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Intel DG33BU manual

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  • Page 1

    May 2007 Order Number: D88104-001US The Intel ® Desktop Board DG33BU may contai n design defects or err ors known as errata that ma y cause the product to deviate fr om published specifications. Current characterized errata are documented in the In tel Desktop Board DG33BU Specifi cation Update. Intel® Desktop Board DG33BU Technical Product Speci[...]

  • Page 2

    Revision History Revision Revision History Date -001 First release of the Intel ® Desktop Board DG33BU Technical Product Specification May 2007 This pro duct sp ecificat ion applie s to only t he stan dard I ntel ® Desktop Board DG33BU with BIOS identifier DPP3510A. 86A. Changes to this s pecificat ion will be pu blished in the Int el Deskto p Bo[...]

  • Page 3

    iii Preface This Technical Product Specification (TPS) specif ies the board layout, compon ents, connectors, power and environmental requirements, and the BIOS for the Intel ® Desktop Board DG33BU. It describes the standard product and available manufacturing options. Intended Audience The TPS is intend ed to provide detailed, technical inf ormati[...]

  • Page 4

    Intel Desktop Board DG33BU Technical Product Specification iv Other Common Notation # Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741, 824 bytes) GB/sec Gigabytes per second Gbit Gigabit (1, 073,741, 824 bits) KB Kilobyte (1024 bytes ) Kbit Kilobit (1024 bit s) kbits/sec 1000 bits per second MB Mega[...]

  • Page 5

    v Contents 1 Product Description 1.1 Overview........................................................................................ 10 1.1.1 Feature Summary ................................................................ 10 1.1.2 Board Layout ....................................................................... 12 1.1.3 Block Diagram .........[...]

  • Page 6

    Intel Desktop Board DG33BU Technical Product Specification vi 2 Technical Reference 2.1 Memory Map ................................................................................... 37 2.1.1 Addressable Memory ............................................................. 37 2.2 Connectors and Headers ...............................................[...]

  • Page 7

    Contents vii 5.1.1 Safety Standards.................................................................. 73 5.1.2 European Union Declaration of Conformity Statement ................ 74 5.1.3 Product Ecology Statements ................................................... 75 5.1.4 EMC Regulations ..........................................................[...]

  • Page 8

    Intel Desktop Board DG33BU Technical Product Specification viii 21. States for a One-Color Power LED ...................................................... 48 22. States for a Two-Color Power LED ...................................................... 48 23. Auxiliary Front Panel Power LED Header .............................................. 48 24.[...]

  • Page 9

    9 1 Product Description What This Chapter Contains 1.1 Overview........................................................................................ 10 1.2 Legacy Considerations ............. ......................................................... 15 1.3 Online Support ...........................................................................[...]

  • Page 10

    Intel Desktop Board DG33BU Technical Product Specification 10 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major featur es of the Desktop Board DG33BU. Table 1. Feature Summary Form Factor microATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]) Processor Support for the following: • Intel ® Core™2 Quad pro[...]

  • Page 11

    Product Description 11 Table 1. Feature Summary (continued) Expansion Capabilities • Two PCI Conventional bus connectors • One PCI Express x1 bus add-in card connector • One PCI Express x16 bus add-in card connector Hardware Monitor Subsystem • Intel ® Quiet System Technology implemented through the Intel ® Management Engine in ICH9DH •[...]

  • Page 12

    Intel Desktop Board DG33BU Technical Product Specification 12 1.1.2 Board Layout Figure 1 shows the location of the major components. Figure 1. Major Board Components Table 2 lists the components identified in Figure 1.[...]

  • Page 13

    Product Description 13 Table 2. Board Components Shown in Figure 1 Item/callout from Figure 1 Descri ption A PCI Conventional bus add-in card connector 1 B Front panel audio header C PCI Conventional bus add-in card connector 2 D PCI Express x1 connector E Speaker F PCI Express x16 connector G Back panel connectors H Processor core power connector [...]

  • Page 14

    Intel Desktop Board DG33BU Technical Product Specification 14 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas. Figure 2. Block Diagram[...]

  • Page 15

    Product Description 15 1.2 Legacy Considerations This board differs from other Intel ® Desktop Board products, with specific changes including (b ut not limited t o) the follow ing: • No parallel port • The location of the floppy drive connector has moved • No serial port on the back panel • The serial port header is located betw een the m[...]

