HP (Hewlett-Packard) ML350 manuel d'utilisation

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Le mot vient du latin "Instructio", à savoir organiser. Ainsi, le manuel d’utilisation HP (Hewlett-Packard) ML350 décrit les étapes de la procédure. Le but du manuel d’utilisation est d’instruire, de faciliter le démarrage, l'utilisation de l'équipement ou l'exécution des actions spécifiques. Le manuel d’utilisation est une collection d'informations sur l'objet/service, une indice.

Malheureusement, peu d'utilisateurs prennent le temps de lire le manuel d’utilisation, et un bon manuel permet non seulement d’apprendre à connaître un certain nombre de fonctionnalités supplémentaires du dispositif acheté, mais aussi éviter la majorité des défaillances.

Donc, ce qui devrait contenir le manuel parfait?

Tout d'abord, le manuel d’utilisation HP (Hewlett-Packard) ML350 devrait contenir:
- informations sur les caractéristiques techniques du dispositif HP (Hewlett-Packard) ML350
- nom du fabricant et année de fabrication HP (Hewlett-Packard) ML350
- instructions d'utilisation, de réglage et d’entretien de l'équipement HP (Hewlett-Packard) ML350
- signes de sécurité et attestations confirmant la conformité avec les normes pertinentes

Pourquoi nous ne lisons pas les manuels d’utilisation?

Habituellement, cela est dû au manque de temps et de certitude quant à la fonctionnalité spécifique de l'équipement acheté. Malheureusement, la connexion et le démarrage HP (Hewlett-Packard) ML350 ne suffisent pas. Le manuel d’utilisation contient un certain nombre de lignes directrices concernant les fonctionnalités spécifiques, la sécurité, les méthodes d'entretien (même les moyens qui doivent être utilisés), les défauts possibles HP (Hewlett-Packard) ML350 et les moyens de résoudre des problèmes communs lors de l'utilisation. Enfin, le manuel contient les coordonnées du service HP (Hewlett-Packard) en l'absence de l'efficacité des solutions proposées. Actuellement, les manuels d’utilisation sous la forme d'animations intéressantes et de vidéos pédagogiques qui sont meilleurs que la brochure, sont très populaires. Ce type de manuel permet à l'utilisateur de voir toute la vidéo d'instruction sans sauter les spécifications et les descriptions techniques compliquées HP (Hewlett-Packard) ML350, comme c’est le cas pour la version papier.

Pourquoi lire le manuel d’utilisation?

Tout d'abord, il contient la réponse sur la structure, les possibilités du dispositif HP (Hewlett-Packard) ML350, l'utilisation de divers accessoires et une gamme d'informations pour profiter pleinement de toutes les fonctionnalités et commodités.

Après un achat réussi de l’équipement/dispositif, prenez un moment pour vous familiariser avec toutes les parties du manuel d'utilisation HP (Hewlett-Packard) ML350. À l'heure actuelle, ils sont soigneusement préparés et traduits pour qu'ils soient non seulement compréhensibles pour les utilisateurs, mais pour qu’ils remplissent leur fonction de base de l'information et d’aide.

Table des matières du manuel d’utilisation

  • Page 1

    HP Pr oL iant ML3 5 0 Gener ation 5 S er v er Maint enance and Se r v ic e Guide Part Number 405046-008 J uly 2008 (Ei g hth Edition)[...]

  • Page 2

    © Copyright 2006, 2008 Hewlett- Packard Development Company, L.P. The information contained herein is subject to chan ge without no tice. The only warranties for HP products and services ar e set forth in the express warranty statements accompanying such produc ts and services. Noth ing herein should be construed as constituting an a dditional w a[...]

  • Page 3

    Contents 3 Con t en t s Customer se lf re pair ...................................................................................................................... 5 Parts only warr anty service .................................................................................................... ..................... 5 Illustrated pa rts cata log [...]

