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HP (Hewlett-Packard) BL465c G7 manual

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Table of contents for the manual

  • Page 1

    HP Pr oL i ant BL4 6 5c G7 Serv er B lade Maintenance an d Se r v i ce Guide Part Num ber 594690 - 001 June 2010 (Fi rst Editio n)[...]

  • Page 2

    © Copyright 2010 Hewlett - Packar d Developm ent Comp any, L.P . The i nformation cont aine d herein is subject to chan ge with out not ice. The on ly warr anties for HP produc ts and servic es ar e set fort h in the ex pre ss warran ty statem ents accom panying such pr oduct s and services . N othin g herein sh ould be construe d as const i tut i[...]

  • Page 3

    C ontents Customer self repair ...................................................................................................................... 5 Parts o nly warr anty service ............................................................................................................................ 5 Illustrated parts catalog ...............[...]

  • Page 4

    Exter nal U SB functio nality ................................................................................................................. 50 Intern al SD suppo rt ..................................................................................................................................... 50 Component identification ...................[...]

  • Page 5

    Customer self repair 5 C us tomer self r epair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing de f ective parts replacement. If during the diagnosis period HP (or HP service providers o r service p artners) identi fies that the repai r can be acc omplished [...]

  • Page 6

    Customer self repair 6 Obligatoire - Pièc es pour lesquelles l a réparation p ar le client est obliga toire. Si vous demandez à HP de remplacer c es pièces, les c oûts de déplacement et main d'œuvre du service vous ser ont factu rés. Facultatif - Pièces pour lesquelles la réparation par le client est facu ltative. Ces pièces son t ?[...]

  • Page 7

    Customer self repair 7 NOTA: alc uni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illu strato dei c omponenti. In base alla disponibilità e al[...]

  • Page 8

    Customer self repair 8 anrufen und sich von einem Mitarbeite r per Telefon helf en lassen. Den Mat erialien, die mit einem C SR - Ersatzteil gelief ert werden, k önnen Sie entn ehmen, ob das def ekte Teil an HP zurü ckgeschic kt werden muss. Wen n es erforderlic h ist, das defekte Teil a n HP zurückzu schicken , müssen Sie dies inn erhalb eines[...]

  • Page 9

    Customer self repair 9 Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales par a la sustituc ión de compo nentes CSR, HP especi ficará si lo s componentes defec tuosos deberán devol verse a HP. En aqu ellos casos en los que sea necesario devolver algún component e a HP, deberá[...]

  • Page 10

    Customer self repair 10 bijbehoren de document atie worden gereto urneerd in het m eegeleverde verpa kkings materia al. Als u het defecte onderdeel niet terugze ndt, kan HP u voor het ve rvangende onderdeel kosten in rekening breng en. Bij reparatie d oor de klant betaalt HP a lle verzendkost en voor het vervang ende en geret ourneerde onderdeel en[...]

  • Page 11

    Customer self repair 11 Se r v iço de gar antia a penas par a peças A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma taxa. No caso desse serviç o, a substit uição de peç as CSR é obrigatóri[...]

  • Page 12

    Customer self repair 12[...]

  • Page 13

    Customer self repair 13[...]

  • Page 14

    Customer self repair 14[...]

  • Page 15

    Customer self repair 15[...]

  • Page 16

    Illustrated parts catalog 16 Illus tr ated p ar ts catalo g S erver blade c omponents Item Description Spare part numbe r Custom e r self repair (on page 5 ) 1 System board a ssembly 598247 - 001 Mandatory 1 2 DIMMs — — a) 8 - GB, dual - ran k, PC3 - 1060 0, regis tered 595097 - 001 Mandatory 1 b) 4 - GB, dual - ran k, PC3 - 1060 0, regis tered[...]

  • Page 17

    Illustrated parts catalog 17 a) Processor 1 598248 - 001 Opti onal 2 b) Processor 2* 598249 - 001 Opti onal 2 4 Processors — — a) 2.4 - GHz AMD O pteron™ Mode l 6136** 583753 - 001 Opti onal 2 b) 2.3 - GHz AMD O pteron™ Mode l 6134* ** 583752 - 001 Optional 2 c) 2.2 - GHz AMD Opteron™ Model 6174* ** 598729 - 001 Optional 2 d) 2.1 - GHz AM[...]

