HP (Hewlett-Packard) H3L41AARABA manual

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Buen manual de instrucciones

Las leyes obligan al vendedor a entregarle al comprador, junto con el producto, el manual de instrucciones HP (Hewlett-Packard) H3L41AARABA. La falta del manual o facilitar información incorrecta al consumidor constituyen una base de reclamación por no estar de acuerdo el producto con el contrato. Según la ley, está permitido adjuntar un manual de otra forma que no sea en papel, lo cual últimamente es bastante común y los fabricantes nos facilitan un manual gráfico, su versión electrónica HP (Hewlett-Packard) H3L41AARABA o vídeos de instrucciones para usuarios. La condición es que tenga una forma legible y entendible.

¿Qué es un manual de instrucciones?

El nombre proviene de la palabra latina “instructio”, es decir, ordenar. Por lo tanto, en un manual HP (Hewlett-Packard) H3L41AARABA se puede encontrar la descripción de las etapas de actuación. El propósito de un manual es enseñar, facilitar el encendido o el uso de un dispositivo o la realización de acciones concretas. Un manual de instrucciones también es una fuente de información acerca de un objeto o un servicio, es una pista.

Desafortunadamente pocos usuarios destinan su tiempo a leer manuales HP (Hewlett-Packard) H3L41AARABA, sin embargo, un buen manual nos permite, no solo conocer una cantidad de funcionalidades adicionales del dispositivo comprado, sino también evitar la mayoría de fallos.

Entonces, ¿qué debe contener el manual de instrucciones perfecto?

Sobre todo, un manual de instrucciones HP (Hewlett-Packard) H3L41AARABA debe contener:
- información acerca de las especificaciones técnicas del dispositivo HP (Hewlett-Packard) H3L41AARABA
- nombre de fabricante y año de fabricación del dispositivo HP (Hewlett-Packard) H3L41AARABA
- condiciones de uso, configuración y mantenimiento del dispositivo HP (Hewlett-Packard) H3L41AARABA
- marcas de seguridad y certificados que confirmen su concordancia con determinadas normativas

¿Por qué no leemos los manuales de instrucciones?

Normalmente es por la falta de tiempo y seguridad acerca de las funcionalidades determinadas de los dispositivos comprados. Desafortunadamente la conexión y el encendido de HP (Hewlett-Packard) H3L41AARABA no es suficiente. El manual de instrucciones siempre contiene una serie de indicaciones acerca de determinadas funcionalidades, normas de seguridad, consejos de mantenimiento (incluso qué productos usar), fallos eventuales de HP (Hewlett-Packard) H3L41AARABA y maneras de solucionar los problemas que puedan ocurrir durante su uso. Al final, en un manual se pueden encontrar los detalles de servicio técnico HP (Hewlett-Packard) en caso de que las soluciones propuestas no hayan funcionado. Actualmente gozan de éxito manuales de instrucciones en forma de animaciones interesantes o vídeo manuales que llegan al usuario mucho mejor que en forma de un folleto. Este tipo de manual ayuda a que el usuario vea el vídeo entero sin saltarse las especificaciones y las descripciones técnicas complicadas de HP (Hewlett-Packard) H3L41AARABA, como se suele hacer teniendo una versión en papel.

¿Por qué vale la pena leer los manuales de instrucciones?

Sobre todo es en ellos donde encontraremos las respuestas acerca de la construcción, las posibilidades del dispositivo HP (Hewlett-Packard) H3L41AARABA, el uso de determinados accesorios y una serie de informaciones que permiten aprovechar completamente sus funciones y comodidades.

Tras una compra exitosa de un equipo o un dispositivo, vale la pena dedicar un momento para familiarizarse con cada parte del manual HP (Hewlett-Packard) H3L41AARABA. Actualmente se preparan y traducen con dedicación, para que no solo sean comprensibles para los usuarios, sino que también cumplan su función básica de información y ayuda.

