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Intel D95738-001US manual

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  • Page 1

    May 2007 Order Number: D95738-001US The Intel ® Desktop Board DG33TL may co ntain design defects or er rors known as err ata that may cause the product to deviate from published specifications. Current characterized errata are documented in the In tel Desktop Board DG33TL Specif ication Update. Intel® Desktop Board DG33TL Technical Product Specif[...]

  • Page 2

    Revision History Revision Revision History Date -001 First rele ase of the Intel ® Desktop Board DG33TL Technical Product Specification. May 2007 This pro duct s pecifica tion app lies to o nly the st andard Intel ® Desktop Board DG33TL with BIOS identifier DPP3510J.86A . Changes to this s pecifica tion will be publishe d in the Intel De sktop Bo[...]

  • Page 3

    iii Preface This Technical Product Specification (TPS) specif ies the board layout, compon ents, connectors, power and environmental requirements, and the BIOS for the Intel ® Desktop Board DG33TL. It describes the standard product and available manufacturing options. Intended Audience The TPS is intend ed to provide detailed, technical inf ormati[...]

  • Page 4

    Intel Desktop Board DG33TL Technical Product Specification iv Other Common Notation # Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741, 824 bytes) GB/sec Gigabytes per second Gbit Gigabit (1,073,741, 824 bits) KB Kilobyte (1024 bytes ) Kbit Kilobit (1024 bit s) kbits/sec 1000 bits per second MB Megab[...]

  • Page 5

    v Contents 1 Product Description 1.1 Overview........................................................................................ 10 1.1.1 Feature Summary ................................................................ 10 1.1.2 Board Layout ....................................................................... 12 1.1.3 Block Diagram .........[...]

  • Page 6

    Intel Desktop Board DG33TL Technical Product Specification vi 2.3 Jumper Block .................................................................................. 53 2.4 Mechanical Considerations ........... ..................................................... 54 2.4.1 Form Factor ....................................................................[...]

  • Page 7

    Contents vii Figures 1. Major Board Components.................................................................. 12 2. Block Diagram ................................................................................ 14 3. Memory Channel and DIMM Configuration ........................................... 18 4. Back Panel Audio Connector Options .......[...]

  • Page 8

    Intel Desktop Board DG33TL Technical Product Specification viii 28. Thermal Considerations for Compon ents ............................................. 57 29. Desktop Board DG33TL Environmental Specifications ............................ 58 30. BIOS Setup Program Menu Bar .......................................................... 60 31. BIOS Setup[...]

  • Page 9

    9 1 Product Description What This Chapter Contains 1.1 Overview........................................................................................ 10 1.2 Legacy Considerations ............. ......................................................... 15 1.3 Online Support ...........................................................................[...]

  • Page 10

    Intel Desktop Board DG33TL Technical Product Specification 10 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major featur es of the Desktop Board DG33TL. Table 1. Feature Summary Form Factor ATX (9.60 inches by 9.60 inches [ 243.84 millimeters by 243.84 millimeters]) Processor Support for the following: • Intel ® Core™2 Quad process[...]

  • Page 11

    Product Description 11 Table 1. Feature Summary (continued) Instantly Available PC Technology • Support for PCI* Local Bus Specification Revision 2.3 • Support for PCI Express* Revision 1.0a • Suspend to RAM support • Wake on PCI, RS-232, front panel , PS/2 devices, US B ports, LAN, and CIR Expansion Capabilities • One PCI Express x16 bus[...]

  • Page 12

    Intel Desktop Board DG33TL Technical Product Specification 12 1.1.2 Board Layout Figure 1 shows the location of the major components. Figure 1. Major Board Components Table 2 lists the components identified in Figure 1.[...]

  • Page 13

    Product Description 13 Table 2. Board Components Shown in Figure 1 Item/callout from Figure 1 Description A Front panel audio header B Speaker C PCI Conventional bus add-in card connector D Battery E PCI Express x1 connector F PCI Express x1 connector G Chassis intrusion header H PCI Express x16 connector I Back panel connectors J Processor core po[...]