  • Page 4

    Contents 4 Optical driv e cabl ing .......................................................................................................... ..................... 65 Optional ATA or ATAP I device cabling ........................................................................................... ........... 66 Diagnostic tools .....................[...]

  • Page 5

    Customer self repair 5 C ust omer self r epair HP products are designed with many Customer Self Repair (CSR) parts to minimi ze repair time and allow for greater flexibility in performing def ective parts re placement. If during the di agnosis period HP (or HP service providers or service partners) iden tifies that the repair can be accomplished by[...]

  • Page 6

    Customer self repair 6 • Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplac ement et main d'œuvre du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont é[...]

  • Page 7

    Customer self repair 7 NOTA: alcuni componenti HP non sono progettati per la ri parazione da parte del cl iente. Pe r rispettare la garanzia, HP richiede che queste parti siano sostituite da un c entro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Ca talogo illustrato dei componenti. In base alla disponibilità e [...]

  • Page 8

    Customer self repair 8 anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materiali en, die mit einem CSR- Ersatzteil geliefert werden, könn en Sie entnehmen, ob das defekte Teil an HP zurückgesc hickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzu schicken, müssen Sie dies innerh alb eines vorgegebene[...]

  • Page 9

    Customer self repair 9 Centro de asistencia técnica de HP y reci birá ayu da telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componente s CSR, HP especificará si los componente s defectuosos deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá hace[...]

  • Page 10

    Customer self repair 10 periode, gewoonlijk vijf (5) werkdagen, retourne ren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meeg eleverde verpakkingsmateriaal. Als u het defecte onderdeel niet t erugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant[...]

  • Page 11

    Customer self repair 11 Se r v iço de gar anti a ape nas par a peças A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do serviço de garantia apenas para peças, a HP fo rnece as peças de reposição sem cobrar nenhuma taxa. No caso desse serviço, a substituição de peças CSR é obrigatória[...]

  • Page 12

    Customer self repair 12[...]

  • Page 13

    Customer self repair 13[...]

  • Page 14

    Customer self repair 14[...]

  • Page 15

    Customer self repair 15[...]

  • Page 16

    Illustrated parts catalog 16 Illus tr ated par ts catalog Mechanical components Item Description Spare part number Customer self repair (on page 5 ) 1 Access panel 413981-001 Mandatory 1 2 Rack bezel 41398 3-001 Mandatory 1 3 Front bezel, tower mode l 413982-001 Mandatory 1 4 SATA/SAS hard drive cage, SFF 413985-001 Optional 2 5 SATA/SAS hard drive[...]

  • Page 17

    Illustrated parts catalog 17 Item Description Spare part number Customer self repair (on page 5 ) 6 Hard drive blank, SFF 392613-001 Mandatory 1 7 Hard drive blank, LFF* 389015-001 Mandatory 1 8 Plastics/hardware k it 413989-001 Mandatory 1 a) Removable media blank — — b) Retainer card guide — — c) Power supply blank — — d) Foot, carbon[...]

  • Page 18

    Illustrated parts catalog 18 HP realice su sustitución, puede o no conllevar costes adi cionales, dependiendo del tipo de servicio de garantía correspondiente al producto. 3 No: No—Algunos componentes no están diseñados para que puedan ser repa rados por el usuario. Para que el usuario haga valer su garantía, HP pone como condición que un p[...]

  • Page 19

    Illustrated parts catalog 19 System components Item Description Spare part number Customer self repair (on page 5 ) System components 9 Fan assembly, 92-mm 413978-001 Mandatory 1 10 3-V lithium battery 234556-001 Mandatory 1 11 Heatsink 413977-001 Optional 2 12 Processor with thermal grease and alcohol pad — — a) Dual-Core, Intel® Xeon ® Proc[...]

  • Page 20

    Illustrated parts catalog 20 Item Description Spare part number Customer self repair (on page 5 ) e) Dual-Core, Intel® Xeon® Proc essor 5120 (1.86-GHz, 1066 - MHz FSB, 1x4-MB L2 cache)*† 416794-001 Optiona l 2 f) Dual-Core, Intel® Xeon® Processor 5130 (2.0-GHz, 1333- MHz FSB, 1x4-MB L2 cache)*† 416796-001 Optional 2 g) Dual-Core, Intel® Xe[...]

