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Intel mPGA604 manuel d'utilisation

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Tout d'abord, le manuel d’utilisation Intel mPGA604 devrait contenir:
- informations sur les caractéristiques techniques du dispositif Intel mPGA604
- nom du fabricant et année de fabrication Intel mPGA604
- instructions d'utilisation, de réglage et d’entretien de l'équipement Intel mPGA604
- signes de sécurité et attestations confirmant la conformité avec les normes pertinentes

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Habituellement, cela est dû au manque de temps et de certitude quant à la fonctionnalité spécifique de l'équipement acheté. Malheureusement, la connexion et le démarrage Intel mPGA604 ne suffisent pas. Le manuel d’utilisation contient un certain nombre de lignes directrices concernant les fonctionnalités spécifiques, la sécurité, les méthodes d'entretien (même les moyens qui doivent être utilisés), les défauts possibles Intel mPGA604 et les moyens de résoudre des problèmes communs lors de l'utilisation. Enfin, le manuel contient les coordonnées du service Intel en l'absence de l'efficacité des solutions proposées. Actuellement, les manuels d’utilisation sous la forme d'animations intéressantes et de vidéos pédagogiques qui sont meilleurs que la brochure, sont très populaires. Ce type de manuel permet à l'utilisateur de voir toute la vidéo d'instruction sans sauter les spécifications et les descriptions techniques compliquées Intel mPGA604, comme c’est le cas pour la version papier.

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Tout d'abord, il contient la réponse sur la structure, les possibilités du dispositif Intel mPGA604, l'utilisation de divers accessoires et une gamme d'informations pour profiter pleinement de toutes les fonctionnalités et commodités.

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Table des matières du manuel d’utilisation

  • Page 1

    R Document Number: 25423 9-002 mPGA604 Socket Mechanical Design Guide March 2005[...]

  • Page 2

    R 2 mPGA604 Socket Mechanical Design Guid e INFORMATION IN TH IS DOCUMEN T IS PROVIDED IN CON NECTION WITH IN TEL ® PRODUCTS. NO LICENSE, EXPRESS OR IM PLIED, BY ESTOPPEL OR OTHERWISE, TO AN Y INTELLECT UAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PR OVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, IN TEL ASSUME[...]

  • Page 3

    R mPGA604 Socket 3 Mechanical Design Guid e Contents 1 Introduc tion ................................................................................................................... .... 7 1.1 Objective ................................................................................................................ 7 1.2 Purpose .................[...]

  • Page 4

    R 4 mPGA604 Socket Mechanical Design Guid e 5.2 Solvent Resistance .............................................................................................. 28 5.3 Durab ility .............................................................................................................. 28 6 Validation Testi ng Require ments ...................[...]

  • Page 5

    R mPGA604 Socket 5 Mechanical Design Guid e Revision History Revision Number Description Date 001 • Initial release of the document. October 2003 002 • Updated for 2005 Intel ® Xeon™ p roducts. March 2005 Note: Not all revisions may be published.[...]

  • Page 6

    R 6 mPGA604 Socket Mechanical Design Guid e Re-Validation Notice to Socket Vendors Any significant change to the socket will require submission of a detailed explanation of the chang e at least 60 days prior to the planned implementatio n. Intel will review the modification and establish the necessary re-validation procedur e that the socket must p[...]

  • Page 7

    R mPGA604 Socket 7 Mechanical Design Guid e 1 Introduction 1.1 Objective This docum ent defines a surface m ount, Zer o Insertion Force (ZIF) socket inte nded for w orkstation and server plat forms based o n Intel m icroprocessors. The socket provi des I/O, power and ground contacts. The socket cont ai ns 604 cont acts arrayed ab out a cavi ty in t[...]

  • Page 8

    Introduction R 8 mPGA604 Socket Mechanical Design Guid e[...]

  • Page 9

    R mPGA604 Socket 9 Mechanical Design Guid e 2 Assembled Component and Package Description The mPGA604 socket dim ensions an d characteri stics must be compatible with that of the processor package and related assem bly compone nts. Proces sors using flip-chip pi n grid a rray (FC- mPGA4) package technolog y are targeted to be used with the mPGA604 [...]

  • Page 10

    Assembled Component and Package Description R 10 mPGA604 Socket Mechanical Design Guid e[...]

  • Page 11

    R mPGA604 Socket 11 Mechanical Design Guid e 3 Mechanical Requirements 3.1 Attachment A retention system needs to is olate any load in excess of 222.41 N , compressive, from the soc ket during the shock an d vibration cond itions outlined in Section 5 . The socket must pass the mechanical shock and vibra tion requirements listed in Section 5 with t[...]

  • Page 12

    Mechanical Requirements R 12 mPGA604 Socket Mechanical Design Guid e 3.5 Markings All markings required in this section must be able to withstand a temperature of 240 ºC for 40 seconds (minim um) typical of a refl ow profil e for so lder material used on the socket, as well as any environmental test procedure outlined in Secti on 5 . 3.5.1 Name mP[...]