  • Page 14

    Intel Desktop Board DG33TL Technical Product Specification 14 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas. Figure 2. Block Diagram[...]

  • Page 15

    Product Description 15 1.2 Legacy Considerations This board differs from other Intel Deskto p Board products, with specific changes including (b ut not limited t o) the follow ing: • No parallel port • No floppy drive connector • No serial port on the back panel • The serial port header is located near the memory sockets and may require a s[...]

  • Page 16

    Intel Desktop Board DG33TL Technical Product Specification 16 1.5 System Memory The board has four DIMM sockets and su pport the following memory features: • 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts • Unbuffered, sing le-sided or double-sided DIMM s with the following restriction: Double-sided DIMMS with x16 organizati on are not[...]

  • Page 17

    Product Description 17 1.5.1 Memory Configurations The Intel 82G33 GMCH supports the followi ng types of memory organization: • Dual channel (Interleaved) mode . This mode offers the highest throughput for real world applications. Du al channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and de[...]

  • Page 18

    Intel Desktop Board DG33TL Technical Product Specification 18 Figure 3 illustrates the memory ch annel and DIMM conf iguration.  NOTE The DIMM 0 sockets of both channels are bl ue. The DIMM 1 sockets of both channels are black. Figure 3. Memory Channel and DIMM Configuration # INTEGRATOR’S NOTE Regardless of the memory configuration used (dual[...]

  • Page 19

    Product Description 19 1.6 Intel ® G33 Express Chipset The Intel G33 Express chipset cons ists of the following devices: • Intel 82G33 Graphics and Memory Controller Hub (GMCH) with Direct Media Interface (DMI) interconnect • Intel 82801IR I/O Controller Hub (ICH9R) The GMCH component provides interfaces to the CPU, memory, PCI Express, and th[...]

  • Page 20

    Intel Desktop Board DG33TL Technical Product Specification 20 • Display ⎯ Supports analog displays up to 2048 x 1536 at 75 Hz refresh (QXGA) ⎯ Dual independent display support ⎯ DDC2B compliant interface with Advanced Di gital Display 2 card or Medi a Expansion Card (ADD2/MEC), support for TV-out/TV-in and DVI digital display connections 1.[...]

  • Page 21

    Product Description 21 1.6.1.5 Advanced Digital Display (ADD2/MEC) Card Support The GMCH routes two multiplexed SDVO ports that are each capable of driving up to a 225 MHz pixel clock to the PCI Express x16 connector. When an ADD2/MEC card is detected, the Intel GMA 3100 graphics contro ller is enabled and the PCI Express x16 connector is configure[...]

  • Page 22

    Intel Desktop Board DG33TL Technical Product Specification 22 1.6.4 Serial ATA Interfaces The board provides five Serial ATA (SATA) connectors, which support one device per connector. The board also provides one re d-colored external Serial ATA (eSATA) connector. 1.6.4.1 Serial ATA Support The DG33TL Desktop Board’s Se rial ATA controller offers [...]

  • Page 23

    Product Description 23 1.7 Parallel IDE Controller The Parallel ATA IDE con troller has one bus-mastering P arallel ATA IDE interface. The Parallel ATA IDE interf ace supports the following modes: • Programmed I/O (PIO): processor controls data transfer. • 8237-style DMA: DMA offloads the processo r, supporting transfer rates of up to 16 MB/sec[...]

  • Page 24

    Intel Desktop Board DG33TL Technical Product Specification 24 1.9 Legacy I/O Controller The I/O controller provides t he following features: • Consumer Infrared (CIR) headers • One serial port header • Serial IRQ interface compatible with serialized IRQ support for PCI systems • PS/2-style mouse and keyboard interfaces • Intelligent power[...]

  • Page 25

    Product Description 25 1.10 Audio Subsystem The onboard audio subsystem consists of the following: • Intel 82801IR (ICH9R) • IDT STAC9271D audio codec • Back panel audio connectors • Component-side audio headers: ⎯ Intel ® High Definition Audi o front panel header ⎯ HD audio link header The audio subsystem supports the following featur[...]