  • Page 21

    Illustrated parts catalog 21 Item Description Spare part number Customer self repair (on page 5 ) a) System board with tray and screws, supports Intel® Xeon® 50xx and 51xx processors† 413984-001 Optiona l 2 b) System board with tray and screws, supports Intel® Xeon® 52xx, 53xx, and 54xx processors*† 439399-001 Optiona l 2 16 Power supply ba[...]

  • Page 22

    Illustrated parts catalog 22 Item Description Spare part number Customer self repair (on page 5 ) j) 500-GB, SATA, 7,200- rpm, LFF* 404654-001 Mandatory 1 k) 1-TB, SATA, 7,200-rp m, LFF* 461289-001 Mandatory 1 29 Parallel and second serial connector bracke t* 418300-001 Mandatory 1 30 Keyboard* 355630-001 Mandatory 1 31 Mouse* 344704-001 Mandatory [...]

  • Page 23

    Illustrated parts catalog 23 1 Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet. 2 Optional: Optional—Teile, für die das Customer Self Repa ir-Verfahren optional ist. Diese Te[...]

  • Page 24

    Illustrated parts catalog 24[...]

  • Page 25

    Removal and replacement procedures 25 R emo v al and r eplacement pr ocedur es Required tools You need the following item s for some procedures: • T-15 Torx screwdriver • Flathead screwdriver • Diagnostics Utility Safety considerations Before performing service proced ures, review all the safety information. Preventing electrostatic discharge[...]

  • Page 26

    Removal and replacement procedures 26 This symbol indicates the presence of el ec tric shock hazards. The area contains no user or field serviceable parts. Do not open for any reason. WARNING: To reduce the risk of injury from el ectric shock hazards, do not open this enclosure. This symbol on an RJ-45 receptacle indicates a network interface conne[...]

  • Page 27

    Removal and replacement procedures 27 WARNING: To reduce the risk of personal injury or damage to the equipment, adequately stabilize the rack before extending a componen t outside the rack. Extend only one compon ent at a time. A rack may become unstable if more than one component is extended. WARNING: When installing a server in a telco rack , be[...]

  • Page 28

    Removal and replacement procedures 28 The system is now without power. Extend the server from the rack 1. Power down the server (on page 27 ). 2. Pull down the quick-release levers on each side of the server to release the server fr om the rack. IMPORTANT: If the server is installed in a telco rack , remove the server from the rack to acc ess inter[...]

  • Page 29

    Removal and replacement procedures 29 Front bezel This server has a removable bezel that must be un locked and opened before accessin g the front panel components. The bezel should be kept cl osed during normal serv er operations. Use the key provided with the server to unlock the bezel with a clo ckwise turn. If necessary, remove the bezel. CAUTIO[...]

  • Page 30

    Removal and replacement procedures 30 Tower foot To remove the component: 1. Power down the server (on page 27 ). 2. Remove the tower bezel (" Front bezel " on page 29 ). 3. Place the server on its side. 4. Remove the foot. To replace the component, reverse the r emoval procedure. Access panel CAUTION: Do not operate the server with the a[...]

  • Page 31

    Removal and replacement procedures 31 Rack bezel To remove the component: 1. Power down the server (on page 27 ). 2. Extend the server from the rack (on page 28 ). 3. Remove the access panel. 4. Remove the bezel. To replace the component, reverse the r emoval procedure. Rack rails NOTE: This procedure applies to rack servers only. To remove the com[...]

  • Page 32

    Removal and replacement procedures 32 4. Slide the rail forward and remove it from the server. 5. Repeat the steps above to remove the other rail. To replace the component, reverse the r emoval procedure. Power supply blank Remove the blank from the bay. To replace the component, reverse the r emoval procedure. Hot-plug power supply WARNING: To red[...]

