Compaq MSB900 Bedienungsanleitung

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66

Zur Seite of

Richtige Gebrauchsanleitung

Die Vorschriften verpflichten den Verkäufer zur Übertragung der Gebrauchsanleitung Compaq MSB900 an den Erwerber, zusammen mit der Ware. Eine fehlende Anleitung oder falsche Informationen, die dem Verbraucher übertragen werden, bilden eine Grundlage für eine Reklamation aufgrund Unstimmigkeit des Geräts mit dem Vertrag. Rechtsmäßig lässt man das Anfügen einer Gebrauchsanleitung in anderer Form als Papierform zu, was letztens sehr oft genutzt wird, indem man eine grafische oder elektronische Anleitung von Compaq MSB900, sowie Anleitungsvideos für Nutzer beifügt. Die Bedingung ist, dass ihre Form leserlich und verständlich ist.

Was ist eine Gebrauchsanleitung?

Das Wort kommt vom lateinischen „instructio”, d.h. ordnen. Demnach kann man in der Anleitung Compaq MSB900 die Beschreibung der Etappen der Vorgehensweisen finden. Das Ziel der Anleitung ist die Belehrung, Vereinfachung des Starts, der Nutzung des Geräts oder auch der Ausführung bestimmter Tätigkeiten. Die Anleitung ist eine Sammlung von Informationen über ein Gegenstand/eine Dienstleistung, ein Hinweis.

Leider widmen nicht viele Nutzer ihre Zeit der Gebrauchsanleitung Compaq MSB900. Eine gute Gebrauchsanleitung erlaubt nicht nur eine Reihe zusätzlicher Funktionen des gekauften Geräts kennenzulernen, sondern hilft dabei viele Fehler zu vermeiden.

Was sollte also eine ideale Gebrauchsanleitung beinhalten?

Die Gebrauchsanleitung Compaq MSB900 sollte vor allem folgendes enthalten:
- Informationen über technische Daten des Geräts Compaq MSB900
- Den Namen des Produzenten und das Produktionsjahr des Geräts Compaq MSB900
- Grundsätze der Bedienung, Regulierung und Wartung des Geräts Compaq MSB900
- Sicherheitszeichen und Zertifikate, die die Übereinstimmung mit entsprechenden Normen bestätigen

Warum lesen wir keine Gebrauchsanleitungen?

Der Grund dafür ist die fehlende Zeit und die Sicherheit, was die bestimmten Funktionen der gekauften Geräte angeht. Leider ist das Anschließen und Starten von Compaq MSB900 zu wenig. Eine Anleitung beinhaltet eine Reihe von Hinweisen bezüglich bestimmter Funktionen, Sicherheitsgrundsätze, Wartungsarten (sogar das, welche Mittel man benutzen sollte), eventueller Fehler von Compaq MSB900 und Lösungsarten für Probleme, die während der Nutzung auftreten könnten. Immerhin kann man in der Gebrauchsanleitung die Kontaktnummer zum Service Compaq finden, wenn die vorgeschlagenen Lösungen nicht wirksam sind. Aktuell erfreuen sich Anleitungen in Form von interessanten Animationen oder Videoanleitungen an Popularität, die den Nutzer besser ansprechen als eine Broschüre. Diese Art von Anleitung gibt garantiert, dass der Nutzer sich das ganze Video anschaut, ohne die spezifizierten und komplizierten technischen Beschreibungen von Compaq MSB900 zu überspringen, wie es bei der Papierform passiert.

Warum sollte man Gebrauchsanleitungen lesen?

In der Gebrauchsanleitung finden wir vor allem die Antwort über den Bau sowie die Möglichkeiten des Geräts Compaq MSB900, über die Nutzung bestimmter Accessoires und eine Reihe von Informationen, die erlauben, jegliche Funktionen und Bequemlichkeiten zu nutzen.

Nach dem gelungenen Kauf des Geräts, sollte man einige Zeit für das Kennenlernen jedes Teils der Anleitung von Compaq MSB900 widmen. Aktuell sind sie genau vorbereitet oder übersetzt, damit sie nicht nur verständlich für die Nutzer sind, aber auch ihre grundliegende Hilfs-Informations-Funktion erfüllen.