  • Page 26

    Intel Desktop Board DG33TL Technical Product Specification 26 1.10.1 Audio Subsystem Software Audio software and drivers are availabl e from Intel’s Worl d Wide Web site. For information about Refer to Obtaining audio software and driv ers Section 1.2, page 15 1.10.2 Audio Connectors and Headers The board contains audio connectors on th e back pa[...]

  • Page 27

    Product Description 27 1.11 LAN Subsystem The LAN subsystem consists of the following: • Intel 82566DC Gigabit Ethernet Co ntroller (10/100/1000 Mbits/sec) • Intel 82801IR (ICH9R) • RJ-45 LAN connector with integrated status LEDs Additional features of the LAN subsystem include: • CSMA/CD protocol engine • LAN connect interface between IC[...]

  • Page 28

    Intel Desktop Board DG33TL Technical Product Specification 28 1.11.2 LAN Subsystem Software LAN software and drivers are available from Intel’s Worl d Wide Web site. For information about Refer to Obtaining LAN soft ware and d rivers Section 1.2, page 15 1.11.3 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connect[...]

  • Page 29

    Product Description 29 1.12 Hardware Management Subsystem The hardware management features enable th e board to be compatible with the Wired for Management (WfM) specification. Th e board has several hardware management features, inclu ding the follow ing: • Fan monitoring and control • Thermal and voltage monit oring • Chassis intrusion dete[...]

  • Page 30

    Intel Desktop Board DG33TL Technical Product Specification 30 1.12.4 Thermal Monitoring Figure 6 shows the locations of th e thermal sensors and fan headers. Item Description A Rear chassis fan B Thermal diode, located on processor die C Thermal diode, located on the GMCH die D Remote thermal sensor E Processor fan F Thermal diode, located on the I[...]

  • Page 31

    Product Description 31 1.13 Power Management Power management is implemen ted at several levels, inclu ding: • Software support through Advanced Conf iguration and Power Interface (ACPI) • Hardware support: ⎯ Power connector ⎯ Fan headers ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯ Wake from USB ⎯ Power Management [...]

  • Page 32

    Intel Desktop Board DG33TL Technical Product Specification 32 1.13.1.1 System States and Power States Under ACPI, the operating system direct s all system and device power state transitions. The operating system puts de vices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Device[...]

  • Page 33

    Product Description 33 1.13.1.2 ENERGY STAR * In 2007, the US Department of Energy and the US Environmental Protection Agency revised the ENERGY STAR* requirements. In tel has worked directly with these two governmental agencies to define the ne w requirements. Cu rrently Intel Desktop Boards meet the new requirements. For information about Refer t[...]

  • Page 34

    Intel Desktop Board DG33TL Technical Product Specification 34 1.13.2 Hardware Support CAUTION Ensure that the power supply provides adeq uate +5 V standby current if LAN wake capabilities and Instantly Available PC technolo gy features are used. Failure to do so can damage the power supply. The total am ount of standby current required depends on t[...]

  • Page 35

    Product Description 35 1.13.2.2 Fan Headers The function/operation of the fan headers is as foll ows: • The fans are on when the board is in the S0 state. • The fans are off when the board is off or in the S3, S4, or S5 state. • The CPU fan header is wired to a fan tach ometer input and the Front and Rear fan headers share the tachometer inpu[...]

  • Page 36

    Intel Desktop Board DG33TL Technical Product Specification 36 1.13.2.4 Instantly Available PC Technology CAUTION For Instantly Available PC technology, th e +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technolo[...]

  • Page 37

    Product Description 37 1.13.2.5 Wake from USB USB bus activity wakes the comput er from ACPI S1 and S3 state.  NOTE Wake from USB requires the use of a USB peripheral that supports Wake from USB and support in the OS. 1.13.2.6 PME# Signal Wake-up Support When the PME# signal on the PCI bus is a sserted, the computer wakes from an ACPI S1, S3, S4[...]