  • Page 13

    R Mechanical Requirements mPGA604 Socket 13 Mechanical Design Guid e 3.7 Socket/Package Translation During Actuation The socket shall be built so that the post-actuated pac kage pin fi eld displacement will not exceed 1.27 mm. Movement will be alo ng the Y direction. No Z-axis travel (lift out) of the pack age is allowed during actuation . 3.8 Orie[...]

  • Page 14

    Mechanical Requirements R 14 mPGA604 Socket Mechanical Design Guid e CFCs and HF Cs shall not be used i n manufact uring the s ocket. It is rec omme nded that any pl astic component exceeding 25g must be recyclable as per the Europea n Blue Angel recycling desi gn guidelines. 3.11 Lever Actuation Requirements • Lever closed d irection—rig ht. ?[...]

  • Page 15

    R Mechanical Requirements mPGA604 Socket 15 Mechanical Design Guid e maintain Critical Process Parameters controlling th ese CTFs or will provide direct measurements to meet ongoing quality requ irements. Table 3-1. Package Critical-To-Functi on (CT F) Dimensions Dimension Socket Length Socket Width Socket Height (Interposer surface from MB) Assemb[...]

  • Page 16

    Mechanical Requirements R 16 mPGA604 Socket Mechanical Design Guid e[...]

  • Page 17

    R mPGA604 Socket 17 Mechanical Design Guid e 4 Electrical Requirements Socket electrical requirements are m easured from the socked-seating plane of the processo r test vehicle (PTV) to the com ponent side of the socket PCB to which it is attached. All specification are maximum values (unless ot herwise stated) for a single soc ket pin, but include[...]

  • Page 18

    Electrical Requirements R 18 mPGA604 Socket Mechanical Design Guid e Table 4-2. Definitions (Sheet 2 of 2) 4 Maximum Average Contact Resistance. Refer to Table 4-1 , Item 4 The max average resistance target is originally derived from max resistance of each chain minus resistance of shorting bars divided by number of pins in the daisy chain. This va[...]

  • Page 19

    R Electrical Requirements mPGA604 Socket 19 Mechanical Design Guid e Figure 4-3 shows the re sistance test fixtures separate ly and superimposed. The upper figure is the package. The next figure is t he baseboard. There ar e 48 daisy chain configura tions on resistance test board. The bottom fi gure is the t wo parts s uperim posed. Table 4-3 shows[...]

  • Page 20

    Electrical Requirements R 20 mPGA604 Socket Mechanical Design Guid e[...]

  • Page 21

    R Electrical Requirements mPGA604 Socket 21 Mechanical Design Guid e Table 4-3. Resistance Test Fixture Netlist (She et 1 of 2) DC Endpoints Edgefingers: Hi Edgefingers: Low Daisy Chain # of © per chain Hi Low +I +V -V -I 1 14 AE2 AE16 A94 A93 A118 A117 2 14 AE29 AE16 A136 A135 A118 A117 3 16 AD1 AD16 A92 A91 A116 A117 4 14 AD30 AD16 A138 A137 A11[...]

  • Page 22

    Electrical Requirements R 22 mPGA604 Socket Mechanical Design Guid e Table 4-3. Resistance Test Fixture Netlist (She et 2 of 2) DC Endpoints Edgefingers: Hi Edgefingers: Low Daisy Chain # of © per chain Hi Low +I +V -V -I 42 16 E28 Y28 A8 A7 A122 A121 43 10 D29 N29 A10 A9 A34 A33 44 8 AA29 N29 A146 A145 A34 A33 45 10 C30 N30 A12 A11 A32 A31 46 10 [...]

  • Page 23

    R Electrical Requirements mPGA604 Socket 23 Mechanical Design Guid e 4.3 Inductance The bottom fixture for t he inductan ce measurement is a ground plane on the seco ndary side of the motherboard with all pins grounded. The com ponent side of t he socket PC B does not co ntain a plane. The top fixture is the package, which contains pins that will c[...]

  • Page 24

    Electrical Requirements R 24 mPGA604 Socket Mechanical Design Guid e 4.3.1 Design Procedure for Inductance Measurements The measurement equipment required to perform the validatio n is: • Equipment - HP8753D Vect or Networ k Analyzer or equiva lent. • Robust Probe Station (GTL4 040) or equival ent. • Probes - G S1250 & GSG1250 Air -Co-Pla[...]

  • Page 25

    R Electrical Requirements mPGA604 Socket 25 Mechanical Design Guid e 4.3.2 Correlation of Measurement and Model Data Inductance To correlate the measurement and m odel data for loop i nductance, one unit of m easured socket assembly (socket and shorted test fixture) and one unit of measured sandwich (shorted test fixture) will be chosen for cross s[...]

