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HP (Hewlett-Packard) DL365 manuel d'utilisation

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Le mot vient du latin "Instructio", à savoir organiser. Ainsi, le manuel d’utilisation HP (Hewlett-Packard) DL365 décrit les étapes de la procédure. Le but du manuel d’utilisation est d’instruire, de faciliter le démarrage, l'utilisation de l'équipement ou l'exécution des actions spécifiques. Le manuel d’utilisation est une collection d'informations sur l'objet/service, une indice.

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Tout d'abord, le manuel d’utilisation HP (Hewlett-Packard) DL365 devrait contenir:
- informations sur les caractéristiques techniques du dispositif HP (Hewlett-Packard) DL365
- nom du fabricant et année de fabrication HP (Hewlett-Packard) DL365
- instructions d'utilisation, de réglage et d’entretien de l'équipement HP (Hewlett-Packard) DL365
- signes de sécurité et attestations confirmant la conformité avec les normes pertinentes

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Tout d'abord, il contient la réponse sur la structure, les possibilités du dispositif HP (Hewlett-Packard) DL365, l'utilisation de divers accessoires et une gamme d'informations pour profiter pleinement de toutes les fonctionnalités et commodités.

Après un achat réussi de l’équipement/dispositif, prenez un moment pour vous familiariser avec toutes les parties du manuel d'utilisation HP (Hewlett-Packard) DL365. À l'heure actuelle, ils sont soigneusement préparés et traduits pour qu'ils soient non seulement compréhensibles pour les utilisateurs, mais pour qu’ils remplissent leur fonction de base de l'information et d’aide.

Table des matières du manuel d’utilisation

  • Page 1

    HP Pr oL iant DL3 6 5 S er v er Maintenance and S e r v i ce Gui de Part Number 418289- 005 March 2008 (Fifth Edition)[...]

  • Page 2

    © Copyright 2006, 2008 Hewlett-Pa ckard Development Company, L.P. The in format ion c onta ined h erein is su bject to chan ge withou t not ice. The onl y war ranti es for HP product s an d servi ces ar e s et fort h in the expr ess warrant y st atements accom pany ing such produ cts an d ser vices. Noth ing h erein shoul d be constru ed as c onst[...]

  • Page 3

    Contents 3 Con t e n t s Custom er self re pair ........................................................................................................... ........... 5 Parts only war ranty s erv ice .................................................................................................... ........................ 5 Illustrated par ts ca[...]

  • Page 4

    Contents 4 PCI Sma rt Array c o ntr oller ca bl ing ............................................................................................. ........ 59 Battery pa ck ca blin g........................................................................................................... .............. 60 Diagnos tic tools .........................[...]

  • Page 5

    Customer self repair 5 C ust omer self r epair HP products are designed with many Customer Self Repair (CSR) parts to minimize r epair time and allow for greater flexibility in performing defective parts re placement. If during the di agnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by t[...]

  • Page 6

    Customer self repair 6 • Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vou s demandez à HP de remplacer ces pièces, les coûts de déplacement et main d' œuv re du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont [...]

  • Page 7

    Customer self repair 7 NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste par ti siano sostituit e da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti. In base alla disponibilità e all[...]

  • Page 8

    Customer self repair 8 anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR- Ersatzteil geliefert werden, k önnen Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschi cken, müssen Sie dies innerhalb eines vorgegebenen Z[...]

  • Page 9

    Customer self repair 9 Centro de asistencia técnica de HP y recibirá ay uda telefónica por parte de un técni co. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectu osos deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá hacer[...]

  • Page 10

    Customer self repair 10 periode, gewoonlijk vijf (5) we rkdagen, retourneren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant b[...]

  • Page 11

    Customer self repair 11 Para obter mais informações sobre o programa de re paro feito pelo cliente da HP, entre em contato com o fornecedor de serv iços local. Para o pr og rama norte-americano, visite o site da H P ( http://www.h p.com/go/s elfrepair ). Se rv iço de gar anti a a pena s par a peças A garantia limitada da HP pode incluir um ser[...]