Índice de manuales de instrucciones

  • Página 1

    HP Pr oL iant Mi c r oSer ver Gen8 Maintenance an d Serv i ce Guide Abstract This docume nt is for an experienced servi ce technicia n. It is helpful if you are qualifie d in the servicing of comp uter equip ment and trained in recogn izing hazard s in produ cts w ith hazar dous e nergy levels and are fam iliar with we ight and stabilit y precau ti[...]

  • Página 2

    © Copyright 2013 Hewlett - Packar d Dev elopm ent C omp any, L .P. The informa tion contained herei n is subject to change wit hout notice . The on ly w arran ties f or HP produ cts and servic es ar e set forth in th e ex press warran ty st atemen ts accom pany ing su ch produ cts an d services . Nothing here in sh ould be c onstru ed a s con stit[...]

  • Página 3

    Contents 3 C ontents Customer self repair ...................................................................................................................... 5 Parts o nly warran ty service ............................................................................................................................ 5 Illustrated parts catalog ....[...]

  • Página 4

    Contents 4 HP pro duct QuickSpe cs .............................................................................................................................. 63 HP Insight Diagnost ics ................................................................................................................................ 63 HP Insight Diagnost ics surve[...]

  • Página 5

    Customer self repair 5 C us tomer self r epair HP products are designed wi th many Customer Self Repa ir (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partne rs) identif ies that the re pair can be accomplished by[...]

  • Página 6

    Customer self repair 6 Obligatoire - Pièces pou r lesquelles la réparation par le client est obligatoire. Si vous demandez à H P de remplacer c es pièces, l es coûts de déplac ement et main d 'œuvre du servic e vous sero nt factu rés. Facultatif - Pièces pou r lesquelles la répar ation par le c lient est facu ltative. Ces pi èces so[...]

  • Página 7

    Customer self repair 7 In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stes so o entro quattro ore è offerta con un supplemento di costo solo in alcune zone. In caso di necessità si può ric hiedere l'assisten za telefo nica di un a[...]

  • Página 8

    Customer self repair 8 defekte Teil nic ht zurü ckschicken , kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier - /Frachtdi enst. Weitere Informationen über das H P Customer Self Repair Programm erhalten Sie von Ihrem S ervic[...]

  • Página 9

    Customer self repair 9 enviara el componente defe ctuoso requerido, HP podrá cobrarle por el de sustituc ión. En el caso de todas sustituc iones que l leve a cabo el client e, HP se hará c argo de todos los gasto s de envío y devoluc ión de compon entes y escogerá la em presa de transpor te que se utilic e para dicho servicio. Para obtener m?[...]

  • Página 10

    Customer self repai r 10 Neem contac t op met een Servic e Partner voor m eer inform atie over het C ustomer Self Rep air program ma van HP. Informatie over Service Partners vindt u op de HP website ( h ttp://www.h p.c om/go/selfrepai r ). Gar antie se r v ice "P ar ts O nly" Het is mogelijk dat de HP garantie alleen de garantieserv ice &[...]

  • Página 11

    Customer self repair 11 No caso desse serviç o, a subst ituição de peças CSR é obrigat ória. Se desejar que a HP substi tua essas peças, serão cobradas as despesas de transporte e mão - de - obra do serviço.[...]

  • Página 12

    Customer self repair 12[...]

  • Página 13

    Customer self repair 13[...]

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    Customer self repair 14[...]

  • Página 15

    Illustrated parts catalog 15 I llus tr ated par ts c atalog M echanical c omponents Item Description Spare part numbe r Custom e r sel f repair (on page 5 ) 1 Chassis cover 724494 - 001 Mandatory 1 2 Optic al drive blank 724499 - 001 Mandatory 1 3 LFF non - hot - plug drive carrie r* 691585 - 001 Mandatory 1 4 Front bezel assembly 724490 - 0 01 Man[...]

  • Página 16

    Illustrated parts catalog 16 2 Option al — Parts for which customer self repair is optional. T hese parts are also designed for customer se lf repair. If , howev er, you re quire t hat HP replac e the m for yo u, th ere m ay or may not be addi tion al charg es, dependi ng on the type of warranty servi ce desig nated for your product. 3 No — Som[...]

