HP ProLiant ML350 G6 Bedienungsanleitung

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Richtige Gebrauchsanleitung

Die Vorschriften verpflichten den Verkäufer zur Übertragung der Gebrauchsanleitung HP ProLiant ML350 G6 an den Erwerber, zusammen mit der Ware. Eine fehlende Anleitung oder falsche Informationen, die dem Verbraucher übertragen werden, bilden eine Grundlage für eine Reklamation aufgrund Unstimmigkeit des Geräts mit dem Vertrag. Rechtsmäßig lässt man das Anfügen einer Gebrauchsanleitung in anderer Form als Papierform zu, was letztens sehr oft genutzt wird, indem man eine grafische oder elektronische Anleitung von HP ProLiant ML350 G6, sowie Anleitungsvideos für Nutzer beifügt. Die Bedingung ist, dass ihre Form leserlich und verständlich ist.

Was ist eine Gebrauchsanleitung?

Das Wort kommt vom lateinischen „instructio”, d.h. ordnen. Demnach kann man in der Anleitung HP ProLiant ML350 G6 die Beschreibung der Etappen der Vorgehensweisen finden. Das Ziel der Anleitung ist die Belehrung, Vereinfachung des Starts, der Nutzung des Geräts oder auch der Ausführung bestimmter Tätigkeiten. Die Anleitung ist eine Sammlung von Informationen über ein Gegenstand/eine Dienstleistung, ein Hinweis.

Leider widmen nicht viele Nutzer ihre Zeit der Gebrauchsanleitung HP ProLiant ML350 G6. Eine gute Gebrauchsanleitung erlaubt nicht nur eine Reihe zusätzlicher Funktionen des gekauften Geräts kennenzulernen, sondern hilft dabei viele Fehler zu vermeiden.

Was sollte also eine ideale Gebrauchsanleitung beinhalten?

Die Gebrauchsanleitung HP ProLiant ML350 G6 sollte vor allem folgendes enthalten:
- Informationen über technische Daten des Geräts HP ProLiant ML350 G6
- Den Namen des Produzenten und das Produktionsjahr des Geräts HP ProLiant ML350 G6
- Grundsätze der Bedienung, Regulierung und Wartung des Geräts HP ProLiant ML350 G6
- Sicherheitszeichen und Zertifikate, die die Übereinstimmung mit entsprechenden Normen bestätigen

Warum lesen wir keine Gebrauchsanleitungen?

Der Grund dafür ist die fehlende Zeit und die Sicherheit, was die bestimmten Funktionen der gekauften Geräte angeht. Leider ist das Anschließen und Starten von HP ProLiant ML350 G6 zu wenig. Eine Anleitung beinhaltet eine Reihe von Hinweisen bezüglich bestimmter Funktionen, Sicherheitsgrundsätze, Wartungsarten (sogar das, welche Mittel man benutzen sollte), eventueller Fehler von HP ProLiant ML350 G6 und Lösungsarten für Probleme, die während der Nutzung auftreten könnten. Immerhin kann man in der Gebrauchsanleitung die Kontaktnummer zum Service HP finden, wenn die vorgeschlagenen Lösungen nicht wirksam sind. Aktuell erfreuen sich Anleitungen in Form von interessanten Animationen oder Videoanleitungen an Popularität, die den Nutzer besser ansprechen als eine Broschüre. Diese Art von Anleitung gibt garantiert, dass der Nutzer sich das ganze Video anschaut, ohne die spezifizierten und komplizierten technischen Beschreibungen von HP ProLiant ML350 G6 zu überspringen, wie es bei der Papierform passiert.

Warum sollte man Gebrauchsanleitungen lesen?

In der Gebrauchsanleitung finden wir vor allem die Antwort über den Bau sowie die Möglichkeiten des Geräts HP ProLiant ML350 G6, über die Nutzung bestimmter Accessoires und eine Reihe von Informationen, die erlauben, jegliche Funktionen und Bequemlichkeiten zu nutzen.

Nach dem gelungenen Kauf des Geräts, sollte man einige Zeit für das Kennenlernen jedes Teils der Anleitung von HP ProLiant ML350 G6 widmen. Aktuell sind sie genau vorbereitet oder übersetzt, damit sie nicht nur verständlich für die Nutzer sind, aber auch ihre grundliegende Hilfs-Informations-Funktion erfüllen.

Inhaltsverzeichnis der Gebrauchsanleitungen

  • Seite 1

    HP Pr oL ian t ML3 5 0 G6 S er v er Maint enance and Se r v i ce Guide Abstract This guide is for an experien ced service technician. HP assumes you are qualified in the servicing of comp uter equipment and trained in r ecognizing hazards in products with hazardous energy levels and are familiar with weight and stability precautio ns for rack insta[...]

  • Seite 2

    © Copyright 2009, 2015 Hewlett- Packard Development Company, L.P. The information contained herei n is subject to change without notic e. The only warranties for HP produ cts and services are set forth in the expr ess warranty statements accompanyin g such products and services. Nothing herein should be construed as constituting an add itional war[...]

