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HP Intel Xeon E5450 manual

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Table of contents for the manual

  • Page 1

    Reference Number: 3186 11 Revision: 001 Quad-Core Intel ® Xeon ® Processor 5400 Series Thermal/Mechanical Design Guidelines November 2007[...]

  • Page 2

    2 Quad-Core Intel® Xeon® Processor 5400 Series TMDG IINFORMA TION IN THIS DOCUMENT IS PR OVIDED IN CONNECTION WITH INTEL® PRODUCTS . NO LICENSE, EXPRES S OR IMPLIED, BY EST OPPEL OR OTHERWISE, T O ANY INTELLECTUAL PROPER TY RIGHT S IS GRANTED BY THIS DOCUMENT . EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDIT IONS OF SALE FOR SUCH PR ODUCTS, [...]

  • Page 3

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 3 Contents 1I n t r o d u c t i o n ......... ......... ........ ........... ........ ........... ........ ........ ........... ........ ........... ........ 9 1.1 Objective .......... ......... .......... ......... .......... ......... ........ ........... ........ ........... ........ .... 9 1.2[...]

  • Page 4

    4 Quad-Core Intel® Xeon® Processor 5400 Series TMDG D Safety Requirements .............. ........ ........... ........ ......... .......... ......... .......... ......... ........89 E Quality and Reliab ility Requirements .. ........ ........... ........ ........ ........... ........ ........... .... 91 E.1 Intel Verification Criteria for the Ref[...]

  • Page 5

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 5 B-5 CEK Sp ring (Sheet 1 of 3) ................... ........ ........... ........... ........ ........... ........ ...... 62 B-6 CEK Sp ring (Sheet 2 of 3) ................... ........ ........... ........... ........ ........... ........ ...... 63 B-7 CEK Sp ring (Sheet 3 of 3) .................[...]

  • Page 6

    6 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Tables 1-1 Referen ce Documents... .......... ......... .......... ......... .......... ......... .......... ......... .......... . 9 1-2 Terms and Descriptions ...... ........... .......... ........... ........ ........... .......... ......... ..........10 2-1 Processor Mechanical Parameters Ta[...]

  • Page 7

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 7 Revision History § Reference Number Revision Number Description Date 318611 001 Initial release of the document. November 2007[...]

  • Page 8

    8 Quad-Core Intel® Xeon® Processor 5400 Series TMDG[...]

  • Page 9

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 9 Introduction 1 Introduction 1.1 Objective The purpose of this guide is to describe the reference thermal solution and design parameters required for the Quad-Core Intel® Xeon® Processor 5400 Series. It is also the intent of this document to comprehend and demonstr ate the processor cooling sol[...]

  • Page 10

    Introduction 10 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Note: C ontact your Intel field sales representativ e for the latest revisi on and or der number of this d ocument. 1.4 Definition of Terms Clovertown_Harper town_Wolfdale-DP Processor Enabled C omponents CEK Thermal Models (in Flotherm* and Icepak*) Av ailable electronically Clove[...]

  • Page 11

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 11 Introduction § T CONTROL A processor uni que value for use in fan speed control me chanisms. T CONTROL is a temperature specification based o n a temperature reading from the p rocessor ’s Digital Thermal Sensor . T CONTROL can be descr ibed as a trigge r point for fan speed contro l impleme[...]

  • Page 12

    Introduction 12 Quad-Core Intel® Xeon® Processor 5400 Series TMDG[...]

  • Page 13

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 13 Thermal/Mechanical Reference Design 2 Thermal/Mechanical Reference Design This chapter describes the thermal/mechanic al reference design for Quad-Core Intel® X eon® Processor 5400 Series. Both Quad-Cor e Intel® Xeon® Processor X5400 Series and Quad-Core Intel® X eon® Processor E5400 Seri[...]

  • Page 14

    Thermal/Mechanical Reference Design 14 Quad-Core Intel® Xeon® Processor 5400 Series TMDG 2.1.2 Quad-Core Intel® Xeon® Processor 5400 Series Package The Quad-Core Intel® X eon® Processor 5400 Series is packaged using the flip-chip land grid array (FC -LGA) package technology . Please refer to the Quad-Core Intel® Xeon® Processor 5400 Series [...]

  • Page 15

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 15 Thermal/Mechanical Reference Design Note: Guidelines on pote ntial IHS flatness variat ion with so cket load plate actuation and ins tallation of the cooling solution are available in the processor Therma l/Mechanical Design Guidelines. Figure 2-1. Quad-Core Intel® Xeon® Processor 5400 Series[...]