  • Página 17

    Illustrated parts catalog 17 2 Option al: Opci onal — Peças cujo reparo fe ito pelo c lien te é opci onal. Es sas peças também são projetad as par a o reparo fei to pelo c lien te. No e ntanto, se desej ar que a HP as subst itua, p ode have r ou não a cobran ça de tax a adicio nal, depen dendo do ti po de s erviç o de garan tia dest inado[...]

  • Página 18

    Illustrated parts catalog 18 S ystem compon ents Item Description Spare part numbe r Custom e r sel f repair (on page 5 ) 7 LFF non - hot - pl ug drive bracket as sembly 724493 - 001 Mandatory 1 8 Capacit or pack 671353 - 001 Mandator y 1 9 Front I/O module assembly 724492 - 0 01 No 3 10 SATA DVD - RW opti cal dri ve (9.5 mm, 0.37 in) 724498 - 001 [...]

  • Página 19

    Illustrated parts catalog 19 Item Description Spare part numbe r Custom e r sel f repair (on page 5 ) c) 4 GB, dual - rank x8 P C3 - 12800E - 11* 684034 - 001 Mandatory 1 d) 4 GB, du al - rank x8 PC3L - 10600E - 9* 664695 - 001 Mandato ry 1 e) 8 GB, dual - rank x8 PC 3 - 12800E - 11* 684035 - 001 Mandatory 1 f) 8 GB, dua l - rank x8 PC 3L - 10600E [...]

  • Página 20

    Illustrated parts catalog 20 3 No: No — Algunos compon entes no están di señados para que puedan ser repar ados por el us uario. Para q ue el usu ario haga valer su g arantía, HP pon e com o condici ón que un prove edor de servic ios autoriza do r ealice la sustitución de estos componentes. Dichos componentes se identifican con la p alabra ?[...]

  • Página 21

    Rem oval and repl acemen t procedures 21 R emo v al and r eplac ement pr oce dur es R equired tool s You need the fo llowing it ems for some p rocedur es: • T- 10/T - 15 To rx screwdri ver (on page 74 ) • HP Insight Diagnostics (on page 63 ) S afety consi derations Before perfor ming service pr ocedures, review all the saf ety informati on. P r[...]

  • Página 22

    Remov al and replac emen t procedures 22 This symbol on an RJ - 45 receptacle indicates a network interface connection. WARNING: To reduce the risk of elec tric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors int o this receptacle. This symbol in dicates the pr esence of a ho t surface or hot c ompone[...]

  • Página 23

    Remov al and replac emen t procedures 23 • Remove the fron t bezel (on page 25 ). • Remove the chassi s cover (on page 26 ). • Remove the system board a ssembly (on page 28 ). P ower down t he server Before powering down the s erver for any upgrade or maintenance procedures , perform a ba ckup of critical server data and programs. WARNING: To[...]

  • Página 24

    Remov al and replac emen t procedures 24 O pen the fron t b ezel If the front bezel is not secured from inside the c hassis, open the bezel. If the fron t bezel is secured from inside th e chassis, do the foll owing (Perfo rm steps 1 to 3 only if the server is turned on.): 1. Power do wn the server (on page 23 ). 2. Discon nect the power cord from [...]

  • Página 25

    Remov al and replac emen t procedures 25 6. Open the f ront bezel. R emove th e front bezel If the front bezel is not secured from inside the c hassis, open the fr ont bezel, an d then release the h inges fro m the front panel. If the fron t bezel is secured from inside th e chassis, do the foll owing (Perfo rm steps 1 to 3 only if the server is tu[...]

  • Página 26

    Remov al and replac emen t procedures 26 5. Slide the relea se tab upwar d to unl ock the front b ezel from the chassi s. 6. Open the f ront bezel. 7. Release the bez el hinges fr om the fro nt panel. R emove the chassis cover 1. Power do wn the server (on page 23 ). 2. Discon nect the power cord from th e AC source. 3. Discon nect the power cord f[...]

  • Página 27

    Remov al and replac emen t procedures 27 7. Slide the c hassis cover to ward the r ear panel, and then lift it to remove it from the chassis. I nstall the chassis c over 1. Align the i nstallatio n markers on the chassis c over with those located o n the front edge of the chassis, and then slide the chassis cover back onto the server. 2. Tighten th[...]