  • Page 38

    Intel Desktop Board DG33TL Technical Product Specification 38[...]

  • Page 39

    39 2 Technical Reference What This Chapter Contains 2.1 Memory Map ................................................................................... 39 2.2 Connectors and Headers ................................................................... 42 2.3 Jumper Block .................................................................................[...]

  • Page 40

    Intel Desktop Board DG33TL Technical Product Specification 40 The amount of in stalled memory that can be used w ill vary based on add-in cards and BIOS settings. Figure 8 shows a schematic of the sy stem memory map. All installed system memory can be used when there is no overlap of system addresses. Upper BI OS area (64 KB) Lower BIO S area (64 K[...]

  • Page 41

    Technical Reference 41 Table 10 lists the system memory map. Table 10. System Memory Map Address Range (decimal) Address Range (hex) Size Description 1024 K - 8388608 K 100000 - 1FFFFFFFF 8191 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K E0000 - EFFFF 64 KB Reserved 800 K - 896 K C8000 - DFFFF 96 KB Potential ava[...]

  • Page 42

    Intel Desktop Board DG33TL Technical Product Specification 42 2.2 Connectors and Headers CAUTION Only the following connectors have overcurrent protection: Back panel and front panel USB, with support for 1394. The other internal connectors/headers ar e not overcurrent protected and should connect only to devices inside the computer ’s chassis, s[...]

  • Page 43

    Technical Reference 43 2.2.1 Back Panel Connectors Figure 9 shows the location of the back panel connectors. Item Description A VGA output B DVI-D output C IEEE-1394a D USB ports [2] E USB ports [2] F LAN G USB ports [2] H Surround left/right channel audio out I Center channel and LFE (subwoofer) audio out J Audio line in K S/PDIF Digital audio out[...]

  • Page 44

    Intel Desktop Board DG33TL Technical Product Specification 44 2.2.2 Component-side Connectors and Headers Figure 10 shows the locations of the co mponent-side connectors and headers. Figure 10. Component-side Connectors and Headers[...]

  • Page 45

    Technical Reference 45 Table 11 lists the component-side co nnectors and headers identified in Figure 10. Table 11. Component-side Connectors and Headers Shown in Figure 10 Item/callout from Figure 10 Description A Front panel audio header B PCI Conventional bus add-in card connector C PCI Express x1 add-in card connector D PCI Express x1 add-in ca[...]

  • Page 46

    Intel Desktop Board DG33TL Technical Product Specification 46 2.2.2.1 Signal Tables for the Connectors and Headers Table 12. HD Audio Link Header Pin Signal Name Pin Signal Name 1 BCLK 2 Ground 3 RST# 4 3.3 VCC 5 SYNC 6 Ground 7 SDO 8 3.3 VCC 9 SDI0 10 +12 V 11 SDI1 12 Key (no pin) 13 Aud RSVD 14 3.3 V STBY 15 Aud RSVD 16 Ground Table 13. Front Pan[...]

  • Page 47

    Technical Reference 47 Table 16. Chassis Intrusion Header Pin Signal Name 1 Intruder 2 Ground Table 17. Front and Rear Chassis (3-Pin) Fan Headers Pin Signal Name 1 Control 2 +12 V 3 Tach Table 18. Processor (4-Pin) Fan Header Pin Signal Name 1 Ground 2 +12 V 3 FAN_TACH 4 FAN_CONTROL Table 20. Back Panel CIR Emitter (Output) Header Pin Signal Name [...]

  • Page 48

    Intel Desktop Board DG33TL Technical Product Specification 48 2.2.2.2 Add-in Card Connectors The board has the following add-in card connectors: • PCI Express x16: one connector supportin g simultaneous transfer speeds up to 4 GBytes/sec of peak bandwi dth per directio n and up to 8 GBytes/sec concurrent bandwidth • PCI Express x1: two PCI Expr[...]