  • Page 16

    Thermal/Mechanical Reference Design 16 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure 2-2. Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (2 of 3)[...]

  • Page 17

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 17 Thermal/Mechanical Reference Design Note: The optional dimple packing marking highlighted by Detail F from the ab ove dr awing may only be found on initial processors. Figure 2-3. Quad-Core Intel® Xeon® Processor 5400 Series Mechanic al Drawing (3 of 3)[...]

  • Page 18

    Thermal/Mechanical Reference Design 18 Quad-Core Intel® Xeon® Processor 5400 Series TMDG The package includes an integr ated heat spreader (IHS). The IHS tr ansfers the non- uniform heat from the die to the top of the IHS, out of which th e heat flux is more uniform and spreads over a larger surface area (not the entire IHS area). This allows mor[...]

  • Page 19

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 19 Thermal/Mechanical Reference Design A potential mechanical solution for heavy heatsinks is th e direct attachment of the heatsink to the chassis pan. In this case, the strength of the chassis pan can be utilized rather than solely relying on the basebo ard strength. In addition to the general g[...]

  • Page 20

    Thermal/Mechanical Reference Design 20 Quad-Core Intel® Xeon® Processor 5400 Series TMDG processor operating frequency (via the bus multiplier) and input v oltage (via the VID signals). Please refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for further details on TM and TM2. PROCHO T# is designed to assert at or a few degree[...]

  • Page 21

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 21 Thermal/Mechanical Reference Design smaller foot print and decreased sensitivity to noise. These D TS benefits will result in more accurate fan speed control and T CC ac tivation.Th e DTS app lication in fan speed control will be discussed in more detail in Section 2.4 .1 . 2.2.3 Platform Envir[...]

  • Page 22

    Thermal/Mechanical Reference Design 22 Quad-Core Intel® Xeon® Processor 5400 Series TMDG 2.2.4.2 Thermal Mo nitor fo r Multiple Core Products The thermal management for multiple core products has only one T CONTROL val ue p er processor . The T CONTROL for processor 0 and T CONTROL for processor 1 are independent from each other . If the D TS tem[...]

  • Page 23

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 23 Thermal/Mechanical Reference Design Figure 2-6. Processor Core Geometric Center Locations X1 , X2, X3 , X4 Y X Y2 Y3 Y4 Y1 Cor e1 Cor e2 Cor e3 Cor e4 X1 , X2, X3 , X4 Y X Y2 Y3 Y4 Y1 Cor e1 Cor e2 Cor e3 Cor e4 Table 2-3. Processor Core Geometric Center Dimensions Feature X Dimension Y Dimensi[...]

  • Page 24

    Thermal/Mechanical Reference Design 24 Quad-Core Intel® Xeon® Processor 5400 Series TMDG 2.2.5 Thermal Profile The thermal profile is a line that defines the relationship between a processor’ s case temperature and its power consumption as shown in Figure 2-7 . The equation of the thermal profile is defined as: Equation 2-1.y = ax + b Where: y [...]

  • Page 25

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 25 Thermal/Mechanical Reference Design above, the case-to-ambient resistance represents the slope of the line and the processor local ambient temperature represents the y- axis intercept. Hence the T CASE_MAX value of a specific solution can be ca lculated at TDP . Once this point is determined, t[...]

  • Page 26

    Thermal/Mechanical Reference Design 26 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure 2-9 depicts the interaction between the Thermal Profile a nd T CONTROL . If the D TS temperature is less than T CONTROL , then the case temp erature is permitted to exceed the Thermal Profile, but the D TS temper ature must remain at or below T CONTROL[...]

  • Page 27

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 27 Thermal/Mechanical Reference Design The Thermal Profile A is based on Intel’ s 2U+ air cooling solution. Designing to Thermal Profile A ensures that no measurable performance loss due to Thermal Control Circuit (TCC) activ ation is observed in the processo r . It is expected that TCC would on[...]

  • Page 28

    Thermal/Mechanical Reference Design 28 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet or Section 2.2.8 for the Thermal Profile A and Th ermal Profile B specifications . Section 2.5 of this document also provides details on the 2U+ and 1U Intel reference thermal solutions tha[...]

