HP (Hewlett-Packard) 16500B manual

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Table of contents for the manual

  • Page 1

    Errata Title & Document Type: Manual Part Number: Revision Date: HP References in this Manual This manual may contain references to HP or Hewlett - Packard. Please note that Hewlett - Packard's former test and measurement, semiconductor products an d chemical analysis businesses are now part of Agilent Technologies. We have made no changes[...]

  • Page 2

    Servic e Gu ide Publicati o n numbe r 165 00-9 701 1 First edi tio n, August 19 94 For Safe ty inform atio n, Warrant ies, and Reg ulato ry informati on, see the pages at the end of the book.  Copyri ght Hewlet t-Pack ard Company 1987 – 1 994 All Right s Re served. HP 16500B/16501A Logic A nalysis S ystem[...]

  • Page 3

    HP 1 6500B/1 6 501 A Log ic Ana lysis S ystem The HP 1 6500 B i s the main frame of th e Log ic A naly sis S yste m, and th e HP 16501 A is the ex pansio n frame. The HP 16500B/ 1650 1A is of modular stru ctur e using plu g-in card s wi th a wide range of data acquisiti on and stimu lus capabi litie s. Features Some of th e main featur es of the HP[...]

  • Page 4

    The H P 16 500B L ogic Ana lysi s S ys tem iii[...]

  • Page 5

    In This Book This book is the service guide for the H P 16500 B/1 6501 A Logi c Analysis Syst em and is divided into e ight chapte rs. Chapter 1 contains informat io n about the instrument and i ncludes accessories for the instrument , specificat ions and characteristics of the instrument , and a list of the equipme nt required for servicing the in[...]

  • Page 6

    Cont ents 1 Genera l Informa tion Accessori es 1–2 Specificatio ns 1– 3 Characterist ics 1– 3 Recommende d Test Equipme nt 1 – 6 2 Preparing for Use To inspect the lo gic anal ysis sys tem 2–2 To apply po wer 2– 3 To operat e t he use r interface 2–3 To set the line volt age 2–4 To degauss the display 2–5 To clean t he lo gic anal[...]

  • Page 7

    6 Replacing Asse mblies To remove and repl ace t he Optio nal mo dules or fille r panels 6–3 Covers 6 –4 Flexib le disk drive 6–5 Power supply 6–6 Rear fan 6–8 Side fan 6–9 HP 165 00L i nterface mo dule 6–10 Hard disk drive 6–12 Microprocess or bo ard ( CPU) 6–1 3 SIMM memory 6–14 Expansio n int erface bo ard 6– 1 5 Mother b o[...]

  • Page 8

    1 Accessori es 1– 2 Specificatio ns 1– 3 Characterist ics 1– 3 Recommende d Test Equipme nt 1 – 6 Gene ral Information[...]

  • Page 9

    Gen era l Info r mation This chap ter lists the accesso ries , the specification s and characteris tics , and the reco mmende d te st e quipmen t. Access ories The follo wing acce ssories are suppl ied wi th the H P 165 00B/1 6501A Lo gic Analys is Sy stem. Access ories Supp lied Qty Training Kit 1 Setting Up The Sys tem G uide 1 User’s Re fe ren[...]

  • Page 10

    Specification s The specificat ions are t he pe rformance st andards against which t he pro duct is t ested. There are no specificat ions for the HP 1 6500 B o r the H P 16501A. Character istics These characteristi cs are not specifications, but are included as additional informat ion. The followi ng characterist ics are typical for the HP 1 6500 B[...]

  • Page 11

    Time Interval Accuracy Between Modu les Equal s t he sum of the channel-t o-channel time interval accuracies of each module used in the measurement , for a deske wed measurement . Time Correlati on Resolution 2 ns ( 5 00 MH z) . Opera ting Environme nt Tem pe ratu re Instru men t 0 ° C t o 50 ° C (+ 32 ° F to 1 22 ° F). Disk Medi a 10 ° C to 4[...]

  • Page 12

    Dimen si ons Refer to the followi ng figure for dimensio nal detail. Dimens i onal Det ai l Genera l Inf orma tion Cha ract eri s tics 1–5[...]

  • Page 13

    Recom mended T est Equipment Equipme nt Re qui red Equip ment Critical Spe cifica tions Recommend ed Model / Par t Use * Osc illoscop e 100 M Hz B andwidt h HP 5 4600 A T Voltmet er HP 347 8A T RS-23 2C L oop back Con nect or HP Part Number 01 65 0- 63 20 2 T *A = Adjus tmen t P = Pe rfo rma nce Te sts T = Tr oub lesh ooting Gener al In for matio n[...]

  • Page 14

    2 To inspect the lo gic anal ysis sys tem 2–2 To apply po wer 2– 3 To operat e t he use r interface 2–3 To set the line volt age 2–4 To degauss the display 2–5 To clean t he lo gic analysi s sy ste m 2– 5 To test t he lo gic analysi s sy ste m 2– 5 To instal l mo dules 2–6 To instal l t he H P 1650 0L int erface module 2–7 To conn[...]

  • Page 15

    Pre pari ng For Use This chap ter g ives you in str uctio ns for p rep arin g th e l ogic analy sis s yste m for u se. Powe r Re qu irem ents The lo gic an alys is system main frame requires a p ower so urce of ei ther 115 Vac or 23 0 Vac, –22 % to +10 %, sing le phase, 48 to 66 Hz, 475 W maximum power. The lo gic an alys is system e x pans ion f[...]

