HP COMPAQ NC4200 Bedienungsanleitung

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197

Zur Seite of

Richtige Gebrauchsanleitung

Die Vorschriften verpflichten den Verkäufer zur Übertragung der Gebrauchsanleitung HP COMPAQ NC4200 an den Erwerber, zusammen mit der Ware. Eine fehlende Anleitung oder falsche Informationen, die dem Verbraucher übertragen werden, bilden eine Grundlage für eine Reklamation aufgrund Unstimmigkeit des Geräts mit dem Vertrag. Rechtsmäßig lässt man das Anfügen einer Gebrauchsanleitung in anderer Form als Papierform zu, was letztens sehr oft genutzt wird, indem man eine grafische oder elektronische Anleitung von HP COMPAQ NC4200, sowie Anleitungsvideos für Nutzer beifügt. Die Bedingung ist, dass ihre Form leserlich und verständlich ist.

Was ist eine Gebrauchsanleitung?

Das Wort kommt vom lateinischen „instructio”, d.h. ordnen. Demnach kann man in der Anleitung HP COMPAQ NC4200 die Beschreibung der Etappen der Vorgehensweisen finden. Das Ziel der Anleitung ist die Belehrung, Vereinfachung des Starts, der Nutzung des Geräts oder auch der Ausführung bestimmter Tätigkeiten. Die Anleitung ist eine Sammlung von Informationen über ein Gegenstand/eine Dienstleistung, ein Hinweis.

Leider widmen nicht viele Nutzer ihre Zeit der Gebrauchsanleitung HP COMPAQ NC4200. Eine gute Gebrauchsanleitung erlaubt nicht nur eine Reihe zusätzlicher Funktionen des gekauften Geräts kennenzulernen, sondern hilft dabei viele Fehler zu vermeiden.

Was sollte also eine ideale Gebrauchsanleitung beinhalten?

Die Gebrauchsanleitung HP COMPAQ NC4200 sollte vor allem folgendes enthalten:
- Informationen über technische Daten des Geräts HP COMPAQ NC4200
- Den Namen des Produzenten und das Produktionsjahr des Geräts HP COMPAQ NC4200
- Grundsätze der Bedienung, Regulierung und Wartung des Geräts HP COMPAQ NC4200
- Sicherheitszeichen und Zertifikate, die die Übereinstimmung mit entsprechenden Normen bestätigen

Warum lesen wir keine Gebrauchsanleitungen?

Der Grund dafür ist die fehlende Zeit und die Sicherheit, was die bestimmten Funktionen der gekauften Geräte angeht. Leider ist das Anschließen und Starten von HP COMPAQ NC4200 zu wenig. Eine Anleitung beinhaltet eine Reihe von Hinweisen bezüglich bestimmter Funktionen, Sicherheitsgrundsätze, Wartungsarten (sogar das, welche Mittel man benutzen sollte), eventueller Fehler von HP COMPAQ NC4200 und Lösungsarten für Probleme, die während der Nutzung auftreten könnten. Immerhin kann man in der Gebrauchsanleitung die Kontaktnummer zum Service HP finden, wenn die vorgeschlagenen Lösungen nicht wirksam sind. Aktuell erfreuen sich Anleitungen in Form von interessanten Animationen oder Videoanleitungen an Popularität, die den Nutzer besser ansprechen als eine Broschüre. Diese Art von Anleitung gibt garantiert, dass der Nutzer sich das ganze Video anschaut, ohne die spezifizierten und komplizierten technischen Beschreibungen von HP COMPAQ NC4200 zu überspringen, wie es bei der Papierform passiert.

Warum sollte man Gebrauchsanleitungen lesen?

In der Gebrauchsanleitung finden wir vor allem die Antwort über den Bau sowie die Möglichkeiten des Geräts HP COMPAQ NC4200, über die Nutzung bestimmter Accessoires und eine Reihe von Informationen, die erlauben, jegliche Funktionen und Bequemlichkeiten zu nutzen.

Nach dem gelungenen Kauf des Geräts, sollte man einige Zeit für das Kennenlernen jedes Teils der Anleitung von HP COMPAQ NC4200 widmen. Aktuell sind sie genau vorbereitet oder übersetzt, damit sie nicht nur verständlich für die Nutzer sind, aber auch ihre grundliegende Hilfs-Informations-Funktion erfüllen.

Inhaltsverzeichnis der Gebrauchsanleitungen

  • Seite 1

    Main tenan ce and Ser vice Gu id e HP C ompaq nc4 200 Notebook P C Doc ument P art Number: 444 6 2 4 -00 2 Apr il 200 7 This guide is a troubleshooting reference used for maintaining and servicing the notebook. It provides comprehensi ve information on identifying notebook features, components, and spare parts; troubleshooting notebook problems; an[...]

  • Seite 2

    © Copyright 2006, 2007 He wlett-P ackard Dev elopment Company , L.P . Microsoft and W indo ws are U.S. re gistered trademarks of Microsoft Corporation. Intel, Pentium, and Celeron are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Bluetooth is a trademark o wned by its proprie[...]

  • Seite 3

    Saf e t y w ar ning not ice Å WA R N I N G : T o reduce the po ssibility of heat-r elated inj uri es or of o ve rheating the comput er , do not plac e the computer dir ectly on y our lap or obstru ct the computer air ve nt s. Use the com puter only on a har d , flat surface . Do not allow ano ther ha r d surface , such as an adjo ining optional pr[...]

  • Seite 4

    Maintenance and S ervi ce Guide v Cont e nt s 1 Product Description 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 1.2 Resetting the Notebook . . . . . . . . . . . . . . . . . . . . . . . 1–4 1.3 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . 1–5 1.4 External Components . . . . . .[...]

  • Seite 5

    v i Maintenance and S ervi ce Guide Cont en ts 3 Software Update and Recovery Downloading a BIOS Update . . . . . . . . . . . . . . . . . . 3–3 Installing a BIOS Update . . . . . . . . . . . . . . . . . . . . . 3–4 Recovering the BIOS . . . . . . . . . . . . . . . . . . . . . . . . 3–5 4 Illustrated Parts Catalog 4.1 Serial Number Location . [...]

  • Seite 6

    Cont en ts Maintenance and S ervi ce Guide v ii 6 Removal and Replacement Procedures 6.1 Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–2 6.2 Disassembly Sequence Chart . . . . . . . . . . . . . . . . . . 6–3 6.3 Preparing the Notebook for Di sassembly . . . . . . . . . 6–5 6.4 Hard Drive . . . . . . . . . . . . .[...]

  • Seite 7

    v iii Maintenance and S ervi ce Guide Cont en ts 7 Specifications A Connector Pin Assignments B Power Cord Set Requirements C S c r e w L i s t i n g Index[...]

  • Seite 8

    Maintenance and S ervi ce Guide 1–1 1 Pr oduct Descript ion The HP Compaq nc4200 Notebook PC of fers adv anced modularity , Intel® Pentium® M and Celeron® M processors, and extensi ve multimedia support. HP Compaq nc4 200 Notebook P C[...]

  • Seite 9

    1–2 Maintenance and Serv ice Gui de Pr oduct Desc r iption 1. 1 F e a t u r e s ■ Intel Pentium M 2.13-, 2.00-, 1.86-, 1.73-, or 1.60-GHz processors, or Intel Celeron M 1.50-GHz processor , varying by notebook model ■ 12.1-inch, XGA, TFT (1024 × 768) display with ov er 16.8 million colors ■ 80-, 60-, or 40-GB high-capacity hard dri v e, v [...]

  • Seite 10

    Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–3 ■ External 65-watt A C adapter with 3-wire po wer cord ■ 6-cell Li-Ion battery pack, v arying by notebook model ■ Audio speaker ■ V olume up, v olume mute, and v olume do wn b uttons ■ Connectors: ❏ Infrared ❏ Audio-out (headphone) ❏ Audio-in (microphone) ❏ Uni versal [...]

  • Seite 11

    1–4 Maintenance and Serv ice Gui de Pr oduct Desc r iption 1 .2 Reset ting t h e Notebook If the notebook you are servicing has an unkno wn password, follo w these steps to clear the password. These steps also clear CMOS: 1. Prepare the notebook for disassembly (refer to Section 4.3, “Miscellaneous Plastics/ Hardware Kit, ” for more informati[...]

  • Seite 12

    Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–5 1. 3 P o w e r M a n a g e m e n t The notebook comes with po wer management features that extend battery operating time and conserv e po wer . The notebook supports the follo wing po wer management features: ■ Standby ■ Hibernation ■ Setting customization by the user ■ Hotke ys[...]

  • Seite 13

    1–6 Maintenance and Serv ice Gui de Pr oduct Desc r iption 1 .4 Exter nal C om ponents The external components on the front of the notebook are sho wn belo w and described in T able 1-1. F r ont Component s Ta b l e 1 - 1 Fr ont Components Item Component Function 1 Wireless light On: One or more optional internal wireless de vices, such as a WLAN[...]

  • Seite 14

    Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–7 3B a t t e r y l i g h t ■ Amber : A batter y pack is charging. ■ Green: A batter y pack is close to full charge capacity . ■ Blinking amber : A batter y pack that is the only a vailab le po wer source has reached a low-battery condition. When the batter y reaches a critical lo w-[...]