  • Page 16

    Intel Desktop Board DG33BU Technical Product Specification 16 # INTEGRATOR’S NOTE Use only ATX12V-compliant power supplies. For information about Refer to Power supply connectors Section 2.2.2.4, page 46 1.5 System Memory The board has four DIMM sockets and su pports the following memory features: • 1.8 V (only) DDR2 SDRAM DIMMs with gold-plate[...]

  • Page 17

    Product Description 17 1.5.1 Memory Configurations The Intel 82G33 GMCH supports the followi ng types of memory organization: • Dual channel (Interleaved) mode . This mode offers the highest throughput for real world applications. Du al channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and de[...]

  • Page 18

    Intel Desktop Board DG33BU Technical Product Specification 18 Figure 3 illustrates the memory ch annel and DIMM conf iguration.  NOTE The DIMM 0 sockets of both channels are bl ue. The DIMM 1 sockets of both channels are black. Figure 3. Memory Channel Conf iguration and DIMM Configuration # INTEGRATOR’S NOTE Regardless of the memory configura[...]

  • Page 19

    Product Description 19 1.6 Intel ® G33 Express Chipset The Intel G33 Express chipset cons ists of the following devices: • Intel 82G33 Graphics and Memory Controller Hub (GMCH) with Direct Media Interface (DMI) interconnect • Intel 82801IH I/O Controller Hub (ICH9DH) with DMI interconnect The GMCH component provides interfaces to the CPU, memo[...]

  • Page 20

    Intel Desktop Board DG33BU Technical Product Specification 20 • Video ⎯ Software DVD at 30 fps full screen ⎯ DVMT support up to 256 MB • Display ⎯ Supports analog displays up to 2048 x 1536 at 75 Hz refresh (QXGA) ⎯ Dual independent display support ⎯ DDC2B compliant interface with Advanced Di gital Display 2 card or Media Expansion Ca[...]

  • Page 21

    Product Description 21 • HDMI support (when used with the HD Audio Link) 1.6.2 Intel ® Viiv™ Processor Technology This Intel desktop board supports Intel Viiv processor technology. T o be eligible for the Intel Viiv processor technology brand, a system must meet certain hardware and software requirements. To get the list of requirements for In[...]

  • Page 22

    Intel Desktop Board DG33BU Technical Product Specification 22  NOTE Many Serial ATA drives use new low-voltag e power connectors and require adapters or power supplies equipped with lo w-voltage power connectors. For more information, see: http://www.serialata.org/ For information about Refer to The location of the Serial ATA connectors Figure 1[...]

  • Page 23

    Product Description 23 1.8 Real-Time Clock Subsystem A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall so cket, the battery has an estimated life of three years. When the computer is plu gged in, the standby current from the power supply extends the life of the battery. The clock i[...]

  • Page 24

    Intel Desktop Board DG33BU Technical Product Specification 24 1.9.3 PS/2 Keyboard and Mouse Interface The PS/2 keyboard and mouse connectors are located on the back panel.  NOTE The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2 connector. Power to the computer should be turned off before a keyboard[...]

  • Page 25

    Product Description 25 1.10.1 Audio Subsystem Software Audio software and drivers are availabl e from Intel’s Worl d Wide Web site. For information about Refer to Obtaining audio software and driv ers Section 1.2, page 15 1.10.2 Audio Connectors and Headers The board contains audio connectors on th e back panel and audio headers on the component [...]

  • Page 26

    Intel Desktop Board DG33BU Technical Product Specification 26 1.11 LAN Subsystem The LAN subsystem consists of the following: • Intel 82566DC Gigabit Ethernet Co ntroller (10/100/1000 Mbits/sec) • Intel 82801IH (ICH9DH) • RJ-45 LAN connector with integrated status LEDs Additional features of the LAN subsystem include: • CSMA/CD protocol eng[...]

  • Page 27

    Product Description 27 1.11.2 LAN Subsystem Software LAN software and drivers are available from Intel’s Worl d Wide Web site. For information about Refer to Obtaining LAN softwa re and d rivers Section 1.2, page 15 1.11.3 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5 below). Item Desc[...]