  • Page 16

    2 Check the sup plied ac cessori es. Accessori es supplied with the log ic analysis syst em are liste d in "Access orie s" in chapter 1. 3 Inspe ct th e product for physica l damage. Check the lo gic analysis sys tem and t he suppl ied acce ssories for o bvious physi cal o r mechanical defe cts. If y ou fi nd any defects , co ntact your n[...]

  • Page 17

    To set the line voltage When shipped from HP, the line voltag e selector is set and an appropri ate fuse is installed for operating the instrument in the country of destinat ion. To operat e t he instrument from a power so urce o ther than t he o ne set, perfo rm the fo llo wing steps . 1 Tur n the front pan el pow er switch to t he STB Y posi tion[...]

  • Page 18

    To degauss the display • If the mainfra me has be en subjec te d to strong magn etic field s, the C RT might beco me magn etized an d displa y data might bec ome distorted . To corre ct this cond itio n, deg auss the CRT with a c onven tion al, exter nal -telev ision -typ e deg aussin g co il. To clean th e logic analysis system • Wi th the i n[...]

  • Page 19

    To in stall m odules The following steps give general instruct ions for installing modules into the mainframe or the expansio n frame of the system. CA UT ION El ectrosta tic discharge can damage electroni c components . Use grounded wris tstra ps and mats when perf ormi ng any s ervice to modul es. 1 Tur n off t he frame pow er switch, th en unplu[...]

  • Page 20

    To in stall the HP 16500L interface mod ule The HP 16500L interface module is required to connect t he HP 16501A Expansio n Frame to the H P 1650 0B m ainframe. WA RNI NG Haz ardous voltages exi st on the power supply , the CRT, and the C RT driver board of the HP 16500 B mainframe. To avoid electri cal shock, disconnect the pow er from the instrum[...]

  • Page 21

    5 Slide the inter fa ce mod ule into the main frame thro ug h the slo t i n the rear pan el. 6 Install the scr ews co nnectin g the i n terface mo dule to the mai nframe . Two screws through the top of the interface module connect i t to the sheet met al plate, and four screws through the rear plate of the interface module connect it t o the rear p[...]

  • Page 22

    To connect the HP 16501A Expansion Frame The HP 1 6 501A Expansio n Frame includes an interface cabl e and re qui res an H P 16500 L interface module to connect to the H P 16500B mainframe. To install the expans ion frame, you need to install the inte rface module into the mainframe, then connect the cable from the module to the expansio n frame. C[...]

  • Page 23

    To co nnect an external monit or The following tab les define the signal available for external monito rs at t he HP 16500L connecto r and pin numb ers. HP 16 5 00L O utput Sign al F or Ext erna l M oni tor s Horizont al def lection ( f h) 25.0 k Hz Vertica l de flec tion (fv) 5 9.95 Hz Resolut io n 576 x 36 8 x do ts x l ines (W xH) RGB vid eo 0.7[...]

  • Page 24

    3 To perform the power-up tests 3 –3 To perform the self-tes ts 3–4 Testing Performance[...]

  • Page 25

    Testi ng Perfor mance To ensure the logic analys is sy stem is o perating correctly, you can perform software tests (s elf-tests ) on the sy stem. Dire ction s for pe rformin g th e s oftware te sts are give n i n this chap ter. This chap ter normall y tells you how to te st th e perfor mance of the logi c analysi s system ag ainst th e s peci fica[...]

  • Page 26

    To per f or m t he powe r - up tes ts The logic analysis syste m automat ically performs power- up tests when you apply power to the instrument . T he revision number of the boot ROM shows in t he upper-right corner of the screen during thes e power-up tests. As each test complet es, eit her "passed" or "failed" prints on the sc[...]

  • Page 27

    To p erform the self-tests The s elf-tests ver ify th e cor rect oper ation of th e lo gic an alys is sy stem. Sel f-tests can be pe rformed all at once or one at a time. While testin g the p erfor mance of the logi c anal ysis sys tem, ru n the self-tes ts all at once. 1 If y ou j ust di d t h e po we r -u p se lf -t est s , go t o st ep 2. If you[...]

  • Page 28

    5 Install a formatted d i sk that is not write protected i nto the flexib le d isk dr ive. Conn ect an RS- 232C loopb ack conne ctor onto the RS- 232C port. 6 Select All System Tests . You can run all tests at one time b y running All System Tests. To s e e more detail s about each test, yo u can run each test individually. This step shows how to r[...]

  • Page 29

    3– 6[...]

  • Page 30

    4 To prepare t he ins trume nt 4 – 3 To access t he test patterns 4–4 To adjust geo met ry 4–5 To adjust focus, landing , and co nvergence 4–6 To adjust white balance 4–13 Calibrating and Adjusting[...]

  • Page 31

    Cal ibra ting an d Adj usting This chap ter normall y gives you instru ction s for calibrati ng and adjusting the logic anal ysi s sys tem. Becaus e the HP 16500B/ 16501A req uires no calib ration , only adj ust ment i nstructi ons are in clud ed . Adj ustm ents The only adju stmen ts to the logic analys is sy stem are adjustments to the color CRT [...]

  • Page 32

    To p repare the instr ument 1 Remove the rear feet and the cove rs from the mainframe. 2 Before startin g the adjustmen t s, mark the position whe re the p oten tiometer s are set. This helps i n ret urning t he adj ustm ents to their o rigi nal po sitions if i t beco mes neces sary t o restart the procedure . 3 Dur ing a ny of the follo wing CRT a[...]

  • Page 33

    To access t he test patterns Some procedures on the follo wing pages ask you to access test patterns. This pro cedure tel ls you how to access the m and ho w t o exit the t est . 1 In the Sys tem C onfigu ratio n menu, touc h C onfig uration, then select Test in the po p- up me nu . 2 Touch the f i eld near the center of t he screen to l o ad the T[...]

