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Intel D810EMO manual

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Table of contents for the manual

  • Page 1

    Intel ® Desktop Board D810EMO/MO810E Technical Product Specification The Inte l ® Desktop Board D810EMO/MO810E may contain design defects or errors known as errata that may cause the product to deviate from p ublished specifications. Current characterized errata are documented in the Intel Desktop Board D810EMO/MO810E Specification Update. Februa[...]

  • Page 2

    Revision History Revision Revision History Date -001 First release of the Intel ® Desktop Board D810EMO /MO810E Technic al Product Specific ation February 2000 This product specification applies to only standard D810EMO/MO810E boards with BIOS identifier MO81010A.86A. Changes to this specification will be published in the Intel Desktop B oard D810[...]

  • Page 3

    iii Preface This Technical Product Specifi cation (TPS) specifies the board la yout, components, connectors, power and environmental requirements, and the BIOS for the D810EMO/MO810E desktop board. It describes the standard product and available manufacturing options. The D810EMO desktop board is known in some documentation and sales collateral as [...]

  • Page 4

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification iv Other Common Notation # Used after a signal name to identify an active-low signal (s uch as USBP0#) (NxnX) When used in the desc ription of a component, N indic ates component ty pe, xn are the relative coordinates of its location on the board, and X is the instanc e of the part[...]

  • Page 5

    v Contents 1 Product Description 1.1 Overvie w ................................................................................................................... 1 0 1.1.1 Feature Summary ....................................................................................... 10 1.1.2 B oard L ayou t ................................................[...]

  • Page 6

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification vi 2.9 Jumpe r Blo ck ............................................................................................................. 49 2.10 Mechanical C onsiderations ........................................................................................ 51 2.10.1 Fle xATX F orm F[...]

  • Page 7

    Contents vii 4.5 Secu rity Men u............................................................................................................ 83 4.6 Pow er Menu .............................................................................................................. 84 4.7 Boo t Menu .............................................................[...]

  • Page 8

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification viii 21. Mic In Connector ....................................................................................................... 40 22. Chassis Fan Connector (J2J1) .................................................................................. 42 23. Processor Fan Connector (J[...]

  • Page 9

    9 1 Product Description What This Chapter Contains 1.1 Overvie w ................................................................................................................... 1 0 1.2 Online Support........................................................................................................... 13 1.3 Desi gn S peci fica tions ......[...]

  • Page 10

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 10 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the D810EMO/MO 810E board’s major features. Table 1. Feature Summary Form Factor Flex ATX (9.0 inches by 7.5 inches) Processor Support for either an Intel ® Pentium ® III processor in a Flip Chip Pin Grid Array (FC-PGA) p[...]

  • Page 11

    Product Description 11 For information about Refer to The board’s com pliance level with ACPI, Plug and Play , and SMBIOS Table 2, page 13 1.1.2 Board Layout Figure 1 shows the location of the major components on the board. OM08923 D A B C Q L M O P F E G K J I H N A Crystal Sem iconductor CS4297A c odec J Front panel connector B Creative ES1373D[...]

  • Page 12

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 12 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas of the board. Port 3 810E Chipset PPGA370 Processor Socket DIMM Socket Primary/ Secondary IDE Interface LPC I/O Controller Serial Port ATA33/66 Port 0 USB PCI Bus Connector 66/100/133 MHz Host Bus PCI [...]

  • Page 13

    Product Description 13 1.2 Online Support Find information about Intel ® desktop boards under “Product Info” or “Customer Support” at these World Wide Web sites: http: //www.int el.com /desi gn/moth erbd http://support.intel.com/support/motherboards/desktop 1.3 Design Specifications Table 2 lists the specifications applicable to the D810EM[...]

  • Page 14

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 14 Table 2. Specifications ( continued) Reference Name Specification Title Version, Revision Date, and Owners hip This specification is available at: IrDA † Serial Infrared Physical Layer Link Spec ification Version 1.1, October 17, 1995 Infrared Data Assoc iation Phone: (510) 94[...]

  • Page 15

    Product Description 15 Table 2. Specifications ( continued) Reference Name Specification Title Version, Revision Date, and Owners hip This specification is available at: UHCI Univers al Host Controller Interface Design G uide Version 1.1, March 1996, Intel Corporation. This guide is av ailable at: http://www.usb.org/ developers USB Universal Serial[...]