  • Page 28

    Intel Desktop Board DG33BU Technical Product Specification 28 1.12 Hardware Management Subsystem The hardware management features enable th e board to be compatible with the Wired for Management (WfM) specification. Th e board has several hardware management features, inclu ding the follow ing: • Fan monitoring and control • Thermal and voltage[...]

  • Page 29

    Product Description 29 1.12.4 Thermal Monitoring Figure 6 shows the locations of th e thermal sensors and fan headers. Item Description A Thermal diode, located on processor di e B Thermal diode, located on the GMCH di e C Thermal diode, located on the ICH9DH die D Front chassis fan E Processor fan F Rear chassis fan Figure 6. Thermal Sensors and F[...]

  • Page 30

    Intel Desktop Board DG33BU Technical Product Specification 30 1.13 Power Management Power management is implemen ted at several levels, inclu ding: • Software support through Advanced Conf iguration and Power Interface (ACPI) • Hardware support: ⎯ Power connector ⎯ Fan headers ⎯ LAN wake capabilities ⎯ Instantly Available PC technology [...]

  • Page 31

    Product Description 31 1.13.1.1 System States and Power States Under ACPI, the operating system direct s all system and device power state transitions. The operating system puts de vices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be tu rne[...]

  • Page 32

    Intel Desktop Board DG33BU Technical Product Specification 32 1.13.1.2 ENERGY STAR * In 2007, the US Department of Energy and the US Environmental Protection Agency revised the ENERGY STAR* requirements. In tel has worked directly with these two governmental agencies to define the ne w requirements. Cu rrently Intel Deskt op Boards meet the new req[...]

  • Page 33

    Product Description 33 1.13.2 Hardware Support CAUTION Ensure that the power supply provides adeq uate +5 V standby current if LAN wake capabilities and Instantly Available PC technolo gy features are used. Failure to do so can damage the power supply. The total am ount of standby current required depends on the wake devices supported and manufactu[...]

  • Page 34

    Intel Desktop Board DG33BU Technical Product Specification 34 1.13.2.2 Fan Headers The function/operation of the fan headers is as foll ows: • The fans are on when the board is in the S0 state. • The fans are off when the board is off or in the S3, S4, or S5 state. • The processor fan header is wired to a fan tachometer input and the Front an[...]

  • Page 35

    Product Description 35 1.13.2.4 Instantly Available PC Technology CAUTION For Instantly Available PC technology, th e +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply. Instant[...]

  • Page 36

    Intel Desktop Board DG33BU Technical Product Specification 36 1.13.2.9 +5 V Standby Power Indicator LED The +5 V standby pow er indicator LED shows th at power is still present even w hen the computer appears to be off. Figure 7 shows the locati on of the standby power indicator LED. CAUTION If AC power has been switched off and the standby power i[...]

  • Page 37

    37 2 Technical Reference What This Chapter Contains 2.1 Memory Map ................................................................................... 37 2.2 Connectors and Headers ................................................................... 40 2.3 Jumper Block .................................................................................[...]

  • Page 38

    Intel Desktop Board DG33BU Technical Product Specification 38 The amount of in stalled memory that can be used w ill vary based on add-in cards and BIOS settings. Figure 8 shows a schematic of the sy st em memory map. All installed system memory can be used when there is no overlap of system addresses. Upper BI OS area (64 KB) Lower BIO S area (64 [...]

  • Page 39

    Technical Reference 39 Table 9 lists the system memory map. Table 9. System Memory Map Address Range (decimal) Address Range (hex) Size Description 1024 K - 8388608 K 100000 - 1FFFFFFFF 8191 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K E0000 - EFFFF 64 KB Reserved 800 K - 896 K C8000 - DFFFF 96 KB Potential avail[...]

  • Page 40

    Intel Desktop Board DG33BU Technical Product Specification 40 2.2 Connectors and Headers CAUTION Only the following connectors and headers ha ve overcurrent protection: Back panel and front panel USB, PS/2, and VGA. The other internal connectors/headers ar e not overcurrent protected and should connect only to devices inside the computer ’s chass[...]

  • Page 41

    Technical Reference 41 2.2.1 Back Panel Connectors Figure 9 shows the locations of the back panel connectors. Item Description A PS/2 mouse port B PS/2 keyboard port C VGA po rt D IEEE 1394a port E USB ports [2] F USB ports [2] G LAN H USB ports [2] I Line in J Mic in K Line out Figure 9. Back Panel Connectors[...]