  • Page 34

    To ad just geo metry 1 Displ ay the white cr oss-ha tc h test patt ern on the CRT. From the Colo r Displ ay Test menu, select the white, cross- hatch patter n. 2 Preset the fro nt panel brigh tness con trol , the top of the two control s to the left of the displa y, maximu m clo ckw ise. 3 Preset the fro nt panel contra st co ntro l, the botto m o [...]

  • Page 35

    To ad just f ocus, landin g, and convergence Once you have started, you will have to do all three of the procedures in this group: the focus, the landing , and t he co nverge nce adjustme nts. Initial Preparati on 1 Loosen the deflectio n yoke clamp scre w. 2 Remove the rear and side fans. Refer to chapter 6, "Replacing Assem blies. " Foc[...]

  • Page 36

    Landin g Ad ju stmen t 1 Tur n the front pan el BRIGHTNES S contro l full y clockw ise. 2 Degauss the CRT by momentari ly pres sing the D E GAUS S switch located on the instru men t re ar pa nel . In some cases, the user’s enviro nment or shipping environment may have caused high levels o f magnetizat ion in the CRT. In this case, t o co mplet el[...]

  • Page 37

    8 Mov e the deflectio n yoke for war d u n til the entire ra s ter i s green . Landing adjustment is easier if the y oke is moved all t he way forward and then moved back until t he rast er i s co mplet ely green. 9 Using th e Color Purity k ey, replace the gree n raster with red and then b lue raster, eac h time c h eck ing for proper landin g adj[...]

  • Page 38

    Static Co nverg enc e 1 Temp ora rily disco nn ect the powe r from the in str umen t. 2 Re move th e PC b o ard shiel d cover fro m the rear of the Co lor CRT Modu le by p ryi ng eve nly o n all four sides. 3 Re app ly p ow er. 4 Displ ay the white, cro s s-hatch test patter n on the CRT. From the Colo r Displ ay Test menu, select the white, cross-[...]

  • Page 39

    D yna mic Co nver g enc e 1 Displ ay the white, cro s s-hatch test patter n on the CRT. From the Colo r Displ ay Test menu, select the white, cross- hatch test pattern. 2 Adjust Y BOW ( RV80 5) located on the bottom PC boar d to elimina te red, gre en, and blue bow ing at the top and bot tom of the cen ter ver tical li ne. 3 Adju st Y C R OSS (RV80[...]

  • Page 40

    4 Adjust V TOP ( RV80 1) and V BOTTOM (RV802) to obtai n coincide nce o f th e red, blue, an d green at the intersectio n of the top and b o ttom horizon tal lin es with the cen ter ver tical line. The VTOP a n d VBOTTOM adjustmen t s ar e located o n the bot tom PC b oard . Use the next two figure s for V TOP an d V BOTTOM respe ctivel y. Calibrat[...]

  • Page 41

    5 Adju st H.AMP (R V807) l oca ted on the bot tom PC b o ard for equal amo unt s of misco nve rgen ce at the right an d left sides of the screen. 6 Adju st H. TILT (RV8 06) lo cated on the botto m PC board for coi nci dence o f red, gre en, and blue at the right an d left s i des of the screen. 7 If you are fi nish ed with the C RT ad justmen ts, r[...]

  • Page 42

    To ad just w hite balance 1 Pro vid e a blank d ispl ay on the CR T. From the Colo r Displ ay Test menu, select a blank ( colo rles s) raster. 2 Preset the fro nt panel brigh tness and co n trast contr ols to thei r mechani cal ce nters. 3 On the bottom PC b oard, set the following adju stment s to their mech anical center s. • SUB BRT (RV901 ) ?[...]

  • Page 43

    4– 14[...]

  • Page 44

    5 To use t he flo wcharts 5–2 To check t he power-up self- tests 5–18 To run the self-tests 5–19 To check t he vi deo signal s 5–22 To check the po wer s upply L EDs 5 –23 To test the po wer suppl y vo ltag es 5 – 24 To test t he fle xibl e dis k dri ve voltag es 5–25 To test the hard di sk drive vo ltages 5–27 To test the ex pansio[...]

  • Page 45

    Trou ble shootin g This chap ter help s you troublesh oot the logi c analysi s sys tem to fin d defective assembl ies . T he trou ble shootin g co ns ists of flo wcharts, s elf-test in stru ction s, and tes ts. Th is infor mation is not inte nded fo r compone nt-leve l repair . If you suspect a pro blem, star t at th e top of th e first flo wchart.[...]

  • Page 46

    Mai n Tro ubl es hoot i ng F lo wchar t 1 Troubles hoo ting To use t he f lo wc hart s 5–3[...]

  • Page 47

    Mai n Tro ubl es hoot i ng F lo wchar t 2 Note: The HP 16 500L is in the Sys t em Configura tion menu if "Mas ter F rame" is i n a blue field a nd "Ethe rnet " is in the Communicatio ns field . Troubles ho otin g To use the fl owchar ts 5– 4[...]

  • Page 48

    Col or Mo dul e Tr oubl es hoo ting Fl owcha rt 3 Troubles hoo ting To use t he f lo wc hart s 5–5[...]

  • Page 49

    Col or Mo dul e Tr oubl es hoo ting Fl owcha rt 3A ( cont i nue d) Troubles ho otin g To use the fl owchar ts 5– 6[...]

  • Page 50

    Pow er- Up Tr oubl es hoo ting F low cha rt 4 Troubles hoo ting To use t he f lo wc hart s 5–7[...]