  • Page 33

    Removal and replacement procedures 33 CAUTION: Do not attempt to remove and replac e a power supply as a hot-plug procedure unless both bays are populated with power supplies. To remove the component: 1. Disconnect the power cord from the AC source. 2. Disconnect the power cord from the power supply. 3. Remove the power supply. CAUTION: To prevent [...]

  • Page 34

    Removal and replacement procedures 34 NOTE: Depending on model purchased, the server may look slightly different than shown. To replace the component, reverse the r emoval procedure. Hot-plug SATA and SAS hard drives To remove the component: CAUTION: To prevent improper cooling and therma l damage, do not operate the server unless all bays are popu[...]

  • Page 35

    Removal and replacement procedures 35 3. Remove the hard drive. To replace the component, reverse the r emoval procedure. IMPORTANT: When installing a x3/x1 SAS cable in a SFF system, HP recommends that the x3 part of the x3/x1 cable be linked to the SAS ha rd drive backplane connector that corresponds to hard drive slots 1 to 4. In this setup, har[...]

  • Page 36

    Removal and replacement procedures 36 6. Remove the four T-15 s crews and slide th e hard drive cage out of the chassis. 7. Remove all hard drives. To replace the components, revers e the removal procedure. NOTE: When replacing or installing a 6-bay hard drive cage, connect the 10-pin power cable from the power backplane to the 8-pin power connecto[...]

  • Page 37

    Removal and replacement procedures 37 o Unlock and remove the bezel (" Front bezel " on page 29 ). o Extend the server from the rack (on page 28 ). 3. Remove the access panel. 4. Remove the air baffle. To replace the component, reverse the r emoval procedure. System fans CAUTION: The system fan is a non-hot-pluggable device. Fan failures [...]

  • Page 38

    Removal and replacement procedures 38 6. Remove the fan. To replace the component, reverse the r emoval procedure. Expansion slot cover To remove the component: 1. Do one of the following: o Unlock and remove the bezel (" Front bezel " on page 29 ). o Extend the server from the rack (on page 28 ). 2. Remove the access panel. 3. Push the r[...]

  • Page 39

    Removal and replacement procedures 39 4. Remove the expansion slot cover. CAUTION: To prevent improper cooling and therma l damage, do not operate the server unless all PCI slots have either an expansion slo t c over or an expansion board installed. To replace the component, reverse the r emoval procedure. Expansion board CAUTION: To prevent damage[...]

  • Page 40

    Removal and replacement procedures 40 5. Push the release latches on the expansion board retainer and open the retainer. 6. Remove the T-15 Torx screw securing the expansion board, if necessary. 7. Remove the expansion board. To replace the component, reverse the r emoval procedure. Media bay blank To remove the component: 1. Open or remove the tow[...]

  • Page 41

    Removal and replacement procedures 41 3. Remove the media bay blank. To replace the component, reverse the r emoval procedure. Battery-backed write cache module To remove the component: 1. Power down the server (on page 27 ). 2. Do one of the following: o Open or remove the tower bezel, as needed (" Front bezel " on page 29 ). o Extend th[...]

  • Page 42

    Removal and replacement procedures 42 PCI-X expansion cage CAUTION: To prevent damage to the server or ex pansion boards, power down the server and remove all AC power cords before removing or installing the PCI expansion cage. To remove the component: 1. Power down the server. 2. Do one of the following: o Unlock and remove the bezel (" Front[...]

  • Page 43

    Removal and replacement procedures 43 8. Pull the spring-loaded lockin g pin out of its socket. 9. Remove the PCI-X expansion cage.[...]

  • Page 44

    Removal and replacement procedures 44 10. Remove any expansion boards. To replace the components, revers e the removal procedure. Half-height or full-height media device To remove the component: 1. Power down the server (on page 27 ). 2. Do one of the following: o Unlock and remove the bezel (" Front bezel " on page 29 ). o Extend the ser[...]