  • Page 42

    Intel Desktop Board DG33BU Technical Product Specification 42 2.2.2 Component-side Connectors and Headers Figure 10 shows the locations of the co mponent-side connectors and headers. Figure 10. Component-side Connectors and Headers[...]

  • Page 43

    Technical Reference 43 Table 10 lists the component-side co nnectors and headers identified in Figure 10. Table 10. Component-side Connectors and Headers Shown in Figure 10 Item/callout from Figure 10 Descri ption A PCI Conventional bus add-in card connector 1 B Front panel audio header C PCI Conventional bus add-in card connector 2 D PCI Express x[...]

  • Page 44

    Intel Desktop Board DG33BU Technical Product Specification 44 2.2.2.1 Signal Tables for the Connectors and Headers Table 11. Serial ATA Connectors Pin Signal Name 1 Ground 2 TXP 3 TXN 4 Ground 5 RXN 6 RXP 7 Ground Table 12. Chassis Intrusion Header Pin Signal Name 1 Intruder 2 Ground Table 13. Serial Port Header Pin Signal Name Pin Signal Name 1 DC[...]

  • Page 45

    Technical Reference 45 Table 16. Front Panel Audio Header Pin Signal Name Pin Signal Name 1 [Port 1] Left channel 2 Ground 3 [Port 1] Right channel 4 PRESENCE# (Dongle present) 5 [Port 2] Right channel 6 [Port 1] SENSE_RETURN 7 SENSE_SEND (Jack detection) 8 Key (no pin) 9 [Port 2] Left channel 10 [Port 2] SENSE_RETURN 2.2.2.2 Add-in Card Connectors[...]

  • Page 46

    Intel Desktop Board DG33BU Technical Product Specification 46 2.2.2.4 Power Supply Connectors The board has the following power supply connectors: • Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desk top boards. The board supports the use of ATX12V power supplies with either 2 x 10[...]

  • Page 47

    Technical Reference 47 2.2.2.5 Front Panel Header This section describes the functi ons of the front panel header. Table 20 l ists the signal names of the front panel header. Figure 11 i s a connection diagram for the front panel header. Table 20. Front Panel Header Pin Signal In/ Out Description Pin Signal In/ Out Description Hard Drive Activity L[...]

  • Page 48

    Intel Desktop Board DG33BU Technical Product Specification 48 2.2.2.5.2 Reset Switch Header Pins 5 and 7 can be connected to a momentar y single pole, single throw (SPS T) type switch that is n ormally open. When th e swit ch is closed, the board resets and runs the POST. 2.2.2.5.3 Power/Sleep LED Header Pins 2 and 4 can be connected to a one- or t[...]

  • Page 49

    Technical Reference 49 2.2.2.7 Front Panel USB Headers Figure 12 is a connection diagram for the front panel USB headers. # INTEGRATOR’S NOTES • The +5 V DC power on the front panel USB headers is fused. • Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices. Figure 12. Connection Diagram [...]

  • Page 50

    Intel Desktop Board DG33BU Technical Product Specification 50 2.3 Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before chan ging a jumper setting. Otherwise, the board could be damaged. Figure 13 shows the location of the jumper block. The jumper determines the B[...]

  • Page 51

    Technical Reference 51 2.4 Mechanical Considerations 2.4.1 Form Factor The board is designed to fit into an ATX- or microATX-form-factor chassis. Figure 14 illustrates the mechanical f orm factor of the board. D imensions are given in inch es [millimeters]. The outer dimensions ar e 9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimete[...]

  • Page 52

    Intel Desktop Board DG33BU Technical Product Specification 52 2.5 Electrical Considerations 2.5.1 Power Supply Considerations CAUTION The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depe nds on the wake [...]

  • Page 53

    Technical Reference 53 2.5.2 Fan Header Current Capability CAUTION The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. Table 26 lists the current capability of the fan h eaders. Table 26[...]

  • Page 54

    Intel Desktop Board DG33BU Technical Product Specification 54 CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regu lator circuit. The processor voltage regulator area (shown in Figure 15) can reach a temperature of up to 95 o C in an open chassis. Figu[...]

