Asus S62F Bedienungsanleitung

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Zur Seite of

Richtige Gebrauchsanleitung

Die Vorschriften verpflichten den Verkäufer zur Übertragung der Gebrauchsanleitung Asus S62F an den Erwerber, zusammen mit der Ware. Eine fehlende Anleitung oder falsche Informationen, die dem Verbraucher übertragen werden, bilden eine Grundlage für eine Reklamation aufgrund Unstimmigkeit des Geräts mit dem Vertrag. Rechtsmäßig lässt man das Anfügen einer Gebrauchsanleitung in anderer Form als Papierform zu, was letztens sehr oft genutzt wird, indem man eine grafische oder elektronische Anleitung von Asus S62F, sowie Anleitungsvideos für Nutzer beifügt. Die Bedingung ist, dass ihre Form leserlich und verständlich ist.

Was ist eine Gebrauchsanleitung?

Das Wort kommt vom lateinischen „instructio”, d.h. ordnen. Demnach kann man in der Anleitung Asus S62F die Beschreibung der Etappen der Vorgehensweisen finden. Das Ziel der Anleitung ist die Belehrung, Vereinfachung des Starts, der Nutzung des Geräts oder auch der Ausführung bestimmter Tätigkeiten. Die Anleitung ist eine Sammlung von Informationen über ein Gegenstand/eine Dienstleistung, ein Hinweis.

Leider widmen nicht viele Nutzer ihre Zeit der Gebrauchsanleitung Asus S62F. Eine gute Gebrauchsanleitung erlaubt nicht nur eine Reihe zusätzlicher Funktionen des gekauften Geräts kennenzulernen, sondern hilft dabei viele Fehler zu vermeiden.

Was sollte also eine ideale Gebrauchsanleitung beinhalten?

Die Gebrauchsanleitung Asus S62F sollte vor allem folgendes enthalten:
- Informationen über technische Daten des Geräts Asus S62F
- Den Namen des Produzenten und das Produktionsjahr des Geräts Asus S62F
- Grundsätze der Bedienung, Regulierung und Wartung des Geräts Asus S62F
- Sicherheitszeichen und Zertifikate, die die Übereinstimmung mit entsprechenden Normen bestätigen

Warum lesen wir keine Gebrauchsanleitungen?

Der Grund dafür ist die fehlende Zeit und die Sicherheit, was die bestimmten Funktionen der gekauften Geräte angeht. Leider ist das Anschließen und Starten von Asus S62F zu wenig. Eine Anleitung beinhaltet eine Reihe von Hinweisen bezüglich bestimmter Funktionen, Sicherheitsgrundsätze, Wartungsarten (sogar das, welche Mittel man benutzen sollte), eventueller Fehler von Asus S62F und Lösungsarten für Probleme, die während der Nutzung auftreten könnten. Immerhin kann man in der Gebrauchsanleitung die Kontaktnummer zum Service Asus finden, wenn die vorgeschlagenen Lösungen nicht wirksam sind. Aktuell erfreuen sich Anleitungen in Form von interessanten Animationen oder Videoanleitungen an Popularität, die den Nutzer besser ansprechen als eine Broschüre. Diese Art von Anleitung gibt garantiert, dass der Nutzer sich das ganze Video anschaut, ohne die spezifizierten und komplizierten technischen Beschreibungen von Asus S62F zu überspringen, wie es bei der Papierform passiert.

Warum sollte man Gebrauchsanleitungen lesen?

In der Gebrauchsanleitung finden wir vor allem die Antwort über den Bau sowie die Möglichkeiten des Geräts Asus S62F, über die Nutzung bestimmter Accessoires und eine Reihe von Informationen, die erlauben, jegliche Funktionen und Bequemlichkeiten zu nutzen.

Nach dem gelungenen Kauf des Geräts, sollte man einige Zeit für das Kennenlernen jedes Teils der Anleitung von Asus S62F widmen. Aktuell sind sie genau vorbereitet oder übersetzt, damit sie nicht nur verständlich für die Nutzer sind, aber auch ihre grundliegende Hilfs-Informations-Funktion erfüllen.

Inhaltsverzeichnis der Gebrauchsanleitungen

  • Seite 1

    service overview 1-1 Chapter 1 Ser vice Ov er view Car efully r ead thr ough this chapter for a look at various components of the notebook and necessar y cautions an d tools befor e perfor ming any ser vice and r epairs. o provide the best service and support for th e ASUS S62F Series, we have provided the below information for techni cians from di[...]