  • Página 28

    Removal and replacemen t procedures 28 7. Power u p the server. R emove th e system board assembly 1. Power do wn the server (on page 23 ). 2. Discon nect the power cord from th e AC source. 3. Discon nect the power cord from th e server. 4. Remove the c hassis cover (o n page 26 ). 5. It is recommended that you take a picture of the cu rrent syste[...]

  • Página 29

    Remov al and replac emen t procedures 29 8. Press the system board tray latch. 9. Slide the syst em board asse mbly co mpletely out of the chassis.[...]

  • Página 30

    Remov al and replac emen t procedures 30 I nstall the system board assembly 1. Slide the syst em board asse mbly into the chassis. 2. Connect all cables disconnec ted from the system board and/or expansion board. D rive ca rrier CAUTION: To prevent improper cooling and thermal damage, do not operate the serv er unless all bays are populated with ei[...]

  • Página 31

    Remov al and replac emen t procedures 31 L FF no n - hot - plug drive CAUTION: To prevent improper cooling and thermal damage, do not operate the serv er unless all bays are populated with either a component or a blank. To remove the c omponent: 1. Back up all server data on the drive. 2. Power do wn the server (on page 23 ). 3. If the fr ont bezel[...]

  • Página 32

    Remov al and replac emen t procedures 32 e. Release the bezel hinges f rom the fro nt panel. 5. Remove the dri ve. 6. Remove the drive from the carrier. To replace th e compon ent, reverse the rem oval procedu re.[...]

  • Página 33

    Remov al and replac emen t procedures 33 O ptical dri ve blank To remove the c omponent: 1. Power do wn the server (on page 23 ). 2. Discon nect the power cord from th e AC source. 3. Discon nect the power cord from th e server. 4. Remove the c hassis cover (o n page 26 ). 5. Press the optical drive blank release latches, and then pull the blank ou[...]

  • Página 34

    Remov al and replac emen t procedures 34 6. Press the o ptical dri ve release lever, and th en push the dri ve out of th e bay. To replace th e compon ent, reverse the rem oval procedu re. Flash- backed write cache procedu res The following types of procedures are provided for the FBWC option: • Removal and replacement of failed components: o Rem[...]

  • Página 35

    Remov al and replacement procedures 35 4. Remove the c hassis cover (o n page 26 ). CAUTION: When connecting or disconnecting the capacitor pack cable , the connectors on the cache module and cable are susceptible to damage. Avoid excessive force and use cauti on to avoid damage to these connectors. 5. Discon nect the ca pacitor pack cable from the[...]

  • Página 36

    Remov al and replac emen t procedures 36 2. Discon nect the power cord from th e AC source. 3. Discon nect the power cord from th e server. 4. Remove the c hassis cover (o n page 26 ). 5. If the existing cache module is connected to a capacito r pack, observe the FBWC module LEDs: o If a backup is in progress, wait for the backup to complete. o If [...]

  • Página 37

    Remov al and replac emen t procedures 37 R ecovering data from the flash - backed wr ite c ache If the server fail s, use the fo llowing procedu re to rec over data temporaril y stored in the FBWC. CAUTION: Before starting this procedure, read the information about protec ting against electrostatic discharge (" Preventing electrostatic dischar[...]

  • Página 38

    Remov al and replac emen t procedures 38 c. To detach the cover from the chassis, push the latches toward the front. 9. Remove the po wer button /LED mo dul e: a. Release the mo dule cabl e from the to p chassis c lips. b. Remove the mo dule brac ket screw. c. Remove the module bra cket.[...]

  • Página 39

    Remov al and replac emen t procedures 39 d. Press the two module latches together, and then pull the module from the chassis. 10. Remove the front USB module: a. Remove the US B module sc rew. b. Pull the USB module out of the chassis. 11. Remove the fr ont I/O mo dule assembly: a. Pull the blue loop to disconnect the front I/O module cable from th[...]