  • Seite 3

    Contents 3 Cont ents Customer self repair ...................................................................................................................... 5 Parts only warranty service ......................................................................................................................... 5 Illustrated parts catalog .........[...]

  • Seite 4

    Contents 4 DIMM .................................................................................................................................................... 55 Heatsink ................................................................................................................................................. 56 Processor ..............[...]

  • Seite 5

    Customer self repair 5 C u st omer s elf r epair HP products are desig ned with many Customer Self Repai r (CSR) parts to minimiz e repair time and allow for greater flex ibility in perf orming defect ive parts replac ement. If durin g the diagnosi s period HP (or H P service providers or service partners) identifies that the repair can be acc ompl[...]

  • Seite 6

    Customer self repair 6 Obligatoire - P ièces pour lesquelles la ré paration par le client est ob ligatoire. Si vous demand ez à HP de remplacer c es pièces, les coût s de déplacemen t et main d'œuvr e du service vous seront facturés. Facultatif - Pièces pour lesquell es la réparat ion par le client est facultative. C es pièces sont [...]

  • Seite 7

    Customer self repair 7 In base alla disponibi lità e alla località geografica , le parti CSR vengono sp edite con consegna entro il giorno lavorat ivo seguente. La consegn a nel giorno stesso o ent ro quattro ore è off erta con un supplemen to di costo solo in alcu n e zone. In caso di necessità si pu ò richiedere l'a ssistenza tel efonic[...]

  • Seite 8

    Customer self repair 8 defekte Teil nicht zurückschicken, kann HP Ihne n das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair ko mmt HP für alle Kost en für die Lieferun g und Rücksend ung auf und bestim mt den Kurier- /Frachtdienst. Weitere Info rmationen übe r das HP Customer S elf Repair Progra mm erhalten S ie von Ihrem Se[...]

  • Seite 9

    Customer self repair 9 enviara el componente defectuoso requerido, HP podr á cobrarle por el de sus titución. En el caso de to das sustitucion es que lleve a cab o el cliente, HP se h ará cargo de todos l os gastos de enví o y devolución de componente s y escogerá la emp resa de transpo rte que se utili ce par a dicho servicio. Para obtener m[...]

  • Seite 10

    Customer self repair 10 Neem contact op met e en Service Partner voor me er informatie over het C ustomer Self Repair pro gramma van HP. Informatie o ver Service Partners vindt u op de HP website ( http://www .hp.com/go/selfrepair ). Gar anti es erv ice "P ar ts Onl y" Het is mogelijk dat de HP garantie alleen de garantie service "Pa[...]

  • Seite 11

    Customer self repair 11 No caso desse se rviço, a substituição de peç as CSR é obrigatória. Se desejar que a HP substi tua essas peças, serão cobradas as despesas de transporte e mão - de - obra do serviço.[...]

  • Seite 12

    Customer self repair 12[...]

  • Seite 13

    Customer self repair 13[...]

  • Seite 14

    Customer self repair 14[...]

  • Seite 15

    Illustrated parts catalog 15 I llus tr ated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page 5 ) 1 Access panel 511769 - 001 Mandatory 1 2 DIMM baffl e 511773 - 001 Mandatory 1 3 Large redunda nt fan air baffl e 511772 - 001 Mandatory 1 4 Front bezel, ra ck model 511771 - 001 Mandatory 1 5 Front b[...]

  • Seite 16

    Illustrated parts catalog 16 Item Description Spare part number Customer self repair (on page 5 ) 7 Standard SAS/SATA 6 - bay har d drive cage, LFF* 511784 - 001 Mandatory 1 8 Plastics an d hardware kit 511788 - 001 Mandatory 1 a) Removabl e media blank — — b) Retainer card guide — — c) Power supply blank — — d) Foot, carbon ite* — ?[...]

  • Seite 17

    Illustrated parts catalog 17 1 Mandatory: Obl igatorio — componentes para los que la repa ración por parte de l usuario es oblig atoria. Si soli cita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de lo s gastos de desplazamiento y de mano de obra de d icho servicio. 2 Optional: Opcional — componente s p ara l[...]

  • Seite 18

    Illustrated parts catalog 18[...]

  • Seite 19

    Illustrated parts catalog 19 System components Item Description Spare part number Customer s elf repair (on page 5 ) System components 13 Hot - plug power supply — — a) AC, 460 W 511777 - 001 Mandatory 1 b) AC, 750 W 511778 - 001 Mandatory 1 c) AC, 1200 W 498152 - 001 Mandatory 1 14 Fan assembly, 92 mm 511774 - 001 Mandatory 1 15 Heatsink 50887[...]