  • Seite 2

    service ov erview 1-2 S62F Series Ov er view and Components The ASUS S62F Series Notebook is a product combining the power of Intel® Pentium-M CPU. In this section, an overvi ew for the S62F, along with its components, will be presented. S62F Ov er view OVERVIEW The illustrations below show the notebook’s ov erview from front vi ew, right side v[...]

  • Seite 3

    service overview 1 - 3 USB ( 2.0 ) p orts Modem port PCMCIA slot LAN port VGA Port 1394 port Optical Drive Device Air vents Kensin g ton Lock Batter y Module DC Power Input Jack[...]

  • Seite 4

    service overview 1 - 4 Components LCD COMPONENTS INVERTER BOARD The illustrations below show the components of theS62F Series. LCD Panel* The illustration below shows the LCD display pa nel. The S62F Series notebook comes with 15.0” TFT LCD Panel. Inverter Board The illustration below sh ows the inverter board, which is hidden underneath the lowe[...]

  • Seite 5

    service overview 1 - 5 LCD bracket LCD BRACKETS The illustration below shows the LCD brackets. Hinge Cover HINGE COVER The illustration below shows the Hinge Cover. LCD Case LCD CASE The illustration below shows the LC D case. Here is the LCD bezel.[...]

  • Seite 6

    service overview 1 - 6 Keyboard KEYBOARD The illustration below shows the keyboa rd plate. It can be exchanged with keyboard plates with different language layouts, such as U.S., German, Russian, British, Italian and others. Top Case Module TOP CASE The illustration below shows the top case of the notebook. Battery Pack BATTERY The ill ustr ation b[...]

  • Seite 7

    service overview 1 - 7 Optical Drive Device OPTICAL The illustration below shows the Optical Drive Device DRIVE DEVICE Hard Disk Drive HDD The illustration below shows the 2.5” in dustry-standard HDD with 9.5mm height. HDD Bracket HDD BRACKET The illustration below shows the HDD Brac ket that is placed over the HDD. CPU CPU The illustration below[...]

  • Seite 8

    service overview 1 - 8 CPU Thermal Module CPU The illustration below shows the thermal module for the CPU. It’s located on the top of CPU. THERMAL MODULE Memory Module MEMORY The illustration below shows the industry-standard 200pin SO-DIMM DD R SDRAM module for the notebook. Motherboard MOTHERBOARD The illustration below shows the mo therboard o[...]

  • Seite 9

    service overview 1 - 9 Modem Module MODEM The illustration below shows the modem module of the notebook. MODULE WALN Module WALN The illustration below shows the WALN module of the notebook. MODULE Top Case TOP CASE The illustration below shows the TOP case of the notebook.[...]

  • Seite 10

    service overview 1 - 10 Ser vice Ov er view Please pay special attention to the cautions below to prevent any damages to the notebook and also please be sure to select the appropria te tools described in this section to perform any services desired. Precautions CAUTIONS Before you perform any service and/or repair on the notebook, please follow the[...]

  • Seite 11

    service overview 1 - 11 Appr opriate T ools TOOLS The illustrations below show the appropriate t ools that should be used for the notebook’s service and repair. Phillips-hea d Screwdri ver CROSS SCREW- Use a Phillips-head screwdriver to fas ten/remove the K- or B-typed screws. DRIVER Single-Slo tted Screwd river FLATHEAD SCREW- Use a single-slott[...]

  • Seite 12

    Disassembly procedu re Chapter 2 Disassembl y Pr ocedur e Please follow the infor matio n pr ovided in this section to perfor m the complete disassembly procedur e of the note book . Be sur e to use pr oper tools described befor e. SUS S62F Series Notebook consists of vari ous modules. This chapter describes the proced ures for the complete noteboo[...]

  • Seite 13

    Disassembly procedu re Ba tter y Module BATTERY BATTERY MODULE REMOVAL The illustration below shows how to remove the battery module. 1. Unlock and hold the latch No (1). 1 2. Slide the battery lock (No. 2) and pull the battery pack out. 2 3. Pull the battery pack out. 2 - 2[...]