  • Page 45

    Removal and replacement procedures 45 o SATA DVD-ROM drive 5. Remove the device. o Half-height[...]

  • Page 46

    Removal and replacement procedures 46 o Full-height To replace the component, reverse the r emoval procedure. IMPORTANT: Be sure to connect the right-angle end of the SAT A data cable to the system board. Connecting it to the SATA drive may inte rfere with other installed media bay devices. IMPORTANT: If both SATA and PATA optical device s are inst[...]

  • Page 47

    Removal and replacement procedures 47 6. Remove the heats ink. To replace the component: 1. Use the alcohol swab to remove all the existing th ermal grease from the processor. Allow the alcohol to evaporate before continuing. 2. Remove the heats ink prot ective co ver.[...]

  • Page 48

    Removal and replacement procedures 48 3. Install the heatsink. 4. Close the heatsink lockin g levers. 5. Connect the heatsink fan cable to the system board. 6. Install the access panel. 7. Do one of the following: o Close or install the tower bezel, as need ed. o Slide the server back into the rack. 8. Power up the server. Processor IMPORTANT: If u[...]

  • Page 49

    Removal and replacement procedures 49 IMPORTANT: PPM 2 must be installed when processor 2 is install ed. The system fails to boot if the PPM is missing. CAUTION: To prevent possible serv er malfunction, do not mix processors of different speeds or cache sizes. Refer to the label on the proces so r heatsink for a descript ion of the processor. IMPOR[...]

  • Page 50

    Removal and replacement procedures 50 7. Using your fingers, remove the failed processor. To replace the component: IMPORTANT: Be sure the processor r emains inside the processor installation tool. 1. If the processor has separated from the in stallation tool, carefully re-insert th e processor in the tool. 2. Align the processor installation tool [...]

  • Page 51

    Removal and replacement procedures 51 3. Press down firmly until the processor in stallation tool clicks and separates from the processor, and then remove the processor installation tool.[...]

  • Page 52

    Removal and replacement procedures 52 4. Close the processor retaining latch and th e processor socket retaini ng bracket. 5. Clean the old thermal grease fr om the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing. 6. Apply all the grease to the top of the processor in one of the foll owing patterns to ensure even di[...]

  • Page 53

    Removal and replacement procedures 53 7. Install the heatsink. 8. Close the heatsink lockin g levers 9. Connect the heatsink fan cable to the system board. 10. Install the access panel. 11. Do one of the following: o Close or install the tower bezel, as need ed. o Slide the server back into the rack. 12. Power up the server. PPM NOTE: PPM 1 is embe[...]

  • Page 54

    Removal and replacement procedures 54 To remove the component: 1. Power down the server (on page 27 ). 2. Do one of the following: o Unlock and remove the bezel (" Front bezel " on page 29 ). o Extend the server from the rack (on page 28 ). 3. Remove the access panel. 4. Open the PPM latches. 5. Remove the PPM. NOTE: The appearance of com[...]

  • Page 55

    Removal and replacement procedures 55 5. Remove the redundant fan, if applicable. 6. Remove the FBDIMM. To replace the component, reverse the r emoval procedure. Parallel and second serial connector bracket To remove the component: 1. Power down the server (on page 27 ). 2. Do one of the following: o Unlock and remove the bezel (" Front bezel [...]

  • Page 56

    Removal and replacement procedures 56 5. Remove the T-15 Torx screw securing the para llel and second serial connector bracket. 6. Remove the parallel and second serial connector bracket. To replace the component, reverse the r emoval procedure. Battery If the server no longer automatically displays th e correct date and time, you may need to repla[...]

  • Page 57

    Removal and replacement procedures 57 4. Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery , reconfigure t he system through RBSU. To replace the component, reverse the r emoval procedure. For more information about battery replacement or prop er disposa[...]

  • Page 58

    Removal and replacement procedures 58 CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts. • Always install the processor socket cover after removing the processor from the so cket. • Do not tilt or slide the processor when lowerin g the processor into the socket. CAUTION: Removal of the processor or hea[...]