  • Page 55

    Technical Reference 55 Table 27 provides maximum case temperatur es for the board components that are sensitive to th ermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 27. Thermal Consideratio[...]

  • Page 56

    Intel Desktop Board DG33BU Technical Product Specification 56 2.8 Environmental Table 28 lists the environmental specifications for the board. Table 28. Desktop Board DG33BU Environmental Specifications Parameter Specification Temperature Non-Operating -40 ° C to +70 ° C Operating 0 ° C to +55 ° C Shock Unpackaged 50 g trapezoidal waveform Velo[...]

  • Page 57

    57 3 Overview of BIOS Features What This Chapter Contains 3.1 Introduction ................................................................................... 57 3.2 BIOS Flash Memory Organization .. ..................................................... 58 3.3 Resource Configuration ............ .....................................................[...]

  • Page 58

    Intel Desktop Board DG33BU Technical Product Specification 58 Table 29 lists the BIOS Setup program menu features. Table 29. BIOS Setup Program Menu Bar Maintenance Main Advanced Security Power Boot Exit Clears passwords and displays processor information Displays processor and memory configuration Configures advanced features available through the[...]

  • Page 59

    Overview of BIOS Features 59 3.3.2 PCI IDE Support If you select Auto in the BIOS Setup prog ram, the BIOS automatically sets up the PCI IDE connector with independent I/O ch annel support. The IDE interface supports hard drives up to ATA-66/100/133 and reco gnizes any ATAPI compliant devices, including CD-ROM drives, tape drives, and Ul tra DMA dr[...]

  • Page 60

    Intel Desktop Board DG33BU Technical Product Specification 60 3.5 Legacy USB Support Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an op erating system that supports USB. By default, Legacy USB suppo [...]

  • Page 61

    Overview of BIOS Features 61 3.6 BIOS Updates The BIOS can be updated us ing either of the f ollowing utilities, wh ich are available on the Intel World Wide Web site: • Intel ® Express BIOS Update utility, w hich enables automated updat ing while in the Windows environment . Using this utility , the BIOS can be updated from a f ile on a hard di[...]

  • Page 62

    Intel Desktop Board DG33BU Technical Product Specification 62 3.6.2 Custom Splash Screen During POST, an Intel ® splash screen is displayed by de fault. This splash screen can be augmented with a custom splash screen. The Intel ® Integrator Toolki t that is available from Intel can be us ed to create a custom splash screen.  NOTE If you add a [...]

  • Page 63

    Overview of BIOS Features 63 3.8 Boot Options In the BIOS Setup program, the user can ch oose to boot from a diskette drive, hard drive, USB drive, USB flash drive, CD-ROM, or the network. The default setting is for the diskette drive to be the first boot de vice, the hard drive second, and the ATAPI CD-ROM third. The fourth device is disabl ed. 3.[...]

  • Page 64

    Intel Desktop Board DG33BU Technical Product Specification 64 3.9 Adjusting Boot Speed These factors affect system boot speed: • Selecting and configurin g peripherals properly • Optimized BIOS boot parameters 3.9.1 Peripheral Selection and Configuration The following techniques help improve system boot speed: • Choose a hard drive with param[...]

  • Page 65

    Overview of BIOS Features 65 3.10 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A superv isor password and a user password can be set for the BIOS Setup program and for booting the computer, with the followi ng restrictions: • The supervisor password gives [...]

  • Page 66

    Intel Desktop Board DG33BU Technical Product Specification 66[...]

  • Page 67

    67 4 Error Messages and Beep Codes What This Chapter Contains 4.1 Speaker ......................................................................................... 67 4.2 BIOS Beep Codes ............................................................................ 67 4.3 BIOS Error Messages ...........................................................[...]

  • Page 68

    Intel Desktop Board DG33BU Technical Product Specification 68 4.4 Port 80h POST Codes During the POST, the BIOS generates diagno stic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for de termin ing the point w her e an error occurred. Display[...]

  • Page 69

    Error Messages and Beep Codes 69 Table 37. Port 80h POST Codes POST Code Description of POST Operation Host Processor 10 Power-on initialization of the host processor (Boot Strap Processor) 11 Host processor Cache initialization (including APs) 12 Starting Application processor initialization 13 SMM initialization Chipset 21 Initializing a chipset [...]