  • Page 12

    Customer self repair 12[...]

  • Page 13

    Customer self repair 13[...]

  • Page 14

    Customer self repair 14[...]

  • Page 15

    Customer self repair 15[...]

  • Page 16

    Illustrated parts catalog 16 Illus tr ated par ts cata log Mechanical components Item Description Spare part number Customer se lf repai r ( on page 5 ) 1 Access panel 431360-001 Mandatory 1 2 Miscellaneous hardware ki t 431359-001 Mandatory 1 a) Optical dev ice blank* — — b) Air baff le — — c) HP Smart Array E200i batter y tray — — d) [...]

  • Page 17

    Illustrated parts catalog 17 Item Description Spare part number Customer se lf repai r ( on page 5 ) Rack mo unting hardwa re 5 Rack mo unting ha rdwar e kit* 360104-001 Mandatory 1 6 Cabl e management ar m* 360105-001 Mandatory 1 *Not shown 1 Mandatory—Parts f or which customer self repai r is mandator y. If you request HP to replace th ese part[...]

  • Page 18

    Illustrated parts catalog 18 sustitución de esto s componente s. Dichos compone ntes se id entifican con la palabra “No” en el catálogo il ustrado de componentes. 1 Mandatory: Verplicht—Onderdelen waarv oor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te vervange n, komen d e reiskosten en het arbeid sloon voor uw re[...]

  • Page 19

    Illustrated parts catalog 19 System components Item Description Spare part number Customer self repa ir (on page 5 ) 7 System fan m odule 412212-001 Mandatory 1 8 Hot-plug power suppl y, 700-W 412211-001 Mandatory 1 9 PCIe riser board assembly 412200-001 Mandatory 1 10 Processor — — a) 1.8-GHz, 95- W AMD Opter on™ 419473-001 Optional 2 b) 2.4[...]

  • Page 20

    Illustrated parts catalog 20 Item Description Spare part number Customer self repa ir (on page 5 ) k) 3.0-GHz, 95- W AMD Opter on™* 451810-00 1 Optional 2 11 Heatsink wi th grease and alcohol swab 431356-001 Optional 2 Boards 12 HP Smart Array con trollers — — a) HP Sm art Array E200i Con troller, integrated SAS 412205-001 Mandatory 1 b) HP S[...]

  • Page 21

    Illustrated parts catalog 21 Item Description Spare part number Customer self repa ir (on page 5 ) Miscellaneous 27 SAS cable* 408763-001 Mandatory 1 28 Smart Array batter y cable* 409124-001 Mandatory 1 29 AC power cord* 142258-001 Mandatory 1 30 Battery, 3.3-V, lith ium* 234556-001 Mandatory 1 *Not shown 1 Mandatory—Parts f or which customer se[...]

  • Page 22

    Illustrated parts catalog 22 3 No: No—Algun os componentes no están diseñados para qu e puedan ser reparad os por el usuario. Par a que el usuario haga valer su garantía, HP pone como c ondición que un prov eedor de servicios aut orizado realice la sustitución de esto s componente s. Dichos compone ntes se id entifican con la palabra “No?[...]

  • Page 23

    Removal and replac ement procedures 23 R emo val and r epla cement pr ocedur es Required tools You need the following items for some pro cedures: • T-10 Torx screwdriver • T-15 Torx screwdriver • Diagnostics Utility Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharg[...]

  • Page 24

    Removal and replac ement procedures 24 This symbol indicates the presence of elec tric shock hazards. The area contains no user or field serviceable parts . Do not open for any reason. WARNING: To reduce the r isk of injury fr om electric shock haz ards, do not open t his enclosure. This symbol on an RJ-45 receptacle in dicates a network interface [...]

  • Page 25

    Removal and replac ement procedures 25 Preparation procedures To access some components and perf orm certain service procedures , you must perfo rm one or more of the following procedures: • Extend the server from the rack (on page 25 ). If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack cabinet, you can[...]