Inhaltsverzeichnis der Gebrauchsanleitungen

  • Seite 1

    Detailed Technica l USER M ANU A L FOR: 3.5”-SBC MSB900/L Nordstrasse 11/F CH- 4542 Luterbach Tel.: ++41 (0)32 681 58 00 Fax: ++41 (0)32 681 58 01 Email: support@digitallogic.com Homepage: http://www.digitallogic.com[...]

  • Seite 2

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 2 For internal use only: File: MSB900_Detailed_ V1.0 Path: R:HANDBUCHMS BMSB900MS B900_Detailed_V1.0 .doc COPYRIGHT     2008 BY DIGITA L-LOGIC A G This publication is protecte d b y cop yright and all rights are reserved. No part of this docum ent m a y be re pro- duced, tr[...]

  • Seite 3

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 3 Table of Contents 1. Preface ....................................................................................................................... 5 1.1. T radema rks ................................................................................................................... 5 1[...]

  • Seite 4

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 4 5.6.3. W atchdog ..................................... .................................. .................................. .......................... 28 5.6.4. ROM-BIOS Sockets .............................................. .................................. ...........................[...]

  • Seite 5

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 5 1. P REF A CE The inf ormation conta ined in th is m anual has been caref ully check ed and is believed to be acc urate; it is subject to c hange without n otice. Product ad vances mean that some s pecifications may have changed. DIGITAL-LOG IC AG assu m es no responsibilit y for a ny in[...]

  • Seite 6

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 6 1.5. Recycling Infor mation All c omponents within this product fulfill the requirem ents of the RoHS ( Restriction of Hazardous Substanc es Directive). The pro duct is sold ered with a lea d free proc ess. 1.6. Technical Support 1. Contact your loc al DIGIT AL-LOGIC Tec hnical Support, [...]

  • Seite 7

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 7 1.8. Explanation of Symbols CE Conformity This symbol indica tes that the pro duct desc ribed in this man ual is in compl iance with all ap- plied CE standards. Caution, Electri c Shock! This symbol and t itle warn of hazards due to electrical shocks ( > 60V) when touch ing prod- ucts[...]

  • Seite 8

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 8 1.9. Applicable Doc uments and Sta ndards The following pub lications are us ed in conjunction with this m anual. W hen an y of the referenced s pecifica- tions are supers eded b y an appro ved re vision, th at re vision shall appl y. All d ocuments ma y be obt ained from their respectiv[...]

  • Seite 9

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 9  Smart Batter y Data Specific ation Revision 1.1, December 11, 1998. www.sbs -forum .org  System Managem ent Bus ( SMBus) S pecification V ersion 2 .0, August 3, 2000 C opyright © 1 994, 1995 , 1998, 2000 Duracell, Inc., E nergizer Power Systems, Inc., Fujitsu, Ltd., Intel Corpora[...]

  • Seite 10

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 10 RoHS is often refer red to as the "lead-free" direc tive but it r estricts the us e of the f ollowing substances :  Lead  Mercury  Cadmium  Chromium VI  PBB and PBDE The m aximum allowable c oncentration of an y of the above m entioned substanc es is 0.1% (excep[...]

  • Seite 11

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 11 1.12. Swiss Qualit y  100% Made in Switzerland  DIGITAL-LOG IC is a mem ber of "Swiss- Label"  This product was not m anufactured by em plo yees earning piecework wages  This product was manufac tured in hum ane work c onditions  All em ployees who worked on thi[...]

  • Seite 12

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 12 2. O VERVIEW 2.1. Standard Feat ures of the MSB9 00/L The MICRO SPACE 3.5”-SBC is a m iniaturized m odular device incorp orating the m ajor elem ents of a PC/AT compatible com puter. It includes s tandard PC/ AT compatible e lements, s uch as:  Powerful GEODE  LX-900 600MHz  [...]

  • Seite 13

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 13 2.3. MSB900 Block Diagram[...]

  • Seite 14

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 14 2.4. MSB900/MSB90 0L specificatio ns CPU Specification CPU GEODE LX900 CPU Core Sup ply 1.25V very low po wered Mode Real / Protected Compatibilit y x86 W ord Size 32Bits Secondary Cache 128kB Physical Address ing 32 lines Virtual Address ing 16GB Clock Rates 600MHz Socket Standard Sold[...]

  • Seite 15

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 15 Mass Storage Specification FD Floppy disk interface not support ed HD E-IDE interfac e, AT-t ype, for max. 2 hard disk s, 44pin connector, for 1.3, 1.8 and 2. 5" hard disk with 44 pins ID E Standard A T In terfaces: Specification Name FIFO IRQs Addr. Standard Option Serial COM1 COM[...]