  • Page 29

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 29 Thermal/Mechanical Reference Design Notes: 1. The The thermal spec ifications shown in this graph ar e for Quad-Core Intel® Xeon ® Processor X5400 Series exc ept the Quad-Co re Intel® Xeon® P rocessor X548 2 sku . 2. Refer to th e Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for[...]

  • Page 30

    Thermal/Mechanical Reference Design 30 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Note: The thermal spe cifications sh own in this gr aph are for reference only . R efer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for the Thermal Profile specificat ions. In case of conflict, the data information in the datasheet superse[...]

  • Page 31

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 31 Thermal/Mechanical Reference Design Ta b l e 2 - 4 and Ta b l e 2 - 5 describe the thermal performance target for the Quad-Core Intel® Xeon® Processor 5400 Series cooling solution enabled by Intel. Figure 2-13. Thermal Profile for Quad-Core Intel® Xeon ® Processor X5482 Series T h er ma l P[...]

  • Page 32

    Thermal/Mechanical Reference Design 32 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Note: Intel does not enable refere nce heat sink for the Quad-Core Intel® Xeon® Processor X5482 with 150W TDP. The Intel 2U CEK is capable of meeting the thermal specification when local ambient temperature (T LA ) is maintained at or below 35 ° C. 2.3 Fan[...]

  • Page 33

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 33 Thermal/Mechanical Reference Design 2.4 Characterizing Cooling Solution Performance Requirements 2.4.1 Fan Speed Control F an speed control (FSC) techniques to reduce system level acoustic noise are a common pr actice in server designs. The fan speed is one of the par ameters that determine the[...]

  • Page 34

    Thermal/Mechanical Reference Design 34 Quad-Core Intel® Xeon® Processor 5400 Series TMDG There are many different ways of implementi ng fan speed control, including FSC based on processor ambient temperature, FSC based on processor Digital Thermal Sensor (DT S) temperature or a combination of the tw o. If FSC is based only on the processor ambien[...]

  • Page 35

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 35 Thermal/Mechanical Reference Design The case-to-local ambient thermal characterization parameter of the processor , Ψ CA , is comprised of Ψ CS , the TIM thermal char acterization parameter , and of Ψ SA , the sink -to- local ambient thermal characterization parameter: Equation 2-4. Ψ CA = [...]

  • Page 36

    Thermal/Mechanical Reference Design 36 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Assume the datasheet TDP is 85 W and the case temperature specification is 68 °C. Assume as well that the system airflow has be en designed such that the local processor ambient temperature is 45°C. Then the following could be calculated using equation (2-3[...]

  • Page 37

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 37 Thermal/Mechanical Reference Design T o develop a reliable, cost-effectiv e thermal solution, thermal char acterization and simulation should be carried out at the enti re system level, accounting for the thermal requirements of each component. In additi on, acoustic noise constraints may limit[...]

  • Page 38

    Thermal/Mechanical Reference Design 38 Quad-Core Intel® Xeon® Processor 5400 Series TMDG 2.5.2 Thermal Interface Material TIM application between the processor IHS and the heatsink base is generally required to improve thermal conduction from the IHS to the heatsink. Many therm al interface materials can be pre-applied to the heatsink base prior [...]

  • Page 39

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 39 Thermal/Mechanical Reference Design 2.5.4 Assembly Overview of the Intel Refe rence Thermal Mechanical De sign The reference design heatsinks that meet the Quad-Core Intel® X eon® Processor 5400 Series thermal performance targets ar e called the Common Enabling Kit (CEK) heatsinks, and are av[...]

  • Page 40

    Thermal/Mechanical Reference Design 40 Quad-Core Intel® Xeon® Processor 5400 Series TMDG The CEK reference thermal solution is design ed to extend air-cooling capability through the use of larger heatsinks with minimal airflow blockage and bypass. CEK retention solution can allow the use of much heavier heatsink masses compared to the legacy limi[...]

  • Page 41

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 41 Thermal/Mechanical Reference Design CEK, are now commonly using direct chas sis attach (DCA) as the mechanical retention design. The mass of the new thermal solution s is large enough to require consideration for structural support and stiffening on the ch assis. 2.5.5 Thermal Solution Performa[...]

  • Page 42

    Thermal/Mechanical Reference Design 42 Quad-Core Intel® Xeon® Processor 5400 Series TMDG 2.5.6 Thermal Profile Adherence The 2U+ CEK Intel reference thermal solution is designed to meet the Th ermal Profile A for the Quad-Core Intel® X eon® Processor 5400 Series. From Ta b l e 2 - 4 , the three- sigma (mean+3sigma) performance of the thermal so[...]