  • Page 26

    Removal and replac ement procedures 26 IMPORTA NT: If installing a hot-plug device, it is not nec essary to power down the server. 1. Back up the server data. 2. Shut down the operating system as directed by the operating system documentation. 3. If the server is installed in a rack, press the UID LED button on the front panel. Blue LEDs illuminate[...]

  • Page 27

    Removal and replac ement procedures 27 Hot-plug SAS or SATA hard drives CAUTION: To prevent improper cooling and therm al damage, do not operate the server unless all bays are populated with either a component or a bla nk. Remove the component as indicated. To replace the component, reve rse the removal procedure. Front bezel 1. Power down the serv[...]

  • Page 28

    Removal and replac ement procedures 28 6. Remove the T-10 Torx screw s located on the sides o f the bezel. 7. Gently push on the two tabs located at the top of the be zel 8. Rotate the bezel away from the server and remove the bezel. To replace the component, reve rse the removal procedure. Hard drive bezel blanks CAUTION: To prevent improper cooli[...]

  • Page 29

    Removal and replac ement procedures 29 2. Remove the hard drive bezel blank. To replace the component, reve rse the removal procedure. Hot-plug power supply WARNING: To reduce the r isk of electric s hock, do not disassemble the power supply or attempt to repair it. Replace it only with the specified sp are part. CAUTION: Do not attempt to remove a[...]

  • Page 30

    Removal and replac ement procedures 30 3. Remove the power supply. To replace the component, reve rse the removal procedure. Power supply blank Remove the component as indicated. To replace the component, reve rse the removal procedure. Access panel WARNING: To reduce the risk of personal injury from hot surfaces, allow the dr ives and the internal[...]

  • Page 31

    Removal and replac ement procedures 31 CAUTION: Do not operate the server for lo ng periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper coolin g that can lead to thermal damage. To remove the component: 1. Power down the server if the standard c able management solution is inst[...]

  • Page 32

    Removal and replac ement procedures 32 To remove the component: 1. Power down the server (on page 25 ). 2. Extend or remove the server from the rack (" Extend the server from the rack " on page 25 , " Remove the server from the rack " on page 26 ). 3. Remove the access panel (" Access panel " on page 30 ). 4. Remove th[...]

  • Page 33

    Removal and replac ement procedures 33 o HP Smart Array E200i battery tray o HP Smart Array P400i battery tray To replace the component, reve rse the removal procedure. Battery pack CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID leve l migration, or [...]

  • Page 34

    Removal and replac ement procedures 34 3. Remove the access panel (" Access panel " on page 30 ). 4. Remove the air baffle (" Air baffle " on page 31 ). 5. Remove fan module 2 (" Fan module " on page 31 ). 6. Remove the battery tray (" Battery tray " on page 32 ). 7. Remove the battery pack. o HP Smart Array [...]

  • Page 35

    Removal and replac ement procedures 35 NOTE: Access to the ejector button is intentionally restri cted. To eject the opti cal device, push the ejector button with a small flat object such as a key or pen. 2. Eject the device or blank. CAUTION: To prevent improper cooling and therm al damage, do not operate the server unless all bays are populated w[...]

  • Page 36

    Removal and replac ement procedures 36 9. Remove the multibay backplane assembly. 10. Remove the multibay backplane board from the assembly. To replace the component, reve rse the removal procedure. SAS backplane To remove the component: 1. Power down the server (on page 25 ). 2. Extend or remove the server from the rack (" Extend the server f[...]

  • Page 37

    Removal and replac ement procedures 37 10. Disconnect the power and data cables from the SAS backplane. 11. Remove the three T-15 Torx screws from the backplane. 12. Remove the backplane. To replace the component, reve rse the removal procedure. Systems Insight Display The Systems Insight Displa y is an a ssembly that includes the front panel LEDs,[...]