  • Seite 20

    Illustrated parts catalog 20 Item Description Spare part number Customer s elf repair (on page 5 ) f) 2.26 -GHz Intel® Xeon® processor E5520, 80 W* ** 490073 - 001 Optional 2 g) 2.40 - GHz Intel® Xeon® processor E5530, 80 W* ** 490072 - 001 Optional 2 h) 2.53 - GHz Intel® Xeon® processor E5540, 80 W* ** 490071 - 001 Optional 2 i) 2.66 - GHz I[...]

  • Seite 21

    Illustrated parts catalog 21 Item Description Spare part number Customer s elf repair (on page 5 ) a) 1 - GB PC3 - 1060 0 (DDR3 - 1333) ( RoHS)* 501539 - 001 Mandatory 1 b) 2 -GB PC3 - 10600 (D DR3 - 1333) (RoHS )* 501540 - 001 Mandatory 1 c) 4 - GB PC3 - 1 0600 (DDR3 - 1333) (RoHS)* 501541 - 001 Mandatory 1 Boards 20 System board — — a) For sy[...]

  • Seite 22

    Illustrated parts catalog 22 Item Description Spare part number Customer s elf repair (on page 5 ) e) 300 - GB, 15,000 - rpm, hot - plug, dual - port 416248 - 001 Mandatory 1 f) 300 - GB, 15,000 - rpm, hot - plug, dual - port 432146 - 001 Mandatory 1 g) 400 - GB, 10,000 - rpm, hot -plug 456896 - 001 Mandatory 1 h) 450 - GB, 15 ,000 - rpm, hot -plug[...]

  • Seite 23

    Illustrated parts catalog 23 Item Description Spare part number Customer s elf repair (on page 5 ) k) 146 - GB, 1 0,000 - rpm, hot - plug, dual - port, 6G 507283 - 001 Mandatory 1 l) 300 - GB, 10,000 - rpm, hot - plug, dual - port 493083 - 001 Mandatory 1 m) 300 - GB, 10 ,000 - rpm, hot - plug, dual - port, 6G 507284 - 001 Mandatory 1 n) 72 - GB 6G[...]

  • Seite 24

    Illustrated parts catalog 24 2 Optional — Parts for whi ch customer self rep air is optiona l. These parts are also designed for customer self repair. If, however, you require that HP replace them f or you, there may or may not be additional charges, depending on the type of warranty service d esignated for your p roduct. 3 No — Some HP parts a[...]

  • Seite 25

    I llustrated parts catalog 25 2 Optional: Opcional — Peças cujo reparo feit o pelo cliente é opc ional. Essas peç as também são pro jetadas para o reparo feit o pelo client e. No entanto, se desej ar que a HP as substi tua, pode haver ou não a cobrança de taxa adicional , dependendo d o tipo de serviço de ga rantia destinado a o produto. [...]

  • Seite 26

    Removal an d replacement procedures 26 R emo v al and r eplacemen t pr ocedur es R equired tools You need the following it ems for some procedur es: • T- 10/T - 15 Torx screwdriver • HP Insight Diagnosti cs software (" HP Insight Diagnostics " on page 75 ) Preparation procedures To access so me components a nd perform certa in service[...]

  • Seite 27

    Removal an d replacement procedures 27 NOTE: If the operating system automatically places the server in Standby mode, omit the ne xt step. 3. Press the Power On/Standby button to place the server in Standby mode . When the server activates Standby power mode , the system power LED chan ges to amber. IMPORTANT: Pressing the UID button i lluminates t[...]

  • Seite 28

    Removal an d replacement procedures 28 1. Power down the server (on page 26 ). 2. Extend the server from the rack (o n page 27 ). 3. Disconnect the cabling and remove the server from the rack. Fo r more information, see the documentation that ships with the rack mounting option. 4. Place the serv er on a sturdy, l evel surface. A ccess the server r[...]

  • Seite 29

    Removal an d replacement procedures 29 CAUTION: Do not operate the serve r for long periods with the ac cess panel open or removed. Operating the se rver in this manner resu lts in improper airflow and impr oper cooling that can lead to thermal damage. F ront bezel This server ha s a removable b ezel that must be unlo cked and opened before accessi[...]

  • Seite 30

    Removal an d replacement procedures 30 T ower foot To remove the component: 1. Power down the server (on page 26 ). 2. Remove the to wer bezel (" Front bezel " on page 29 ). 3. Place the serv er on its side. 4. Remove the fo ot. To replace th e component, rev erse the removal p rocedure. A ccess panel CAUTION: Do not operate the server wi[...]

  • Seite 31

    Removal an d replacement procedures 31 R ack bezel To remove the component: 1. Power down the server (on page 26 ). 2. Extend the server from the rack (o n page 27 ). 3. Remove the acc ess panel (" Access p anel " on page 30 ). 4. Remove the beze l. To replace th e component, re verse the removal procedure . R ack rails To remove the comp[...]

  • Seite 32

    Removal and re placement procedures 32 4. Slide the rail fo rward and remove it from the server. 5. Repeat the ste ps above to remov e the other rail. To replace th e component, rev erse the removal p rocedure. L arge redundant f an air baffle To remove the component: 1. Power down the server (on page 26 ). 2. Do one of the following: o Open or rem[...]