  • Page 49

    Technical Reference 49 2.2.2.4 Power Supply Connectors The board has the following power supply connectors: • Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desk top boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When usin[...]

  • Page 50

    Intel Desktop Board DG33TL Technical Product Specification 50 2.2.2.5 Front Panel Header This section describes the functi ons of the front panel header. Table 22 l ists the signal names of the front panel header. Figure 11 i s a connection diagram for the front panel header. Table 22. Front Panel Header Pin Signal In/ Out Description Pin Signal In[...]

  • Page 51

    Technical Reference 51 2.2.2.5.1 Hard Drive Activity LED Header Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires one of the following: • A Serial ATA hard drive connected to an onboard Serial ATA connector • A Parallel ATA IDE hard drive c[...]

  • Page 52

    Intel Desktop Board DG33TL Technical Product Specification 52 2.2.2.6 Front Panel USB Headers Figure 12 is a connection diagram for the front panel USB headers. # INTEGRATOR’S NOTES • The +5 V DC power on the USB headers is fused. • Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices. Fig[...]

  • Page 53

    Technical Reference 53 2.3 Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before chan ging a jumper setting. Otherwise, the board could be damaged. Figure 14 shows the location of the jumper block. The jumper determines the BIOS Setup program’s mode. Table 25 li[...]

  • Page 54

    Intel Desktop Board DG33TL Technical Product Specification 54 2.4 Mechanical Considerations 2.4.1 Form Factor The board is designed to fit into an ATX-form-factor chassis. Figure 15 illustrat es the mechanical form factor for t he board. Dimensions are given in inches [millimeters]. The outer dimensions are 9.60 inches by 9.60 inches [243.84 millim[...]

  • Page 55

    Technical Reference 55 2.5 Electrical Considerations 2.5.1 Power Supply Considerations CAUTION The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depe nds on the wake devices supported and manufacturing opt[...]

  • Page 56

    Intel Desktop Board DG33TL Technical Product Specification 56 2.5.3 Add-in Board Considerations The board is designed to provide 2 A (average ) of +5 V current for each add-in board. The total +5 V current draw for add-in bo ards for a fully loaded board (all three expansion slots and th e PCI Express x16 connect or filled) must not exceed 8 A. 2.6[...]

  • Page 57

    Technical Reference 57 Figure 16 shows the locations of the localized high temperature zones. Item Description A Processor voltage regulator area B Processor C Intel 82G33 GMCH D Intel 82801IR (ICH9R) Figure 16. Localized High Temperature Zones Table 28 provides maximum case temperatur es for the board components that are sensitive to th ermal chan[...]

  • Page 58

    Intel Desktop Board DG33TL Technical Product Specification 58 2.7 Reliability The Mean Time Between Failures (MTBF) pred iction is calculated using component and subassembly random failure rat es. The calculation is based on t he Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estima[...]

  • Page 59

    59 3 Overview of BIOS Features What This Chapter Contains 3.1 Introduction ................................................................................... 59 3.2 BIOS Flash Memory Organization .. ..................................................... 60 3.3 Resource Configuration ............ .....................................................[...]

  • Page 60

    Intel Desktop Board DG33TL Technical Product Specification 60 Table 30 lists the BIOS Setup program menu features. Table 30. BIOS Setup Program Menu Bar Maintenance Main Advanced Security Power Boot Exit Clears passwords and displays processor information Displays processor and memory configuretion Configures advanced features available through the[...]

  • Page 61

    Overview of BIOS Features 61 3.3.2 PCI IDE Support If you select Auto in the BIOS Setup prog ram, the BIOS automatically sets up the PCI IDE connector with independent I/O ch annel support. The IDE interface supports hard drives up to ATA-66/100 and recognizes any ATAPI compliant devices, including CD-ROM drives, tape drives, and Ultra DMA drives. [...]

  • Page 62

    Intel Desktop Board DG33TL Technical Product Specification 62 3.5 Legacy USB Support Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an op erating system that supports USB. By default, Legacy USB suppo [...]