  • Seite 14

    Disassembly procedu re HDD Module HDD MODULE The illustrations below show how to remove the HDD module from the notebook. Removing HDD Module HDD MODULE REMOVAL 1. Remove 3 screws (M2.5*4L (K )), then remove the HDD door. M2.5*4L 2. Lift the HDD module a nd then remove it. 3. Remove 4 screws [M3 * 4(L)] to separate HDD from HDD housing. M3*4L 2 - 3[...]

  • Seite 15

    Disassembly procedu re W ir eless LAN Module WIRELESS LAN The illustration below shows how to remove the Wireless LAN module. 1. Remove 1 piece of tape and disconnect the MAIN & AUX antenna. 2. And open the two latches to pop the MINI PC I MODULE up then pull it out. Memor y Module MEMORY MODULE The S62F Series Notebook does not hav e RAM onboa[...]

  • Seite 16

    Disassembly procedu re 2. Open the 2 latches aside (No. 1, 2), which will pop the memory module up to an angle of 30 ° , then pull out the memory modul e in that angle (No. 3). 1 3 2 30 o CPU Module CPU MODULE The illustrations below show how to remove the CPU module from the notebook. Removing CPU Module CPU REMOVAL 1. Remove 2 screws (M2.5*4L (K[...]

  • Seite 17

    Disassembly procedu re 3. Disconnect the Fan cable and remove 2 sc rews (M2.5*4L (K)) then take away the CPU thermal module. 4. Turn the non-removabl e screw here 180 degrees counter-clockwise to loosen the CPU. 5. Squeeze the vacuum handling pump and use it to lift the CPU away. M2.5*4L Unlock L O 2 - 6[...]

  • Seite 18

    Disassembly procedu re ODD Module OPTICAL DRIVE DEVICE The illustration below shows how to remove the ODD m odule. 1. Remove 1 screw (M2.5*4L (K )). ODD REMOVAL M2.5*4L 2. Push the ODD Module out by a pair of tweezers. 2 - 7[...]

  • Seite 19

    Disassembly procedu re K eyboar d KEYBOARD The illustration of below shows how to remove the keyboard. Removing Keyboard K/B REMOVAL 1. Push the 4 latches in (No.1, No.2, No.3, No.4) with a pair of tweezers or a single-slotted screwdriver and lift the keyboard plate up. 2. Lay the keyboard dow n over the Top case. *Do not remove the keyboard y et. [...]

  • Seite 20

    Disassembly procedu re Removing Keyboard Cable CABLE 1. Use a flexible connector t ool to unlock the cable connecto r on both ends (no. 1). REMOVAL 2. Carefully pull out the keyboard cabl e (no. 2) with a pair of tweezers. 3. Lock the connector (no. 3) agai n to avoid possible breakage. 1. Unlock 2. Cable out 3. 1. Unlock 3. 4. Remove keyboard from[...]

  • Seite 21

    Disassembly procedu re 2. Use a pair of tweezers to remove both hinge Cover. 3. Disconnect the LANCH cable and touchpad FFC on the top case. LANCH cable T ouchpad FFC 4. Turn over the NB and re move 1 screws (M2*3L (K)). I M2*3L 2 - 10[...]

  • Seite 22

    Disassembly procedu re 5. Disconnect the Coaxia l & inverter cable. Coaxial cable Inverter ca ble 6. Arrange the Coaxial & inverter cable and antenna on the bottom case. BOTTOM CASE REMOVAL 7. Remove 15 screws (M2.5* 6L (K)) and 1 screw (M2.5*4L) (K)) on the bottom case. M2.5*6L M2.5*4L 2 - 11[...]

  • Seite 23

    Disassembly procedu re 8. Before separate the bottom case , remove a l ittle bit bottom case and let the cable and antennas through out of hole . Inverter & camera cable Antenna 9. Separate the bottom ca se from the top case. 10. Remove 2 screws (M2. 5*6L (K)) on both hinge. M2.5*6L 2 - 12[...]

  • Seite 24

    Disassembly procedu re 11. Separate the LCD module from the Top Case module 12. Remove 2 screws (M2.5*4L (K)) and take away the LANCH board. TOP CASE REMOVAL M2.5*4L 13. Remove the LANCH board cable. 2 - 13[...]

  • Seite 25

    Disassembly procedu re 14. Disconnect the touch pad FFC and remove 1 piece of tape then take away the touch pad FFC. 15. Remove 5 screws (M2.5*4L (K)) and take away the touchpad bracket. M2.5*4L 16. Take away the touchpad. 2 - 14[...]