  • Página 40

    Remov al and replac emen t procedures 40 c. Release the cable from the left - side cable clip. d. Pull the modu le cable out through the top chassis opening. e. Pull the entire ass embly out of the front USB module chassis opening. To replace th e compon ent, reverse the rem oval procedu re. A mbient temperatu re sensor cable To remove the c ompone[...]

  • Página 41

    Remov al and replac emen t procedures 41 6. Remove the am bient temper ature senso r cable: a. Open the l eft - side chassi s cable cl ip. b. If more working room is required, disconnect the followi ng cables from the system board: — System board p ower cable — Optical drive SATA cable — Mini - SAS cable c. Pull the brown loop to dis connect [...]

  • Página 42

    Remov al and rep lacemen t procedures 42 3. Discon nect the power cord from th e server. 4. Open the f ront bezel (o n page 24 ). 5. Remove all d rives (" LFF non - hot - plug drive " on page 31 ) and drive carriers (" Drive carrier " on page 30 ). 6. If the c hassis cover was n ot removed in step 4, rem ove it (" Remove th[...]

  • Página 43

    Remov al and replac emen t procedures 43 c. Disconnect the dr ive power cable f rom the P SU 4 - pin drive power connector. d. Pull the drive power c able out from t he right side chassis o pening. 9. Release the Mini - SAS ca ble from the c hassis:[...]

  • Página 44

    Remov al and replac emen t procedures 44 a. Disconnect the Mini - SAS cable from the syste m board or from a storage controller. b. Pull the Mini - SAS cab l e out from the lef t side chassis o pening toward the ri ght side one u ntil the cable is relea sed from the chassi s. 10. Remove the no n - hot - plug drive cage bracket: a. Remove the bra ck[...]

  • Página 45

    Remov al and replac emen t procedures 45 c. Pull the bracket out of the chassis. To replace th e compon ent, reverse the rem oval procedu re. S ystem fan To remove the c omponent: 1. Power do wn the server (on page 23 ). 2. Discon nect the power cord from th e AC source. 3. Discon nect the power cord from th e server. 4. Remove the c hassis cover ([...]

  • Página 46

    Remov al and replac emen t procedures 46 I ntegrated po wer supply WARNING: To reduce the risk of personal injury from hot surfaces, allow the power s upply or power supply blank to cool before touching it. To remove the c omponent: 1. Power do wn the server (on page 23 ). 2. Discon nect the power cord from th e AC source. 3. Discon nect the power [...]

  • Página 47

    Remov al and replac emen t procedures 47 c. Remove the power supply. To replace th e compon ent, reverse the rem oval procedu re. E xpansion boar d To remove the c omponent: 1. Power do wn the server (on page 23 ). 2. Discon nect the power cord from th e AC source. 3. Discon nect the power cord from th e server. 4. Remove the c hassis cover (o n pa[...]

  • Página 48

    Remov al and replac emen t procedures 48 8. Remove the expan sion board. To replace th e compon ent, reverse the rem oval procedu re. DIMMs G eneral DIMM slo t population guidelin es • The server suppo rts a maxi mum of 16 GB mem ory using two 8 GB single - rank or d ual - rank UDIMMs. • The server support s up to 1600 MT/s ECC UDIM Ms. • LV [...]

  • Página 49

    Remov al and replac emen t procedures 49 R emovin g a D IMM 1. Power do wn the server (on page 23 ). 2. Discon nect the power cord from th e AC source. 3. Discon nect the power cord from th e server. 4. Remove the c hassis cover (o n page 26 ). 5. Open the DIMM slot latches. 6. Remove the DI MM. To replace th e compon ent, reverse the rem oval proc[...]

  • Página 50

    Remov al and replac emen t procedures 50 b. Comp letely loosen al l screws in the sa me sequence. c. Remove the heatsink from the processo r backplat e. To replace the component: 1. Clean the old thermal g rease from the pro cessor with the alcoho l swab. Allow the alcohol to evaporate before continuing. 2. Remove the ther mal interf ace protec tiv[...]

  • Página 51

    Remov al and replac emen t procedures 51 c. Finish the installation by completely tightening the scre ws in the same sequ ence. 4. Install the system board assembly (on page 30 ). 5. Install t he chassis c over (on page 27 ). 6. Conn ect the power c ord to the server. 7. Connect the power cord to the AC p ower source. 8. Press the Power On/Standby [...]