  • Page 18

    Illustrated parts catalog 18 b) QLog ic QMH2462 4Gb FC HBA for H P c - Class BladeSystem* 405920 - 001 Mandatory 1 c) Emule x LPe1205 - HP 8Gb F C HBA for HP c - Class BladeSystem* 456978 - 001 Mandatory 1 d) QLog ic QMH2562 8Gb FC HBA for H P c - Class BladeSystem* 455869 - 001 Mandatory 1 15 Ethernet mezzanine card options — — a) HP NC325m PC[...]

  • Page 19

    Illustrated parts catalog 19 *Not shown **Do not m ix processors with different model number s, speeds, cache sizes, or power consu mption. 1 Mandatory — Parts for which customer self repair is manda tory. If you r equest HP to replace these parts, you will be charged f or the travel and labor cost s of this se rv ice. 2 Option al — Parts for w[...]

  • Page 20

    Illustrated parts catalog 20 3 No: Nee — Sommige HP onderdelen zijn niet ontwikkeld voor r eparatie door de klant. In verband met de garantiev oorwaarden moet het on derdeel d oor een geautoriseerde Service Partner worden vervangen. Deze onderdelen worden in de geïllustr eerde onderdelencatalo gus aangemerkt met "Nee". 1 Mandatory: Obr[...]

  • Page 21

    Remov al and replac ement procedures 21 R emo v al and r epla cement pr ocedu r es R equired tool s You need the fo llowing items f or some proc edures: • T- 15 Torx screwdr iver (provid ed inside the acc ess panel) • HP Insight Diagnostics software (" HP Insight Diagnos tics " on page 48 ) S afety consi derations Before perfor ming s[...]

  • Page 22

    Remov al and replac ement procedures 22 S ymbols on eq uipment The following symbols may be placed on equipment to indicate the presen ce of potentially ha zardous conditions. This symbol in dicates the presenc e of hazardo us energy circu its or electric shoc k haz ards. Refer all servicing to qualified pers onnel. WARNING: To reduce the risk of i[...]

  • Page 23

    Remov al and replac ement procedures 23 This method initiates a controlled remote shutdown of applications and the OS before the server blade enter standby mode. • Press and release the Power On/Standby button. This method initiates a controlled shutdown of applic ations and the OS before the server blade e nter standby mode. • Press and hold t[...]

  • Page 24

    Remov al and replac ement procedures 24 3. Remove the server b lade. 4. Place the server bl ade on a flat, level work surfac e. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system c omponents to cool before to uching them. CAUTION: To prevent dam age to electrical components, properly ground th[...]

  • Page 25

    Remov al and replac ement procedures 25 H ard drive b lank CAUTION: To prevent improper co oling and thermal damage, do not operate the server blade or the enclosure unless all hard drive and device bays are populated with either a component or a blank. Remove the com ponent as indi ca ted. To replace the blank, slide t he blank into the bay until [...]

  • Page 26

    Remov al and replac ement procedures 26 b. Release the hard driv e tra y, slide it forward until it lo c ks, and then press hard d rive carrier 1 down to access hard drive 2. c. Remove hard drive 2. To replace th e componen t, reverse the removal pr ocedure. D IMM baffle CAUTION: To avoid damag e to th e server blade and the enclosure, install all [...]

  • Page 27

    Remov al and replac ement procedures 27 3. Remove the acc ess panel (" Ac cess panel " on page 24 ). 4. Disconnect the cables, and then re move the DIMM baffle. To replace th e componen t, reverse the removal pr ocedure. DIMMs To remove the c omponent: 1. Power down th e server blade (on page 22 ). 2. Remove the server b lade (on page 23 [...]