  • Seite 33

    Removal an d replacement procedures 33 To replace th e component, rev erse the removal p rocedure. D IMM baffle To remove the component: 1. Power down the server (on page 26 ). 2. Do one of the following: o Open or remov e the tower bezel, as needed (" Front bezel " on page 29 ). o Extend the server from the rack (o n page 27 ). 3. Remove[...]

  • Seite 34

    Removal an d replacement procedures 34 5. Remove the fan blank. To replace th e component, rev erse the removal p rocedure. F an To remove the component: 1. Power down the server (on page 26 ). 2. Do one of the following: o Open or remov e the tower bezel, as needed (" Front bezel " on page 29 ). o Extend the server from the rack (o n pag[...]

  • Seite 35

    Removal an d replacement procedures 35 6. Remove the fa n. To replace th e component, rev erse the removal p rocedure. P ower suppl y blank To remove the component: 1. Access the produc t rear panel (" Access the serv er rear panel (ra ck model) " on page 28 ). 2. Remove the power supply blank . WARNING: To reduce the risk of person al in[...]

  • Seite 36

    Removal an d replacement procedures 36 H ot - plug power supply WARNING: To reduce the ris k of electric shock, d o not disassemble t he power supply or a ttempt to repair it. Replace it on ly with the specified spare pa rt. CAUTION: Do not atte mpt to remove and replace a power s upply as a hot - plug proced ure unless both bays are popul ated wit[...]

  • Seite 37

    Removal an d replacement procedures 37 Remove the component as indicate d. To replace the blank, slide the blank into the bay unti l it locks into place. S AS/SATA hard dri ve CAUTION: To pre vent improper cooling and thermal damage, do not o perate the server unless all bays are popul ated with either a compone nt or a blank. To remove the compone[...]

  • Seite 38

    Removal an d replacement procedures 38 S tandard hard drive cage The procedure i s the same for both the stan dard six - bay LFF hard dri ve cage and the st andard eight - bay SFF hard drive cage. To remove the component: 1. Power down the server (on page 26 ). 2. Do one of the following: o Open or remov e the tower bezel, as needed (" Front b[...]

  • Seite 39

    Removal an d replac ement procedures 39 NOTE: Remov e the shipping scr ew, if installed , before removin g the hard drive cag e. 7. Remove the hard drive c age. To replace the component: 1. Using a T - 15 Torx screwdriver , remove the sleev e from the spar e hard drive cage.[...]

  • Seite 40

    Removal an d replacement procedures 40 2. Install the SFF hard drive cage into the server. 3. Connect all cables to the spare hard drive c age. CAUTION: Always po pulate each media bay wi th either a de vice or a blank. Proper airflow can only be maintained whe n the bays are populated. Unpopulate d drive bays can lead to improper cooling and therm[...]

  • Seite 41

    Removal an d replacement procedures 41 7. Remove the hard drive c age. To replace the compon ent: 1. Slide the spare hard dr ive cage about three - fourths of the way into the bay, leaving room to connect cables at the back of the drive cage. 2. Connect all cables to the spare hard drive c age. 3. Slide the optional hard drive cage fully into the b[...]

  • Seite 42

    Removal an d replacement procedures 42 o Slide the server back into the rack. 7. Power up the server. S tandard hard d rive cage ba ckplane To remove the component: 1. Power down the server (on page 26 ). 2. Do one of the following: o Open or remov e the tower bezel, as needed (" Front bezel " on page 29 ). o Extend the server from the ra[...]

  • Seite 43

    Removal an d replacement procedures 43 o Eight - bay SFF hard drive cage backplane To replace th e component, rev erse the removal p rocedure. E xpansion slot cover To remove the component: 1. Do one of the following: o Unlock and remove t he bezel (" Front beze l " on page 29 ). o Extend the server from the rack (o n page 27 ). 2. Remove[...]

  • Seite 44

    Removal an d replacement procedures 44 4. Remove the expansion slot cover. CAUTION: To pre vent improper cooling and thermal damage, do not o perate the server unless all PCI slots have eith er an expansion slot cover or an exp ansion board installed. To replace th e component, rev erse the removal p rocedure. E xpans ion boa rd CAUTION: To pre ven[...]

  • Seite 45

    Removal an d replacement procedures 45 5. Push the release latches on the expansion board retai ner, and then open the retainer. 6. Remo ve the T - 15 Torx screw securing th e expansion board, if necessa ry. 7. Remove the expansio n board. To replace th e component, rev erse the removal p rocedure. M edia bay bl ank To remove the component: 1. Open[...]

  • Seite 46

    Removal an d replacement procedures 46 2. Remove the media bay blan k. To replace th e component, rev erse the removal p rocedure. Battery- backed wr ite cache proce dures Two types of procedur es are provided for the BBWC o ption: • Removal and replace ment of failed components: o Removing the cache module (" Battery - backe d write cache m[...]