  • Página 52

    Remov al and replac emen t procedures 52 CAUTION: The pi ns on the processo r socket are very fr agile. Any dama ge to them may require replacing the system board. 7. Open the processor locking lever, and then ope n the processor retaining bracket. 8. Grasp the processor by the edges, and then lift it out of th e socket. To replace the component: C[...]

  • Página 53

    Remov al and replac emen t procedures 53 2. Close t he processor retaining bracket , and then sec ure the processo r lockin g lever. 3. Clean the old thermal grease from the he atsink with the alcohol swab. Allow the alc ohol to evaporate before co ntinuing. 4. Apply all the grease to the top of the processor in the following pattern to ensure even[...]

  • Página 54

    Remov al and replac emen t procedures 54 To remove the system bo ard: 1. Power do wn the server (on page 23 ). 2. Disc on nect t he power cor d from the AC sou rce. 3. Discon nect the power cord from th e server. 4. Remove the c hassis cover (o n page 26 ). 5. Remove the sy stem board a ssembly. WARNING: To reduce the risk of personal injury from h[...]

  • Página 55

    Remov al and replac emen t procedures 55 8. Grasp the processor by the edges, and then lift it out of the socket. 9. Remo ve all DI MMs (" R emoving a DIMM " on page 49 ). 10. If installed, remove the expa nsion bo ard (" Expansion board " on page 47 ). 11. Remove the fa iled system b oard.[...]

  • Página 56

    Remo val and replac ement procedures 56 To replace th e system board : 1. Install the system board. CAUTION: Failure to completely open the processor locking lever prevents the process or from seating during installation, leading to hardware damage. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the [...]

  • Página 57

    Remov al and replac emen t procedures 57 3. Remove the pro cessor soc ket c over. CAUTION: TH E PINS ON T H E SYS TEM B OARD AR E V ERY F RAGI LE A ND EASIL Y D AMA GED . To avoid damage to the system board: • Do not touch the processor socket contacts. • Do not tilt o r slide the processor when l owering the pro cessor in to the socket . 4. In[...]

  • Página 58

    Remov al and replac emen t procedures 58 5. Close t he processor retaining bracket , and then sec ure the processo r lockin g lever. 6. Clean the old thermal grease from the heatsink and the top of the process or with the alcohol swab. Allow the alcohol to evaporate before continuing. 7. Apply all the grease to the top of the processor in the follo[...]

  • Página 59

    Remov al and replac emen t procedures 59 c. Finish the install ation by complet ely tightening the sc rews in the same sequenc e. CAUTION: When return ing a damaged system bo ard to HP, always install all processor so cket covers to prevent d amage to the processo r sockets and system board. 9. Install t he processo r socket cover on t he failed sy[...]

  • Página 60

    Remov al and replac emen t procedures 60 2. Select the Ad vanced Options m enu. 3. Select S ervic e O pti ons . 4. Select Serial N umber . The following warning appears: Warning: The serial number should ONLY be modified by qualified service personnel. This value should always match the serial number located on the chassis. 5. Press the En ter k ey[...]

  • Página 61

    Remov al and replac emen t procedures 61 7. Remove the batter y. IMPO RTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the b attery, reconfigure the sy stem through RBSU. To replace th e compon ent, reverse the rem oval procedu re. For more information about battery replacement or proper [...]

  • Página 62

    Troubleshooting 62 T r oubleshooting T roubleshooting resou rces The HP ProLiant Ge n8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software m aintenanc e on ProLian t servers and server blades. To [...]

  • Página 63

    Dia gn ostic tools 63 D iagno sti c tools H P product QuickSpecs For more information about product features, specificati ons, options, configurations, and compatibility, see the product QuickSpecs on the HP Product Bullet in website ( http://www.hp.com /go/productbulletin ). H P Insight Dia gnostics HP Insight Diagnostics is a proactive server man[...]