  • Page 59

    Removal and replacement procedures 59 CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts. • Always install the processor socket cover after removing the processor from the so cket. • Do not tilt or slide the processor when lowerin g the processor into the socket. 13. Disconnect all cables connect ed to [...]

  • Page 60

    Removal and replacement procedures 60 a. Open the processor retaining latch and the processor socket retaining bracket. b. Remove the processor socket protective cover. 3. Install the processor socket cover onto the pr ocessor socket of the f ailed system board. 4. Install the processor on the spare system board. CAUTION: The processor is design ed[...]

  • Page 61

    Removal and replacement procedures 61 5. Close the processor retaining latch and th e processor socket retaini ng bracket. 6. Clean the old thermal grease fr om the heatsink an d the top of the processor with the alcohol swab. Allow the alcohol to evapo rate before continuing.[...]

  • Page 62

    Removal and replacement procedures 62 7. Apply all the grease to the top of the processor in one of the foll owing patterns to ensure even distribution: 8. Install the heatsink.[...]

  • Page 63

    Removal and replacement procedures 63 9. Close the heatsink lockin g levers. 10. Connect the heatsink fan cable to the system board. IMPORTANT: Install all components with the same co nfiguration that was used on the failed system board. 11. Install all components removed fr om the failed syst em board. 12. Install the access panel. 13. Do one of t[...]

  • Page 64

    Removal and replacement procedures 64 Power supply backplane To remove the component: 1. Power down the server (on page 27 ). 2. Remove the power supplies (" Hot-plug power supply " on page 32 ). 3. Do one of the following: o Unlock and remove the bezel (" Front bezel " on page 29 ). o Extend the server from the rack (on page 28[...]

  • Page 65

    Cabling 65 C abling Optional SATA or SAS cabling Many configurations are possible when SATA or SAS controllers are added. When upgrading the storage controller, refer to the Quic kspecs and th e cabling matrix to identify the correct cables ( http://h10010.www1.hp.com/wwpc/ pscmisc/va c/us/en/ss/proliant/proliant-ml.html ). Standard SATA cabling It[...]

  • Page 66

    Cabling 66 • PATA optical drive cabling • SATA optical drive cabling Optional ATA or ATAPI device cabling This server includes one PATA cable (the Cable Sele ct Cable) that can connect up to two ATA o r ATAPI devices to the system through the integrated PATA controller. This cable has three clearly labeled connectors. If only one PATA device is[...]

  • Page 67

    Diagnostic tools 67 Diagno sti c tools Troubleshooting resources The HP ProLiant Servers Troubleshoot ing Guide provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, error message interpretation, issue resolution, and software maintenance on ProLiant servers and server bl ades.[...]

  • Page 68

    Diagnostic tools 68 For additional information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack or the HP SIM website ( http://www.hp.com/go/hpsim ). Integrated Management Log The IML records hundreds of events and s tores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity. You can view re[...]

  • Page 69

    Diagnostic tools 69 For more information regarding array co ntroller configuration, refer to the controll er user guide. For more information regarding the defa ult configurations that ORCA uses, refer to the HP ROM-Based Setup Utility User Guide on the Documentation CD. HP ProLiant Essentials Rapid Deployment Pack The RDP software is the preferred[...]

  • Page 70

    Diagnostic tools 70 • Access advanced troubleshooting featur es through the iLO 2 interface. • Diagnose iLO 2 using HP SIM throug h a web browser and SNMP alerting. For more information about iLO 2 features, refer to the iLO 2 documentation on the Documentation CD or on the HP website ( http://www.hp.com/servers/light s-out ). System Online ROM[...]

  • Page 71

    Diagnostic tools 71 HP Insight Diagnostics HP Insight Diagnostics is a proactive serv er manage ment tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to a ssist IT administrators who verify server installations, troubles hoot pr oblems, and perform repair validation. HP Insight Diagnost[...]