  • Page 51

    Syst em St art Tr oub lesho ot ing Fl ow ch art 5 Troubles ho otin g To use the fl owchar ts 5– 8[...]

  • Page 52

    Mai nframe T est s T rou blesh oot ing Fl owc har t 6 Troubles hoo ting To use t he f lo wc hart s 5–9[...]

  • Page 53

    Pow er Sup ply Tr oubl es hoo ting F low cha rt 7 Troubles ho otin g To use the fl owchar ts 5– 10[...]

  • Page 54

    HI L T r ou b le s ho ot in g Fl ow ch art 8 Troubles hoo ting To use t he f lo wc hart s 5– 11[...]

  • Page 55

    Flex ib le D is k Dr iv e Tr oubl es hoo ting F low cha rt 9 Troubles ho otin g To use the fl owchar ts 5– 12[...]

  • Page 56

    H ard Dis k Dr ive Tr oub le s ho oti ng F lo wch art 10 Troubles hoo ting To use t he f lo wc hart s 5– 13[...]

  • Page 57

    RS- 23 2C Trou bl esh oot ing Fl ow c har t 1 1 Troubles ho otin g To use the fl owchar ts 5– 14[...]

  • Page 58

    Int ermo dule Tr oubl es hoo ting Fl ow cha rt 12 Troubles hoo ting To use t he f lo wc hart s 5– 15[...]

  • Page 59

    Expans io n Fr ame Tr oubl eshoo ting F low chart 13 Troubles ho otin g To use the fl owchar ts 5– 16[...]

  • Page 60

    Ext er nal M oni tor Tr ouble sho ot in g Fl owc h art 14 Note: Co mpare the spec ifica tion s o f the monitor again st th e spec ifica tion s o f the video sig nal as a wa y to det ermin e compat ibility ( abilit y to synch). Video signa l sp ecif icat ions are lis ted in " To connec t an ex ter nal monitor " in chap ter 2. Troubles hoo [...]

  • Page 61

    To ch eck t he power-up s elf -tests The logic analysis syste m automat ically performs power- up self-te sts when you apply power to the ins trume nt. The revi sion numb er o f the o perati ng sy stem sho ws i n the upper-ri ght corner of the screen during these power-up t ests. As each test complete s, eithe r "passed" or "failed&q[...]

  • Page 62

    To run the self-tests Self-tes ts identify the correct operatio n of major, functional subsy stems of the instrume nt. You can run all sel f-te sts wit hout access ing t he i nterior o f t he ins trume nt. If a s elf-test fail s, the tro ub lesho oting flowchart s instruct yo u to chang e a part o f the inst rument . 1 If y ou j ust di d t h e po w[...]

  • Page 63

    5 Select ROM Test. The ROM Test screen i s displayed . You can run all tests at one time b y running All System Tests. To s e e more detail s about ea ch test, you can run each test individual ly. This exam ple shows how to run an individual test . 6 Select Run, then select Singl e. To run a test cont inuously, sele ct Repeti tive . Se lect Stop to[...]

  • Page 64

    7 To e x it t he ROM Test, select Done. N o te t h at the status chan ges to Pass e d o r Failed. 8 Install a formatted disk that is not write-p rotec ted into the flexible disk d riv e. Conn ect an RS- 232C loopb ack conne ctor o nto the R S-232C port. Run the r emain ing All System Tests i n t he same manner . The Color Display Test is not part o[...]

  • Page 65

    To ch eck the vide o sign als Refer to chapte r 6, "Replacing A ssem blies, " fo r inst ructi ons on how t o re move or replace covers and as semb li es. WA RNI NG Haz ard vol tage s exist on the powe r s upply, t he CRT, and the CRT driver board. This procedure is to be pe rforme d by serv ice-tra ined pers onnel aware of the haz ards in[...]

  • Page 66

    To ch eck the p ower supply LEDs Refer to chapte r 6, "Repl acing A ssem blies, " fo r inst ructi ons to remo ve or replace co vers and asse mb lies. WA RNI NG Haz ard vol tage s exist on the powe r s upply, t he CRT, and the CRT driver board. This procedure is to be pe rforme d by serv ice-tra ined pers onnel aware of the haz ards inv ol[...]

  • Page 67

    To ch eck the p ower supp ly voltages Refer to chapte r 6, "Repl acing A ssem blies, " fo r inst ructi ons to remo ve or replace co vers and asse mb lies. WA RNI NG Haz ard vol tage s exist on the powe r s upply, t he CRT, and the CRT driver board. This procedure is to be pe rforme d by serv ice-tra ined pers onnel aware of the haz ards i[...]

  • Page 68

    To t est th e flex ible disk drive voltages Refer to chapte r 6, "Repl acing A ssem blies, " fo r inst ructi ons to remo ve or replace co vers and asse mb lies. WA RNI NG Haz ard vol tage s exist on the powe r s upply, t he CRT, and the CRT driver board. This procedure is to be pe rforme d by serv ice-tra ined pers onnel aware of the haz [...]

  • Page 69

    5 Check for the fol lowin g volta ges and signa ls u sing an oscillo scop e. Disk D ri ve Volt age s Pi n Si gnal Descript ion Pi n Si gnal Descript ion Pi n Signal Descr ip tion 1 NC 13 Ground 24 Write G at e 2 Disk C hang e 14 NC 25 Ground 3 NC 15 Gro und 26 Track 0 0 4 High Densit y 16 Motor On 27 Ground 5 NC 17 Ground 28 Write P rotec t 6 NC 18[...]