  • Seite 15

    1–8 Maintenance and Serv ice Gui de Pr oduct Desc r iption The external components on the right side of the notebook are sho wn belo w and described in T able 1-2. R ight-Side C omponents[...]

  • Seite 16

    Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–9 Ta b l e 1 - 2 Right-Side Components Item Component Function 1A u d i o - o u t (headphone) jack Connects an optional headphone or pow ered stereo speakers . Also connects the audio function of an audio/video de vice , such as a tele vision or VCR. 2 A udio-in (microphone) jack Connects[...]

  • Seite 17

    1–1 0 Maintenance and S ervi ce Guide Pr oduct Desc r iption The external components on the left side of the notebook are sho wn belo w and described in T able 1-3. Lef t -S ide Com po ne nt s Ta b l e 1 - 3 Left-Side Components Item Component Function 1 Security cable slot Attaches an op tional security cable to the notebook. ✎ The purpose of [...]

  • Seite 18

    Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–1 1 3 Wireless button (select models only) T urns the wireless functionality of the WLAN or Bluetooth de vice on or off , b ut does not establish a connection. ✎ To establish a wireless connection, a wireless network must already be set up. 4 USB por t Connects a USB 1.1- and 2.0-compli[...]

  • Seite 19

    1–1 2 Maintenance and S ervi ce Guide Pr oduct Desc r iption The external components on the rear panel of the notebook are sho wn belo w and described in T able 1-4. R ear P anel Components[...]

  • Seite 20

    Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–1 3 Ta b l e 1 - 4 Rear P anel Components Item Component Function 1 USB por t Connects USB 1.1- and 2.0-compliant de vices to the notebook using a standard USB cable . 2 RJ-11 (modem) jack Connects a modem cab le. Enab led with 56K connectivity . 3 RJ-45 (network) jack Connects a network [...]

  • Seite 21

    1–1 4 Maintenance and S ervi ce Guide Pr oduct Desc r iption The standard ke yboard components of the notebook are sho wn belo w and described in T able 1-5. St andard K ey boar d C omponents[...]

  • Seite 22

    Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–1 5 T able 1-5 Standar d Ke yboar d Components Item Component Function 1 Function ke ys (12) P erform system and application tasks. When combined with the fn key , th e function ke ys f3 , f4 , and f8 through f11 perf or m additional tasks as hotk eys . 2 caps lock ke y Enables caps lock [...]

  • Seite 23

    1–1 6 Maintenance and S ervi ce Guide Pr oduct Desc r iption The notebook top components are sho wn belo w and described in T able 1-6. To p C o m p o n e n t s[...]

  • Seite 24

    Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–1 7 T able 1-6 T op Components Item Component Function 1 Left and right T ouchP ad bu tt o n s (2 ) Function lik e the left and ri ght b uttons on an e xternal mouse. 2 T ouchP ad Mov es the pointer . Can be set to perf or m other mouse functions, such as scrolling, selecting, and double-[...]

  • Seite 25

    1–1 8 Maintenance and S ervi ce Guide Pr oduct Desc r iption The external components on the bottom of the notebook are sho wn belo w and described in T able 1-7. Bot tom Component s[...]

  • Seite 26

    Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–1 9 Ta b l e 1 - 7 Bottom Components Item Component Function 1 Base enclosure cov er Cov ers the display cab le and connector . 2 Doc king connector Connects the notebook to an optional doc king de vice. 3 T r av el battery connector Connects an optional trav el battery . 4 V ents (3) Ena[...]

  • Seite 27

    1–20 Maintenance and S ervi ce Guide Pr oduct Desc r iption 1. 5 D e s i g n O v e r v i e w This section presents a design ov ervie w of k ey parts and features of the notebook. Refer to Chapter 4, “Illustrated P arts Catalog, ” to identify replacement parts, and Chapter 6, “Remo v al and Replacement Procedures, ” for disassembly steps. [...]

  • Seite 28

    Maintenance and S ervi ce Guide 2–1 2 T r oubl eshooting Å WA R N I N G : Only au thori z ed tec hnic ians tr ained by HP should r epair this equipmen t . All tr ouble shooting and r epair pr ocedur es ar e det ailed to allo w onl y subass embl y-/module -lev el r epair . Because of the comple x ity of the indi v idual boar ds and subas sembli e[...]

  • Seite 29

    2–2 Maintenance and Serv ice Gui de T roubleshooting Acce ssing Computer Se tup The information and settings in Computer Setup are accessed from the File , Security , To o l s , and Advanced menus. 1. Open Computer Setup by turning on or restarting the notebook. Press f10 while the F10 = Based Setup message is displayed in the lo wer -left corner[...]

  • Seite 30

    Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–3 4. T o confirm the restoration, press f10 . 5. Select File > Sa ve changes and exit , and then follo w the instructions on the screen. When the computer restarts, the factory settings are restored, and any identif ication information you ha v e entered is sa ved. Sele cting f r o[...]

  • Seite 31

    2–4 Maintenance and Serv ice Gui de T roubleshooting Selec ting from th e Securit y Menu Ta b l e 2 - 2 Security Menu Select T o Do This Administrator pass w ord Enter , change , or delete an HP Administrator pass word. P ower-on pass w ord Enter , change, or delete a power-on pass word. P ass w ord options ■ Enable/Disab le stringent secur ity[...]

  • Seite 32

    Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–5 Selec ting from th e T ools Menu Ta b l e 2 - 3 To o l s M e n u Select T o Do This HDD Self T est options Run a quick or comprehensiv e self-test on an y hard drive in the system. Batter y Inf or mation Vie w inf or matio n about any battery packs in the notebook. Memor y Check ■[...]

  • Seite 33

    2–6 Maintenance and Serv ice Gui de T roubleshooting Selec ting from th e Ad v anced Menu Ta b l e 2 - 4 Adv anced Menu Select T o Do This Language (or press f2 ) Change the Computer Setup language. Boot options ■ Enable/Disab le MultiBoot, which sets a star tup sequence that can include most bootable de vices and media in the system. ■ Set t[...]

  • Seite 34

    Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–7 2.2 T roubl eshooting Flo wc h arts Ta b l e 2 - 5 T roubleshooting Flo wc har ts Overview Flowchart Description 2.1 “Flowchar t 2.1—Initial T roubleshooting” 2.2 “Flowchar t 2.2—No P ower , P ar t 1” 2.3 “Flowchar t 2.3—No P ower , P ar t 2” 2.4 “Flowchar t 2.4?[...]

  • Seite 35

    2–8 Maintenance and Serv ice Gui de T roubleshooting Flowchart Description 2.14 “Flowchar t 2.14—No OS Loading, Optical Drive” 2.15 “Flowchar t 2.15—No A udio , P ar t 1” 2.16 “Flowchar t 2.16—No A udio , P ar t 2” 2.17 “Flowchar t 2.17—Nonfunctioning De vice” 2.18 “Flowchar t 2.18—Nonfunctioning K e yboard” 2.19 “[...]

  • Seite 36

    Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–9 Flo wc h art 2. 1—Initial T roubleshootin g Connecting to network or modem? Begin troubleshooting. Is there power? Is the OS loading? Is there video? (no boot) Is there sound? Beeps, LEDs, or error messages? Keyboard/ pointing device work- ing? Go to “Flowchart 2.17—Nonfunc- t[...]

  • Seite 37

    2–1 0 Maintenance and S ervi ce Guide T roubleshooting Flo wc h ar t 2.2—No P o w er , P art 1 1. Reseat the power cables in the docking device and at the AC outlet. 2. Ensure the AC power source is active. 3. Ensure that the power strip is working. Done Remove from docking device (if applicable). Po we r up on batter y power? Po we r up on AC [...]

  • Seite 38

    Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–1 1 Flo w c har t 2.3—No P o w er , P art 2 Continued from “Flowchar t 2.2—No P ower , Pa r t 1 . ” Visually check for debris in batter y socket and cl ean if necessary . Done N Y Po we r on ? Check batter y by recharging it, moving it to another notebook, or replacing it. Po [...]

  • Seite 39

    2–1 2 Maintenance and S ervi ce Guide T roubleshooting Flo wc h ar t 2.4—No P o w er , P art 3 Continued from “Flowchart 2.3—No P ower , Pa r t 2 . ” Reseat AC adapter in notebook and at po wer sou rc e. Internal or external AC adapter? Done Done Done Done Po we r on ? Po we r on ? Po we r on ? Plug directly into AC outlet. Po we r LE D o[...]

  • Seite 40

    Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–1 3 Flowc h ar t 2. 5—N o P o w er , P ar t 4 Y N Continued from “Flowchar t 2.4—No P ower , Pa r t 3 . ” Reseat loose components and boards and replace damaged items. Open notebook. Loose or damaged parts? Y Close notebook and retest. Po we r o n? Done N Replace the following[...]

  • Seite 41

    2–1 4 Maintenance and S ervi ce Guide T roubleshooting Flo wc h ar t 2.6—No Video, P art 1 A N Stand-alone or docking device? No video. Replace the following one at a time . T est after each replacement. 1. Cable between notebook and not ebook display (if applicable) 2. Display 3. System board Internal or external display*? Adjust brightness. V[...]