  • Seite 47

    Removal an d replacement procedures 47 4. Remove the ca che module. To replace th e component, rev erse the removal p rocedure. B BWC b attery pack To remove the component: 1. Power down the server (on page 26 ). 2. Do one of the following: o Open or remov e the tower bezel, as needed (" Front bezel " on page 29 ). o Extend the server fro[...]

  • Seite 48

    Removal an d replacement procedures 48 5. Remove the batter y pack. To replace th e component, rev erse the removal p rocedure. R ecovering data from the battery - backed write cache If the server fails, use t he following procedur e to recover data temporarily sto red in the BBWC. CAUTION: Before starting this procedure, read the information about[...]

  • Seite 49

    Removal an d replacement procedures 49 F lash - backed writ e cache proce dures Two types of procedur es are provided for the FBWC o ption: • Removal and replace ment of failed components: o Removing the cache mo dule (" Flash - backed write cache module " on page 49 ) o Removing the capaci tor pack (" Flash - backed write cache ca[...]

  • Seite 50

    Removal an d replacement procedures 50 7. Open the ejector la tches on each side of the cach e module connector. N ormally, the cache module is ejected from the cache module connector. If th e module is not eject ed automatically , remove the ca che module. 8. If the cache module is con nected to a capacitor pack, di sconnect the capacit or pack ca[...]

  • Seite 51

    Removal an d replacement procedures 51 CAUTION: In systems t hat use external data storage, be sure that the server i s the first unit to be powered down and the last to be powered back up. T aking this precautio n ensures that the system does not erro neously mark th e drives as failed wh en the server is po wered up. 4. Do one of the following: o[...]

  • Seite 52

    Removal an d replacement procedures 52 5. Remove the fo ur T - 15 screws f rom the hard drive cage , and then slide the hard drive cag e partially out of the chassi s. 6. Disconnect any external cables from the PCI - X expansion boards. 7. Disconnect the power cable extension and the signal cable from the PCI - X expansion cage. 8. Pull the spring [...]

  • Seite 53

    Remo val and replacemen t procedures 53 9. Remove the P CI - X expansion cage. 10. Remove any expansi on boards. To replace th e components, reverse the removal p rocedure. H alf - height or full - height media device To remove the component: 1. Power down the server (on page 26 ). 2. Do one of the following: o Unlock and remove the bezel (" F[...]

  • Seite 54

    Removal an d replacement procedures 54 4. Disconnect data and powe r cables: 5. Remove the dev ice: o Half - height[...]

  • Seite 55

    Removal an d replacement procedures 55 o Full - height To replace th e component, rev erse the removal p rocedure. IMPORTANT: Be sure to c onnect the right - angle end of the SA TA data cable to the s ystem board. Connecting it to the SATA drive may interfere wit h other installed media bay devices. IMPORTANT: If both SA TA and PATA optic al device[...]

  • Seite 56

    Removal an d replacement procedures 56 8. Remove the D I MM. To replace th e component, rev erse the removal p rocedure. For DIMM configura tion information, se e the server user guide. H eatsink To remove the component: 1. Power down the server (on page 26 ). 2. Do one of the following: o Open or remov e the tower bezel, as needed (" Front be[...]

  • Seite 57

    Removal an d replacement procedures 57 7. Remove the heatsink . To replace the compon ent: 1. Use the alcoh ol swab to remove all th e existing thermal grea se from the processor . Allow the alcohol to evaporate before con tinuing. 2. Remove the h eatsink protec tive cover. 3. Install the heatsink.[...]

  • Seite 58

    Removal an d replacement procedures 58 4. Close the hea tsink loc king levers. 5. Install the lar ge redundant fan air baffle, i f removed. 6. Install the access panel. 7. Do one of the following: o Close or insta ll the tower bezel, as needed. o Slide the server back into the rack. Processor The server sup ports single - and dual - processor opera[...]

  • Seite 59

    Removal an d replacement procedures 59 6. Remove the h eatsink. 7. Open the pro cessor locking lever and the proce ssor socket retain ing bracket. 8. Using the pro cessor tool, rem ove the process or from the system board: a. Line up the processor tool, ensuring the locking lever g raphic on the tool is orient ed correctly. b. Press in on the plast[...]

  • Seite 60

    Removal and replacement procedures 60 c. Release the tabs, and then carefull y lift the processor and tool straight up. 9. Carefully rotate the tool, and then push i n and release the tabs to secure the processor in the tool. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the cont act area. To replac[...]

  • Seite 61

    Removal an d replacement procedures 61 1. Carefully insert th e processor into the processor in stallation tool. Han dle the processor by t he edges only, and do not touch the bottom of the processor, especially the contact area.[...]

  • Seite 62

    Removal an d replacement procedures 62 2. Be sure the tool is oriented correctly. Align the processor installation tool with the socket, and then install the processor . THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED . CAUTION: THE PINS ON THE SYSTEM B OARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the s ystem board:[...]