  • Seite 16

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 16 Operating Environm ent Specification Relative hum idity 5-90%, non-condens ing Vibration 5-2000Hz, 0.1G Shock 1G Temperature MS B900*: Operating: Standard version: -2 5° C to +70° C Extended version: -4 0° C to +85° C Storage: -55° C to +85° C * = with passive c ooler MSB900L**: O[...]

  • Seite 17

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 17 2.7. Dimensions & D iagrams 2.7.1. MSB900/L Board / Version Unit: Tolerance: Date / Author MSB900/L mm (m illimeter) + / - 0.1mm 25.10.2006 / BR R[...]

  • Seite 18

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 18[...]

  • Seite 19

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 19[...]

  • Seite 20

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 20[...]

  • Seite 21

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 21 2.7.2. MSB800CON Part Nr 802205 Board / Version Unit: Tolerance: Date / Author MSB800CON mm (m illimeter) + / - 0.1mm 25.10.2006 / BR R[...]

  • Seite 22

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 22 2.8. MSB900/L Incompa tibilities to a standard PC/ AT None. 2.9. Related A pplica tion Notes Application Notes are available at http: //www.digitallog ic.com     sup port, or on an y DIG IT AL-LOGIC Application CD. # Desc ription 2.10. High Frequenc y Radiation (to m eet EN5[...]

  • Seite 23

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 23 2.11. Battery-Lifetime Battery specs: Lowest t emp. -40° C Nominal temp. +20° C Highest temp. +85° C Manufacturer: pba T y pe: ER10280 Capacity versus T em p: 10 uA 420mAh 400mAh 350m Ah Voltage versus T emp. 10uA 3.6V 3.6V Ca. 3.6V Nominal values: 3.6V / 400m Ah @ 0.5mA / -55° C...[...]

  • Seite 24

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 24 4. BIOS H IST OR Y This BIOS histor y is for the MS B900/L. This BIOS histor y is not f or the follow ing product s: MSEP900, MSM9 00, SM900 Version: D ate: Status: Modification s: 1.23 02.2007 Initial Release - - - - - - - Note… This product has a unique BIOS version. For a descripti[...]

  • Seite 25

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 25 5. D ET A ILED S YS TEM D ESCRIPT ION This s ystem configuration i s based on the I SA architec ture. Check the I/O and m em ory m ap in this chapter. 5.1. Power Require ments The power is conn ected thr ough t he wide-ra nge power c onnector. The sup ply uses onl y th e +8V to +32 V an[...]

  • Seite 26

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 26 5.3. CPU, Boards a nd R A Ms 5.3.1. CPUs of this MICROSPA CE Product Processor: T ype: Clock: GEODE LX900 Nationa l 600 MHz 5.3.2. Numeric Cop rocessor It is integrated in th e LX900 CPU. 5.3.3. DDRA M M emory Speed: 333 Size: DDR-SODIMM DDRDIMM 200p in Bits: 64bit Capacity: 256-1024MB [...]

  • Seite 27

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 27 5.4.3. Serial Ports CO M1-COM2 The s erial chan nels are f ully com patible with 16C 550 UARTS. CO M1 is the primar y serial port, and is sup- ported by the boar d's ROM-BIOS as the PC-DO S 'COM1' device. T he seconda ry serial port is COM2; it is supported as the 'C[...]

  • Seite 28

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 28 5.6. Timers and Co unters 5.6.1. Programmable Timers An 8253 compatible t imer/c ounter device is also i ncluded in the boar d's ASIC de vice. This device is ut ilized in precisel y the sam e manner as in a standard AT implementation. Each c hannel of the 8253 is dri ven by a 1.190[...]

  • Seite 29

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 29 5.6.4.1. Standard BIOS RO M Device: F W H Map: E0000 - FFFFFh Core BIOS 128k C0000 - C7FFFh VGA BIOS 32k CC000 - CFFFF h FR EE 5.6.5. BIOS CMOS Setu p If wrong s etups are m emorized in the CMO S-RAM, the def ault va lues w ill be loaded after resetti ng the RTC/CMOS-RAM by de-sol derin[...]