  • Seite 42

    Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–1 5 Flo wc h ar t 2.7—No Video, P art 2 Y N Continued from “Flowchart 2.6—No Video , Pa r t 1 . ” Done Adjust external monitor display . Video OK? Adjust display brightness. Video OK? Video OK? Done Done Check that notebook is properly seated in docking device, for bent pins o[...]

  • Seite 43

    2–1 6 Maintenance and S ervi ce Guide T roubleshooting F l o wch a rt 2 . 8 — No nf u n ct i on in g D ock i n g De v ice (if a pp licab le) Y N Reseat power cord in docking device and power outlet. N Check voltage setting on docking device. Reset monitor cable connector at docking device. Reinstall notebook into dock- ing device. Docking devic[...]

  • Seite 44

    Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–1 7 Flo wc h ar t 2.9—No O peratin g S y s tem (OS) Loadin g No OS loading from hard drive, go to “Flowchart 2.10—No OS Loading, Hard Drive , P ar t 1. ” Reseat power cord in docking device and power outlet. No OS loading.* *NOTE: Before beginning troubleshooting, always check[...]

  • Seite 45

    2–1 8 Maintenance and S ervi ce Guide T roubleshooting Flo wc h ar t 2. 1 0—N o OS Loadin g , Hard Driv e, Pa r t 1 Go to “Flowchart 2.17—Nonfunction- ing De vice. ” Y Done N OS not loading from hard drive. Nonsystem disk message? Go to “Flowchar t 2.11—No OS Load- ing, Hard Drive , Pa r t 2 . ” Reseat external hard drive. OS loadin[...]

  • Seite 46

    Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–1 9 Flo wc h ar t 2. 1 1—No OS Loa ding , H ard Driv e, Pa r t 2 Load OS using Oper- ating System disc (if applicable). Continued from “Flowchar t 2.10—No OS Loading, Hard Drive, P ar t 1. ” Reseat hard drive. Done Disc or diskette in drive? 1. Replace hard drive. 2. Replace s[...]

  • Seite 47

    2–20 Maintenance and S ervi ce Guide T roubleshooting Flo wc h ar t 2. 1 2—No OS Loa ding , H ard Dri v e, Pa r t 3 Y System files on hard drive? Continued from “Flowchar t 2.11—No OS Load- ing, Hard Drive, Pa r t 2 . ” Clean virus. Done N Install OS and reboot. Virus on hard drive? OS loading from hard drive? Y N Y N Y N Diagnostics on d[...]

  • Seite 48

    Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–2 1 Flo wc h ar t 2. 1 3—No OS Loa ding , Disk et te Driv e Replace the following components individually , retesting after each replacement: ■ Diskette drive ■ System board Done Y N Reseat diskette drive. OS not loading from diskette drive. Done Y Y Y Y Y Y Y N N N N N N N OS l[...]

  • Seite 49

    2–2 2 Maintenance and S ervi ce Guide T roubleshooting Flo wc h art 2. 1 4—No OS Loa ding , O ptical Driv e Y Done N Bootable disc in drive? Disc in drive? No OS loading from CD-ROM or DVD-ROM drive. Install bootable disc and reboot notebook. Go to “Flowchar t 2.17—Nonfunction- ing De vice. ” Go to “Flowchar t 2.17—Nonfunctioning De v[...]

  • Seite 50

    Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–2 3 Flo wc h ar t 2. 1 5 —No Audio, P art 1 No audio. N Notebook in docking device (if applicable)? Internal audio? Audio? Done Undock Audio? Done T urn up audio internally or externally . Go to “Flowchar t 2.16—No A udio , Pa r t 2 . ” Go to “Flowchar t 2.17—Nonfunctionin[...]

  • Seite 51

    2–2 4 Maintenance and S ervi ce Guide T roubleshooting Flo wc h ar t 2. 1 6—N o Audio, P ar t 2 YN Continued from “Flowchart 2.15—No A udio , Pa r t 1 . ” Reload audio drivers. Audio driver in OS configured? Audio? Y Y Y N N N Correct drivers for application? Connect to external speaker . Load drivers and set configuration in OS. Audio? D[...]

  • Seite 52

    Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–2 5 Flo wc h art 2. 1 7—Nonfunc tionin g De v ice Done Any physical device detected? Y N Unplug the nonfunctioning device from the notebook and inspect cables and plugs for bent or broken pins or other damage. Reseat device. Clear CMOS. Done Fix o r replace broken item. Nonfunctioni[...]

  • Seite 53

    2–2 6 Maintenance and S ervi ce Guide T roubleshooting Flo wc h ar t 2. 1 8—N onfunc tionin g K e yboard Y N Keyboard operating properly? Keyboard not operating prop- erly . External device works? Replace system board. Replace system board. Connect notebook to good external key- board. Reseat internal key- board connector (if applicable). Repla[...]

  • Seite 54

    Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–2 7 Flo wc h art 2. 1 9—N onfunc tioning P ointin g De vice Y N Pointing device not operating properly . External device works? Replace system board. Replace system board. Connect notebook to good external pointing device. Reseat internal pointing device connector (if applicable). R[...]

  • Seite 55

    2–2 8 Maintenance and S ervi ce Guide T roubleshooting Flo wc h art 2.20—N o Net w ork/Modem Conn ectio n Y Disconnect all power from the notebook and open. No network or modem connec- tion. N Done Digital line? Network or modem jack active? Replace jack or have jack acti- vated. Connect to nondigital line. NIC/modem configured in OS? Reload dr[...]

  • Seite 56

    Maintenance and S ervi ce Guide 3–1 3 Soft w ar e Upd a te an d Rec o ver y Soft w are Upd ates T o stay current with the newest technolog y and maintain optimal performance, install the latest versions of HP softw are on your computer as they become a v ailable. T o update HP software: 1. Identify your computer model, product category , and seri[...]

  • Seite 57

    3–2 Maintenance and Serv ice Gui de So ftwar e Update and R eco v ery Accessin g Com pu ter Inf orma tion Before you access the updates for your computer , collect the follo wing information: ■ The product cate gory is Notebook. ■ The product family name and series number are printed on the display bezel. ■ Model information is provided on [...]

  • Seite 58

    Softwar e Update and Reco v ery Maintenance and S ervi ce Guide 3–3 Obtainin g t h e Suppor t Sof t w are Disc The Support Softwar e disc provides HP softw are updates and installation instructions. The disc includes de vice dri vers, BIOS updates, and utilities. T o purchase the current Support Softwar e disc or a subscription that provides both[...]

  • Seite 59

    3–4 Maintenance and Serv ice Gui de So ftwar e Update and R eco v ery T o download a BIOS update: 1. Access the page on the HP W eb site that provides software for your computer: ❏ Select Start > Help and Support , and then click a software update link. – or – ❏ V isit the HP W eb site at http://www .hp.com/support . 2. Follo w the ins[...]

  • Seite 60

    Softwar e Update and Reco v ery Maintenance and S ervi ce Guide 3–5 BIOS installation procedures v a ry . Follo w any instructions that are displayed on the screen after the do wnload is complete. If no instructions are displayed: 1. Open W indows Explorer b y selecting Start > All Pr ograms > Accessories > Windo ws Explor er . 2. In the[...]

  • Seite 61

    3–6 Maintenance and Serv ice Gui de So ftwar e Update and R eco v ery BIOS recov ery can be forced on a non-functioning notebook b y turning on the notebook while pressing and holding the W indows logo ke y + B on the nonfunctioning notebook ke yboard until the caps lock light blinks. T o recov er the BIOS: 1. If the nonfunctioning notebook is do[...]

  • Seite 62

    Maintenance and S ervi ce Guide 4–1 4 I llus trated P ar ts C a tal og This chapter provides an illustrated parts breakdo wn and a reference for spare part numbers. 4. 1 Seri al Number Loca tion When ordering parts or requesting information, provide the notebook serial number and model number located on the bottom of the notebook. Serial Numb er [...]

  • Seite 63

    4–2 Maintenance and Serv ice Gui de Illustrated P a rts Catalog 4.2 Notebook Major C om ponents Noteboo k Major C omponents[...]

  • Seite 64

    Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–3 Ta b l e 4 - 1 Spare P arts: Notebook Major Components Item Description Spare P art Number 1 12.1-inch, XGA, TFT displa y assembl y (includes wireless antenna boards and cables) 383548-001 Display Hinge Kit (not illustrated) 383530-001 LCD rubber pad kit, with screws (not illustr at[...]

  • Seite 65

    4–4 Maintenance and Serv ice Gui de Illustrated P a rts Catalog Noteboo k Major C omponents[...]

  • Seite 66

    Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–5 Ta b l e 4 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P art Number 4 Rear keyboar d co ver 383522-001 5 Button board (includes b utton board cab le) 383511-001 6 T op cover 383560-001 7 Fan 383528-001 8 T ouchP ad 383562-001 T ouchP ad cable (not [...]

  • Seite 67

    4–6 Maintenance and Serv ice Gui de Illustrated P a rts Catalog Noteboo k Major C omponents[...]

