboard Fo otprint (Sheet 4 of 7[...]

  • Page 34

    Mechanical Drawings 34 LGA 771 Socket Mechanical Design Guide Figure A-9. LGA771 Socket Moth erboard Footprint (Sheet 5 of 7)[...]

  • Page 35

    LGA 771 Socket Mechanical Design Guide 35 Mechanical Drawings Figure A-10. LGA771 Socket Motherboard Footprint (She et 6 of 7)[...]

  • Page 36

    Mechanical Drawings 36 LGA 771 Socket Mechanical Design Guide Figure A-11. LGA 771 So cket Moth erboard Footprint (Sheet 7 of 7)[...]

  • Page 37

    LGA 771 Socket Mechanical Design Guide 37 Mechanical Drawings Figure A-12. LGA 771 Socket Footprin t (Sheet 1 of 2)[...]

  • Page 38

    Mechanical Drawings 38 LGA 771 Socket Mechanical Design Guide § Figure A-13. LGA 771 So cket Footprint (Sheet 2 of 2)[...]