  • Page 72

    Component identification 72 C omponen t iden tif i cation Front panel components Item Description 1 Removable media bays (4) 2 CD-ROM drive 3 Hot-plug hard drive bays (8-bay drive cage model) 4 Hot-plug hard drive bays (6-bay drive cage model) 5 USB connectors (2)[...]

  • Page 73

    Component identification 73 Front panel LEDs and buttons Item Description Status 1 Power On/Standby button — 2 System power LED Green = Power on Amber = System shut down, but power still applied Off = No power 3 Internal health LED Green = Normal Amber = System degraded. To identify the component in a degraded state, refer to system board LEDs. R[...]

  • Page 74

    Component identification 74 Rear panel components Item Description 1 Video connector 2 Serial connector 3 USB connectors (2) 4 RJ-45 Ethernet connector (iLO 2 management) 5 RJ-45 Ethernet connector (data) 6 PCI Express x8 slots (x4 routed) 7 PCI-X slots (100-MHz) 8 PCI-X slot (133-MHz) 9 Optional redundant hot-plug power supply bay 10 Mouse connect[...]

  • Page 75

    Component identification 75 Rear panel LEDs and buttons Item Description Status 1 Power supply LED Green = Power supply is on and functioning Off = No power or inadequate power supply 2 UID LED and button Blue = Activated Flashing blue = Remote inquiry Off = Deactivated 3 iLO 2 activi ty LED Green or flashing = Network activity Off = No network act[...]

  • Page 76

    Component identification 76 System board components NOTE: PPM 1 is embedded in the system board. Item Description 1 Processor 1 heatsink fan connector 2 Processor socket 1 3 Processor socket 2 4 Power supply connectors 5 Processor 2 heatsink fan connector 6 Power button/LED connector 7 PATA connector 8 Diskette drive connector 9 SAS/SATA connector [...]

  • Page 77

    Component identification 77 Item Description 22 PCI Express x8 slots 4-6 (x4 routed) 23 PPM 2 slot 24 Optional redundant system fa n 4 connector 25 System fan 2 connector 26 Optional redundant system fa n 3 connector 27 System fan 1 connector 28 FBDIMM slots NMI jumper The NMI jumper allows administrators to perform a me mory dump before performi n[...]

  • Page 78

    Component identification 78 System board LEDs Item Description Status 1 FBDIMM 1-8 Amber = FBDIMM fa iled Off = FBDIMM functioning 2 Processor 1 Amber = Processor 1 failed Off = Processor 1 function ing 3 Processor 1 fan failure (fan 5) Amber = Fan is not installed or has failed Off = Processor fan is functioning 4 PPM 1 (embedded ) Amber = PPM 1 f[...]

  • Page 79

    Component identification 79 Item Description Status 12 Optional redundant system fan 2 Amber = Redundant fan has failed Off = Redundant fan is functioning 13 System fan 1 Amber = Fa n is not installed or has failed Off = Rear fan is functioning 14 Online spare memory Amber = Online spare memory is in use due to memory failover Off = Normal operatio[...]

  • Page 80

    Component identification 80 System LED and color Internal health LED color Status Overtemperature (amber) Red • The Health Driver has detected a cautionary temperature level. • The server has detected a hardware critical temperature level. Fan (amber) Red The minimum fan requir ements are not being met. Fan has failed. Amber A fan has failed bu[...]

  • Page 81

    Component identification 81 Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation Flashing regularly (1 Hz) Amber, flashing regularly (1 Hz) Do not remove the drive. Removing a drive may terminate the current operation and cause data loss. The drive is part of an array that is undergoing capacity expansion or stripe migration, but a[...]

  • Page 82

    Specifications 82 Sp e c i fica tio n s Environmental specifications Specification Value Temperature range* Operating 10 ° C to 35 ° C (50 ° F to 95 ° F) Shipping -40 ° C to 70 ° C (- 40 ° F to 158 ° F) Maximum wet bulb temperature 28 ° C (82.4 ° F) Relative humidity (noncondensing)** Operating 10% to 90% Non-operating 5% to 95% * All tem[...]