  • Seite 68

    Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–7 Ta b l e 4 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P art Number 10 Mini PCI comm unications cards (Continued) 802.11a/b/g DynaStar WLAN card, f or use in Ja pan 802.11a/b/g DynaStar WLAN card, f or use in most of the world 802.11a/b/g DynaStar [...]

  • Seite 69

    4–8 Maintenance and Serv ice Gui de Illustrated P a rts Catalog Noteboo k Major C omponents[...]

  • Seite 70

    Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–9 Ta b l e 4 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P art Number Miscellaneous Plastics/Hard ware Kit , includes: 383549-001 14a 14b 14c 14d PC Card slot spacer Bluetooth board cov er Hard drive cov er Memor y module compar tment cove r Not illu[...]

  • Seite 71

    4–1 0 Maintenance and S ervi ce Guide Illustrated P a rts Catalog 4.3 Miscell an eous P la sti c s/ Har dw ar e Ki t T able 4-2 Spare P art Number 383549-001 Item Description 1 Hard drive co v er 2 Bluetooth cov er 3 PC Card slot space sav er 4 Memor y module compar tment cov er (includes 2 captive scre ws) 5 Notebook f eet (5)[...]

  • Seite 72

    Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–1 1 4.4 Miscell an eous Ca bl e Kit Ta b l e 4 - 3 Spare P art Number 383516-001 Item Description 1 LED board cable 2 RJ-11 cable 3 T ouchP ad cab le 4 Bluetooth cable[...]

  • Seite 73

    4–1 2 Maintenance and S ervi ce Guide Illustrated P a rts Catalog 4.5 Miscell an eous (Not I llus trated) Ta b l e 4 - 4 Miscellaneous Spare P art Information Description Spare P art Number Label Kit 383533-001 Adjustable notebook stand 372420-001 Adv anced Doc king Station 374804-001 Docking Station 374803-001 Docking Station Miscellaneous Plast[...]

  • Seite 74

    Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–1 3 Po w e r c o r d s (continued) Fo r u s e i n : Hong K ong and the United Kingdom 350188-031 Israel 350188-BB1 Italy 350188-061 Japan 350188-291 The Netherlands 350188-331 P eople’ s Repub lic of China 350188-AA1 Saudi Arabia 350188-171 Spain 350188-071 Sweden/Finland 350188-B71[...]

  • Seite 75

    4–1 4 Maintenance and S ervi ce Guide Illustrated P a rts Catalog 4.6 Sequ enti al P ar t N umber Listin g Ta b l e 4 - 5 Sequential P art Number Listing Spare P art Number Description 337407-001 802.11a/b/g DynaStar WLAN Mini PCI comm unications card, f or use in most of the world 337407-002 802.11a/b/g DynaStar WLAN Mini PCI comm unications car[...]

  • Seite 76

    Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–1 5 350188-AA1 P ow er cord f or use in P eople’ s Republic of China 350188-B71 P ower cord f or use in Sw eden/Finland 350188-BB1 P ow er cord f or use in Israel 370429-001 Bluetooth wireless module (includes Bluetooth module cab le) 373888-001 802.11a/b/g FRLN WLAN Mini PCI comm u[...]

  • Seite 77

    4–1 6 Maintenance and S ervi ce Guide Illustrated P a rts Catalog 381302-001 802.11g Silv er ton WLAN Mini PCI communications card, f or use in most of the world 381303-001 802.11g Silv er ton WLAN ca rd Mini PCI communications card, f or use in the rest of the world 383458-001 K eyboard with pointing st ic k f or use in the United States 383458-[...]

  • Seite 78

    Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–1 7 383458-211 K eyboard with pointi ng stic k f or use in Hungary 383458-221 K eyboard with pointing stic k f or use in Czech Repub lic 383458-231 K eyboard with pointi ng stic k f or use in Slo v akia 383458-241 K eyboard with pointi ng stic k f or use in P o land 383458-251 K eyboa[...]

  • Seite 79

    4–1 8 Maintenance and S ervi ce Guide Illustrated P a rts Catalog 383518-001 LCD center hinge cap 383519-001 K eyboard co v er 383520-001 Base enclosure co v er 383522-001 Rear k e yboard cov er 383524-001 Rub ber domes 383525-001 40-GB hard driv e (5400 r pm; includes cov er , frame, and connector) 383526-001 60-GB hard driv e (5400 r pm; includ[...]

  • Seite 80

    Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–1 9 383542-001 PC24200 512-MB memory module 383543-001 Microphone 383545-001 TPM security module 383546-001 LCD rubber pad kit with scre ws 383548-001 12.1-inch, XGA, TFT disp la y assemb ly (includes wireless antenna boards and cables) 383549-001 Miscellaneous Plastics/Hardw are Kit [...]

  • Seite 81

    4–20 Maintenance and S ervi ce Guide Illustrated P a rts Catalog 405839-001 80-GB hard driv e (5400 r pm; includes cov er , frame, and connector) 411337-001 Smar t card reader 417947-001 LCD board 440150-001 K eyboard point stic k cap , blue Ta b l e 4 - 5 Sequential P art Number Listing (Continued) Spare P art Number Description[...]

  • Seite 82

    Maintenance and S ervi ce Guide 5–1 5 Remo v al and Repl a cemen t Preliminaries This chapter provides essential information for proper and safe remov al and replacement service. 5 . 1 T ools Required Y ou will need the follo wing tools to complete the remov al and replacement procedures: ■ Magnetic scre wdri ver ■ Phillips P0 scre wdri v er [...]

  • Seite 83

    5–2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies 5 .2 Ser vice C onsid erations The follo wing sections include some of the considerations that you should keep in mind during disassembly and assembly procedures. ✎ As you remov e each subassembly from the notebook, place the subassembly (and all accompanying scre w[...]

  • Seite 84

    Re mo val and R eplaceme nt Pr eliminar ie s Maintenance and S ervi ce Guide 5–3 5. 3 P r eve n t i n g D a m a g e t o R emo v able Dri v es Remov able driv es are fragile components that must be handled with care. T o prev ent damage to the notebook, damage to a remov able driv e, or loss of information, observe the follo wing precautions: ■ [...]

  • Seite 85

    5–4 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies 5 .4 Pr e v enting Elec trosta tic D ama g e Many electronic components are sensiti ve to electrostatic dischar ge (ESD). Circuitry design and structure determine the degree of sensiti vity . Networks built into many inte grated circuits provide some protection, b ut [...]

  • Seite 86

    Re mo val and R eplaceme nt Pr eliminar ie s Maintenance and S ervi ce Guide 5–5 5 .5 P a c k a ging an d T rans por ting Precautions Use the follo wing grounding precautions when packaging and transporting equipment: ■ T o av oid hand contact, transport products in static-safe containers, such as tubes, bags, or boxes. ■ Protect all electros[...]

  • Seite 87

    5–6 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies 5 .6 W orksta tion Precautions Use the follo wing grounding precautions at workstations: ■ Cov er the workstation with appro v ed static-shielding material (refer to T able 5-2, “Static-Shielding Materials” ). ■ Use a wrist strap connected to a properly ground[...]

  • Seite 88

    Re mo val and R eplaceme nt Pr eliminar ie s Maintenance and S ervi ce Guide 5–7 5 .7 G rounding E quip men t and Methods Grounding equipment must include either a wrist strap or a foot strap at a grounded workstation. ■ When seated, wear a wrist strap connected to a grounded system. Wrist straps are flexible straps with a minimum of one megohm[...]

  • Seite 89

    5–8 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies T able 5-1 shows ho w humidity affects the electrostatic v oltage le ve ls generated by dif f erent acti vities. T able 5-2 lists the shielding protection provided b y antistatic bags and floor mats. Ta b l e 5 - 1 T ypical Electrostatic V oltage Levels Relative Humid[...]

  • Seite 90

    Maintenance and S ervi ce Guide 6–1 6 Remo v al and Repl a cemen t Pr ocedure s This chapter provides remo v al and replacement procedures. There are 56 scre ws, in 10 dif feren t sizes, that may ha v e to be remov ed, replaced, or loosened when servicing the notebook. Make special note of each scre w and scre w lock size and location during remo[...]

  • Seite 91

    6–2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 Seri al Number Report the notebook serial number to HP when requesting information or ordering spare parts. The serial number is located on the bottom of the notebook. Serial Numb er Loca tion[...]

  • Seite 92

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–3 6 .2 Di sassembl y Seque nce Chart Use the chart belo w to determine the section number to be referenced when removing notebook components. Disassembl y Sequence Char t Section Description # of Screws Remo ved 6.3 Preparing the notebook for disassemb ly Batter y pack 0 6.[...]

  • Seite 93

    6–4 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es Section Description # of Screws Remo ved 6.13 Processor 1 loosened 6.14 Inter nal memor y module 0 6.15 Mini PCI communications card 0 Å T o prev ent an unresponsive system, replace the wireless module only with a wireless module authorized f or use in the computer by t[...]

  • Seite 94

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–5 6. 3 Preparin g th e Notebook for Di sassem bl y Before you begin an y remo v al or installation procedures: 1. Shut do wn the notebook. If you are unsure whether the notebook is of f or in hibernation, turn the computer on, and then shut it do wn through the operating sy[...]