  • Page 43

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 43 Thermal/Mechanical Reference Design The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile B for the Quad-Core Intel® Xeon® Processor X5400 Series. From Ta b l e 2 - 7 the three- sigma (mean+3sigma) performance of the thermal solution is computed to be 0.246°C/W [...]

  • Page 44

    Thermal/Mechanical Reference Design 44 Quad-Core Intel® Xeon® Processor 5400 Series TMDG The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile specification for the Quad-Core Intel® Xeon® Processor E5400 Series. From Ta b l e 2 - 7 the three-sigma (mean+3sigma) performance of the thermal solution is computed to be [...]

  • Page 45

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 45 Thermal/Mechanical Reference Design Note: Intel has also developed an 1U alternat ive reference he atsink design. This alternative heatsink design meets the thermal profile specifications of the Quad-Core Intel® Xeon® Proces sor E5400 Series and off ers the advantages of weight reduction and [...]

  • Page 46

    Thermal/Mechanical Reference Design 46 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Note: Re f e r t o Appendix B for more detailed mechanical drawings of the heatsink. . Note: Re f e r t o Appendix B for more detailed mechanical drawings of the heatsink. The function of the standoffs is to provide a bridge between the chassis and the heatsi[...]

  • Page 47

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 47 Thermal/Mechanical Reference Design Although the CEK heatsink fits into the legacy volumetric k eep-in, it has a larger footprint due to the elimination of retent ion mechanism and clips used in the older enabled thermal/mechanical components. This allows the heatsink to grow its base and fin d[...]

  • Page 48

    Thermal/Mechanical Reference Design 48 Quad-Core Intel® Xeon® Processor 5400 Series TMDG 2.5.7.3 CEK Sp ring The CEK spring, which is attached on the se condary side of the baseboard, is made from 0.80 mm [0.0315 in.] thick 301 stainless steel half hard. Any future versions of the spring will be made from a similar material. The CEK spring has fo[...]

  • Page 49

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 49 Thermal/Mechanical Reference Design 2.5.8 Boxed Active Thermal Solu tion for the Quad-Core Intel® Xeon® Processor 5400 Series Th ermal Profile Intel will provide a 2U passive and a 1U passiv e/active heatsink solution for bo xed Quad-Core Intel® Xeon® Processor 5400 Series. This active heat[...]

  • Page 50

    Thermal/Mechanical Reference Design 50 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Clear ance is required around the heats ink to en sure unimpeded airflow for proper cooling. The physical baseboard keepout requ irements for the active solution are the same as the passive CEK solution shown in Appendix B . Refer to Figure B-18 through Figur[...]

  • Page 51

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 51 Thermal/Mechanical Reference Design 2.5.8.2 Systems Considerations Associated with the Active CEK This heatsink was designed to help pedestal chassis users to meet the processor thermal requirements without the use of chassis ducting. It may be necessary to implement some form of chassis air gu[...]

  • Page 52

    Thermal/Mechanical Reference Design 52 Quad-Core Intel® Xeon® Processor 5400 Series TMDG The other items listed in Figure 2-16 that are required to complete this solution will be shipped with either the chassis or boards. They are as follows: • CEK Spring (supplied by base board vendors) • Heatsink standoffs (supplied by chassis vendors) §[...]

  • Page 53

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 53 1U Alternative Heatsink Thermal/Mechanical D esign A1 U A l t e r n a t i v e H e a t s i n k Thermal/Mechanical Design Intel has also developed an 1U alternat iv e reference heatsink design for the volumetrically constr ained form factor and targeted for the rack -optimized and ultra dense SKU[...]

  • Page 54

    1U Alternative Heatsink Thermal/Mechanical Design 54 Quad-Core Intel® Xeon® Processor 5400 Series TMDG A.2 Thermal Solution Performance Characterics Figure A-2 s hows the performance of the 1U altern ative heatsink. This figure shows the thermal performance and the pressure drop through fins of the heatsink versus the airflow pro vided. The best [...]

  • Page 55

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 55 1U Alternative Heatsink Thermal/Mechanical D esign x = Processor pow er value (W) Figure A-3 below shows the comparison of this reference thermal solution’ s Thermal Profile to the Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile specification. The 1U alternative solution meets[...]

  • Page 56

    1U Alternative Heatsink Thermal/Mechanical Design 56 Quad-Core Intel® Xeon® Processor 5400 Series TMDG[...]