  • Page 83

    Specifications 83 Specification Value Maximum peak power 1000 W (low line), 1200 W (high line) Rack server specifications Specification Value Dimensions Height 21.7 cm (8.54 in) Depth (with bezel) 55.7 cm (21.9 in) Width (with bezel) 44.5 cm (17.5 in) Weight (no drives installed) 27.24 kg (60 lb) Input requirements Rated input voltage 100 V AC to 2[...]

  • Page 84

    Specifications 84 Specification Value Drive rotation 300 rpm Transfer rate High 500 Kb/s Low 250 Kb/s Bytes/sector 512 Sectors per track (high/low) 18/9 Tracks per side (high/low) 80/80 Access times Track-to-track (high/low) 3 ms/6 ms Average (high/low) 169 ms/9 4 ms Setting time 15 ms Latency average 100 ms Cylinders (high/low) 80/80 Read/write he[...]

  • Page 85

    Specifications 85 Specification Value Height 41 mm (1.6 in) Depth 172 mm (6.7 in) Width 147 mm (5.8 in) Weight 1 kg (2.2 lb) Data transfer rate Sustained 150 KB/s (sustained 1X), 1500/3600 KB/s (10X to 24X) Burst 16.6 MB/s Access times (typical) Full stroke 300 ms Random 140 ms Diameter 12 cm, 8 cm (4.70 in, 3.15 in) Thickness 1.2 mm (0.05 in) Trac[...]

  • Page 86

    Specifications 86 Specification Value Width 147 mm (5.8 in) Weight 1 kg (2.2 lb) Data transfer rate Sustained 4463 - 10,800 KB/s (8X CAV DVD mo de), 150 KB/s (sustained 1X CD-ROM), 1500 - 7200 K B/s (10X - 48X CAV ) Burst 150 MB/s Access times (typical) Full stroke <210 ms CD <250 ms DVD Random <125 ms CD <140 ms DVD Diameter 12 cm, 8 c[...]

  • Page 87

    Acronyms and abbreviations 87 A c r on y ms and abbr e v i ations ABEND abnormal end ASR Automatic Server Recovery ATA Advanced Technology Attachment ATAPI Advanced Technology Atta chment Packet Interfac e BIOS Basic Input/Output System DDR double data rate FBDIMM fully buffered DIMM iLO 2 Integrated Lights-Out 2 IML Integrated Management Log ISEE [...]

  • Page 88

    Acronyms and abbreviations 88 NMI non-maskable interrupt NVRAM non-volatile memory ORCA Option ROM Configuration for Arrays PATA parallel ATA PCI Express Peripheral Component Interconnect Express PCI-X peripheral component interconnect ext ended PPM processor power module RAID redundant array of inexpensive (or independent) disks RBSU ROM-Based Set[...]

  • Page 89

    Acronyms and abbreviations 89 SIM Systems Insight Manager UID unit identification USB universal serial bus[...]

  • Page 90

    Index 90 A air baffle 36 Altiris Deployment Solution 69 Altiris eXpress Deployment Server 69 Autorun menu 70 B battery 56 BIOS upgrade 69 blanks 32, 33, 40 buttons 72, 73 C cables 65, 66 cabling 65, 66 CD-ROM drive 44, 72, 84 component identification 72, 74, 80 components 16, 19, 72, 74 configuration of system 69 connectors 72, 73, 74 creating a di[...]

  • Page 91

    Index 91 M management tools 67 mechanical components 16 media devices 44, 65 N NIC LEDs 72, 73, 75, 79 NMI jumper 77 O Online ROM Flash Compo nent Utility 70 Option ROM Configuration for Arrays (ORCA) 68 ORCA (Option ROM Configuration for Arrays ) 68 P parallel connector 55, 74 part numbers 16, 19 PATA optical drive 44, 65 power LEDs, system 72, 73[...]