  • Page 70

    To t est the hard disk d rive voltages Refer to chapte r 6, "Repl acing A ssem blies, " fo r inst ructi ons to remo ve or replace co vers and asse mb lies. WA RNI NG Haz ard vol tage s exist on the powe r s upply, t he CRT, and the CRT driver board. This procedure is to be pe rforme d by serv ice-tra ined pers onnel aware of the haz ards [...]

  • Page 71

    Disk D ri ve Volt age s Pi n Signal Descr ip tion Pi n Signal Des c r ip tion Pin Signal Descr ip tion 1 Reset 15 Data 29 +5 V 2 Gro und 16 Dat a 30 Ground 3 Data 1 7 Data 31 I n terrupt Requ est 4 Dat a 18 Dat a 32 N C 5 Dat a 1 9 Gro und 33 Addr es s 6 Data 20 (conne ct or k ey pin) 34 NC 7 Dat a 21 NC 35 Addr es s 8 Dat a 2 2 Gro und 36 Addr es [...]

  • Page 72

    To t est th e exp ansion frame in terface This procedure is used during troublesho ot ing to i so late a failed i nterface component, the interface cab le , the ex pansi on fram e int erface card, or the HP 1650 0L. The O pt ion Board Tes t in the performance verificatio n software generates bit patterns acro ss the data, address, and strob e lines[...]

  • Page 73

    Test th e Ex pansio n Interface Card 1 Gro und the osc illo scop e probe to the metal portio n of the frame nea r the rea r panel of the expa nsio n frame and check for TTL acti vity on the foll owing p ins. • U7 pins 11 through 18 • U8 pins 2 thro ugh 9 • U9 pins 5 thro ugh 9 If there is TTL activ ity on a ll of the pins indic ated, then the[...]

  • Page 74

    3 Remove the pr o be ground from the frame , a n d reat tach the pro be ground to the metal portio n of the e xpansio n frame n ear th e front panel. 4 Pro be th e fo llo win g pi ns. • U1 pins 2 thro ugh 9 • U2 pins 2 thro ugh 9 • U3 pins 5 thro ugh 9 If all of the signal lin es show TTL activ ity, then go to the next step . If one or more o[...]

  • Page 75

    Test th e Main frame CPU B o ard 1 Remove power from t h e HP 16500 B syst em and unplug the p ower cords f r om b oth the mai nframe and the exp an si on frame. 2 Reinstall the botto m cove r on th e expan sion fra me. Set the main frame on its sid e with the strap handle faci ng up, then r emov e the b ot tom cov er. 3 Plu g the powe r cor ds int[...]

  • Page 76

    6 To remove and repl ace t he Optio nal m odules o r fill er panels 6- 3 Covers 6–4 Flexib le disk drive 6 –5 Power supply 6–6 Rear fan 6–8 Side fan 6 –9 HP 16500L inte rface module 6–10 Hard disk drive 6–12 Microproces sor board (CP U) 6–13 SIMM memory module 6–14 Expansio n interface board 6–15 Mother b o ard 6–16 Front -Pan[...]

  • Page 77

    Rep lacing Assemblie s This chap ter contain s the instru ction s for removi ng and replacin g the asse mblie s of the log ic analys is system. A lso in this chap ter are instr uctio ns for r etur ning assembl ies. WA RNI NG Haz ardous voltages exi st on the power supply , the CRT, and the C RT driver board. To av oid electri cal shock, disc onnect[...]

  • Page 78

    To remo ve and replace o ption al modules or filler pan els 1 To reconfigu re yo ur system later i n t his pro ced ure, note the confi guration of your syst em. Some modules for the Logic Analysis System req uire calibratio n if you move them to a different s lot. 2 Star ting from the top, lo osen th e thumb screw s on filler panels an d cards in t[...]

  • Page 79

    To remo ve and replace the co vers There are four outside covers on the H P 16500 B and on the HP 1650 1A, a t op cover, a bot tom cover, and t wo side covers . When removing the covers, note where the shiel ding b raid is l ocated. If the shie lding brai d separates from the covers , reinstal l i t when replacing the covers. T he shielding braid h[...]

  • Page 80

    To remo ve and replace the f lexible disk drive HP 165 00B 1 Using p rev ious p roced ure s, remo ve the followin g assembl ies: • Top cover 2 Remove the two disk drive mo u nti ng screws. 3 Slide th e flexi ble d isk drive assembly tow ard the rear panel until the assembly is out of the ins tru men t. 4 Disco nnect the co ntro l cable for the di[...]

  • Page 81

    To remo ve and replace the p ower supp ly WA RNI NG Haz ardous voltages exi st on the power supply . To avoid el ect rica l shock, disconnect the power from the i nstrume nt before perf ormi ng the fol lowing procedures . Af ter disconne cting the power, wait at l east six minute s for the capacitors on the powe r suppl y board to discha rge before[...]

  • Page 82

    Re placing A ssemb lies To remov e a nd re pla ce t he po wer s uppl y 6–7[...]

  • Page 83

    To remo ve and replace t he rear fan HP 16500B and HP 16501A 1 Using p rev ious p roced ure s, remo ve the followin g assembl ies: • Top cover 2 Remove th e rear fan shroud moun ting scr ews. 3 Remove the comp lete rear fan assemb ly from the rear p ane l of t he in strumen t. 4 Disco nnect the rear fan powe r cable. 5 Re move th e rear fan mount[...]

  • Page 84

    To remo ve and replace the side fan HP 16500B and HP 16501A 1 Using p rev ious p roced ure s, remo ve the followin g assembl ies: • Top cover and side cover 2 Remove the four side fan mo unting scre ws. 3 Re ach th rough the top of the i nstrume nt and disco nnect the fan p ow er ca ble , then remo ve the fan . 4 Re verse thi s proc edure to in s[...]