  • Seite 63

    Removal an d replacement procedures 63 3. Press and hold the tabs on the process or installation tool to separate it from the processor, and then remove the tool. 4. Close the pro c essor socket retaining bra cket and the processor lo cking lever. CAUTION: Be sure to close t he processor so cket retaining b racket before closin g the processor lock[...]

  • Seite 64

    Removal an d replacement procedures 64 6. Close the hea tsink locking lev ers. 7. Install the lar ge redundant fan air baffle, i f removed. 8. Install the access panel. 9. Do one of the following: o Close or install the tower bezel, as need ed. o Slide the server back into the rack. 10. Power up the server. System board To remove the component: 1. [...]

  • Seite 65

    Removal an d replacement procedures 65 11. Remove the h eatsink (" Heatsink " on page 56 ). CAUTION: To avoi d damage to the processor: • Handle the processor only by the edges. • Do not touch the bottom of the processor, especi ally the contact area. CAUTION: To avoi d damage to the system board: • Do not touch the processor socket[...]

  • Seite 66

    Removal an d replacement procedures 66 a. Line up the processor tool, ensuring the locking lever g raphic on the tool is orient ed correctly. b. Press in on the plastic tabs, and then place the tool on the proce ssor. c. Re lease the tabs, and then carefully lift the processor and tool straight up. 14. Carefully rotate the tool, and then push i n a[...]

  • Seite 67

    Removal an d replaceme nt procedures 67 16. Using the system boar d tray handles, slide the tr ay forward and remove the fai led system board. To repl ace the component: 1. Install the spa re system boar d in the server befor e installing the p rocessor. CAUTION: Failure to completely open the p rocessor locking lever p revents the processor from s[...]

  • Seite 68

    Removal an d replacement procedures 68 2. Open the pro cessor locking lever and the proce ssor socket retain ing bracket. Do not remove th e processor sock et cover . IMPORTANT: Be sure the processor remains in side the processor insta llation tool. 3. If the proces sor has separa ted from the installat ion tool, carefully re - insert the processor[...]

  • Seite 69

    Removal an d replacement procedures 69 4. Align the processor installation tool wi th the socket, and then install t he processor. THE PINS ON TH E SYSTEM BOARD AR E VERY FRAGILE AND E ASILY DAMAGED . CAUTION: THE PINS ON THE SYSTEM B OARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the s ystem board: • Never install or remov e a proc[...]

  • Seite 70

    Removal an d replacement procedures 70 5. Press the tabs on the processor ins tallation tool to separate it from the processor, and then remove the tool. 6. Close the pro cessor socket r etaining brac ket and the proces sor locking lever. The proce ssor socket cover is automaticall y ejected . Remove th e cover. CAUTION: Be sure to close t he proce[...]

  • Seite 71

    Removal an d replacement procedures 71 9. Apply all the grease to the top of the processor i n the following pattern to ensure even distribution. 10. Install the heatsink. 11. Close the hea tsink locking lev ers. IMPORTANT: Install all components with the same configuration that was used on the failed system board. 12. Install all components remove[...]

  • Seite 72

    Removal an d replacement procedures 72 2. Select the Advanced Options menu. 3. Select Se rvice Options . 4. Select Se rial Number . The following warnin gs appear: WARNING! WARNING! WARNING! The serial number is loaded into the system during the manufacturing process and should NOT be modified. This option should only be used by qualified service p[...]

  • Seite 73

    Removal an d replacement procedures 73 11. Remove the pow er sup ply backplane. To replace th e component, rev erse the removal p rocedure. Battery If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the r eal - time cloc k. Under normal use, batter y life is 5 to 10 y[...]

  • Seite 74

    Removal an d repl acement procedure s 74 4. Remove the battery. IMPORTANT: Replacing the syst em board battery resets the system RO M to its default configuration. After replacing the battery, reconfigure the system through RBSU. To replace th e component, rev erse the removal p rocedure. For more information about batt ery replacement or proper di[...]

  • Seite 75

    Diagnostic tool s 75 D i agno sti c tools T roubleshooting resour ces The HP ProLiant Servers T roubleshooting Guid e provides p rocedures for resolving common p roblems and comprehensiv e courses of action for fault isolati on and identification , error message interpreta tion, issue resolution, and software ma intenance on P roLiant servers a nd [...]

  • Seite 76

    Diagnostic tool s 76 HP Insight Diagnosti cs Online Edition is a web - based application that captures system configuration and other related data ne eded for effective server management. Available in M icrosoft® Windows® and Linux versions, the utility helps to ensure proper sys tem operation. For more information or to download the utility, ref[...]

  • Seite 77

    Diagnostic tool s 77 HP Insight Remote Suppo rt software HP strongly recommends that you install HP Insight Remote Su p port softwa re to complete the insta llation or upgrade of your product and to enable enhan ced delivery of your HP Warran ty, HP Care Pack Servi ce, or HP contractual support agreement. HP Insight Remote Support supplements your [...]