  • Seite 95

    6–6 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.4 Hard Driv e 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the two PM2.0×5.0 scre ws 1 that secure the hard dri v e cov er to the notebook. 3. Lift the right side of the hard dri ve co v er and swing it to the left 2 to remov e it. ✎ The hard [...]

  • Seite 96

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–7 4. Loosen the PM2.5×13.0 hard dri v e retention scre w 1 . 5. Grasp the mylar tab 2 on the hard dri v e and slide the hard dri v e to the left 3 to disconnect it from the system board. 6. Remov e the hard dri v e 4 . R emo v ing the Har d Dr i v e[...]

  • Seite 97

    6–8 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 7. Remov e the four PM3.0×4.0 scre ws 1 that secure the hard dri v e frame to the hard dri ve. 8. Lift the frame straight up 2 to remov e if from the hard dri v e. 9. Remov e the hard dri v e connector 3 . R emo v ing the Har d Dr i v e F rame Re verse the abo v e proce[...]

  • Seite 98

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–9 6.5 Notebook F eet The notebook feet are adhesi v e-backed rubber pads. The feet are included in the Miscellaneous Plastics/Hardware Kit, spare part number 383549-001. R eplac ing the Notebook F eet[...]

  • Seite 99

    6–1 0 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6.6 Bluetooth Modul e 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the hard dri v e ( Section 6.4 ). 3. Position the notebook with the front to ward you. 4. Loosen the two PM2.0×5.0 scre ws 1 that secure the Bluetooth cov er to the notebook. 5. [...]

  • Seite 100

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–1 1 6. Slide the Bluetooth module out of the notebook 1 . 7. Disconnect the Bluetooth module cable 2 from the board. R emo v ing the Bluet ooth Module Re verse the abo v e procedure to install the Bluetooth module.[...]

  • Seite 101

    6–1 2 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6.7 Exter nal Me mor y Module 1. Prepare the notebook for disassembly (refer to Section 6.3 ). 2. Position the notebook with the front to ward you. Memory Module Spare P ar t Number Inf ormation PC24200 1024 MB 512 MB 256 MB 383536-001 383542-001 383538-001 PC23200 102[...]

  • Seite 102

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–1 3 3. Remov e the two PM2.0×5.0 scre ws 1 that secure the memory module compartment cov er to the notebook. 4. Lift the left side of the cov er and swing it to the right 2 to remov e the memory module compartment co ver . ✎ The memory module compartment cov er is includ[...]

  • Seite 103

    6–1 4 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 5. Spread the retaining tabs 1 on each side of the memory module socket to release the memory module. (The side of the module opposite the socket rises a way from the notebook.) 6. Slide the module aw ay from the socket at an angle 2 . 7. Remov e the memory module. ✎[...]

  • Seite 104

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–1 5 6.8 TP M S ec u ri t y C a rd 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the memory module compartment co ver ( Section 6.7 ). 3. Remov e the PM1.5×3.5 scre w 1 that secures the TPM security card to the notebook. 4. Lift up on the rear edge of [...]

  • Seite 105

    6–1 6 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6.9 K e yboar d C o v er 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Position the notebook with the front to ward you. 3. Remov e the two T8M2.0×18.0 scre ws that secure the ke yboard co ver to the notebook. R emo v ing the K e y boar d Co ver S c r e [...]

  • Seite 106

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–1 7 4. T urn the notebook right-side up with the front to ward you. 5. Open the notebook as far as possible. 6. Lift the front edge of the ke yboard cov er until it detaches from the notebook. Rel e as i n g t h e Keybo a rd C over 7. Lift the ke yboard co ver straight up a[...]

  • Seite 107

    6–1 8 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 0 K e ybo ard 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard co ver ( Section 6.9 ). 3. T urn the notebook upside do wn with the front to ward you. Ke yboar d Spare P art Number Information K e yboards, with pointing stic k Belgi[...]

  • Seite 108

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–1 9 4. Remov e the follo wing: 1 Three T8M2.0×9.0 scre ws 2 One T8M2.0×5.0 scre w R emo v ing the K e y boar d Sc r e w s[...]

  • Seite 109

    6–20 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 5. T urn the notebook right-side up with the front to ward you. 6. Open the notebook as far as possible. 7. Slide the ke yboard back 1 until the pointing stick cable is accessible. 8. Release the zero insertion force (ZIF) connector to which the pointing stick cable is [...]

  • Seite 110

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–2 1 9. Lift the rear edge of the ke yboard 1 until it disengages from the notebook. 10. Slide the ke yboard forward 2 until it rests on the palm rest. 11. Release the ZIF connector to which the ke yboard cable is connected and disconnect the ke yboard cable 3 from the syste[...]

  • Seite 111

    6–2 2 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 1 Fan 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard co ver ( Section 6.9 ). 3. Release the ke yboard ( Section 6.10 ). 4. Disconnect the fan cable 1 from the system board. 5. Remov e the three T8M2.0×7.5 scre ws 2 that secure t[...]

  • Seite 112

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–2 3 6. 1 2 H ea t S in k 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard co ver ( Section 6.9 ). 3. Release the ke yboard ( Section 6.10 ). 4. Remov e the f an ( Section 6.11 ). 5. Remov e the four PM2.5×7.0 scre ws that secure the heat si[...]

  • Seite 113

    6–2 4 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. Lift the right side of the heat sink 1 to disengage it from the processor . 7. Slide the heat sink up and to the right 2 to remov e it. ✎ Due to the adhesi v e quality of the thermal paste located between the heat sink and processor , it may be necessary to mov e [...]

  • Seite 114

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–2 5 ✎ The thermal paste should be thoroughly cleaned from the surfaces of the heat sink 1 and processor 2 each time the heat sink is remov ed. Thermal paste is included with all heat sink and processor spare part kits. T hermal P aste L ocations Re verse the abo v e proce[...]

  • Seite 115

    6–2 6 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 3 Pro ces s or ✎ All processor spare part kits include thermal paste. 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard co ver ( Section 6.9 ). 3. Release the ke yboard ( Section 6.10 ). 4. Remov e the f an ( Section 6.11 ). 5. Re[...]

  • Seite 116

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–2 7 6. Use a flat-blade scre wdri v er to turn the processor locking scre w one-quarter turn counterclockwise 1 until you hear a click. 7. Lift the processor straight up and remov e it 2 . ✎ The gold triangle 3 on the processor should be aligned in the rear right corner w[...]

  • Seite 117

    6–2 8 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 4 Inter nal Mem or y Module 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard co ver ( Section 6.9 ). 3. Release the ke yboard ( Section 6.10 ). Memory Module Spare P ar t Number Inf ormation PC24200 1024 MB 512 MB 256 MB 383536-001[...]

  • Seite 118

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6 –2 9 4. Spread the retaining tabs 1 on each side of the memory module socket to release the memory module. (The side of the memory module opposite the socket rises a way from the notebook.) 5. Slide the memory module aw ay from the socket at an angle 2 . 6. Remov e the memo[...]

  • Seite 119

    6–30 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 5 M i ni PCI C o mm u n ic a t io ns C a rd 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard co ver ( Section 6.9 ). 3. Release the ke yboard ( Section 6.10 ). Mini PCI Communications Car d Spare P art Number Information 802.11g Sil[...]

  • Seite 120

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–3 1 ✎ Make note of which antenna cable is attached to which antenna clip on the Mini PCI communications card before disconnecting the cables. 4. Disconnect the auxiliary and main antenna cables 1 from the Mini PCI communications card. 5. Spread the two retaining tabs 2 on[...]

  • Seite 121

    6–3 2 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6 . 1 6 Displa y Assembl y 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard co ver ( Section 6.9 ). 3. Remov e the ke yboard ( Section 6.10 ). 4. Close the notebook. 5. T urn the notebook upside do wn with the rear panel to ward you. Di[...]

  • Seite 122

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6 –3 3 6. Remov e the two T8M2.0×18.0 scre ws 1 that secure the display cable cov er to the notebook. 7. Remov e the two T8M2.0×9.0 scre ws 2 that secure the display assembly to the notebook. R emo v ing the Displa y Assembl y Sc r e w s[...]

  • Seite 123

    6–3 4 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 8. Remov e the base enclosure co ver . R emo v ing the Bas e Enclo sur e C o v er 9. Disconnect the display cable from the system board. Disconnec ting the Displa y Cable[...]

  • Seite 124

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–35 10. Route the display cable through the opening between the base enclosure and the top cov er . R eleasing the Dis play C able[...]

  • Seite 125

    6–3 6 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 11. T urn the notebook right-side up with the front to ward you. 12. Open the notebook as far as possible. 13. Disconnect the wireless antenna cables from the Mini PCI communications card 1 . 14. Disconnect the microphone cable 2 from the system board. 15. Remov e the[...]

  • Seite 126

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–3 7 16. Route the display cable through the opening in the notebook 1 . 17. Remov e the two PM2.0×18.0 scre ws 2 that secure the display assembly to the notebook. 18. Remov e the display assembly 3 . R emo v ing the Displa y Assembl y Re verse the abo v e procedure to inst[...]