  • Page 57

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 57 Mechanical Drawings B Mechanical Drawings The mechanical drawings included in this appendix refer to the thermal mechanical enabling components for the Quad-Core Intel® Xeon® Processor 5400 Series. Note: Intel reserves the right to mak e changes and modifications to the design as necessary . [...]

  • Page 58

    Mechanical Drawings 58 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-1. 2U CEK Heatsink (Sheet 1 of 4)[...]

  • Page 59

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 59 Mechanical Drawings Figure B-2. 2U CEK Heatsink (Sheet 2 of 4)[...]

  • Page 60

    Mechanical Drawings 60 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-3. 2U CEK Heatsink (Sheet 3 of 4)[...]

  • Page 61

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 61 Mechanical Drawings Figure B-4. 2U CEK Heatsink (Sheet 4 of 4)[...]

  • Page 62

    Mechanical Drawings 62 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-5. CEK Spring (She et 1 of 3)[...]

  • Page 63

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 63 Mechanical Drawings Figure B-6. CEK Spring (Sheet 2 of 3)[...]

  • Page 64

    Mechanical Drawings 64 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-7. CEK Spring (She et 3 of 3)[...]

  • Page 65

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 65 Mechanical Drawings Figure B-8. Baseboard Keep out Footprint Definition and Height Restrictions for Enabling Components (Sheet 1 of 6)[...]

  • Page 66

    Mechanical Drawings 66 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-9. Baseboard Keep out Footprint Definition an d Height Restrictions for Enabling Components (Sheet 2 of 6)[...]

  • Page 67

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 67 Mechanical Drawings Figure B-10. Baseboard Keep out Footprint Definition and Height Restrictio ns for Enabling Components (Sheet 3 of 6)[...]

  • Page 68

    Mechanical Drawings 68 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-11. Baseboard Keep out Footprint Definition an d Height Restrictions for Enabling Components (Sheet 4 of 6)[...]

  • Page 69

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 69 Mechanical Drawings Figure B-12. Baseboard Keep out Footprint Definition and Height Restrictio ns for Enabling Components (Sheet 5 of 6)[...]

  • Page 70

    Mechanical Drawings 70 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-13. Baseboard Keep out Footprint Definition an d Height Restrictions for Enabling Components (Sheet 6 of 6)[...]

  • Page 71

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 71 Mechanical Drawings Figure B-14. 1U CEK Heatsink (Sheet 1 of 4 )[...]

  • Page 72

    Mechanical Drawings 72 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-15. 1U CEK Heatsink (Sheet 2 of 4)[...]

  • Page 73

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 73 Mechanical Drawings Figure B-16. 1U CEK Heatsink (Sheet 3 of 4 )[...]

  • Page 74

    Mechanical Drawings 74 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-17. 1U CEK Heatsink (Sheet 4 of 4)[...]

  • Page 75

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 75 Mechanical Drawings Figure B-18. Acti ve CEK Thermal So lution Volumetric (Sheet 1 of 3)[...]

  • Page 76

    Mechanical Drawings 76 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-19. Active CEK Thermal So lution Volumetric (Sheet 2 of 3)[...]

  • Page 77

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 77 Mechanical Drawings Figure B-20. Acti ve CEK Thermal So lution Volumetric (Sheet 3 of 3)[...]

  • Page 78

    Mechanical Drawings 78 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-21. 1U Alternati ve Heatsink (1 of 4)[...]

  • Page 79

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 79 Mechanical Drawings Figure B-22. 1U Altern ative Heatsink (2 of 4)[...]

  • Page 80

    Mechanical Drawings 80 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-23. 1U Alternati ve Heatsink (3 of 4)[...]

  • Page 81

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 81 Mechanical Drawings Figure B-24. 1U Altern ative Heatsink (4 of 4)[...]

  • Page 82

    Mechanical Drawings 82 Quad-Core Intel® Xeon® Processor 5400 Series TMDG §[...]

  • Page 83

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 83 Heatsink Clip Load Methodology C Heatsink Clip Load Methodology C.1 Overview This section describes a procedure for measuring the load applied by the heatsink/clip/ fastener assembly on a processor package. This procedure is recommended to verify the preload is within the design target range fo[...]

  • Page 84

    Heatsink Clip Load Methodology 84 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Alternate Heatsink Sample Preparation As just mentioned, making sure that the load cells have minimum protrusion out of the heatsink base is paramount to meaningful re sults. An alternate method to make sure that the test setup will measure loads representative of[...]