  • Seite 78

    Component identif ication 78 C om ponen t i dentif i cati on F ront panel comp onents Item Description 1 Power On/Standb y button 2 UID button 3 USB connect ors (2) 4 Hot - plug hard driv e bays (8 - bay SFF driv e cage model) 5 Removable m edia bays 6 Optical drive[...]

  • Seite 79

    Component identif ication 79 F ront panel LEDs and b utton s Item Description Status 1 System power LED Green = Power on Flashing green = W aiting for power d ue to group power cap ping Amber = System in standby, but power still applied Off = Power cord not attached or power s upply failure 2 Health LED Green = Normal Amber = Syste m degraded. To i[...]

  • Seite 80

    Component identif ication 80 R ear panel comp onents Item Description 1 Power supply bay 2 2 Keyboard co nnector 3 Power suppl y bay 1 (populated) 4 Video connecto r 5 USB connect ors (2) 6 RJ - 45 Ethernet connectors (2) 7 Slot 1 PCIe 2 x8 (4, 2, 1)¹ 8 Slot 2 PCIe 2 x8 (4, 2, 1)² 9 Slot 3 PCIe 2 x8 (8, 4, 2, 1)³ 10 Slot 4 PCIe 2 x16 (8, 4, 2, 1[...]

  • Seite 81

    Component identif ication 81 R ear pane l LEDs and buttons Item Description Status 1 Power supply 2 LED Green = Power s upply is on and fu nctioning. Off = AC pow er is not available or AC power supply has fai led. 2 UID LED Blue = Activated Flashing blue = System managed remot ely Off = Deactiva ted 3 Power supply 1 LED Green = Power s upply is on[...]

  • Seite 82

    Component identif ication 82 Item Description Status 9 NIC 1 activity LED Green or flashing = Network activity Off = No network activity S ystem boar d components Item Description 1 Processor 1 D IMM slots 2 Power suppl y backplane conn ector 3 Processor socket 2 4 System fan 4 connector 5 System power conne ctors 6 Processor 2 D IMM slots 7 System[...]

  • Seite 83

    Component identif ication 83 Item Description 16 Slot 1 PCIe 2 x8 (4, 2, 1)¹ 17 Slot 2 PCIe 2 x8 (4, 2, 1)² 18 10Gb sideb and connector ( MII 24 - pin) 19 Slot 3 PCIe 2 x8 (8, 4, 2, 1)³ 20 Slot 4 PCIe 2 x16 (8, 4, 2, 1) 75W +EXT 75W 4 21 Slot 5 PCIe 2 x8 (4, 2, 1) 22 Slot 6 PCIe 2 x8 (4, 2, 1) 23 Internal USB connector 24 Internal USB tape conne[...]

  • Seite 84

    Component identif ication 84 System board LEDs Item Description Status 1 Power supply 1 Amber = No AC p ower or failed pow er supply Off = Power sup ply is on and function ing. 2 Power supply 2 Amber = No AC p ower or failed pow er supply Off = Power sup ply is on and function ing. 3 Processor 2 Amber = Proces sor 2 failed. Off = Processor 2 is fun[...]

  • Seite 85

    Component identif ication 85 Item Description Status 10 Processor 1 Amber = Proces sor 1 failed. Off = Processor 1 is functioning. 11 System fan 1 Amber = Fan is missing or has failed. Off = Fan is funct ioning. 12 Processor 1 D IMMs Amber = An error ha s occurred. Off = Normal op eration S ystem mainten ance switch Position Default Function S1 Off[...]

  • Seite 86

    Component identif ication 86 D IMM ident ification IMPORTANT: This se rver does not support mixing RDIMMs and UDIMMs. Attempting to mix these two types causes the server to halt dur ing BIOS initialization. The memory subsystem may be populated with ei ther RDIMMs or UDIMMs, but mixing the two types is no t supported. To determine DIMM characterist[...]

  • Seite 87

    Component identif ication 87 S AS/SATA de vice numbers • SFF configuration with an optional SAS expand er • SFF configuration with a second SAS controller[...]

  • Seite 88

    Component identif ication 88 • LFF configuration S AS and SATA drive LEDs Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green)[...]

  • Seite 89

    Component identif ication 89 S AS and SATA hard drive LE D combinations Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation On, off, or flashing Alternating amber and blue The drive h as failed, or a predictiv e failure alert has been received for this drive; it also has been selected by a managemen t application . On, off, or fla[...]

  • Seite 90

    Component identif ication 90 B attery pac k LEDs Item Color Description 1 Green System Power LED. This LED is on when th e system is powered up an d 12 V system power is available. Thi s power supply is us ed to mai ntain the batter y charge and provide supp lementary power to the cache microcontroller. 2 Green Auxiliary Power LED . This LED is on [...]