  • Página 64

    Diagn osti c tools 64 The HP Insight Remo te Suppo rt software exten ds the HP e nterprise rem ote suppo rt portfol io for cust omers with small and medi um size IT envir onments. Th e software is avail able in two vari ants: • HP Insight Remote Supp ort 7.x software is optimized to support up to 500 managed systems and can be installed on a Wind[...]

  • Página 65

    Dia gn ostic tools 65 • From within HP Insight Diagnostics (on page 63 ) U SB support and funct ionality U SB support HP provides standard USB 2.0 support, standard USB 3.0 support, and legacy USB support. Standard support is provided by the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB 2.0 device[...]

  • Página 66

    Compone nt ident ificat ion 66 C omponent ide ntif icati on F ront panel components Item Description 1 USB 2.0 conne ctors 2 Optic al drive (option al) 3 Drive bays (inside) 4 Front bezel[...]

  • Página 67

    Compone nt ident ificat ion 67 F ront pane l LEDs and buttons Item Description Status 1 Power O n/Stan dby button and system power LED Solid green = System on Flashing green (1 Hz/cycle per sec) = Performing power on sequence Solid am ber = System in s tandby Off = N o power present* 2 NIC status LED Solid green = Li nk to network Flashing green (1[...]

  • Página 68

    Compone nt ident ificat ion 68 R ear panel component s Item Description 1 Kensington security slot 2 Power suppl y 3 Serial number/ iLO infor mation tag* 4 Power cord con nector 5 Dedic ated iLO c onnect or 6 Video conn ector 7 USB 3.0 conne ctors 8 USB 2.0 conne ctors 9 NIC connec tor 2 10 NIC connec tor 1/shared iLO connector 11 System fan * The [...]

  • Página 69

    Compone nt ident ificat ion 69 R ear panel LEDs and buttons Item Description Status 1 NIC link L ED So lid green = Link exists Off = No li nk exists 2 NIC status LED Solid green = Li nk to network Flashing green (1 Hz/cycle per sec) = Network active Off = No network activity S ystem boar d com ponents[...]

  • Página 70

    Compone nt ident ificat ion 70 Item Description 1 Fan conne ctor 2 DIMM slots 3 Front I/O connector 4 Processor socket 5 T PM connector 6 Sy stem battery 7 M ini- SAS connector 8 Optical d rive SATA connector 9 A mbient temperature sensor connector 10 24 - pin syst em board power c onne ctor 11 Interna l USB 2 .0 co nnector 12 microSD c ard slot 13[...]

  • Página 71

    Compone nt ident ificat ion 71 D IMM slot locations DIMM slots are numbered sequentially (1 through 4 ) for the processor. The su pported AMP modes u se the letter assignment s for popu lation gu idelines. S ystem mainte nance switch Position Defa ult Funct ion S1 Off Off = iL O secu rity is ena bled . On = iLO secu rity is disabl ed. S2 Off Off = [...]

  • Página 72

    Compone nt ident ificat ion 72 CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to pro perly configure the server or data loss could occur. N MI functionali ty An NMI crash dump creates a crash dump log before resetting a syste m which is not responding. Crash dump log analysis is an essential part of diagnosi ng relia[...]

  • Página 73

    Compone nt ident ificat ion 73 F BWC module LED definitions The FBWC module has three single - color LEDs (one amber and two green). The LEDs are duplicated on the reverse side of the cach e module to facili tate status viewin g. 1 - Amber 2 - Green 3 - Green Inte rpret ati on Off Off Off The cache module is not powered. Off Flashing 0.5 H z Flashi[...]

  • Página 74

    Compo nent iden tifi cat ion 74 F an locatio n The server has one sy stem fa n located at the rear of the server. T- 10/T - 15 T orx s cre wdri ver The server inc ludes a T - 10/ T - 15 Torx screwdriver located on the front panel. Use this screwdriver to loosen screws during hardware configuration procedures.[...]

  • Página 75

    Cablin g 75 C abling Cabling ove rview This section provides guidelines that help you make informed decisions about cabli ng the serve r and hardware options to optimize performance. For information on cabling p eripheral components, refer to the white paper on high - dens ity deployment at the HP website ( http://www.hp.c om/products/servers/platf[...]