  • Page 16

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 16 1.4 Processor CAUTION The board supports processors that draw a maximum of 22 am ps. Using a processor that draws more than 22 amps can damage the processor, the board, and the power supply. See the processor’s data sheet for current usage requirements. The board supports the [...]

  • Page 17

    Product Description 17 1.5 System Memory CAUTION To be fully compliant with all applicable Intel ® SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD ) data structure. If your memory m odules do not support SPD, you will see a notification to this effect on the screen at power up. The[...]

  • Page 18

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 18 1.6 Intel ® 810E Chipset The Intel 810E chipset consists of the following devices: • 82810E DC-133 G raphics Memory Controller Hub (GMCH) with accelerated hub architecture (AHA) bus • 82801AA I/O Contr oller Hub (ICH) wi th AHA bus • 82802AB Firmware Hub (FWH) The chipset[...]

  • Page 19

    Product Description 19 1.6.1 Direct AGP Direct (integrated) AGP is a high-performance bus (independent of the PCI bus) for graphics-intensive applications, such as 3-D applications. AGP overcomes certain limitations of the PCI bus related to handling large amount of graphics data with the following features: • Pipelined memory read and write oper[...]

  • Page 20

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 20 1.6.3 IDE Support The board has two independent bus-mastering IDE interfaces. These interfaces support: • ATA PI devices (such as CD-RO M drives) • ATA devices using the transfer modes listed in Table 51 on page 79 The BIOS supports logical block addressing (LBA) and extende[...]

  • Page 21

    Product Description 21 ✏ NOTE The recommended method of accessing the date in system s with Intel desktop boards is indirectly from the Real-Time Clock (RTC) via the BIOS. The BIO S on Intel desktop boards contains a century checking and maintenance feature. This feature checks the two least significant digits of the year stored in the RTC during[...]

  • Page 22

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 22 1.9 Graphics Subsystem The Intel 82810E DC-133 GMCH graphics memory controller hub component provides the following graphics support features: • Integrated 2-D and 3-D graphics engines • Integrated hardware motion compression engine • Integrated 230 MHz DAC Table 5 lists t[...]

  • Page 23

    Product Description 23 1.10 Audio Subsystem The Audio Codec ’97 (AC ’97) compatible audio subsystem includes these features: • Split digital/analog architecture for improved signal-to-noise ratio ( ≥ 85 dB) measured at line out, from any analog input, including line in, and CD-ROM • 3-D stereo enhancement • Power management support for [...]

  • Page 24

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 24 1.10.4 Audi o Connectors The audio connectors include the following: • Line out (back panel) • Mic in (back panel) • ATA PI CD-RO M (connects an internal ATAPI C D-ROM drive to the audio mixer) For information about Refer to The back panel audio c onnectors Section 2.8.1, [...]

  • Page 25

    Product Description 25 1.12 LAN Subsystem The Intel 82559 Fast Ethernet Wired for Management (WfM) PCI LAN subsystem provides both 10Base-T and 100Base-TX connectivity. Features include: • 32-bit, 33 MHz direct bus mastering on the PCI bus • 10Base-T and 100Base-TX capability using a single R J-45 connector with connection and activity status L[...]

  • Page 26

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 26 1.12.2 LAN Subsystem Software The Intel 82559 Fast Ethernet WfM PCI LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and driv ers Section 1.2, page 13 1.12.3 RJ-45 LAN Connector LEDs Two LEDs are bui[...]

  • Page 27

    Product Description 27 1.13 Power Management Features Power management is implemented at several levels, including: • Advanced Configuration and Pow er Interface (ACPI) • Hardware support:  Power connector  Wake on network event  Instantly Available technology  Wake on Ring  Resume on Ring 1.13.1 ACPI If the board is used with an[...]

  • Page 28

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 28 1.13.1.1 System States and Power States Under ACPI, the operating system directs all system and device pow er state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications[...]

  • Page 29

    Product Description 29 1.13.1.2 Wake Up Devices and Events Table 9 lists the devices or specific events that can wake the computer from specific states. Table 9. Wake Up Devices and Events These devices/events can wake up the computer… …from this state Power switch S1, S3, S5 RTC alarm S1, S3, S5 LAN S1, S3 Modem S1, S3 USB S1, S3 PCI bus PME# [...]

  • Page 30

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 30 1.13.2.1 Power Connector When used with an ATX-compliant power supply that supports remote power on/off, the board can turn off the system power through software control. To enable soft-off control in software, advanced power management must be enabled in the BIOS Setup program [...]