  • Page 38

    Removal and replac ement procedures 38 4. Remove the front bezel (" Front bezel " on page 27 ). 5. Remove the air baffle (" Air baffle " on page 31 ). 6. Remove fan module 3 (" Fan module " on page 31 ). 7. Remove the multibay backplane assembly (" Multibay backplane assembly " on page 35 ). 8. Disconnect the[...]

  • Page 39

    Removal and replac ement procedures 39 CAUTION: To prevent dam age to the server or ex pansion boards, power down the server and remove all AC power cords before removing or installing the PCI riser board assembly. 1. Power down the server (on page 25 ). 2. Extend or remove the server from the rack (" Extend the server from the rack " on [...]

  • Page 40

    Removal and replac ement procedures 40 6. Remove any expansion board installed in the assembly. To replace the component, reve rse the removal procedure. CAUTION: To prevent improper cooling and therm al damage, do not operate the server unless all PCI slots have either an ex pansion slot cover or an expansion board installed. PCI Express riser boa[...]

  • Page 41

    Removal and replac ement procedures 41 8. Remove the full-length PCI Express rise r board from the riser board assembly . To replace the component, reve rse the removal procedure. Integrated HP Smart Arra y E200i Controller or HP Smart Array P400i Controller To remove the component: 1. Power down the server (on page 25 ). 2. Extend the server from [...]

  • Page 42

    Removal and replac ement procedures 42 6. Disconnect the backplane power c able from the system board. 7. Turn the quarter-turn fasteners an d lift the integrated array controller away from the sy stem board. To replace the component, reve rse the removal procedure. DIMMs To remove the component: 1. Power down the server (on page 25 ). 2. Extend th[...]

  • Page 43

    Removal and replac ement procedures 43 6. Remove the DIMM. To replace the component, reve rse the removal procedure. Heatsink To remove the component: 1. Power down the server (on page 25 ). 2. Extend the server from the rack (on page 25 ). 3. Remove the access panel (" Access panel " on page 30 ). 4. Remove the air baffle (" Air baf[...]

  • Page 44

    Removal and replac ement procedures 44 1. Use the alcohol swab to remove all the ex isting ther mal grease from the processor. Allow the alcohol to evaporate before continuing. 2. Apply new grease to the top of the processor in one of the following patterns to ensure even distribution. CAUTION: The heatsink thermal interface media is not reusable a[...]

  • Page 45

    Removal and replac ement procedures 45 The server uses embedded PPMs as DC-to-DC converter s to provide the proper power to eac h processor. WARNING: To reduce the risk of personal injury from hot surfaces, allow the dr ives and the internal system components to cool before touch ing them. CAUTION: To avoid damage to the processor and sy stem board[...]

  • Page 46

    Removal and replac ement procedures 46 6. Remove the heatsink. 7. Open the processor retaining latch and th e processor socket retaining bracket.[...]

  • Page 47

    Removal and replac ement procedures 47 8. Using your fingers, remove the failed proc essor. IMPORTA NT: Be sure the replacement processor remains inside the processor installation tool. 9. If the processor has separated from the installation to ol, carefully re-insert the processor in the tool. 10. Align the processor installation tool with th e so[...]

  • Page 48

    Removal and replac ement procedures 48 11. Press down firmly until the processor installation t ool clicks and separates from the processor, and then remove the processor installation tool.[...]

  • Page 49

    Removal and replac ement procedures 49 12. Close the processor retaining latch and th e processor socket retaining bracket. 13. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing. 14. Apply all the grease to the top of the processor in one of the following patterns to e nsure even [...]

  • Page 50

    Removal and replac ement procedures 50 15. Install the heatsink. 16. Install the air baffle (" Air baffle " on page 31 ). 17. Install the access panel (" Access panel " on page 30 ). 18. Slide the server into the rack. 19. Power up the server. System battery If the server no longer automatically display s th e correct date and t[...]