  • Page 85

    To remo ve and replace the HP 16500L int erface mo dule HP 16500B and HP 1650 0L 1 1 Using p rev ious p roced ure s, remo ve the followin g assembl ies: • Top cover 2 If y o ur system inclu des an expansio n frame, discon ne ct th e interfa ce cable fro m the HP 1650 0L i n terface mo dule by pre ssing the re lease tab s on eith er side of the ca[...]

  • Page 86

    7 If y o ur system includes an e xpansio n frame, c o nnect the interface cable from the expan sion frame to the HP 165 00L i nterfac e module l oca ted in the HP 16500 B main frame. In order t o e nsure co rrect conne ctio n o f the int erface cab le, t he 6 8-pin "D " co nnect ors on t he cable are asymmet ric in shape. They only fit in[...]

  • Page 87

    To remo ve and replace the h ard disk drive HP 165 00B 1 Using p rev ious p roced ure s, remo ve the followin g assembl ies: • Top and bott om covers • HP 16500L inte rface module 2 Re ach ing i n from the top of the ins trumen t, re move the four scr ews conn ectin g the ha rd disk dr ive to the brac ket. 3 Re ach ing in from the bottom o f th[...]

  • Page 88

    To remo ve and replace t he micropr ocessor boar d ( CPU) HP 165 00B 1 Using p rev ious p roced ure s, remo ve the followin g assembl ies: • Top cover and left, rear foot • All opt ional mo dules and fil ler pane ls 2 Disco nnect the cables from the micro processor boa rd. 3 Remove the two screws conne cting th e micropr oce ssor to the rear pa[...]

  • Page 89

    To remo ve and replace a SIMM mem ory HP 165 00B 1 Using p rev ious p roced ure s, remo ve the followin g assembl ies: • Microproces sor (CPU ) board 2 Hol d the release tab s away fro m the SIMM (sing le inline memor y mod ule ), then pull the mo dule ou t. 3 Reverse thi s procedu re to i n stall the re placemen t S IMM. Slide the SIMM mo dule i[...]

  • Page 90

    To remo ve and replace the ex pansion interface board HP 165 01A 1 Using p rev ious p roced ure s, remo ve the followin g assembl ies: • Botto m co ver • All opt ional mo dules and fil ler pane ls 2 Disco nnect the interface ca ble b y pres sing the r elea se tabs on either sid e of t h e cab le co nnecto r while p ull ing the cab le co nnector[...]

  • Page 91

    To remo ve and replace the m other board HP 165 00B 1 Using p rev ious p roced ure s, remo ve the followin g assembl ies: • Top and bott om covers • Power supply • Microproces sor boa rd • All opt ional mo dules and fil ler pane ls 2 Set the frame so that the b o ttom of the frame is facing up. T h is is t o gain ac cess to the fan pow er c[...]

  • Page 92

    Re placing A ssemb lies To remov e an d rep lac e th e mot her board 6– 17[...]

  • Page 93

    To remo ve and replace the f ront-panel board HP 165 00B 1 Remove the t op trim fro m th e front frame. 2 Disco nnect the two c abl es from the fron t-pa nel boa rd. One cable is connect ed to the color display assemb ly and one cable i s co nnected to the mother board. 3 Re move th e screw s conn ectin g the fro nt-p ane l assembly to the top and [...]

  • Page 94

    To remo ve and replace the co lor display assembly HP 165 00B The color display assemb ly replaceme nt procedure consi sts of three sections: Removing the assem bly from the mainframe. Transferring parts to t he replacement ass embly. Installing the asse mb ly in the mainfram e. Remo vin g the color displ ay assembly from the m ain frame 1 Using p [...]

  • Page 95

    Transferring parts to th e repl acement assembly The purpose of this procedure is to transfe r the mechanical parts from the o ld assembly to the replacement asse mb ly. 1 Re move th e rear mo unting b rac ket from the r ear sup port bra cke t. Remo ve the rear sup port brac ket from the c olor display assembly. 2 Attach t he rea r support brack et[...]

  • Page 96

    Install ing the replacem en t colo r display assem bly 1 Ca reful ly slid e the color d ispl ay assembl y most o f the way into the mainfra me. To preven t damag e to t he cab les, make sure that they c lear th e mainfr ame. 2 Conn ect the co lor disp lay to p ow er sup ply c abl e to the powe r supp ly. Sl i de the display assembly compl etely in [...]

  • Page 97

    To return assemblies Before shi pping t he l ogic analys is syst em o r ass emblie s t o Hewlett -Packard, cont act your nearest Hewl ett -Packard sales offi ce for addit ional det ails. 1 Wr ite the foll owing i nfor mation on a tag and attac h it to t h e part to b e returne d . • Name and address of owner • Model numb er • Serial numb er ?[...]

  • Page 98

    7 Replaceabl e Parts Ordering 7–2 Replaceabl e Parts Lis t 7–3 HP 1650 0B E xpl oded View and Replaceab le Part s 7–4 HP 16501A Explode d View and Replaceable Parts 7–9 Replac e a ble Pa rts[...]

  • Page 99

    Rep lac ea ble Pa rts This chap ter contain s infor mati on for iden tifyin g and orde rin g replace able par ts for you r l ogic analy sis s yste m. Replaceable Parts Ordering Parts listed To order a part on the list of re placeable parts, q uot e the Hewle tt-P ackard part number, indicate the quant ity desired, and address the order t o the near[...]