  • Page 31

    Product Description 31 1.13.2.4 Instantly Available Technology CAUTION For Instantly Available technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when using this feature can damage the power supply. Refer to Section 2.11.3 on page 54 for addi[...]

  • Page 32

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 32[...]

  • Page 33

    33 2 T echnical Reference What This Chapter Contains 2.1 Introduction................................................................................................................ 33 2.2 Memory Ma p ............................................................................................................. 33 2.3 I/O Map ........................[...]

  • Page 34

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 34 2.3 I/O Map Table 12. I/O Map Address (hex) Size Description 0000 – 000F 16 bytes DMA Controller 0020 – 0021 2 bytes Programmable Interrupt Control (PIC ) 0040 – 0043 4 bytes Sys tem Timer 0060 1 byte Keyboard controller by te – reset IRQ 0061 1 byte System Speaker 0064 [...]

  • Page 35

    Technical Reference 35 Table 12. I/O Map (continued) Address (hex) Size Description 96 contiguous by tes starting on a 128-byte divis ible boundary ICH (ACPI + TCO) 64 contiguous by tes starting on a 64-byte divis ible boundary Onboard resource 32 contiguous by tes starting on a 32-byte divis ible boundary ICH (USB) 16 contiguous by tes starting on[...]

  • Page 36

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 36 2.5 PCI Configuration Space Map Table 14. PCI Conf iguration Space Map Bus Number (hex) Device Number (hex) Function Number (hex) Description 00 00 00 Memory c ontroller of Intel 82810E component 00 01 00 Graphics controller of Intel 82810E component 00 1E 00 Link to PCI bridge [...]

  • Page 37

    Technical Reference 37 2.7 PCI Interrupt Routing Map This section describes interrupt sharing and how the interrupt signals are connected between the PCI bus connector and onboard PCI devices. The PCI specification specifies how interrupts can be shared between devices attached to the PCI bus. In most cases, the small amount of latency added by int[...]

  • Page 38

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 38 2.8 Connectors CAUTION Only the back panel I/O connectors of the board have overcurrent protection. The internal board connectors are not overcurrent protected, and should connect only to devices inside the computer chassis, such as fans and internal peripherals. Do not use thes[...]

  • Page 39

    Technical Reference 39 2.8.1 Back Panel I / O Connector s Figure 4 shows the location of the back panel I/O connectors. OM08925 C DF E A B Item Description A USB port 0 ( see Table 17, page 40) B USB port 1 ( see Table 17, page 40) C VGA port (see Table 18, page 40) D LAN (see Table 19, page 40) E Audio line out (see Table 20, page 40) F Mic in (se[...]

  • Page 40

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 40 Table 17. USB Connectors Pin Signal Name 1 +5 V (fused) 2 USBP0# / USBP1# 3 USBP0 / USBP1 4 Ground Table 18. VGA Port Connector Pin Signal Name Pin Signal Name Pin Signal Name 1 Red 6 Ground 11 No connect 2 Green 7 Ground 12 MO NID1 3 Blue 8 Ground 13 HSYNC 4 No c onnect 9 Fused[...]

  • Page 41

    Technical Reference 41 2.8.2 Internal I/O Connectors Figure 5 shows the location of the internal I/O connectors. OM08926 1 2 40 39 C D F E 1 11 10 20 1 2 49 50 B 8 9 2 1 1 A 1 G H 1 Item Description Reference Designator A Fan 2 (chass is fan) (see Table 22, page 42) J2J1 B Fan 1 (process or fan) (see Table 23, page 42) J7J 1 C Primary IDE (see Tabl[...]

  • Page 42

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 42 Table 22. Chassis Fan Connector (J2J1) Pin Signal Name 1 Ground 2 +12 V 3 Ground Table 23. Processor Fan Connector (J7J1) Pin Signal Name 1 Ground 2 +12 V 3 FAN_TACH1 Table 24. Primary IDE Connect or (J7E1) Pin Signal Name Pin Signal Name 1 Reset IDE 2 Ground 3 Data 7 4 Data 8 5[...]