  • Seite 127

    6–3 8 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6 . 1 7 But to n Boa r d 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. K eyboard co v er ( Section 6.9 ) b . K e yboard ( Section 6.10 ) c. Display assembly ( Section 6.16 ) Button Boar d Spare P art Number Informati[...]

  • Seite 128

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–3 9 2. Remov e the two T8M2.0×18.0 scre ws 1 that secure the rear ke yboard co ver to the notebook. 3. Remov e the rear k eyboard co v er 2 . R emo v ing the R ear K e yboar d Co v er[...]

  • Seite 129

    6–40 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 4. Disconnect the b utton board cable 1 from the system board. 5. Remov e the silv er PM2.0×4.0 scre w 2 that secures the b utton board to the top cov er . R emo v ing the Button Boar d Sc r e w[...]

  • Seite 130

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–4 1 6. Lift the left side of the b utton board 1 . 7. Slide the b utton board to the left 2 and remov e it. R emo v ing the Button Boar d Re verse the abo v e procedure to install the b utton board.[...]

  • Seite 131

    6–4 2 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 8 T o p C ov e r 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. Hard dri ve ( Section 6.4 ) b . K e yboard cov er ( Section 6.9 ) c. K eyboard ( Section 6.10 ) d. Display assembly ( Section 6.16 ) e. Button board [...]

  • Seite 132

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–43 2. T urn the notebook upside do wn with the front to ward you. 3. Remov e the se v en T8M2.0×9.0 scre ws that secure the top cov er to the notebook. R emo v ing the T op Co v er Sc r ew s, P ar t 1[...]

  • Seite 133

    6–44 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 4. T urn the notebook right-side up with the front to ward you. 5. Remov e the silv er PM2.0×4.0 scre w that secures the top cov er to the notebook. R emo v ing the T op Co v er S cr ew , P art 2[...]

  • Seite 134

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6 –4 5 6. Disconnect the T ouchPad cable from the system board 1 . 7. Lift the rear edge of the top cov er 2 until it disengages from the base enclosure. 8. Lift the top cov er straight up 3 and remo ve it. R emo v ing the T op Co v er Re verse the abo v e procedure to instal[...]

  • Seite 135

    6–4 6 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 9 T o uc h P a d 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. Hard dri ve ( Section 6.4 ) b . K e yboard cov er ( Section 6.9 ) c. K eyboard ( Section 6.10 ) d. Display assembly ( Section 6.16 ) e. Button board[...]

  • Seite 136

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–4 7 3. Remov e the four PM2.0×4.0 scre ws that secure the T ouchPad bracket to the top co ver . R emo v ing the T ouchP ad Br ac k et Sc r e ws[...]

  • Seite 137

    6–4 8 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 4. Lift the right side of the T ouchPad bracket 1 until it rests at an angle. 5. Slide the T ouchPad bracket to the right 2 and remo v e it. R emo v ing the T ouchP ad Br ac k et[...]

  • Seite 138

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–4 9 6. Lift the right side of the T ouchPad 1 until it rests at an angle. 7. Slide the T ouchPad to the right and remov e it 2 . R emo v ing the T ouchP ad Re verse the abo v e procedure to install the T ouchPad.[...]

  • Seite 139

    6–5 0 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.2 0 S pe a k e r 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. Hard dri ve ( Section 6.4 ) b . K e yboard cov er ( Section 6.9 ) c. K eyboard ( Section 6.10 ) d. Display assembly ( Section 6.16 ) e. Button board ( [...]

  • Seite 140

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–5 1 2. Disconnect the speaker cable 1 from the system board and route the cable under the infrared board cable 2 . 3. Remov e the two T8M2.0×5.0 scre ws 3 that secure the speaker to the notebook. 4. Remov e the speak er 4 . R emo v ing the S peak er Re verse the abo v e pr[...]

  • Seite 141

    6–5 2 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6.2 1 Infrar ed Board 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. Hard dri ve ( Section 6.4 ) b . K e yboard cov er ( Section 6.9 ) c. K eyboard ( Section 6.10 ) d. Display assembly ( Section 6.16 ) e. Button board [...]

  • Seite 142

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–5 3 2. Release the ZIF connector to which the infrared board cable is connected and disconnect the cable 1 from the system board. 3. Remov e the T8M2.0×5.0 scre w 2 that secures the infrared board to the system board. 4. Remov e the infrared board 3 . R emo v ing the Infr [...]

  • Seite 143

    6–5 4 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.22 S y s t em B oa rd ✎ When replacing the system board, ensure that the follo wing components are remov ed from the defecti v e system board and installed on the replacement system board: ■ Memory modules ( Section 6.7 and Section 6.14 ) ■ TPM security card ([...]

  • Seite 144

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–5 5 2. Remov e the four T8M2.0×5.0 scre ws 1 that secure the system board to the notebook. 3. Remov e the T8M2.0×7.5 scre w 2 that secures the system board spacer to the notebook. 4. Remov e the system board spacer 3 . R emo v ing the S ys tem Boar d Sc r ew s[...]

  • Seite 145

    6–5 6 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 5. Lift the left side of the system board 1 until the hard dri v e connector 2 is clear of the base enclosure. 6. Slide the system board to the left 3 to remov e it. R emo v ing the S ys tem Boar d Re verse the abo v e procedure to install the system board.[...]

  • Seite 146

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–5 7 6.2 3 Mod em B oard 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. Hard dri ve ( Section 6.4 ) b . Bluetooth module ( Section 6.6 ) c. K eyboard co v er ( Section 6.9 ) d. K e yboard ( Section 6.10 ) e. Fan ( Section 6.[...]

  • Seite 147

    6–5 8 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 3. Disconnect the modem cable from the two connectors 1 on the system board. 4. Remov e the two PM2.0×4.0 scre ws 2 that secure the modem board to the system board. 5. Lift the right side of the modem board 3 to disconnect it from the system board. 6. Remov e the mode[...]

  • Seite 148

    R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–5 9 6.24 RT C B a t t er y 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. Hard dri ve ( Section 6.4 ) b . Bluetooth module ( Section 6.6 ) c. K eyboard co v er ( Section 6.9 ) d. K e yboard ( Section 6.10 ) e. Fan ( Section[...]

  • Seite 149

    6–60 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 3. Remov e the R TC battery from the system board socket. R emo v ing the R T C Bat tery Re verse the abo v e procedure to install the R TC battery .[...]

  • Seite 150

    Maintenance and S ervi ce Guide 7–1 7 Spec ifi ca tions This chapter provides physical and performance specif ications. Ta b l e 7 - 1 Notebook Dimensions Metric U .S. Height (front to back) Width Depth 30.2 to 31.5 mm 285 mm 235 mm 1.19 to 1.24 in 11.22 in 9 in W eight 1.81 kg 3.99 lbs Input P ower Operating v oltage Operating current 18.5 V dc [...]

  • Seite 151

    7–2 Maintenance and Serv ice Gui de Spe cifica tio ns Relative humidity (noncondensing) Operating Nonoperating 10% to 90% 5% to 95% 10% to 90% 5% to 95% Maximum altitude (unpressurized) Operating (14.7 to 10.1 psia) Nonoperating (14.7 to 4.4 psia) -15 m to 3,048 m -15 m to 12,192 m -50 ft to 10,000 ft -50 ft to 40,000 ft Shock Operating Nonoperat[...]

  • Seite 152

    Spe cificat ion s Maintenance and S ervi ce Guide 7–3 Ta b l e 7 - 2 12.1-inch, XGA, TFT Displa y Dimensions Height Width Diagonal 20.7 cm 33.1 cm 39.1 cm 8.1 in 13.0 in 15.4 in Number of colors Up to 16.8 million Contrast ratio 150:1 Brightness 150 nits typical Pixel resolution Pitch Fo r m a t Configuration 0.300 × 0.300 mm 1024 × 768 RGB v e[...]

  • Seite 153

    7–4 Maintenance and Serv ice Gui de Spe cifica tio ns Ta b l e 7 - 3 Har d Drives 80-GB* 60-GB* 40-GB* Dimensions Height Width We i g h t 9.5 mm 70 mm 99 g 9.5 mm 70 mm 102 g 9.5 mm 70 mm 99 g Interface type ATA - 5 ATA - 5 ATA - 5 T ransfer rate Synchronous (maximum) Security 100 MB/sec A T A security 100 MB/sec ATA s e c u r i t y 100 MB/sec A [...]

  • Seite 154

    Spe cificat ion s Maintenance and S ervi ce Guide 7–5 Ta b l e 7 - 4 Primary 6-cell, Li-Ion Batter y P ac k Dimensions Height Width Depth We i g h t 2.00 cm 9.40 cm 13.40 cm 0.34 kg 0.79 in 3.70 in 5.28 in 0.75 lb Energ y V oltage Amp-hour capacity W att-hour capacity 10.8 V 4.8 Ah 52 Wh T emperature Operating Nonoperating 5°C to 45°C 0°C to 6[...]