  • Page 28

    Remov al and replac ement procedures 28 H P Smart Ar ray Co ntroll er To remove the c omponent: 1. Power dow n the server blade (on page 22 ). 2. Remove the server b lade (on page 23 ). 3. Remove the acc ess panel (" Ac cess panel " on page 24 ). 4. Disconnec t the cables, an d then remove the DIMM baff le. 5. Remove the HP S mart Array C[...]

  • Page 29

    Remov al and replac emen t proce dures 29 M ezzanine card Optional mezzanine cards enable network connectivity or provide Fibre Channel support. For mezz anine card loc ations, see the system board co mponents (on page 53 ). Because mezzani ne cards a re supported on multip le server blade models, the m ezzanine c ard may have captive screws that a[...]

  • Page 30

    Remov al and replac ement procedures 30 1. Install the mezzanine card. Press dow n on the connector to seat the board. 2. Install the ac cess panel (" Acc ess panel " on page 24 ). C ache module capaci tor pack To remove the c omponent: 1. Power down th e server blade (on page 22 ). 2. Remove the server b lade (on page 23 ). 3. Remove the[...]

  • Page 31

    Remov al and replac ement procedures 31 F ront pane l/hard drive cage assembly To remove the c omponent: 1. Power down th e server blade (on page 22 ). 2. Remove the server b lade (on page 23 ). 3. Remove the acc ess panel (" Ac cess panel " on page 24 ). 4. Remove all hard drive blanks (" Hard drive blank " on page 25 ). 5. Rem[...]

  • Page 32

    Remov al and replac ement procedures 32 7. Remove the heatsink. To replace the component: 1. Clean the old th ermal grease from the processor with the alc ohol swab. Allow the alcohol to evaporate before continuing. CAUTION: The heatsink the rmal interface media is not reusable and must be replaced if t he heatsink is rem oved from the pro cessor a[...]

  • Page 33

    Remov al and replac ement procedures 33 3. Remove the thermal interface media pro tective cover. 4. Align and install the heatsink. Alte rnate tightening the screws until the heats ink is seated properly. 5. Install the ac cess panel (" Acc ess panel " on page 24 ). Processor WARNING: To reduce the risk of p e rsonal injury from h ot surf[...]

  • Page 34

    Remov al and replac ement procedures 34 IMPO RTANT: P rocessor so cket 1 must always be po pulated. If processor so cket 1 is empty, t he server blade does no t power u p. To remove the c omponent: 1. Power down th e server blade (on page 22 ). 2. Remove the server b lade (on page 23 ). 3. Remove all hard drive blanks (" Hard drive b lank &quo[...]

  • Page 35

    Remov al and replac ement procedures 35 9. Using your fi ngers, remove the fa iled processo r. To replace the component: CAUTION : The pi ns on the processor so cket are very fragile. Any damage to them m ay require replacing the system board. CAUTION: Failure to completely open the processor locking lev er prevents the processor fr om seating duri[...]

  • Page 36

    Remov al and replac ement pr ocedures 36 CAUTION: The pr ocessor is desi gned to fit one wa y into the socket. Use the alignment gui des on the processor and socket to properly align the processor with the socket. 3. Press down firmly until the p rocessor installation tool clicks and s eparates from the processor, and then remove the processor inst[...]

  • Page 37

    Remov al and replac ement procedures 37 4. Close the processor retaining bracket and the processor retaining latch. 5. Clean the old thermal grease from the hea tsink with the alcohol swab . Allow the alcohol to evaporate before continuing. 6. Apply all the grease to the top of the process or in one of the following patte rns to ensure ev en distri[...]

  • Page 38

    Remov al and replac ement procedures 38 7. Align and install the heatsink. Alte rnate tightening the screws until the heats ink is seated properly. 8. Install the ac cess panel (" Acc ess panel " on page 24 ). S ystem boar d To remove the c omponent: 1. Power down th e server blade (on page 22 ). 2. Remove the s erver blade (on page 23 ).[...]

  • Page 39

    Remov al and replac ement procedures 39 12 . Open the processor retaining latch and the processor socket retaining bracket. 13 . Using the too l, remove the pro cessor from the failed system boa rd. CAUTION: To avoid damag e to the system board: • Do not touch the processor socket contacts. • Always install the pr ocessor socket cover a fter re[...]