  • Page 43

    Technical Reference 43 Table 25. Slimline IDE Connect or (J8E1) Pin Signal Name Pin Signal Name 1 AUD_LCR_R 2 AUD_RCD_R 3 AUD_CDGND_R 4 AUD_CDGND_R 5N / C 6N / C 7 Reset IDE 8 Ground 9 Data 7 10 Data 8 11 Data 6 12 D ata 9 13 Data 5 14 D ata 10 15 Data 4 16 D ata 11 17 Data 3 18 D ata 12 19 Data 2 20 D ata 13 21 Data 1 22 D ata 14 23 Data 0 24 D at[...]

  • Page 44

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 44 Table 27. Pow er Connector (J8B1) Pin Signal Name Pin Signal Name 1 +3.3 V 11 +3.3 V 2 +3.3 V 12 -12 V 3 Ground 13 Ground 4 +5 V 14 PS-ON# (power supply rem ote on/off) 5 Ground 15 Ground 6 +5 V 16 Ground 7 Ground 17 Ground 8 PWRGD (Power Good) 18 PS_FAN_EN 9 +5 VSB 19 +5 V 10 +[...]

  • Page 45

    Technical Reference 45 Table 28. PCI Bus Connect or (J4B1) Pin Signal Pin Signal Pin Signal Pin Signal A1 Ground (TRST#)* B1 -12 V A32 AD16 B32 AD17 A2 +12 V B2 Ground (TCK)* A33 +3.3 V B33 C/BE2# A3 +5 V (TMS)* B3 Ground A34 FRAME# B34 Ground A4 +5 V (TDI)* B4 No c onnect (TDO)* A35 Ground B35 IRDY# A5 +5 V B 5 +5 V A36 TRDY# B36 +3.3 V A6 INTA# B[...]

  • Page 46

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 46 2.8.3 External I / O Connectors Figure 6 shows the locations of the external I/O connectors. OM08927 2 10 7 1 A B 16 15 2 1 Item Description Reference Designator A USB ports (see Table 30, page 47) J7A1 B Front panel (see Table 31, page 47) J8C1 Figure 6. External I/O Connectors[...]

  • Page 47

    Technical Reference 47 2.8.3.1 USB Port Connector Table 30 lists the signal names of the USB port connector. Table 30. USB Port Connector (J7A1) Pin Signal Name Pin Signal Name 1 USB_PWR 2 USB_PWR 3 USB_P2RL# 4 USB_P3RL# 5 USB_P2RL 6 USB_P3RL 7 Ground 8 Ground 9 Key (no pin) 10 USB_FP_OC 2.8.3.2 Front Panel Connector Table 31 lists the signal names[...]

  • Page 48

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 48 2.8.3.2. 1 Power / Sl eep / Message Waiti ng LED Connector Pins 2 and 4 can be connected to a single- or dual-colored LED. Table 32 lists the possible states for a single-colored LED. Table 33 shows the possible states for a dual-colored LED. Table 32. St ates for a Single-color[...]

  • Page 49

    Technical Reference 49 2.9 Jumper Block CAUTION Do not move jumpers with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. O therwise, damage to the board could occur. Figure 7 shows the location of the BIOS Setup jumper block. This 3-pin jumper block determines the BIOS Setup prog[...]

  • Page 50

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 50 Table 34. BIOS Setup Configuration Jumper Settings (J8F1) Function/Mode Jumper Setting Configuration Normal 1-2 1 3 The BIOS uses current configuration information and pas swords for booting. Configure 2-3 1 3 After the POST runs, Setup runs automatically. The m aintenance menu [...]

  • Page 51

    Technical Reference 51 2.10 Mechanical Considerations 2.10.1 FlexATX Form Factor The board is designed to fit into a FlexATX form-factor chassis. The board can also be installed in a microATX-form-factor chassis. Figure 8 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 9.0[...]

  • Page 52

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 52 2.10.2 I/O Shield The back panel I/O shield for the board must meet specific dimension and material requirements. Systems based on this board need the back panel I/O shield to pass certification testing. Figure 9 shows the critical dimensions of the I/O shield. Dimensions are gi[...]

  • Page 53

    Technical Reference 53 2.11 Electrical Considerations 2.11.1 Add-i n Boar d Consi der ati ons The board is designed to provide 2 A (average) of +5 V current for an add-in board in the PCI slot. 2.11.2 Power Consumpti on Table 35 lists voltage and current specifications for a computer that contains the board and the following: • 550E MHz Intel Pen[...]

  • Page 54

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 54 2.11.3 Power Suppl y Consi der ati ons System integrators should refer to the power usage values listed in Table 35 when selecting a power supply for use with this board. The power supply must comply with the following recommendations found in the indicated sections of the ATX f[...]