  • Seite 26

    Disassembly procedu re Motherboar d MOTHERBOARD The illustrations below show how to di sassemble and remove the Motherboard. Removing Motherboard MOTHERBOARD REMOVAL 1. Remove 2 screws (M2.5*4L (K)). 2. Remove 2 screws for CRT on the ri ght side by a spacer screwdriver. 3. Separate the Motherboar d from the bottom case. *Do not remove the Motherboa[...]

  • Seite 27

    Disassembly procedu re 4. Disconnect the Bluetooth & Speaker cabl es then take away the Motherboard. 5. Remove 1 screw (M2* 3L (K)) on the IO bracket. 6. Use a single-slotted screw driver to remove 2 screws HEX 5mm then take away the IO bracket. Bluetooth cable S p eaker cable M2*3L 2 - 16[...]

  • Seite 28

    Disassembly procedu re 7. Remove 1 screw (M2*3L (K)) and take away th e TPM board . M2*3L 8. Remove 4 pieces of tapes and disconnect the modem cable. 9. Remove 2 screws (M2*3L (K)) an d take away the modem board. M2*3L 2 - 17[...]

  • Seite 29

    Disassembly procedu re Bottom Case Module BOTTOM The illustrations below show how to remove and disassem ble the Bottom case m odule. The module contains Bluetoot h board, speaker cable. CASE MODULE Disassembling Bottom case Module BOTTOM CASE DISASSEMBLY 1. Disconnect the Bluetooth cable and remove it. 2. Take away the Bluetooth board from the bot[...]

  • Seite 30

    Disassembly procedu re L CD Module LCD MODULE The illustrations below show how to remove a nd disassemble the LCD m odule. The module contains LCD panel, Inverter board, LCD bezel, LCD back cover. LCD MODULE DISASSEMBLY Disassembling LCD Module 4. Remove 7 rubber pads and 7 screws (M2.5 x 6L) fr om LCD module. M2.5*6L 5. Prying the inside edges of [...]

  • Seite 31

    Disassembly procedu re 6. Disconnect the LCD cable. 7. Remove 2 screws (M2.5*4L (K)) & 4 screws (M2.5*6L (K)) and take away the LCD panel. M2.5*4L M2.5*6L 5. Remove 4 screws(M2*3L(K)) on the right LCD bracket to disassemble the LCD bracket. M2*3L 2 - 20[...]

  • Seite 32

    Disassembly procedu re 6. Remove 4 screws(M2*3L(K)) on the left LCD bracket to di sassemble the other LCD bracket. M2*3L 7. Remove 2 pieces of tapes and disconnect the coaxial cable then take it away . 8. Remove 1 screw (M2x 4L). . M2*4L 2 - 21[...]

  • Seite 33

    Disassembly procedu re 9. Lift a little bit the inverter board and di sconnect the inverter cable and then t ake it away . 6. Remove 2 screws (M2x 6L) on both hinge and take them away . M2.5*6L M2.5*6L 2 - 22[...]

  • Seite 34

    Disassembly procedu re 7. Disconnect the camera cable and remove the microphone. 8. Remove the cable and remove mylar then take away the cable. 9. T ake away the Camera module from the LCD back cover . 10. Remove 1 screw (M2x 4L) and remove 3 pieces of t apes then take away the wireless black wire. 2 - 23[...]

  • Seite 35

    Disassembly procedu re 11. Remove 1 screw (M2x 4L) and remove 3 pieces of t apes then take away the wireless white wire. 2 - 24[...]

  • Seite 36

    Assembly procedure Chapter 3 Assembl y Pr ocedur e Please follow the infor mation pr ovided in this section to perfor m the complete assembly procedur e of the note book. Be sure to use pr oper tools described befor e. fter you have completed the previous chapter of complete disa ssembly, please follow this chapter to assemble the notebook back tog[...]

  • Seite 37

    Assembly procedure L CD Module LCD MODULE The illustrations below show how to asse mble and install the LCD module of the notebook. 1. Install the wireless wh ite wire module and secure 1 screw (M2x 4L) then paste 3 pieces of tapes to secu re it. LCD MODULE ASSEMBLY 2. Install the wireless black wire module and secure 1 screw (M2x 4L) then paste 3 [...]

  • Seite 38

    Assembly procedure 4. Install the microphone on the LCD cover and connect the camera cable. 5. Lay the inverter cable through the locking trench on the LCD back cover . 6. Lay the inverter cable through the locking trench on the LCD back cover . 3 - 3[...]