  • Page 51

    Removal and replac ement procedures 51 5. Remove the battery. IMPORTA NT: Replacing the system board battery re sets the system ROM to its default configuration. After replacing the battery, reconfigure th e system through RBSU. To replace the component, reve rse the removal procedure. For more information about battery replacement or prop er dispo[...]

  • Page 52

    Removal and replac ement procedures 52 CAUTION: To help avoid damage to the processor and system board, do not install the processor without using the processor installation tool. CAUTION: Removal of the processor or heatsink renders the thermal layer between the processor and heatsink useless. A new heat sink must be ordered and installed before r[...]

  • Page 53

    Removal and replac ement procedures 53 12. For each installed processor, open the processor re taini ng latch and the processor socket retaining bracket on the failed system board. 13. For each installed processor, use your fingers to re move the processor from th e failed sy stem board. CAUTION: To avoid damage to the system board: • Do not touc[...]

  • Page 54

    Removal and replac ement procedures 54 14. Remove the failed system b oard. To replace the system board: 1. Install the spare system board in the se rver before installing the processor. 2. Prepare the processor socket o n the spare system board. a. Remove the processor socket protective cover.[...]

  • Page 55

    Removal and replac ement procedures 55 b. Open the processor retaining latch and th e processor socket retaining bracket. 3. Install the processor socket cover onto the proc essor socket of the failed sy stem board. 4. Install the processor on th e spare system board. CAUTION: The processor is designed to fit o ne wa y into the socket. Use the alig[...]

  • Page 56

    Removal and replac ement procedures 56 5. Close the processor retaining latch and th e processor socket retaining bracket. 6. Clean the old thermal grease from the proc essor and heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing. 7. Apply grease to the top of the processor in one of the following patterns to en sure e[...]

  • Page 57

    Removal and replac ement procedures 57 10. Install all power supplies (" Hot-plug power supply " on page 29 ). 11. Install the access panel (" Access panel " on page 30 ). 12. Power up the server. After you replace the system board, you must re-enter the server serial number and the product ID. 1. During the server startup sequ [...]

  • Page 58

    Cabling 58 Cabl in g Cabling overview This section provides guidelines that help you make info rmed decisions about cabling the serv er and hardware options to optimize performance. For information on cabling peripheral components, refe r to the white paper on high- density deployment at the HP website ( http://www.hp.com/prod ucts/servers/platform[...]

  • Page 59

    Cabling 59 HP Smart Array P4 00i Controll er cabling CAUTION: When routing cables, use the cable trou gh between fan modules 1 and 2. Be sure the cables do not interfere with fan module installation. Be sure to route the cables around the DIMM connectors so as not to in terfere with DIMM installation. PCI Smart Array controller cabling CAUTION: Whe[...]

  • Page 60

    Cabling 60 Battery pack cabli ng • HP Smart Array E200i Controller battery pack c abling[...]

  • Page 61

    Cabling 61 • HP Smart Array P400i Controller battery pack cabling[...]

  • Page 62

    Diagnostic tools 62 Di agno st i c t ool s Troubleshooting resources The HP ProLiant Serve rs Troubleshooting Guide provides procedures for resolv ing common problems and comprehensive courses of action for fault isolation and i dentification, error message interpretation, issue resolution, and software maintenance on ProLiant se rv ers and server [...]

  • Page 63

    Diagnostic tools 63 HP Insight Diagnostics su rvey functionality HP Insight Diagnostics (on page 64 ) provides survey functionality that gathers critical hardware and software information on ProLiant serv ers. This functionality suppo rts operating systems that may no t be supported by the server. For operating systems suppo rted by the server, see[...]

  • Page 64

    Diagnostic tools 64 For more information, refer t o th e Management CD in the HP ProL iant Essentials Foundation Pack. Automatic Server Recovery ASR is a feature that causes the system to restart wh en a catastro phic operating system error oc curs, such as a blue screen, ABEND, or panic. A system fail-saf e timer, the ASR timer, starts when the Sy[...]