  • Page 55

    Technical Reference 55 2.12 Thermal Considerations CAUTION An ambient temperature that exceeds the board’s m aximum operating temperature by 5 o C to 10 o C could cause components to exceed their maxim um case temperature and malfunction. For information about the maxim um operating temperature, see the environmental specifications in Section 2.1[...]

  • Page 56

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 56 Table 37 provides maximum component case temperatures for board components that could be sensitive to thermal changes. Case temperatures could be affected by the operating temperature, current load, or operating frequency. Maximum case temperatures are important when considering[...]

  • Page 57

    Technical Reference 57 2.14 Environmental Table 38 lists the environmental specifications for the board. Table 38. Board Environmental Specifications Parameter Specification Temperature Non-Operating -40 ° C to +70 ° C Operating 0 ° C to +55 ° C Shock Unpackaged 30 g trapezoidal waveform Velocity c hange of 170 inches/s econd Packaged Half sine[...]

  • Page 58

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 58 2.15 Regulatory Compliance This section describes the board’s compliance with safety and EMC regulations. 2.15.1 Safety Regulations Table 39 lists the safety regulations the board complies with when it is correctly installed in a compatible host system. Table 39. Safety Regula[...]

  • Page 59

    Technical Reference 59 2.15.3 Certification Markings This printed circuit assembly has the following product certification markings: • UL Joint Recognition Mark: Consists of small c followed by a stylized backward UR and followed by a small US (Component side) • Manufacturer’s recognition mark: Consists of a unique UL recognized manufacturer?[...]

  • Page 60

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 60[...]

  • Page 61

    61 3 Overview of BIOS Features What This Chapter Contains 3.1 Introduction................................................................................................................ 61 3.2 BIOS Flash Memory Organi zation ............................................................................. 62 3.3 Reso urce C onfi gurati on ............[...]

  • Page 62

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 62 3.2 BIOS Flash Memory Organization The Intel 82802AB Firmware Hub (FWH) includes a 4 Mbit (512 KB) symmetrical flash memory device. Internally, the device is grouped into eight 64-KB blocks that are individually erasable, lockable, and unlockable. Figure 11 shows the organizatio[...]

  • Page 63

    Overview of BIO S Features 63 3.3.2 PCI I DE Suppor t If you select Auto in the BIOS Setup program, the BIOS automatically sets up the two PCI IDE connectors with independent I/O channel support. The primary ID E interface supports hard drives up to ATA/66 and recognizes any ATA PI devices, including CD-ROM drives, tape drives, and Ultra DMA drives[...]

  • Page 64

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 64 3.4 System Management BIOS (SMBIOS) SMBIOS is a Desktop Management Interface (D MI) compliant method for managing computers in a managed network. The main component of SMBIOS is the management information format (MIF) database, which contains information about the computing syst[...]

  • Page 65

    Overview of BIO S Features 65 3.5 BIOS Upgrades The BIOS can be upgraded using the Intel ® Flash Memory Update utility that is available from Intel. This utility supports the following BIOS maintenance functions: • Upgrading the flash BIOS from bootable recovery media • Changing the language section of the BIOS • Verifying that the upgrade B[...]

  • Page 66

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 66 3.6 Recovering BIOS Data Some types of failure can destroy the BIOS. For example, the data can be lost if a power outage occurs while the BIOS is being upgraded in flash memory. The BIOS can be recovered from either a 1.44 MB diskette (for recovery from an LS-120 diskette drive [...]

  • Page 67

    Overview of BIO S Features 67 3.7 Boot Options In the BIOS Setup program, the user can choose to boot from an ATAPI removable media device, hard drives, CD-RO M, or the network. Boot devices are defined in priority order. The default setting is for the CD-ROM drive to be the primary boot device and the hard drive to be the secondary boot device. 3.[...]

  • Page 68

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 68 3.8 USB Legacy Support USB legacy support enables USB devices such as keyboards, mice, and hubs to be used even w hen no operating system USB drivers are in place. By default, USB legacy support is set to A uto. USB legacy support is used in accessing the B IOS Setup program and[...]

  • Page 69

    Overview of BIO S Features 69 3.9 BIOS Security Features The BIOS includes security features that restrict access to the BIO S Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIO S Setup program and for booting the computer, with the following restrictions: • The supervisor password gives [...]