  • Page 100

    Replaceable Parts Lis t Descri ption The replaceab le part s list is organi zed b y reference de signat ion. The exploded vi ew does not show all of the parts in the replaceable parts list. Informatio n incl uded fo r each part on the list co nsists of the fo llowing: • Reference des ignat or • Hewlet t-Pack ard part numb er • Total quantity [...]

  • Page 101

    HP 16500B Exp loded View and Replaceable Parts Explo ded v iew o f t he HP 1 6500 B Ext ernal Par t s Replaceab le Part s HP 16 5 00B Ex plo ded Vi ew and Repl acea ble Part s 7– 4[...]

  • Page 102

    HP 16 5 0 0B Re p lac eabl e Par ts Ref . Des. HP Part Number QTY Description Exchang e Ass embl ies A2 16500- 69 512 Front -pane l circuit b oar d (exch ange ) A3 16500- 6950 9 Microp rocess or b oard ass embly (ex cha nge) A5 D232 9-69 001 Hard disk driv e (e xch ange ) A6 16500- 6950 0 Power su pply (ex chan ge) A8 2095-0 001 Color monit or as s[...]

  • Page 103

    Explo ded Vi ew of t he HP 165 00 B Replaceab le Part s HP 16 5 00B Ex plo ded Vi ew and Repl acea ble Part s 7– 6[...]

  • Page 104

    HP 16 5 0 0B Re p lac eabl e Par ts Ref . Des. HP Part Number QTY Description Int ern al P art s A1 16500-66 501 1 Mother boar d ass embly A3 16500-66 509 1 Microp rocessor boar d ass embly A4 0950-216 9 2 Flex ible disk drive A5 D2329- 6000 3 Hard disk driv e A6 0950-185 3 1 Power su pply as sembly A8 2090-0251 1 Color CRT mod ule ass embly A9 1 8[...]

  • Page 105

    HP 16 5 0 0B Re p lac eabl e Par ts Ref . Des. HP Part Number QTY Description W6 1 6 500-61 606 1 Cab le - power sup ply to color mo dule W8 1 6 500- 6161 1 1 Cable - hard driv e (4 0 co nd) W9 1 6 500- 6161 2 1 Cable - har d drive power W10 1650 0-61613 1 Cab le - CRT 10/40 (10 co nd/40 pin, CRT t o CPU) Front -Pane l As se mbl y Part s A2 16500-6[...]

  • Page 106

    HP 16501A Exp loded View and Replaceable Parts Explo ded v iew o f the HP 165 01A Replaceab le Part s HP 1 650 1A E xpl oded View an d Repl ace able Part s 7–9[...]

  • Page 107

    HP 16 5 0 1A Re p lac eabl e Par ts Ref . Des. HP Part Number QTY Description Exchang e Ass embl ies A4 16500-69 50 0 Power supply as se mbly ( exc hange) Ext er nal Par ts F1 21 10 -0 01 0 F1 21 10 -0 39 5 MP1 16 501- 00 201 1 Front -pane l MP 2 1 6501 -0 02 03 1 Re ar p a nel MP3 0363 -012 5 4 FRI strip-f inge rs (t op an d bott om cov ers) MP4 1[...]

  • Page 108

    HP 16 5 0 1A Re p lac eabl e Par ts Ref . Des. HP Part Number QTY Description Int ern al P art s H1 0515-0372 19 Screw M3 X 0.5 8M M-LG H2 0 5 15-043 3 1 2 Screw M 4 X 0.8 15MM-L G H3 0 5 15-043 5 6 Screw M 4 X 0.7 14MM -LG H4 0 5 15-066 4 2 Screw M 3 X 0.5 12MM -LG H5 0 5 15-094 3 1 4 Screw M 4 X 0.7 12MM-L G H6 0 5 15-138 4 2 Screw M 5 X 0.8 10MM[...]

  • Page 109

    7– 12[...]

  • Page 110

    8 Block-Level The ory 8–3 The HP 1650 0B Log ic Anal ysis Syst em 8–3 The Microproce ssor Board 8–6 The Powe r-Up R outi ne 8–9 The Powe r-Up Screen 8–9 Power- Up Se lf-Test s 8–10 Power- Up Task s 8–10 The System Confi gurati on Menu 8 –12 Sel f-Tests Descrip tion 8–13 Power- Up Se lf Test s 8–13 Functio nal Perfo rmance Verifi[...]

  • Page 111

    The ory of Op era tion This chap ter te lls the the ory of op eratio n for the log ic an alys is system an d des crib es the se lf -tests . T he informat i on in this chapter is to help you u nders tand h ow the logic analys is system operate s a n d what th e s elf-tes ts ar e testin g. T hi s informatio n is not in tend ed for co mponent-le vel r[...]

  • Page 112

    Bloc k-Le v e l Theory The b lock-le vel th eor y is d ivid ed into two parts : theory for th e l ogic analy s is s yste m and theory for the micr oproces sor bo ard. A block diagr am is s h own with each theo ry. The HP 16500B Logic A nalysis System The Logic An alysis Syst em 8–3[...]

  • Page 113

    System Ov erview Theory HP 165 00B The HP 16500B is the mainframe for the Logi c Analysis Syst em. Micro processor B o ard The micropro cesso r b oard contains all the interface circuit ry for managing data flow betwee n the mainframe components and the opt ional boards . The microproce sso r used is a Motoro la 68EC0 30. Mother B o a rd Located on[...]

  • Page 114

    HP 165 01A The HP 16501A is the e x pansion frame for the Logi c Analysis System. The expansion fram e component s i nclude t he fo llowing: • Expansio n Interface Bo a rd • Interface Cab le • Mother Bo a rd • Power Supply To connect the expansion frame to the mainframe, you must install an HP 1 6 500L inte rface module into the mainframe. [...]