  • Page 63

    Overview of BIOS Features 63 3.6 BIOS Updates The BIOS can be updated us ing either of the f ollowing utilities, wh ich are available on the Intel World Wide Web site: • Intel ® Express BIOS Update utility, w hich enables automated updat ing while in the Windows environment . Using this utility , the BIOS can be updated from a f ile on a hard di[...]

  • Page 64

    Intel Desktop Board DG33TL Technical Product Specification 64 3.7 BIOS Recovery It is unlikely t hat anyth ing will interrupt a BIOS update; howev er, if an interrupt ion occurs, the BIOS could be damaged. Table 32 lists the drives and media types that can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootab[...]

  • Page 65

    Overview of BIOS Features 65 3.8 Boot Options In the BIOS Setup program, the user can ch oose to boot from a diskette drive, hard drive, USB drive, USB flash drive, CD-ROM, or the network. The default setting is for the diskette drive to be the first boot de vice, the hard drive second, and the ATAPI CD-ROM third. If enabled, the last defaul t boot[...]

  • Page 66

    Intel Desktop Board DG33TL Technical Product Specification 66 3.9 Adjusting Boot Speed These factors affect system boot speed: • Selecting and configurin g peripherals properly • Optimized BIOS boot parameters 3.9.1 Peripheral Selection and Configuration The following techniques help improve system boot speed: • Choose a hard drive with param[...]

  • Page 67

    Overview of BIOS Features 67 3.10 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A superv isor password and a user password can be set for the BIOS Setup program and for booting the computer, with the followi ng restrictions: • The supervisor password gives [...]

  • Page 68

    Intel Desktop Board DG33TL Technical Product Specification 68[...]

  • Page 69

    69 4 Error Messages and Beep Codes What This Chapter Contains 4.1 Speaker ......................................................................................... 69 4.2 BIOS Beep Codes ............................................................................ 69 4.3 BIOS Error Messages ...........................................................[...]

  • Page 70

    Intel Desktop Board DG33TL Technical Product Specification 70 4.4 Port 80h POST Codes During the POST, the BIOS generates diagno stic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for de termin ing the point w her e an error occurred. Display[...]

  • Page 71

    Error Messages and Beep Codes 71 Table 38. Port 80h POST Codes POST Code Description of POST Operation Host Processor 10 Power-on initialization of the host processor (Boot Strap Processor) 11 Host processor cache initialization (including APs) 12 Starting Application processor initialization 13 SMM initialization Chipset 21 Initializing a chipset [...]

  • Page 72

    Intel Desktop Board DG33TL Technical Product Specification 72 Table 38. Port 80h POST Codes (continued) POST Code Description of POST Operation Keyboard (PS/2 or USB) 90 Resetting keyboard 91 Disabling keyboard 92 Detecting presence of keyboard 93 Enabling the keyboard 94 Clearing keyboard input buffer 95 Instructing keyboard controller to run Self[...]

  • Page 73

    Error Messages and Beep Codes 73 Table 38. Port 80h POST Codes (continued) POST Code Description of POST Operation DXE Drivers E7 Waiting for user input E8 Checking password E9 Entering BIOS setup EB Calling Legacy Optio n ROMs Runtime Phase/EFI OS Boot F4 Entering Sleep state F5 Exiting Sleep state F8 EFI boot service ExitBootServ ices ( ) has bee[...]

  • Page 74

    Intel Desktop Board DG33TL Technical Product Specification 74 Table 39. Typical Port 80h POST Sequence POST Code Description 21 Initializing a chipset component 22 Reading SPD from memory DIMMs 23 D etecting presence of memory DIMMs 25 Configuring memory 28 Testing memory 34 Loadi ng recovery capsule E4 Entered DXE phase 12 Starting application pro[...]

  • Page 75

    75 5 Regulatory Compliance and Battery Disposal Information What This Chapter Contains 5.1 Regulatory Compliance ..................................................................... 75 5.2 Battery Disposal Information ........ ..................................................... 85 5.1 Regulatory Compliance This section contain s the following re[...]