  • Page 70

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 70[...]

  • Page 71

    71 4 BIOS Setup Program What This Chapter Contains 4.1 Introduction................................................................................................................ 71 4.2 Maintenance Menu .................................................................................................... 72 4.3 Main Menu.............................[...]

  • Page 72

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 72 Table 43 lists the function keys available for menu screens. Table 43. BIOS Setup Program Function Keys BIOS Setup Program Function Key Description < ← > or < → > Selec ts a different menu sc reen < ↑ > or < ↓ > Selects an item <Tab> Selects[...]

  • Page 73

    BIOS Setup Program 73 4.2.1 Extended Confi gur ati on Submenu To access this submenu, select Maintenance on the menu bar, then Extended Configuration . Maintenance Main Advanced Security Power Boot Exit Extended Configuration The submenu represented by Table 45 is for setting system control and video memory cache mode. This submenu becomes availabl[...]

  • Page 74

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 74 4.3 Main Menu To access this menu, select Main on the menu bar at the top of the screen. Maintenance Main Advanced Security Power Boot Exit Table 46 describes the Main menu. This menu reports processor and memory information and is for configuring the system date and system time[...]

  • Page 75

    BIOS Setup Program 75 4.4 Advanced Menu To access this menu, select Advanced on the menu bar at the top of the screen. Maintenance Main Advanced Security Power Boot Exit Boot Configuration Peripheral Configuration IDE Configuration Event Log Configuration Video Configuration Table 47 describes the Advanced menu. This menu is used for setting advanc[...]

  • Page 76

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 76 4.4.1 Boot Confi gur ati on Submenu To access this submenu, select Advanced on the menu bar, then Boot Configuration . Maintenance Main Advanced Security Power Boot Exit Boot Configuration Peripheral Configuration IDE Configuration Event Log Configuration Video Configuration The[...]

  • Page 77

    BIOS Setup Program 77 4.4.2 Per i pher al Configur ati on Submenu To access this submenu, select Advanced on the menu bar, then Peripheral Configuration . Maintenance Main Advanced Security Power Boot Exit Boot Configuration Peripheral Configuration IDE Configuration Event Log Configuration Video Configuration The submenu represented in Table 49 is[...]

  • Page 78

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 78 4.4.3 I DE Confi gur ati on Submenu To access this submenu, select Advanced on the menu bar, then IDE Configuration . Maintenance Main Advanced Security Power Boot Exit Boot Configuration Peripheral Configuration IDE Configuration Primary IDE Master Primary IDE Slave Secondary I[...]

  • Page 79

    BIOS Setup Program 79 4.4.3.1 Primary/Secondary IDE Master/Slave Submenus To access these submenus, select Advanced on the menu bar, then IDE Configuration and then the master or slave to be configured. Maintenance Main Advanced Security Power Boot Exit Boot Configuration Peripheral Configuration IDE Configuration Primary IDE Master Primary IDE Sla[...]

  • Page 80

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 80 Table 51. Primary/Secondary IDE Master/Slave Submenus (continued) Feature Options Description PIO Mode • Auto (default) • 0 • 1 • 2 • 3 • 4 Configures the PIO m ode. Auto sets the PIO m ode to the fastest s peed supported. Ultra DMA • Disabled (default) • Mode 0 [...]

  • Page 81

    BIOS Setup Program 81 4.4.4 Event Log Confi gur ati on To access this menu, select Advanced on the menu bar, then Event Log Configuration . Maintenance Main Advanced Security Power Boot Exit Boot Configuration Peripheral Configuration IDE Configuration Event Log Configuration Video Configuration The submenu represented by Table 52 is used to config[...]

  • Page 82

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 82 4.4.5 Vi deo Configuration To access this menu, select Advanced on the menu bar, then Video Configuration . Maintenance Main Advanced Security Power Boot Exit Boot Configuration Peripheral Configuration IDE Configuration Event Log Configuration Video Configuration The submenu re[...]

  • Page 83

    BIOS Setup Program 83 4.5 Security Menu To access this menu, select Security from the menu bar at the top of the screen. Maintenance Main Advanced Security Power Boot Exit The menu represented by Table 54 is for setting passwords and security features. Table 54. Securit y Menu Feature Options Description Supervisor Pass word Is No options. Reports [...]