  • Seite 155

    7–6 Maintenance and Serv ice Gui de Spe cifica tio ns Ta b l e 7 - 5 System DMA Hard ware DMA System Function DMA0 Not applicable DMA1* Not applicable DMA2* Not applicable DMA3 Not applicable DMA4 Direct memor y access controller DMA5* A vailab le f or PC Card DMA6 Not assigned DMA7 Not assigned *PC Card controller ca n use DMA 1, 2, or 5.[...]

  • Seite 156

    Spe cificat ion s Maintenance and S ervi ce Guide 7–7 Ta b l e 7 - 6 System Interrupts Hard ware IRQ System Function IRQ0 System timer IRQ1 Standard 101-/102-K e y or Microsoft Natural K eyboard IRQ2 Cascaded IRQ3 Intel 82801DB/DBM USB2 Enhanced Host Controller—24CD IRQ4 COM1 IRQ5* Cone xant A C—Link A udio Intel 82801DB/DBM SMBus Controller?[...]

  • Seite 157

    7–8 Maintenance and Serv ice Gui de Spe cifica tio ns IRQ11 Intel USB EHCI controller—24CD Intel USB UHCI controller—24C4 Intel USB UHCI controller—24C7 Intel Pro/Wireless 2200BG TI OHCI 1394 host controller TI PCI1410 CardBus controller IRQ12 Synaptics PS/2 T ouchPad IRQ13 Numer ic data processor IRQ14 Pri mar y IDE channel IRQ15 Secondar [...]

  • Seite 158

    Spe cificat ion s Maintenance and S ervi ce Guide 7–9 Ta b l e 7 - 7 System I/O Addresses I/O Address (he x) System Function (shipping configuration) 000 - 00F DMA controller no . 1 010 - 01F Unused 020 - 021 Interrupt controller no . 1 022 - 024 Opti chipset configuration registers 025 - 03F Unused 02E - 02F 87334 “Super I/O” configuration f[...]

  • Seite 159

    7–1 0 Maintenance and S ervi ce Guide Spe cifica tio ns I/O Address (he x) System Function (shipping configuration) 0A2 - 0BF Unused 0C0 - 0DF DMA controller no . 2 0E0 - 0EF Unused 0F0 - 0F1 Coprocessor busy clear/reset 0F2 - 0FF Unused 100 - 16F Unused 170 - 177 Secondar y fix ed disk controller 178 - 1EF Unused 1F0 - 1F7 Pr imar y fix ed disk [...]

  • Seite 160

    Spe cificat ion s Maintenance and S ervi ce Guide 7–1 1 I/O Address (he x) System Function (shipping configuration) 2F0 - 2F7 Unused 2F8 - 2FF Infrared por t 300 - 31F Unused 320 - 36F Unused 370 - 377 Secondar y diskette driv e controller 378 - 37F P arallel por t (LPT1/def ault) 380 - 387 Unused 388 - 38B FM synthesizer—OPL3 38C - 3AF Unused [...]

  • Seite 161

    7–1 2 Maintenance and S ervi ce Guide Spe cifica tio ns Ta b l e 7 - 8 System Memory Map Size Memory Address System Function 640 KB 00000000-0009FFFF Base memor y 128 KB 000A0000-000BFFFF Video memor y 48 KB 000C0000-000CBFFF Video BIOS 160 KB 000C8000-000E7FFF Unused 64 KB 000E8000-000FFFFF System BIOS 15 MB 00100000-00FFFFFF Extended memor y 58[...]

  • Seite 162

    Maintenance and S ervi ce Guide A–1 A Co nnec tor P in A ssi gnm en ts Ta b l e A - 1 A udio-Out (Headphone) Pin Signal Pin Signal 1 A udio out, left channel 3 Ground 2 A udio out, right channel[...]

  • Seite 163

    A–2 Maintenance and Serv ice Gui de Connec tor P in Assignments Ta b l e A - 2 A udio-In (Micr ophone) Pin Signal Pin Signal 1 A udio signal in 3 Ground 2 A udio signal in Ta b l e A - 3 Universal Serial Bus Pin Signal Pin Signal 1 +5 VDC 3 Data + 2 Data – 4 Ground[...]

  • Seite 164

    Connec tor P in Assignments Maintenance and S ervi ce Guide A–3 Ta b l e A - 4 External Monitor Pin Signal Pin Signal 1 Red analog 9 +5 VDC 2 Green analog 10 Ground 3 Blue analog 11 Monitor detect 4 Not connected 12 DDC 2B data 5 Ground 13 Hor izontal sync 6 Ground analog 14 V er tical sync 7 Ground analog 15 DDC 2B cloc k 8 Ground analog[...]

  • Seite 165

    A–4 Maintenance and Serv ice Gui de Connec tor P in Assignments Ta b l e A - 5 RJ-11 (Modem) Pin Signal Pin Signal 1 Unused 4 Unused 2T i p 5U n u s e d 3 Ring 6 Unused[...]

  • Seite 166

    Connec tor P in Assignments Maintenance and S ervi ce Guide A–5 Ta b l e A - 6 RJ-45 (Netw ork) Pin Signal Pin Signal 1 T ransmit + 5 Unused 2 T ransmit – 6 Receiv e – 3 Receive + 7 Unused 4 Unused 8 Unused[...]

  • Seite 167

    A–6 Maintenance and Serv ice Gui de Connec tor P in Assignments Ta b l e A - 7 S-Video-Out Pin Signal Pin Signal 1 S-VHS color (C) signal 5 TV -CD 2 Composite video signal 6 S-VHS intensity ground 3 S-VHS intensity (Y) signal 7 Composite video ground 4 S-VHS color ground[...]

  • Seite 168

    Maintenance and S ervi ce Guide B–1 B P o w er Cord Se t Requirements 3-Con duc tor P o w er C ord Set The wide range input feature of the notebook permits it to operate from any line v oltage from 100 to 120 or 220 to 240 v olts A C. The po wer cord set included with the notebook meets the requirements for use in the country or region where the [...]

  • Seite 169

    B–2 Maintenance and Se rvic e Guide P ow er Cor d Set R equirements Gen eral R equiremen ts The requirements listed belo w are applicable to all countries or regions. ■ The length of the po wer cord set must be at least 1.5 m (5.0 ft) and a maximum of 2.0 m (6.5 ft). ■ All po wer cord sets must be approv ed b y an acceptable accredited agency[...]

  • Seite 170

    P ow er Cor d Set Requir ements Maintenance and S ervi ce Guide B–3 Countr y/Region -Spec ific Requiremen ts 3-Conductor P ower Cor d Set Requirements Country/Region Accredited Agency Applicable Note Number A ustralia EANSW 1 Au s t r i a OVE 1 Belgium CEBC 1 Canada CSA 2 Denmark DEMK O 1 Finland FIMK O 1 F rance UTE 1 Ger many VDE 1 Italy IMQ 1 [...]

  • Seite 171

    B–4 Maintenance and Se rvic e Guide P ow er Cor d Set R equirements The Netherlands KEMA 1 Norwa y NEMK O 1 Sweden SEMK O 1 Switzerland SEV 1 United Kingdom BSI 1 United States UL 2 ✎ NOTES: 1. The fle xible cord m ust be <HAR> T ype HO5VV -F , 3-conductor , 1.0 mm² conductor size . P ower cord set fittings (appliance coupler and w all p[...]

  • Seite 172

    Maintenance and S ervi ce Guide C–1 C Sc r e w List ing This appendix provides specif ication and reference information for the scre ws and scre w locks used in the notebook. All scre ws and scre w locks listed in this appendix are a v ailable in the Scre w Kit, spare part number 383556-001.[...]

  • Seite 173

    C–2 Maintenance and S ervi ce Guide Scr e w Listi ng Phillips M2 . 0×5 . 0 Sc r ew L ocations Ta b l e C - 1 Phillips PM2.0×5.0 Screw Color Qty . Length Thread Head Width Black 6 5.0 mm 2.0 mm 4.5 mm Where used: 1 T wo screws that secure the hard driv e cov er to the notebook (documented in Section 6.5 ) 2 T wo screws that secure the memory mo [...]

  • Seite 174

    Scr e w Listi ng Maintenance and S ervi ce Guide C–3 Phillips M2 . 0×5 . 0 Sc r ew L ocations Ta b l e C - 1 Phillips PM2.0×5.0 Screw (Continued) Color Qty . Length Thread Head Width Black 6 5.0 mm 2.0 mm 4.5 mm Where used: 2 screws that secure the Bluetooth co v er to the notebook (scre ws are captured on the cov er b y C clips; documented in [...]

  • Seite 175

    C–4 Maintenance and S ervi ce Guide Scr e w Listi ng Phillips M2 .5×1 3 . 0 and Phillips M3 .0×4. 0 Scr ew L ocations Ta b l e C - 2 Phillips PM2.5×13.0 Spring-Loaded Har d Drive Retention Screw Color Qty . Length Thread Head Width Black 1 13.0 mm 2.5 mm 5.5 mm Where used: 1 One scre w that secures the hard dr iv e frame to the hard drive (doc[...]

  • Seite 176

    Scr e w Listi ng Maintenance and S ervi ce Guide C–5 Phillips M1 . 5×3 . 5 Sc re w L ocation Ta b l e C - 4 Phillips PM1.5×3.5 Screw Color Qty . Length Thread Head Width Silv er 1 3.5 mm 1.5 mm 4.5 mm Where used: One screw that secures the TPM security card to the notebook (documented in Section 6.8 ) mm[...]