  • Seite 91

    Component identif ication 91 LED3 pattern LED4 pattern Interpretation Off Flashing (1 Hz) The battery pack is below the minimum charge level and is being charged. Features that require a battery (such as write cache, capacity expansion, strip e size migration, a nd RAID migration) a re unavai lable temporarily until charging is complete. The rechar[...]

  • Seite 92

    Component identif ication 92 1 Green LED 2 Amber LED Interpretation Off Off The flash code is corrupt. F an location s and configur ations CAUTION: To maintain pro per cooling, all fan bays mus t be populated with a fan or a fan bl ank. • Fan locations Item Description 1 Rear fan 1 2 Rear fan 2 3 Front fan 3 4 Front fan 4[...]

  • Seite 93

    Component identif ication 93 • Single - processor, standard fan c onfiguration Item Description 1 Rear fan 1 2 Rear fan 2 3 Front fan 3 4 Processor 1 5 DIMM baffl e • Single - processor, redundant fan c onfiguration Item Description 1 Rear fan 1 2 Rear fan 2[...]

  • Seite 94

    Component identif ication 94 Item Description 3 Front fan 3 4 Front fan 4 5 Processor 1 6 DIMM baffl e 7 Large redunda nt fan air baffl e • Dual - proc essor, non - r edundant fan configuration Item Description 1 Rear fan 1 2 Rear fan 2 3 Front fan 3 4 Processor 1 5 Processor 2 6 DIMM baffl es[...]

  • Seite 95

    Component identif ication 95 • Dual - processor, redun dant fan configuration Item Description 1 Rear fan 1 2 Rear fan 2 3 Front fan 3 4 Front fan 4 5 Processor 1 6 Processor 2 7 DIMM baffl es 8 Large redunda nt fan air baffl e[...]

  • Seite 96

    Component identif ication 96 O ptional hard dr ive cage jumper location and configuration settin gs • Optional two - bay LFF backplane • Optional eight - bay SFF bac kplane Drive cage Installation Pin setting 1 Standard No jumper 2 Optional 1- 2* *Optional driv e cages ship with the jum per set across pin s 1 and 2.[...]

  • Seite 97

    Specifications 97 S pec if icati ons E nvironmental specif ications Specification Value Temperature range* Operating 10 ° C to 35 ° C ( 50 ° F to 95 ° F) Shipping - 40 ° C to 70 ° C ( - 40 ° F to 158 ° F) Maximum wet bulb temperature 28 ° C (82.4 ° F) Relative humidity (noncondensing)** Operating 10% to 90% Nonoperating 5% to 95% * All te[...]

  • Seite 98

    Specifications 98 Rated input po wer 930 W at 100 V AC input 1348 W at 20 0V AC input BTUs per hour 3530 at 120V AC input 4600 at 200V to 240V AC in put Power supply output Rated steady - state power 800 W at 100 V AC input 900 W at 120 V AC input 1200 W at 20 0V to 240V AC input Maximum peak power 800 W at 100 V AC input 900 W at 120 V AC input 12[...]

  • Seite 99

    Specifications 99 Maximum peak power 460 W at 100 V to 120V AC inpu t 460 W at 200 V to 240V AC inpu t[...]

  • Seite 100

    Acronyms and abbreviation s 100 A c r on y ms and abbr e v iati ons ADU Array Diagnostics U tility AMP Advanced Memory Protec tion FBWC flash - backed write cac he iLO Integrated Lights - Out IML Integrated Management Log LFF large form factor LV DIMM low - voltage DIM M NCQ Native Command Queuin g NMI nonmaskable inter rupt PATA parallel ATA PCIe [...]

  • Seite 101

    Acronyms and abbreviation s 101 POST Power - On Self Te st PSP HP ProLiant Support Pack RBSU ROM - Based Setup Utility RDIMM registered d ual in - line memory modul e SAS serial attached SCSI SATA serial ATA SFF small form factor SIM Systems Insig ht Manager SMP Server Migration Pack TPM Trusted Platform Mo dule UDIMM unregistered dual in - line me[...]

  • Seite 102

    Index 102 A access panel 30 accessing ser vers 28 adapter LEDs 78, 79, 81, 84 additional inform ation 75 ADU (Array Diagnost ic Utility) 76 B battery 73 battery - backed write cache (BBWC) 46, 48, 90 battery - backed write cache battery pack 46, 47 BBWC (battery - backed write c ache) 46, 90 BBWC battery pack 47 blanks 45 buttons 78, 79 C capacitor[...]

  • Seite 103

    Index 103 L Large redundant air baff le 32 LED, health 78, 79 LED, system p ower 79 LED, UID 79, 81 LEDs 88, 89 LEDs, front panel 79 LEDs, hard drive 88, 89 LEDs, NIC 78, 79, 81, 84 LEDs, rear panel 81 LEDs, system board 84 LEDs, unit identification (UID) 78, 79, 81 M maintenance 26 management tools 75 mechanical compone nts 15 mechanical specific [...]