  • Page 84

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 84 4.6 Power Menu To access this menu, select Power from the menu bar at the top of the screen. Maintenance Main Advanced Security Power Boot Exit The menu represented in Table 55 is for setting the power management features. Table 55. Pow er Menu Feature Options Description ACPI S[...]

  • Page 85

    BIOS Setup Program 85 4.7 Boot Menu To access this menu, select Boot from the menu bar at the top of the screen. Maintenance Main Advanced Security Power Boot Exit IDE Drive Configuration The menu represented in Table 56 is used to set the boot features and the boot sequence. Table 56. Boot Menu Feature Options Description Quiet Boot • Disabled ?[...]

  • Page 86

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 86 Table 56. Boot Menu (continued) Feature Options Description First Boot Device Second Boot Devic e Third Boot Device Fourth Boot Device • ARMD-FDD (Note 1) • ARMD-HDD (Note 2) • IDE-HDD • ATAPI CDROM • Intel UNDI, PXE 2.0 (Note 3) • Disabled Specifies the boot s equen[...]

  • Page 87

    BIOS Setup Program 87 4.8 Exit Menu To access this menu, select Exit from the menu bar at the top of the screen. Maintenance Main Advanced Security Power Boot Exit The menu represented in Table 57 is for exiting the BIOS Setup program, saving changes, and loading and saving defaults. Table 57. Exit Menu Feature Description Exit Saving Changes Exits[...]

  • Page 88

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 88[...]

  • Page 89

    89 5 Error Messages and Beep Codes What This Chapter Contains 5.1 BIOS Error Messages ................................................................................................ 89 5.2 Port 80h POST C odes ............................................................................................... 91 5.3 Bus In itia liz ation Che ckpoin ts [...]

  • Page 90

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 90 Table 58. BIO S Error Messages (continued) Error Message Explanation Checking NVRAM..... NVRAM is being c hecked to see if it is valid. Update OK! NVRAM was inv alid and has been updated. Updated Failed NVRAM was invalid but was unable to be updated. Keyboard Error Error in the [...]

  • Page 91

    Error Messages and B eep Codes 91 5.2 Port 80h POST Codes During the POST, the BIO S generates diagnostic progress codes (POST-codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. Displaying the POST-codes requires an a[...]

  • Page 92

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 92 Table 61. Runtime Code Uncompressed in F000 Shadow RAM Code Description of PO ST Operation 03 NMI is Disabled. To chec k soft reset/pow er-on. 05 BIOS stack set. G oing to disable cache if any . 06 POST code to be uncompress ed. 07 CPU init and CPU data area init to be done. 08 [...]

  • Page 93

    Error Messages and B eep Codes 93 Table 61. Runtime Code Uncompressed in F000 Shadow RAM (continued) Code Description of PO ST Operation 40 To prepare the descriptor tables. 42 To enter in virtual mode for memory test . 43 To enable interrupts for diagnostics mode. 44 To initialize data to check mem ory wrap around at 0:0. 45 Data initialized. Goin[...]

  • Page 94

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 94 Table 61. Runtime Code Uncompressed in F000 Shadow RAM (continued) Code Description of PO ST Operation 84 Lo ck-key ch e cking over . To ch eck fo r memor y size mi smatch wi th CMOS . 85 Memory size chec k done. To display soft error and check for passw ord or bypass s etup. 86[...]

  • Page 95

    Error Messages and B eep Codes 95 Table 61. Runtime Code Uncompressed in F000 Shadow RAM (continued) Code Description of PO ST Operation AE Uncompress SMBIOS m odule and init SMBIOS code and form the runtime SMBIOS image in shadow. B1 Going to copy any code to spec ific area. 00 Copying of code to specific area done. Going to give control to INT19 [...]

  • Page 96

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 96 Table 64 describes the lower nibble of the high byte and indicates the bus on which the routines are being executed. Table 64. Lower Nibble High Byte Functions Value Description 0 Generic DI M (Devic e Initialization Manager) 1 Onboard system d e vice s 2 ISA devices 3 EISA devi[...]

  • Page 97

    Error Messages and B eep Codes 97 5.5 BIOS Beep Codes Whenever a recoverable error occurs during power-on self-test (POST), the BIO S displays an error message describing the problem (see Table 65). The BIOS also issues a beep code (one long tone followed by two short tones) during POST if the video configuration fails (a faulty video card or no ca[...]

  • Page 98

    Intel Desktop Board D810EMO/MO 810E Technical Product Specification 98[...]