  • Page 40

    Remov al and replac ement procedures 40 1. Remove the proc essor socke t protective c over. 2. Install the pro cessor soc ket cover onto the pro cessor socket of the failed system board. 3. Install the processor on the spare system board. CAUTION: The pr ocessor is desi gned to fit one wa y into the socket. Use the alignment gui des on the proc ess[...]

  • Page 41

    Remov al and replac ement procedures 41 4. Close the processor retaining latch and the processor socket retaining bracket. 5. Clean the old thermal grease from the hea tsink and the top of the pro cessor with the alco h ol swab. Allow the alcohol to evaporate before continuing. 6. Apply all the greas e to the top of the processor in one o f the fol[...]

  • Page 42

    Remov al and replac ement procedures 42 10 . Install the hard drives (" H ard drive " on page 25 ). IMPO RTANT: To avoid damage to the server blade, support the riser board when installing the TPM board and rivet. 11 . If necessary, install the TPM module. For more information, se e the HP ProLia nt BL465c G7 Ser ver Blade User Guide . 12[...]

  • Page 43

    Remov al and replac ement proced ures 43 WARNING: The co mputer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury: • Do not attempt to recharge the battery. • Do not expose the batte[...]

  • Page 44

    Cablin g 44 C abling H ard drive po wer cabling H ot - plug SAS/ SATA hard drive cabling[...]

  • Page 45

    Cablin g 45 C ache module capaci tor pack cabli ng U sing the HP c-Class Bla de SUV Cable The HP c - C lass Blade SUV Cable enables the user to perform server blade administration, c onfiguration, and diagnostic procedures by connecting video and USB devices directly to the server blade. For SUV cable co nnectors, see " HP c - Class Blade SUV [...]

  • Page 46

    Cablin g 46 2. Connect the video connector to a monitor. 3. Connect a USB mouse to one USB c onnector. 4. Connect a USB keyboard to the se cond USB connector. Item Description 1 Monitor 2 USB mo use 3 USB keybo ard 4 HP c - Class Blade SUV Cable A ccessing a server blade with local media devi ces Use the following configuration when configuring a s[...]

  • Page 47

    Cablin g 47 Item Description 1 Monitor 2 USB CD/DVD - ROM drive or diskette driv e 3 USB keybo ard 4 USB hub 5 USB mo use 6 Local I/ O cable[...]

  • Page 48

    Dia gno stic tools 48 D iag n o sti c tools T roubleshooting resou rces The HP ProLiant Servers Troubleshooting Guide provides procedures for resolv ing common problems and comprehen sive co urses of action f or fault isolation and identification, error message interpretation, issue resolutio n, and softwa re maintenance on P roLiant servers and se[...]

  • Page 49

    Dia gno stic tools 49 • From within HP SIM • From with in operating system - specific IML viewers: o For Wind ows®: IML Viewer o For Linux: IML Viewer Applica tion • From within the iLO 3 user i nterface • From within HP Insight Diagnostics (on page 48 ) • From within the Onboard Administrator GUI For more i nformation, see the HP BladeS[...]

  • Page 50

    Dia gno stic tools 50 Both HP Insight Remote Support solutio ns are available at no additional cost to customers with a valid warranty on HP technology, an HP Care Pack Service or HP contractual support agreement. For more i nformation, see the HP website ( http: //www.hp. com/go/insight remotesu pport ). U SB support and funct io nality U SB suppo[...]

  • Page 51

    Compone nt ident ification 51 C omponent i dentifi c atio n F ront pane l components Item Description 1 Seri al label pull tab 2 SUV conne ctor* 3 Server blade relea se button 4 Power O n/Stan dby button 5 Server blade relea se lever 6 Hard driv e bays * The S UV connector a nd the HP c - Class Blade S UV cable ar e for som e serve r blade conf igu[...]

  • Page 52

    Compone nt ident ification 52 Item Description Status Off = No li nk or activi ty 4 Flex 2 LED* Green = Networ k linked Green flashing = Network activi ty Off = No li nk or activi ty 5 System power LED Green = On Amber = Stan dby (auxi liary po wer avai lable) Off = Off * Actual NIC numbers depend on several factor s, including the operat ing syste[...]