  • Página 76

    Cablin g 76 • Mini - SAS cable co nnected to controller board Item Description 1 4- pin powe r cable ( conn ected to th e PSU P2 c able) 2 Mini- SAS cable C apacitor pack cabling[...]

  • Página 77

    Cablin g 77 O ptical dri ve cabling Item Description 1 4- pin power con nector (c onnected to the PSU P 3 cable) of the optic al drive SATA Y - c able 2 Common e nd of the optical dr ive SATA Y - cable 3 SATA connector of the optic al drive SATA Y - cabl e F ront I/O assembly cabling[...]

  • Página 78

    Cablin g 78 A mbient temperatu re sensor cabling S ystem fan cabling[...]

  • Página 79

    Cablin g 79 P ower supply c abling Item PSU cable marker Description 1 P3 4- pin opti cal dri ve power c able 2 P2 4- pin dri ve power c able 3 P1 24 - pin syste m board power c able[...]

  • Página 80

    Specifica tions 80 S pec ifi cations E nvironment al specifi cations Specification Val ue Tempera ture ra nge* Operati ng 10 ° C to 35 ° C ( 50 ° F to 95 ° F) Nonoperatin g - 30 ° C to 60 ° C ( - 22 ° F to 140 ° F) Relativ e humidity (nonco ndensi ng) Opera ting, maximu m wet bu lb temperature of 28°C (82.4°F ) 10% to 90% Nonoper ating, m[...]

  • Página 81

    Specifica tions 81 Rated in put voltag e 100 V AC to 240 V AC Rated in put freque ncy 47 Hz to 63 Hz Rated in put curren t 3.5 A Rated in put power 150 W Efficien cy (minimu m) 70% Powe r supply o utput — Rated ste ady - state power 150 W Maximum pe ak power 200 W Rated output power 150 W[...]

  • Página 82

    Acronyms and abbr eviati ons 82 A c r on y ms and abbr e v iati ons ABEND abnormal end AMP Advanced Memory Protection ASR Automati c Server Recover y CSR Customer Self Repair DDR3 double data rate -3 FBWC flash - backed write cache HP SIM HP Systems Insight Manage r iLO Integrated Lights - Out IML Integrated Management Log LFF large form factor LV [...]

  • Página 83

    Acronyms and abbr eviati ons 83 NVRAM nonvolatile memory PCIe Peripheral Component Interconnect Expre ss POST Power - On Self Test PSU power supply u nit RBSU ROM- Based Setup Utility RDIMM registered dual in - line memory module SAS serial attached SCSI SATA serial ATA SD Secure Digital SPP HP Serv ice Pack for ProLiant TPM Trusted Platform Module[...]

  • Página 84

    Docume ntation feedbac k 84 D oc umentati on f e edback HP is committed to providing documentation that meets your needs. To help us im prove the documen tation, send any errors, suggestion s, or c omments to Documentation Feedback ( mailto:doc sfeedback@hp.com ). Include the document title and pa rt number, version number, or the URL when submitti[...]

  • Página 85

    Index 85 A ambient temperature sensor cable 40 ambient temperature sensor, cabling 78 Auto mati c Ser ver Rec over y (ASR ) 65 B bezel, openin g 24 bezel, removin g 25 C cabling, drive cage 75 cablin g, FBWC 76 cabling, front I/O 77 cabling, internal power 79 cabling, optical drive 77 cache mo dule 34, 73 capacitor pack 35 capacitor pack cabling 76[...]

  • Página 86

    Index 86 K Kensington sec urity slot 68 L LED, system power 67 LEDs, drive 67 LEDs, FB WC module 73 LEDs, fron t panel 67 LEDs, NIC 67, 69 LEDs, rear pan el 69 low - voltage DIMMs 48 M mechanical components 15 mechanical specifications 80 memory dump 72 memory module population guidelines 48 microSD card slot 69 N NIC connectors 68 NMI functionalit[...]

  • Página 87

    Index 87 U USB connectors 69 USB support 65 utilities 63 V video connect or 69 W warnings 22 weight 80[...]