  • Page 70

    Intel Desktop Board DG33BU Technical Product Specification 70 Table 37. Port 80h POST Codes (continued) POST Code Description of POST Operation Keyboard (PS/2 or USB) 90 Resetting keyboard 91 Disabling keyboard 92 Detecting presence of keyboard 93 Enabling the keyboard 94 Clearing keyboard input buffer 95 Instructing keyboard controller to run Self[...]

  • Page 71

    Error Messages and Beep Codes 71 Table 37. Port 80h POST Codes (continued) POST Code Description of POST Operation DXE Drivers E7 Waiting for user input E8 Checking password E9 Entering BIOS setup EB Calling Legacy Optio n ROMs Runtime Phase/EFI OS Boot F4 Entering Sleep state F5 Exiting Sleep state F8 EFI boot service ExitBootServ ices ( ) has bee[...]

  • Page 72

    Intel Desktop Board DG33BU Technical Product Specification 72 Table 38. Typical Port 80h POST Sequence POST Code Description 21 Initializing a chipset component 22 Reading SPD from memory DIMMs 23 D etecting presence of memory DIMMs 25 Configuring memory 28 Testing memory 34 Loadi ng recovery capsule E4 Entered DXE phase 12 Starting application pro[...]

  • Page 73

    73 5 Regulatory Compliance and Battery Disposal Information What This Chapter Contains 5.1 Regulatory Compliance ..................................................................... 73 5.2 Battery Disposal Information ........ ..................................................... 81 5.1 Regulatory Compliance This section contain s the following re[...]

  • Page 74

    Intel Desktop Board DG33BU Technical Product Specification 74 5.1.2 European Union Declaration of Conformity Statement We, Intel Corporation, declare under our sole responsibility t hat the product Int el ® Desktop Board DG33BU is in conformit y with all applicable essential requiremen ts necessary for CE markin g, following the prov isions of the[...]

  • Page 75

    Regulatory Compliance and Battery Disposal Information 75 Español Este producto cumple con las norm as del Directivo Europeo 2004/108/EC & 2006/95/EC. Slovensky Tento produkt je v súlade s us tanoveniami európskych di rektív 2004/108/EC a 2006/95/EC. Slovenš č ina Izdelek je skladen z dolo č bami evropskih direktiv 2004/108/EC in 2006/95[...]

  • Page 76

    Intel Desktop Board DG33BU Technical Product Specification 76 Español Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos In tel devuelvan los productos u sados en los lugares seleccionados para su correspondient[...]

  • Page 77

    Regulatory Compliance and Battery Disposal Information 77 Russian В качестве части своих обязательств к окружающей среде , в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным польз[...]

  • Page 78

    Intel Desktop Board DG33BU Technical Product Specification 78 Table 40 shows the various forms of the “Lead-Free 2 nd Level Interconnect” mark as it appears on the board and accompanying collateral. Table 40. Lead-Free Board Markings Description Mark Lead-Free 2 nd Level Interconnect: This symbol is used to identify electrical and electronic as[...]

  • Page 79

    Regulatory Compliance and Battery Disposal Information 79 5.1.4 EMC Regulations Desktop Board DG33BU complies with the EMC regulations stated in Table 41 when correctly installed in a compatible host system. Table 41. EMC Regulations Regulation Title FCC 47 CFR Part 15, Subpart B Title 47 of the Code of Federal Regu lations, Part 15, Subpart B, Rad[...]

  • Page 80

    Intel Desktop Board DG33BU Technical Product Specification 80 Korean Class B statement translation: this is household equipment that is certified t o comply with EMC requirements. You may use this equipmen t in residential environments and other non-residential envi ronments. 5.1.5 Product Certification Markings (Board Level) Desktop Board DG33BU h[...]

  • Page 81

    Regulatory Compliance and Battery Disposal Information 81 5.2 Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRECAUTION Risque d'explosion si la pile usag[...]

  • Page 82

    Intel Desktop Board DG33BU Technical Product Specification 82 PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo qu e las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usad as, siga igualmente las instrucciones del fabricante. WAARSCHUWING Er[...]

  • Page 83

    Regulatory Compliance and Battery Disposal Information 83 AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula ji ka boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpiecze ń stwo wybuchu w przypadku zastosowania niew ł a ś [...]

  • Page 84

    Intel Desktop Board DG33BU Technical Product Specification 84[...]