  • Seite 30

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 30 CMOS Map Location Desc ription 00h Time of day (seconds) specified in BCD 01h Alarm (seconds) specified in BCD 02h Time of day (minutes) specified in BCD 03h Alarm (minutes) specified in BCD 04h Time of day (hours) specified in BCD 05h Alarm (hours) specified in BCD 06h Day of week spec[...]

  • Seite 31

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 31 CMOS Map continued... Location Description 0Eh CMOS Location for Bad CMOS and Checksum Flags Bit 7 = Flag for CMOS Lost Power 0 = Pow er OK 1 = Lo st Power Bit 6 = Flag for CMOS checksum bad 0 = C hecksum is valid 1 = C hecksum is bad 0Fh Shutdown C ode 10h Diskette Drives Bits 7-4 = Di[...]

  • Seite 32

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 32 CMOS Map continued... Location Description 15h Base Memory Size (in kB) - Low Byte 16h Base Memory Size (in kB) - High Byte 17h Extended Memory Size (in kB) - Low Byte 18h Extended Memory Size (in kB) - High Byte 19h Extended Drive Type - Hard Drive 0 1Ah Extended Drive Type - Hard Driv[...]

  • Seite 33

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 33 CMOS Map continued... Location Description 22h Byte 3 Bits 7-6 = Res erved Bits 5-0 = Upp er 6 bits of Write Precompensation 23h Byte 4 Bits 7-0 = Num ber of Heads 24h Byte 5 Bits 7-0 = Sec tors Per Track 25h - 2Ah Cu stom Drive Table 1 These 6 Bytes (48 bits) contain the following data[...]

  • Seite 34

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 34 CMOS Map continued... Location Description 33h Base Memory Installed Bit 7 = Flag for Memory Size 0 = 640kB 1 = 512kB Bits 6-0 = Res erved 34h M inor CPU Revision Differentiates CPUs within a CP U type (i.e., 486SX vs 486 DX, vs 486 DX/2). This is crucial for correctly determining CPU i[...]

  • Seite 35

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 35 5.8.1. EEPROM Memory for Setup The EEPROM is used for setup and configurat ion data, stored as an alternative to the CMOS-RT C. Option- ally, the E EPROM s etup dri ver m ay update the CMO S RTC, if the battery is r unning do wn and th e check sum error would appe ar and stop the system[...]

  • Seite 36

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 36 5.9.2. System I/O map The f ollowing table deta ils the legac y I/O range f or 000h t hrough 4FFh. Each I/ O location has a read/ write (R/W) capability. Note the follow ing abbrev iations: --- Unknown or can not be determ ined. Yes Read and write th e register at the indicated location[...]

  • Seite 37

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 37 I/O Map Continued… I/O Addr. Function Size R/W Comment If KEL Memory Offset 100h[0] = 1(Emulation- Enabled bit). 060h Keyboard/Mouse - Data Port 8bit Yes If MSR 5140001Fh[0] = 1 (SNOOP bit) and KEL Memory Offset 100h[0] = 0 (Emulation- Enabled bit). 061h Port B Control 8bit Yes 062h-0[...]

  • Seite 38

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 38 I/O Map Continued… I/O Addr. Function Size R/W Comment 0CCh Master DMA Address - Channel 7 8bit Yes 16 bit values in two transfers. 0CDh No Specific Usage 8bit --- 0CEh Master DMA Counter - Channel 7 8bit Yes 16bit values in two trans fers. 0CFh No Specific Usage 8bit --- 0D0h Master [...]

  • Seite 39

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 39 I/O Map Continued… I/O Addr. Function Size R/W Comment 3F1h Flop py Status R B 8bit RO Firs t Floppy. 3F2h Flop py Digital Out 8bit Shw@ First Floppy. 3F3h No Specific Us age 8bit --- 3F4h Flop py Cntrl Status 8bit RO Fi rst Floppy. 3F5h Flopp y Data 8bit Yes Fi rst Floppy. 3F6h No Sp[...]

  • Seite 40

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 40 6. VGA 6.1. VGA/LCD Contr oller of the Ge ode LX90 0 • Highly integrated flat panel and CRT G UI Accelerator & Multim edia Engine, Palet te/DAC, Clock Synthe- sizer, and integrat ed fram e buffer • HiQColor TM Tec hnolog y implemented with T MED (Tem poral Modulated Energy Distr[...]