  • Seite 177

    C–6 Maintenance and S ervi ce Guide Scr e w Listi ng T or x T8M2 .0×1 8.0 S cr ew L ocati ons Ta b l e C - 5 T orx T8M2.0×18.0 Screw Color Qty . Length Thread Head Width Black 8 18.0 mm 2.0 mm 4.5 mm Where used: 2 screws that secure the k e yboard co v er to the notebook (documented in Section 6.9 ) mm[...]

  • Seite 178

    Scr e w Listi ng Maintenance and S ervi ce Guide C–7 T or x T8M2 .0×1 8.0 S cr ew L ocati ons Ta b l e C - 5 T orx T8M2.0×18.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 18.0 mm 2.0 mm 4.5 mm Where used: 2 screws that secure the bas e enclosure cov er to the notebook (documented in Section 6.16 ) mm[...]

  • Seite 179

    C–8 Maintenance and S ervi ce Guide Scr e w Listi ng T or x T8M2 .0×1 8.0 S cr ew L ocati ons Ta b l e C - 5 T orx T8M2.0×18.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 18.0 mm 2.0 mm 4.5 mm Where used: 2 screws that secure the displa y asse mbly to the notebook (documented in Section 6.16 ) mm[...]

  • Seite 180

    Scr e w Listi ng Maintenance and S ervi ce Guide C–9 T or x T8M2 .0×1 8.0 S cr ew L ocati ons Ta b l e C - 5 T orx T8M2.0×18.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 18.0 mm 2.0 mm 4.5 mm Where used: 2 screws that secure the rear k e yboard cov e r to the notebook (documented in Section 6.17 ) mm[...]

  • Seite 181

    C–1 0 Maintenance and Serv ice Gui de Scr e w Listi ng T or x T8M2 .0×9 . 0 Sc r e w L ocations Ta b l e C - 6 T orx T8M2.0×9.0 Screw Color Qty . Length Thread Head Width Black 12 9.0 mm 2.0 mm 4.5 mm Where used: 1 Three screws that secure the k e yb oard to the notebook (documented in Section 6.10 ) 2 T wo screws that secure the displa y assem[...]

  • Seite 182

    Scr e w Listi ng Maintenance and S ervi ce Guide C–1 1 T or x T8M2 .0×9 . 0 Sc r e w L ocations Ta b l e C - 6 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 12 9.0 mm 2.0 mm 4.5 mm Where used: 7 screws that secure the top co v e r to the notebook (documented in Section 6.18 ) mm[...]

  • Seite 183

    C–1 2 Maintenance and Serv ice Gui de Scr e w Listi ng T or x T8M2 .0×5 . 0 Scr ew L ocati on Ta b l e C - 7 T orx T8M2.0×5.0 Screw Color Qty . Length Thread Head Width Black 8 5.0 mm 2.0 mm 4.5 mm Where used: One screw that secures the k e yboa rd to the noteboo k (documented in Section 6.10 ) mm[...]

  • Seite 184

    Scr e w Listi ng Maintenance and S ervi ce Guide C–1 3 T or x T8M2 .0×5 . 0 Scr ew L ocati ons Ta b l e C - 7 T orx T8M2.0×5.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 5.0 mm 2.0 mm 4.5 mm Where used: 1 T wo screws that secure the speak e r to the notebook (documented in Section 6.20 ) 2 One scre w that secures the infrare[...]

  • Seite 185

    C–1 4 Maintenance and Serv ice Gui de Scr e w Listi ng T or x T8M2 .0×5 . 0 Scr ew L ocati ons Ta b l e C - 7 T orx T8M2.0×5.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 5.0 mm 2.0 mm 4.5 mm Where used: 4 screws that secure the system boar d to the notebook (documented in Section 6.22 ) mm[...]

  • Seite 186

    Scr e w Listi ng Maintenance and S ervi ce Guide C–1 5 T or x T8M2 .0×7 .5 Sc r ew L ocations Ta b l e C - 8 T orx T8M2.0×7.5 Screw Color Qty . Length Thread Head Width Silv er 4 7.5 mm 2.0 mm 4.5 mm Where used: 3 screws that secure the f an to the notebook (documented in Section 6.11 ) mm[...]

  • Seite 187

    C–1 6 Maintenance and Serv ice Gui de Scr e w Listi ng T or x T8M2 .0×7 . 5 Sc r e w L ocation Ta b l e C - 8 T orx T8M2.0×7.5 Screw (Continued) Color Qty . Length Thread Head Width Silv er 4 7.5 mm 2.0 mm 4.5 mm Where used: One screw that secures the system boar d and system board spacer to the notebook (documented in Section 6.22 ) mm[...]

  • Seite 188

    Scr e w Listi ng Maintenance and S ervi ce Guide C–1 7 Phillips M2 .5×7 .0 S cr ew L ocati ons Ta b l e C - 9 Phillips PM2.5×7.0 Screw Color Qty . Length Thread Head Width Black 4 7.0 mm 2.5 mm 5.0 mm Where used: 4 screws that secure the heat sink to the notebook (documented in Section 6.12 ) mm[...]

  • Seite 189

    C–1 8 Maintenance and Serv ice Gui de Scr e w Listi ng Phillips M2 . 0×4. 0 Sc r e w L ocati ons T able C-10 Phillips PM2.0×4.0 Screw Color Qty . Length Thread Head Width Silv er 8 2.0 mm 4.0 mm 4.0 mm Where used: 1 One scre w that secures the button b oard to the notebook (documented in Section 6.17 ) 2 One scre w that secures the top co v er [...]

  • Seite 190

    Scr e w Listi ng Maintenance and S ervi ce Guide C–1 9 Phillips M2 . 0×4. 0 Sc r e w L ocati ons T able C-10 Phillips PM2.0×4.0 Screw ( Continued) Color Qty . Length Thread Head Width Silv er 8 2.0 mm 4.0 mm 4.0 mm Where used: 4 screws that secure the T ouchPad br a ck et to the top co v er (documented in Section 6.19 ) mm[...]

  • Seite 191

    C–20 Maintenance and S ervi ce Guide Scr e w Listi ng Phillips M2 . 0×4. 0 Sc r e w L ocati ons T able C-10 Phillips PM2.0×4.0 Screw ( Continued) Color Qty . Length Thread Head Width Silv er 8 2.0 mm 4.0 mm 4.0 mm Where used: 2 screws that secure the modem board to the system board (documented in Section 6.23 ) mm[...]

  • Seite 192

    Maintenance and S ervi ce Guide Inde x–1 In de x A adjustable notebook stand, spare part number 4–12 , 4–15 Advanced Docking Station, HP, spare part number 4–12 , 4–15 arrow keys 1–15 audio troubleshooting 2–23 audio-in jack location 1–9 pin assignments A–2 audio-out jack location 1–9 pin assignments A–1 B base enclosure cover[...]

  • Seite 193

    Inde x–2 Maintenance and Serv ice Gui de Inde x components bottom 1–18 front 1–6 keyboard 1–14 left-side 1–10 , 1–12 rear 1–10 , 1–12 right-side 1–8 top 1–16 Computer Setup Advanced Menu 2–6 File Menu 2–3 overview 2–1 Security Menu 2–4 Tools Menu 2–5 Computer Setup defaults 2–2 connector pin assignments audio-in A–[...]

  • Seite 194

    Inde x Maintenance and S ervi ce Guide Inde x–3 no OS loading from hard drive 2–18 , 2–19 , 2–20 no OS loading from optical drive 2–22 no power 2–10 , 2–12 , 2–13 no video 2–14 , 2–15 nonfunctioning device 2–25 nonfunctioning docking device 2–16 nonfunctioning keyboard 2–26 nonfunctioning pointing device 2–27 fn key 1–[...]

  • Seite 195

    Inde x–4 Maintenance and Serv ice Gui de Inde x L Label Kit, spare part number 4–12 , 4–19 LED board cable 4–11 left-side components 1–10 , 1–12 M memory map specifications 7–12 memory module removal 6–12 , 6–28 spare part numbers 4–5 , 4–18 , 4–19 , 6–12 , 6–28 memory module compartment 1–19 memory module compartment [...]

  • Seite 196

    Inde x Maintenance and S ervi ce Guide Inde x–5 PC Card slot eject button 1–9 PC Card slot space saver 4–10 plastic parts 5–2 pointing device, troubleshooting 2–27 pointing stick 1–17 pointing stick buttons 1–17 power connector 1–13 power cord set requirements B–2 spare part numbers 4–12 , 4–13 , 4–14 , 4–15 power manageme[...]

  • Seite 197

    Inde x–6 Maintenance and Serv ice Gui de Inde x notebook 7–1 system DMA 7–6 static shielding materials 5–8 S-Video-out jack location 1–13 pin assignments A–6 system board removal 6–54 spare part number 4–7 , 4–17 , 6–54 system DMA 7–6 system memory map 7–12 T tools required 5–1 top components 1–16 top cover removal 6–4[...]