  • Page 76

    Intel Desktop Board DG33TL Technical Product Specification 76 5.1.2 European Union Declaration of Conformity Statement We, Intel Corporation, declare under our sole responsibility t hat the product Int el ® Desktop Board DG33TL is in con formity with all applicable essential requ irements necessary for CE markin g, following the prov isions of the[...]

  • Page 77

    Regulatory Compliance and Battery Disposal Information 77 Malti Dan il-prodott hu konformi mal-pro vvedimenti tad-Direttivi Ewropej 2004/108/EC u 2006/95/EC. Norsk Dette produktet er i henhold til bestemmelsen e i det europeiske direktiv et 2004/108/EC & 2006/95/EC. Polski Niniejszy produkt jest zgodny z postan owieniami Dyrektyw Unii Europejsk[...]

  • Page 78

    Intel Desktop Board DG33TL Technical Product Specification 78 5.1.3 Product Ecology Statements The following inf ormation is provided to address worldwide produc t ecology concerns and regulations. 5.1.3.1 Disposal Considerations This product contains the followi ng material s that may be regulated upon disposal: lead solder on the printed wiring b[...]

  • Page 79

    Regulatory Compliance and Battery Disposal Information 79 Français Dans le cadre de son engagement pour la protecti on de l'environnement, Intel a mis en œuvre le programme Intel Product Recy cling Program (Programme de recyclage des produits Intel) pour pe rmettre aux consommateurs de produits Intel de recycler les produits usés en les ret[...]

  • Page 80

    Intel Desktop Board DG33TL Technical Product Specification 80 Türkçe Intel, çevre sorumlulu ğ una ba ğ ı ml ı l ı ğ ı n ı n bir parças ı olarak, perakend e tüketicileri n Intel markal ı kullan ı lm ı ş ürünlerin i belirlenmi ş merkezlere iade edip uygun ş ekilde geri dönü ş türmesini amaçlayan In tel Ürünleri Geri Dön?[...]

  • Page 81

    Regulatory Compliance and Battery Disposal Information 81 Table 41 shows the various forms of the “Lead-Free 2 nd Level Interconnect” mark as it appears on the board and accompanying collateral. Table 41. Lead-Free Board Markings Description Mark Lead-Free 2 nd Level Interconnect: This symbol is used to identify electrical and electronic assemb[...]

  • Page 82

    Intel Desktop Board DG33TL Technical Product Specification 82 5.1.4 EMC Regulations Desktop Board DG33TL complies with the EMC regulations stated in Table 42 when correctly installed in a compatible host system. Table 42. EMC Regulations Regulation Title FCC 47 CFR Part 15, Subpart B Title 47 of the Code of Federal Regu lations, Part 15, Subpart B,[...]

  • Page 83

    Regulatory Compliance and Battery Disposal Information 83 Japanese Kanji statement translation: this is a Class B product based on the standard of the Voluntary Control Council for Inte rference from Information Technology Equipment (VCC I). If this is us ed near a radio or television receiver in a domestic environment, it may cause radio interf er[...]

  • Page 84

    Intel Desktop Board DG33TL Technical Product Specification 84 5.1.5 Product Certification Markings (Board Level) Desktop Board DG33TL has the product certification markings shown in Table 43. Table 43. Product Certification Markings Description Mark UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel desktop boa[...]

  • Page 85

    Regulatory Compliance and Battery Disposal Information 85 5.2 Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRECAUTION Risque d'explosion si la pile usag[...]

  • Page 86

    Intel Desktop Board DG33TL Technical Product Specification 86 PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo qu e las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usad as, siga igualmente las instrucciones del fabricante. WAARSCHUWING Er[...]

  • Page 87

    Regulatory Compliance and Battery Disposal Information 87 AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula ji ka boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZE Ż ENIE Istnieje niebezpiecze ń stwo wybuchu w przypadku zastosowania niew ł a ?[...]

  • Page 88

    Intel Desktop Board DG33TL Technical Product Specification 88[...]