  • Seite 41

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 41 7. V IDEO I NPUT The MSB900 co ntains a low-cost video input p ort. It c onsist of LX900’s video input port ( VIP) a nd t he exter- nal fram e grabber chip SA A7111A. T his port is capab le of digitizing a C VBS video signal with 15 fram es per second at a resolution of 352x288bits. N[...]

  • Seite 42

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 42 Top view of the MSB900/L[...]

  • Seite 43

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 43 Bottom v iew of the M SB900/L[...]

  • Seite 44

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 44 X1 P ower Suppl y Pin Signal 1 (Shield) Po wer suppl y 8-30V 2 NC 3 Power su pply GND X14 Video IN Pin Si gnal Pin Signal 1 CVB S 2 G ND[...]

  • Seite 45

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 45 X15 O perator Panel / Flat Panel (bo ttom side) X15 is intend ed t o be used internally to at tach an operator panel. Som e signals may not be present or are shared with ot her connect ors . This connector is not ass embled and is only for OEM-specific a pplications . A 2mm x 44pin hea [...]

  • Seite 46

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 46 X15 Rev erse Pin Con figuration MSB900 LVD S X15 (on com ponent side) Attention! W hen X15 is soldered on t he com ponent side, a diff erent pin num bering schem a must be applied. Odd and even pin numbers are swapped. Ignoring this warning may result in the destruction of any attached [...]

  • Seite 47

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 47 X31 Ke yboard PS/2 and Mo use Utility Connector Connector and Adapter Mini- DIN PS/2 (6 PC) Remar ks Shield S hield KEYBOARD DATA 1 GND 3 VCC (+5V) 4 CLK 5 Mini- DIN PS/2 (6 PC) Remar ks VCC (+5V) 4 MOUSE DATA 2 GND 3 CLK 6 PS/2 Front side ( female) X33 10/1 00 BASE-T In terface Co nnec[...]

  • Seite 48

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 48 X39 Serial Port COM 2 Header onboard D-SUB conn ector Signal Pin 1 Pin 1 DCD Pin 2 Pin 6 DSR Pin 3 Pin 2 RxD Pin 4 Pin 7 RTS Pin 5 Pin 3 Tx D Pin 6 Pin 8 CTS Pin 7 Pin 4 DTR Pin 8 Pin 9 RI Pin 9 Pin 5 GND Pin 10 open Attention! If the X39 connector is use d, DO NOT c onnect the CO M2 si[...]

  • Seite 49

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 49 X52 USB UDO C (not assembled ) Pin Si gnal Pin Signal 1 VCC 6 NC 2 NC 7 GND 3 USB- P2- 8 NC 4 NC 9 NC 5 USB- P2+ 10 NC Attention! X52 f or USB-DOC-F lash drives are only for OEM use. T he connector is not assem bled. T he UDOC may be assem bled if the C ompac tFlash is not assem bled. X[...]

  • Seite 50

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 50 X61 Serial Port COM 1, Parallel Port L PT1 Header onboard D-SUB conn ector Signal Pin 1 Pin 1 DCD Pin 2 Pin 6 DSR Pin 3 Pin 2 RxD Pin 4 Pin 7 RTS Pin 5 Pin 3 Tx D Pin 6 Pin 8 CTS Pin 7 Pin 4 DTR Pin 8 Pin 9 RI Pin 9 Pin 5 GND Pin 10 G ND Pin 11 s elect Pin 12 Pin 12 paper end Pin 13 Pin[...]

  • Seite 51

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 51 X101 PCI-104 BU S Interface Pin A B C D 1 GND/5.0V KEY2 Reserve d +5 AD00 2 VI/O AD02 AD01 +5V 3 AD05 GND AD04 AD03 4 C/BE0* AD07 GND AD06 5 GND AD09 AD08 GND 6 AD11 VI/O AD10 M66EN 7 AD14 AD13 G ND AD12 8 +3.3V C/B E1* AD15 +3.3V 9 SERR* GND SB0* PAR 10 GND PERR* +3. 3V SDONE 11 STOP* [...]

  • Seite 52

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 52 X230 JT A G-Port Pin Si gnal Pin Signal 1 T CK 2 T MS 3 T DI 4 T DO X301 VG A Monitor (CRT- Signals) 15pins High-Den sity DSub Pin Signal 1 Red 2 Green 3 Blue 13 H-Synch 14 V-Synch 5 + 11 Bridged 5, 6, 7, 8 Grounde d The VGA-CRT signals fr om J2 mus t be wired to a standard VGA High De [...]