  • Page 85

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 85 Heatsink Clip Load Methodology Figure C-2. Load Cell Installation in Ma chined Heatsink Base Pocket - Side Vi ew Figure C-3. Preload Test Configuration Wax to mainta in loa d cell in position during heatsink installation Height of pocket ~ height of select ed load cel l Wax to mainta in loa d c[...]

  • Page 86

    Heatsink Clip Load Methodology 86 Quad-Core Intel® Xeon® Processor 5400 Series TMDG C.2.2 Typical Test Equipment For the heatsink clip load measurement, use equiv alent test equipment to the one listed Ta b l e C - 1 . Notes: 1. Select load range depending on expect ed load level. It is usually better , whenever poss ible, t o operat e in the hig[...]

  • Page 87

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 87 Heatsink Clip Load Methodology (often on the order of 3 minut es). The time zero reading should be taken at the end of this settling time. 5. Record th e preload measurement (total from all three load cells) at the target time and average the v alues over 10 seconds around this target time as w[...]

  • Page 88

    Heatsink Clip Load Methodology 88 Quad-Core Intel® Xeon® Processor 5400 Series TMDG[...]

  • Page 89

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 89 Safety Requirements D S afety Requirements Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet the safety standards: 1. UL Recognition- approved for flammabilit y at the system level. All mechanical and thermal enabling components must be a minimum UL9[...]

  • Page 90

    Safety Requirements 90 Quad-Core Intel® Xeon® Processor 5400 Series TMDG[...]

  • Page 91

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 91 Quality and Reliability Requirements E Quality and Reliability Requirements E.1 Intel Verification Criteria for the Reference Designs E.1.1 Reference Heatsink Thermal Ve rification The Intel reference heatsinks will be verified within specific bounda ry conditions using a T TV and the methodolo[...]

  • Page 92

    Quality and Reliability Requirements 92 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Note: In the case of a discrepancy , information in the mo st recent LGA771 Socket Mechanical Design Guidelines supersedes that in the T able E-1 above. E.1.2.2 Recommended Test Sequence Each test sequence should start with components (i.e. baseboard, heatsi[...]

  • Page 93

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 93 Quality and Reliability Requirements 3. No signs of physical damage on baseboard surface due to impact of heatsink. 4. No visible physical damage to the processor package. 5. Successful BIOS/Processor/memory test of post-test samples. 6. Thermal compliance testing to demonstrate that the case t[...]

  • Page 94

    Quality and Reliability Requirements 94 Quad-Core Intel® Xeon® Processor 5400 Series TMDG[...]

  • Page 95

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 95 Enabled Suppliers Information FE n a b l e d S u p p l i e r s Information F.1 Supplier Information F.1.1 Intel Enabled Suppliers The Intel reference enabling solution fo r Quad-Core Intel® Xe on® Processor 5400 Series is preliminary . The Intel reference so lutions have not been verified to [...]

  • Page 96

    Enabled Suppliers Information 96 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Note: CEK771-02-1U is the 1U alte rnative reference heatsi nk design for Quad-Core Intel® X e on® Processor E5400 Series in volumetrically constr ained form factors. F.1.2 Additional Suppliers The Intel enabled solutions for Quad-Core Intel® X eon® Proces sor 5[...]

  • Page 97

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 97 Enabled Suppliers Information Table F-2. Additional Suppliers for the Qu ad-Core Intel® Xeon® Processor 5400 Series Intel Reference Solution (Sheet 1 of 2) Assembly Component Description Development Suppliers Supplier Contact Info 2U Heatsink Alternative CEK Heatsink Copper Fin, Copper Base A[...]

  • Page 98

    Enabled Suppliers Information 98 Quad-Core Intel® Xeon® Processor 5400 Series TMDG 1U Heatsink Alternative CEK Heatsink Copper Fi n, Copper Base Aavid Thermalloy CNDA#2525071 David Huang huang@aavid.com 603-223-1724 Frank Hsue frank.hsu@aa vid.com.tw 886-2-26989888 x306 Copper Fi n, Copper Base - and - Aluminum ADDA CNDA# AP1249 Jungpin Chen jung[...]

  • Page 99

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 99 Enabled Suppliers Information §[...]

  • Page 100

    Enabled Suppliers Information 100 Quad-Core Intel® Xeon® Processor 5400 Series TMDG[...]