  • Page 65

    Diagnostic tools 65 Open Services Event Manager OSEM is a standalone tool that perf orms real-time reactive and proactiv e service event filtering, analysis, and notification. The tool gathers ev ent data from SNMP traps or information provided ov er an HTTP interface and notifies an administrator or HP through S MTP and ISEE. For more information,[...]

  • Page 66

    Component identification 66 C ompo nent identif i catio n Front panel components Item Description 1 Hard drive bay 5 (optional) * 2 Hard drive bay 6 (optional) * 3 Multibay drive bay 4 HP Systems Insight Display 5 USB connector 6 Video connector 7 Hard drive bay 4 8 Hard drive bay 3 9 Hard drive bay 2 10 Hard drive bay 1 11 Serial pull tab *An opti[...]

  • Page 67

    Component identification 67 Front panel LEDs and buttons Item Description Status 1 Power On/ Standby button and system power LED Green = System is on. Amber = System is sh ut down, but power is still applied. Off = Power c ord is not attached, power supply f ailure has occurred, no power supplie s are installed, f acility power is n ot available, o[...]

  • Page 68

    Component identification 68 Item Description Status 6 NIC 2 lin k/activity LED Green = Network lin k exists. Flashing green = Network li nk and activi ty exist. Off = N o link to network exists. If power is off, the f ront panel LED is not active. View the LEDs on the RJ-45 conn ector for status by referri ng to the rear pan el LEDs (" Rear pa[...]

  • Page 69

    Component identification 69 Rear panel LEDs and buttons Item Description Status 1 iLO 2 NIC activity LED Green = Activity exists. Flashing green = Activity exists. Off = No activity exists. 2 iLO 2 NIC link LED Green = Link exists. Off = N o link exists. 3 10/100/1000 NIC 1 activity LED Green = Activity exists. Flashing green = Activity exists. Off[...]

  • Page 70

    Component identification 70 System board components Item Description 1 System battery 2 NMI jumper 3 System maintenance switc h (SW1) 4 Internal U SB connector 5 Multiba y connector 6 Power switch co nnector 7 DIMM slots (1-4) 8 Fan modu le 3 connect ors 9 Fan modu le 2 connect ors 10 DIMM slots (5-8) 11 Fan module 1 connectors 12 SFF hard drive ba[...]

  • Page 71

    Component identification 71 System maintenance switch Position Defau lt F unction S1 Off Off = iLO 2 secur ity is enab led. On = iLO 2 secur ity is disab led. S2 Off Off = System co nfigur ation can be mod ified. On = System conf igura tion is lo cked and cannot be modified. S3 Off Reserved S4 Off Reserved S5 Off O ff = Power- on password is enable[...]

  • Page 72

    Component identification 72 To view the LEDs, acc ess the HP System s Insight Display. LED Sta tus Off Normal Amber Fai lure For additional information about these LE Ds, see "HP Sy stems Insight Displa y LEDs and internal health LED combinations (on page 72 )." NOTE: The HP Systems Insight Display LEDs represent t he system board layout.[...]

  • Page 73

    Component identification 73 HP Systems Insight Display LE D and color Internal health LED c olor Status PPM failu re (amber) Red In tegrated PPM has failed. DIMM failure, slot X (amber) Red One or more o f the follow ing co nditions may exist: • DIMM in slot X has failed. • DIMM in slot X is an unsupported type, an d no valid memory exis ts in [...]

  • Page 74

    Component identification 74 • Six hard drive configuration SAS and SATA hard drive LEDs Item Description 1 Fault/UID LED (amb er/blue) 2 Online L ED (gree n)[...]

  • Page 75

    Component identification 75 SAS and SATA hard drive LED combinations Online/activity LED (gr een) Fault/UID LE D (amber/blue) Interpretation On, off, o r flash ing Alternating amber and blue The drive has failed, or a pred ictive failure alert has been received for this d rive; it also has been selected by a managem ent application . On, off , or f[...]