  • Seite 53

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 53 9. J UMPER L OC A TIONS ON THE B O ARD The f ollowing f igure s hows the location of a ll jum per blocks on the MS B900/L board. T he num bers shown in this figure are silk screened on the board s o that the pins can easil y be located. This chapter refer s to the individual pins f or t[...]

  • Seite 54

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 54[...]

  • Seite 55

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 55 10. C A BLE I NTERF ACES 10.1. The Hard Disk Cable 44pin IDT Term inal for Dual Row (2.00mm grid) and 1.00mm flat cable; 44p ins = 40pins signal and 4pins power. 1 1 2 43 43 44 44 39 39 40 40 2 Max. length for the IDE cab le is 30cm . Attention! Check the pin 1 m ark er of the cable and[...]

  • Seite 56

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 56 10.2. The COM1/LPT Ser ial Interface Cable Term inal for dual row 2mm grid and 1mm flat cable. Connector X61 Pin Signal COM1 9pin D- Sub male Pin 1 = DCD 1 Pin 2 = DSR 6 Pin 3 = RXD 2 Pin 4 = RT S 7 Pin 5 = T XD 3 Pin 6 = CT S 8 Pin 7 = DT R 4 Pin 8 = RI 9 Pin 9 = GND 5 Pin 10 Pin Signa[...]

  • Seite 57

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 57 10.3. The COM2 Seria l Interface Ca ble DT term inal for dual row 0.1" (2. 54mm grid) and 1.27m m flat cable. Connector X39 Pin Signal COM2 9pin D- Sub male Pin 1 = DCD 1 Pin 2 = DSR 6 Pin 3 = RXD 2 Pin 4 = RT S 7 Pin 5 = T XD 3 Pin 6 = CT S 8 Pin 7 = DT R 4 Pin 8 = RI 9 Pin 9 = GN[...]

  • Seite 58

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 58 11. T HERM A L S PECIFIC A TIONS 11.1. Thermal Analysis for Case Inte gration The MSB900/L h as a uniqu e thermal design. Heat sour ces are located o n the bottom s ide of the PCB. Usually this m eans the board will be m ounted upsid e down with the CPU ther m ally in contac t with a h [...]

  • Seite 59

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 59 12. A SSEMBL Y V IEWS 12.1. MSB900/L[...]

  • Seite 60

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 60[...]

  • Seite 61

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 61 12.2. Mechanical Dim ensions MSB900 Version Unit: mm (millimeter) Tolerance: +/- 0.1mm Date: 28.03.2006 Author: BRR[...]

  • Seite 62

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 62 13. PXE-B OOT AND PXE-S ETUP IN THE BIOS PXE Protocol PXE is defined on a f oundation of industr y-standard Internet protocols and ser vices that are widely d eplo yed in the industr y, nam ely TCP/IP, D HCP, and TF TP. These standar dize the form of the interactions bet ween clients an[...]

  • Seite 63

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 63 BIOS-Setup Scre en with the LA N-BOOT (PXE) DISABLE / EN ABLE m enu: After ENABLING th e LAN- Boot, the Pass word m ust be entered. The Password m ust be req uested with the PX E-licence order f orm on the following pa ge.[...]

  • Seite 64

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 64 14. PXE-L ICENSE O RDER The PXE-Function must be license d before it can be enabled. T o order, fill out and s ign this form ; r eturn to the fax number below. T his f orm m ay be printed out separatel y f rom the digita l c opy of this manual on the Product CD. Note... One license per [...]

  • Seite 65

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 65 15. I NDEX 1 10/100 BASE-T Interface 47 A Addressing PCI D evices 23 Application Notes 16, 2 2 B Battery-Lifetim e 23 BIOS CMOS 29 BIOS Histor y 24 BIOS, Reload Def ault Setti ngs 53 Block Diagram 13 Boot Time 25 Bus Signals 23 C CMOS 29 CMOS Setup 34 Connectors 41 Controllers 27 Counte[...]

  • Seite 66

    DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 66 RoHS Comm itment 9 ROM-BIOS 28 RTC 28 S Safety Precautions 9 Schematics 59 Serial Interface Ca ble 56, 5 7 Serial Port COM1 50 Serial Port COM2 48 Serial Ports 27 Specifications 14 SQS 11 Standards 8 Swiss Associati on for Qualit y and Managem ent Systems 11 Swiss Qualit y 11 Symbols 7 [...]