  • Page 53

    Compone nt ident ification 53 Online/activity LED (gr een) Fault/UID L ED (amber/blue) Inte rpret ation Flashing regularly (1 Hz) A mber, f lash ing regular ly (1 Hz ) Do not r emove the d rive. Rem oving a dri ve may termi nate the curren t operatio n and cause data loss. The driv e is part of an array th at is un dergoin g capaci ty expansio n or[...]

  • Page 54

    Compone nt ident ification 54 Item Description 1 DIMM slots (Processor 2) 2 DIMM slots (Processor 1) 3 Smart Array con nector 4 TPM security riv et (optional) 5 Micro SD co nnnector 6 Interna l USB conne ctor 7 Mezzanine connector 2 (Type I or T ype II mezzanine) 8 Enclosure con nector 9 Mezzanine connector 1 (Type I mezzanine only) 10 System maint[...]

  • Page 55

    Compone nt ident ification 55 Item PCIe Mezzanine connector 2 x 8, Type I or II mezzanine card A PCIe x4 mezzanine connector su pports x8 cards at up to x4 speeds. A PCIe x8 mezza nine connec tor supports x16 cards at u p to x8 spee ds. S ystem mainte nance switch Position Functi on Default 1* iLO 3 se curity override Off 2 Configuration lock Off 3[...]

  • Page 56

    Compone nt ident ification 56 9. Change posit ion 6 of the system m aintenance swi tch to off . 10 . Repeat steps 5 and 6. IMPO RTANT: W hen the server blade boots after NVRAM is cleared, a delay of up to 2 minutes is normal. During this delay, the system appears non - functional. Do not attempt any procedures during the delay. A ccess ing the red [...]

  • Page 57

    Comp onent ident ificatio n 57 Item Connector Description 2 Video For c onnecting a video monitor 3 USB For con necting up to two USB devices 4 Serial For trained personn el to c onnect a null modem s erial cable and perfor m advan ced diagn ostic proc edures[...]

  • Page 58

    Specifica tions 58 S pe c if icati on s E nvironment al specif ications Specification Val ue Tempera ture range* — Operati ng 10 ° C to 35 ° C (50 ° F to 9 5 ° F) Non - operat ing - 30 ° C to 60 ° C ( - 22 ° F to 140 ° F) Relativ e humidity (nonco ndens ing )** — Operati ng 10% to 90% @ 2 8 ° C (82.4 ° F) Non - operat ing 5% to 95% @ [...]

  • Page 59

    Acronyms and abbr eviati ons 59 A cr on y ms an d abbr e v iati ons ADU Array Diagnostics Utility CSR Customer Self Repair ESD electrostatic discharge iLO 3 Integrated Lights - Out 3 IML Integ rated Management Log ORCA Option ROM Configuration for Arrays POST Power - On Self Test PSP ProLiant Support Pack PXE Preboot Execution Environment RBSU ROM-[...]

  • Page 60

    Acronyms and abbr eviati ons 60 SD Secure Digital SIM Systems I nsight Manager SMP Server Migration Pack TPM trusted platform module UID unit identification USB universal serial bus[...]

  • Page 61

    Index 61 A access panel 24 accessing a ser ver blade with l ocal KVM 45, 46 ADU (Array Diagnos tic Utility) 49 B batteries, replacing 42 battery 42 buttons 51 C cables 44, 45 cabling 44, 45 cache module capacitor pack 30, 45 cache module capacitor pack cabling 45 components 16, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 33, 38, 42 , 51 components,[...]

  • Page 62

    Index 62 R removing the ac cess panel 24 removing the server blade 23 resources 48 resources, troublesho oting 48 ROM redundanc y 56 S safety considerations 21 safety information 21 SAS cab ling 44 SAS dri ves 52 SAS hard drive LEDs 52 SATA hard drive 52 SATA hard drive LEDs 52 serial connector 56 specifications 58 static electricity 21 SUV cable 5[...]