  • Page 115

    The Microproces sor Board The M i cropr oces so r Board The ory of Op erat io n The Mi crop roce ssor Bo ard 8– 6[...]

  • Page 116

    Micro processor B o ard T heo ry The microprocesso r board cont ains the system memo ry, all of the interfaces for the mainframe peri pherals, the int ermodule b us moni tor, and t he o pti on bo ard module i nterface . Micropro cessor and System ROM & R AM The processi ng engine of t he HP 16500B micro proces sor board is a Moto rola 68EC03 0 [...]

  • Page 117

    HIL Interface The Hewlett -Packard Human Interface Link ( HP-HIL ) is the interface b etwe en t he microproce ssor and t he H P 16500B front panel. In t he write mode , the int erface cont roll er serializ es the 8-bit data and t ransmits the data to t he devices on the link. In the read mode, the data is fed to t he interface controll er in serial[...]

  • Page 118

    The P owe r-Up Routine When powe r is appli ed to the HP 1 6500 B Logic Analy sis Syste m main frame, a se ries of tasks called the power-u p routi ne is per formed to initial ize and to verify operatio n of th e mainfr a me. T he mai nframe mon itor rep orts th e p rogr ess an d status of th e power-up ro utin e. Each of th e tas ks of th e p ower[...]

  • Page 119

    Power-Up S elf-Tests All of the power-up self tests are performe d to verify the operati on of the H P 16500B mainframe. If any o f the se lf-t ests fail , then t he po wer-up ro uti ne is halted and t he F ATAL ERRORS EN CO UNTERED , BOO T HALTED m essag e appears . For more inform atio n about t he individual self-t ests, refer t o "Self-Tes[...]

  • Page 120

    Initi alizi ng and Cali bratin g Mo dules The install ed mo dules are i niti alized and stored cal ibratio n fact ors are uplo aded fro m eithe r the disk drive or module NV-RAM into sys tem RAM. The configurat ion menu of the module using the calibrat ion facto rs will show if the calibrati on factors have bee n successfully l o aded. In some case[...]

  • Page 121

    The S ystem Configuration M enu When t he po wer-up routi ne is com plet e and t he HP 165 00B is operat ional, t he Sy stem Configurati on menu is displayed. The names of the installe d modules appear in fields on the left si de o f the displ ay. The fiel ds co rrespo nd to t he sl ot int o whi ch the mo dule i s install ed. UNR ECOG NI ZED MO D U[...]

  • Page 122

    Self-Te sts De scri ption The s elf-tests iden tify th e cor rect oper ation of th e major sub-s yste ms in th e HP 16500B Logic An alys is System mainframe. The se lf -tests are not intend ed for componen t-level diagno stics . Two type s of tests are pe rformed on the HP 16 500B main fra me: th e p ower-u p self -tests and th e fun ction al perfo[...]

  • Page 123

    RAM T est The RAM T est perform s an abbreviat ed read/writ e test at various memory locatio ns. The t est returns a pass o r fail mess age. F or RAM Test failures, first you can suspect a faulty SIMM module, then you can suspect a faulty microproce ssor board. Interrup t Test The Interrupt Test checks the microproce ssor interrupts (inte rrupts 1 [...]

  • Page 124

    Correlator T est The correlat or t est verifies that the int ermo dule b us tim e co rrelat or o n t he mi croprocesso r board i s funct ioning pro perly. If t he co rrelat or is funct io ning, then inte rmodul e measurement s can be t i me-correlat ed to withi n 2 ns. T hi s t est reports either a pass or fail message. For Correl ator Test failure[...]

  • Page 125

    RAM T est This test checks t he mainframe RAM on the microprocessor board. The t est performs a non-dest ructive patt ern wri te/read at eve ry locati on. The ini tial RAM co ntents are res tor ed after the test. For RAM Test failures, first y o u can suspect a faulty SIMM module, then you can suspect a fault y mi cropro cesso r board. HP-IB T e st[...]

  • Page 126

    Poss ible pro blems causing a fail ed message in e ithe r the flex ible disk drive or hard disk drive include the fol lowi ng: • A damaged o r dis connect ed di sk drive cab le. • Wrong disk formatt ing or no disk formatt ing. • The disk write- protect tab set to the write -prot ect position. • A faulty disk drive. • Faulty microproce sso[...]

  • Page 127

    HP-IB The Hewl ett-Packard Interface Bus (HP-IB) i s Hewlett-Packard ’s i mplemen tation of IEE E Stand ard 488 -1978, "Standard Dig ital In terface for Prog ramm ing Instrumen tation ." HP-IB i s a carefully defined i n terface that simpli fies the inte gratio n of vari ous in str umen ts an d compu ters in to s yste ms. The in terface[...]

  • Page 128

    RS-2 32C The lo gic an alys is sy stem i nter faces wi th R S-23 2C communication lines throug h a stan dar d 25 pin D connecto r. The logic analys is sys tem is compatibl e with R S-232 C protocol . When a hard wire handshake method is use d, the Data Ter minal Read y (DTR) l ine, p in 20 o n th e co nnector, is used to s ignal i f space is avail [...]

  • Page 129

    © Copyright Hewl ett- Packar d Company 1987-1 994 All Rig h ts Rese r ve d. Reprod uc t ion, adaptat ion, or tran slation without prior writt en permission is proh ib it ed, exce pt as allowed under the co pyright l aws. Restricted R ights Legen d Use, duplicat io n, or disclosure by the U.S. Gove rnment i s subject to re stri cti ons set forth in[...]