  • Page 26

    Electrical Requirements R 26 mPGA604 Socket Mechanical Design Guid e Table 4-4. Net list for FSETV4 Rev 1 Edge Fingers Edge Fingers +I: A61 Jumpers: -I: A145 A85-A89 A45-A17 A135-A141 A59-A57 A129-A133 A7-A5 A87-A95 A15-A13 A139-A143 A49-A47 A131-A137 A3-A1 A101-A99 A11-A9[...]

  • Page 27

    R mPGA604 Socket 27 Mechanical Design Guid e 5 Environmental Requirements Design, including materials, shall be consistent with the manufacture of units that meet the following environmental reference points. The reliability targets in this section are based on the expected field use environment for a desktop product. The test sequ ence for new soc[...]

  • Page 28

    Environmental Requirements R 28 mPGA604 Socket Mechanical Design Guid e 5.1 Mixed Flowing Gas Test will be defined in a future revision of this document. 5.2 Solvent Resistance Requireme nt: No dam age to ink m arkings i f applicable . EIA 36 4-11A 5.3 Durability Use per EIA-364 , test procedure 09. Measure contact resistance when mated in 1st and [...]

  • Page 29

    R mPGA604 Socket 29 Mechanical Design Guid e 6 Validation Testing Requirements This section of the docum ent outlines the tests that m ust be successf ully completed in order for the supplier’s socket to p ass the design guidelines valid ations. It provides the test plan and procedure required for validation . 6.1 Applicable Documents • EIA-364[...]

  • Page 30

    Validation Testing Requirements R 30 mPGA604 Socket Mechanical Design Guid e Typical examples of sign ificant changes include, but are not limited to , the following: Plastic material changes including base ma terial or color; cont act c hanges including base m aterial, plating material or t hickness; an d design m odificati ons. 6.7 Quality Assura[...]

  • Page 31

    R mPGA604 Socket 31 Mechanical Design Guid e 7 Safety Requirements Design, including materials, shall be consistent with the manufacture of units that meet the following safety standards: • UL 1950 most current ed itions. • CSA 950 most current edition. • EN60 950 most current edition an d amendments. • IEC60 950 most current edition and am[...]

  • Page 32

    Safety Requirements R 32 mPGA604 Socket Mechanical Design Guid e[...]

  • Page 33

    R mPGA604 Socket 33 Mechanical Design Guid e 8 Documentation Requirements The socket supp lier shall provide Intel with the following docu mentation: • Multi-Line Coupled SPICE models for socket. • Product design guidelines in corporating the requirements of these design guidelines. • Recommended board layout guidelines for the sock et consis[...]

  • Page 34

    Documentation Requirem ents R 34 mPGA604 Socket Mechanical Design Guid e[...]

  • Page 35

    R mPGA604 Socket 35 Mechanical Design Guid e 9 Mechanical Drawings These drawings refer t o the mPGA604 socket. Note: Intel re serves the right to make cha nges and m odificati ons to the de sign as necessary. Note: Figures m ay not be to scale. Figure 9-1. mPGA604 Socket Dra wing (Sheet 1 of 4)[...]

  • Page 36

    Mechanical Drawing s R 36 mPGA604 Socket Mechanical Design Guid e Figure 9-2. mPGA604 Socket Dra wing (Sheet 2 of 4)[...]

  • Page 37

    R Mechanical Drawing s mPGA604 Socket 37 Mechanical Design Guid e Figure 9-3. mPGA604 Socket Dra wing (Sheet 3 of 4)[...]

  • Page 38

    Mechanical Drawing s R 38 mPGA604 Socket Mechanical Design Guid e Figure 9-4. mPGA604 Socket Dra wing (Sheet 4 of 4)[...]

  • Page 39

    R Mechanical Drawing s mPGA604 Socket 39 Mechanical Design Guid e Figure 9-5. 603-Pin Interposer Assembly Drawing (Sheet 1 of 6)[...]

  • Page 40

    Mechanical Drawing s R 40 mPGA604 Socket Mechanical Design Guid e Figure 9-6. 603-Pin Interposer Assembly Drawing (Sheet 2 of 6)[...]

  • Page 41

    R Mechanical Drawing s mPGA604 Socket 41 Mechanical Design Guid e Figure 9-7. 603-Pin Interposer Assembly Drawing (Sheet 3 of 6)[...]

  • Page 42

    Mechanical Drawing s R 42 mPGA604 Socket Mechanical Design Guid e Figure 9-8. 603-Pin Interposer Assembly Drawing OLGA Keepout (She et 4 of 6)[...]

  • Page 43

    R Mechanical Drawing s mPGA604 Socket 43 Mechanical Design Guid e Figure 9-9. 603-Pin Interposer Assembly Drawing FCBGA2 Keepout (Sheet 5 of 6)[...]

  • Page 44

    Mechanical Drawing s R 44 mPGA604 Socket Mechanical Design Guid e Figure 9-10. 603-Pin Interposer Assembly Drawing (Sheet 6 of 6) §[...]

  • Page 45

    R Mechanical Drawing s mPGA604 Socket 45 Mechanical Design Guid e[...]