  • Page 76

    Component identification 76 Fan locations Item Description 1 Fan module 1 2 Fan module 2 3 Fan module 3[...]

  • Page 77

    Specifications 77 Sp e cific a t io n s Environmental specifications Specification Value Tempera ture ra nge* Operat ing 10 ° C to 35 ° C (50 ° F to 95 ° F) Shipping -40 ° C to 70 ° C (-40 ° F to 158 ° F) Maximu m wet bu lb tempera ture 28 ° C (82.4 ° F) Relative hu midity (noncond ensi ng)** Operating 10% to 90% Non-operati ng 5% to 95% [...]

  • Page 78

    Specifications 78 Specification Value Rated steady-state power 700 W Hot-plug power supply calculations For hot-plug power supply spec ifications and calculators to determin e electrical and heat loading for the server, refer to the HP Enterprise Configurator website ( http://h30099.www 3.hp.com /configurato r/ ). DDR2 SD RAM DIMM specifications CA[...]

  • Page 79

    Specifications 79 Specification Value Track -to-track (high/low ) 3 ms/6 ms Average (h igh/low) 169 ms/94 ms Setting time 15 ms Latency averag e 100 ms Cylinders (high/low) 80/80 Read/write h eads 2 CD-ROM drive specifications Specification Value Disk formats CD-RO M (modes 1 and 2); m ixed mode (audi o and data co mbin ed); CD- DA; Photo CD ( sing[...]

  • Page 80

    Specifications 80 Specification Value Operatin g conditions Temperature 5°C to 45°C (41°F to 118°F) Humidity 5% to 90% DVD-ROM drive specific ations Specification Value Disk formats DVD (single and dou ble layer), DVD-5, DVD-9, DVD-10, DVD-R, CD-ROM Mode 1 & 2, CD-DA, CD -XA (Mode 2, Form 1 & 2), CD- I (Mode 2, Form 1 & 2), CD-I rea[...]

  • Page 81

    Specifications 81 Specification Value Operatin g conditions Temperature 5°C to 45°C (41°F to 118°F) Humidity 5% to 90% SAS hard drive specifications Item 36-GB SAS drive 72-GB SAS drive 146-GB SAS d rive Capacity 36,420 MB 73,408 MB 146,815 MB Height 25.4 mm (1.0 in) 25.4 mm (1.0 in) 25.4 mm (1.0 in) Interface SAS SAS SAS Transfer rate 3 Gb/sec[...]

  • Page 82

    Acronyms an d abbreviations 82 A c r on y ms and abbr e v i ati ons ABEND abnormal end ASR Automatic Server Recovery BBWC battery-backed write cache DDR double data rate IML Integrated Management Log NIC network interface controller NVRAM non-volatile memory OSEM Open Services Event Manager PCI Express Peripheral Component Interconnect Express PCI-[...]

  • Page 83

    Acronyms an d abbreviations 83 RBSU ROM-Based S etup Utility SAS serial attached SCSI SATA serial ATA SFF small form-factor SIM Systems Insight Mana ger UID unit identification USB universal serial bus[...]

  • Page 84

    Index 84 A access panel 30 additional information 62 ADU (Array Diagnostic Utility) 62 air baffle 25, 31 array controller, cabling 5 8, 59 array controller, removing 41 Array Diagnostic Utility (ADU) 62 ASR (Automatic Server Recovery) 64 Automatic Server Recovery (ASR) 64 B backplane, SAS 35 battery tray 32 battery-backed write cache battery pack 3[...]

  • Page 85

    Index 85 LEDs 66, 75 LEDs, hard driv e 74, 75 LEDs, NIC 67, 69 LEDs, power button/LED board 67 LEDs, unit identificati on (UID) 6 7 M management tools 62 mechanical components 16 multibay backplane assembly 35 multibay blank, removing 34 multibay/SAS backplane, removing 35 N NIC LE Ds 67 P PCI array controllers, cabling 58 PCI Express riser boards [...]