  • Seite 39

    Assembly procedure 7. Inst all the both hinge on LCD back cover and secure 2 screws (M2x 6L) to secure them. 8. Install the inverter board on LCD back cover and connect the inverter cable. 9. Secure 1 screw (M2x 4L) to secure it. . M2.5*6L M2.5*6L M2*4L 3 - 4[...]

  • Seite 40

    Assembly procedure Assembly LCD Module 1. Connect the coaxial cable and paste 2 pieces of tapes to secure it. 2. Install the left LCD br acket and secure 4 screws (M2*3L (K)) to fix it. 3. Install the right LCD bracket and 4 screws(M2*3L(K)) and secure 4 screws (M2*3L (K)) to fix it. M2*3L M2*3L 3 - 5[...]

  • Seite 41

    Assembly procedure 4. Install the LCD p anel and secure 2 screws (M2.5*4L (K)) & 4 screws (M2.5*6L (K)) to secure it. M2.5*4L M2.5*6L 5. Connect the LCD cable. 6. Combine the LCD bezel and LCD Cover properly and press on all four edges until them snap into position. 3 - 6[...]

  • Seite 42

    Assembly procedure 7. Secure74 screws (M2.5 x 6L) on LCD front be zel then paste 7 rubber pads above. M2.5*6L Bottom Case Module BOTTOM CASE MODULE The illustrations below show ho w to assembly the Bottom case m odule. The module contains Bluetooth boar d, speaker cable. Assembling Bottom case Module BOTTOM CASE ASSEMBLY 1. Install the speaker mo d[...]

  • Seite 43

    Assembly procedure 2. Install the Bluetooth bo ard on the bottom case. 3. Connect the Bluetooth cable and lay it th r o ug h t he l o ck i n g t re n c h on b o t to m c as e . Motherboar d MOTHERBOARD The illustrations below show how to asse mble and install the motherboard of the notebook. MOTHERBOARD ASSEMBLY 1. Install the modem board and se cu[...]

  • Seite 44

    Assembly procedure 2. Connect the modem cable and paste 4 pi eces of tape to fix the cable. 3. Install the TPM board and secure 1 screw (M2*3L (K)) to secure it. M2*3L 4. Install the IO bracket a nd use a single-slotted screwdriv er to secure 2 screws HEX 5mm. 3 - 9[...]

  • Seite 45

    Assembly procedure 5. Secure 1 screw (M2* 3L (K)) on the IO br acket to secure it. M2*3L 6. Connect the Bluetooth & Speaker cables, before install the Motherboard to the bottom case. Bluetooth cable S p eaker cable 7. Combine the Motherbo ard and the bottom case. 8. Remove 2 screws for CRT on the ri ght side by a spacer screwdriver. 3 - 10[...]

  • Seite 46

    Assembly procedure 9. Secure 2 screws (M2.5*4L (K)) to secu re the motherboard. T op Case Module TOP CASE MODULE The illustrations below show how to assemb le and install the top case module of the notebook. 1. Install the touc hpad on the top case. TOP CASE ASSEMBLY 2. Install the touchpad bracke t and secure 5 screws (M2. 5*4L (K)) to secure it. [...]

  • Seite 47

    Assembly procedure 3. Connect the touch pad FFC and paste 1 piece of tape. 4. Connect the LANCH board cable. 5. Install the LANCH board and secu re 2 screws (M2.5*4L (K)). M2.5*4L 3 - 12[...]

  • Seite 48

    Assembly procedure 1. Combine the Top case module and LCD module. 2. Secure 2 screws (M2.5 *6L (K)) to fix the hinge. 1. Combine the bottom ca se from the top case. TOP CASE MODULE ASSEMBLY M2.5*6L BOTTOM CASE ASSEMBLY 3 - 13[...]

  • Seite 49

    Assembly procedure 2. Before secure the botto m case, let the cable and ant ennas through in the hole. Inverter & camera cable Antenna 3. Secure 15 screws (M2.5*6L (K)) and 1 screw (M2 .5*4L) (K )) to secure the bottom case. 4. Lay the antennas through the locking trench on bottom case M2.5*6L M2.5*4L 3 - 14[...]

  • Seite 50

    Assembly procedure 5. Connect the Coaxial & inverter cable and la y the cables through the locking trench on bottom case. Coaxial cable Inverter ca ble 6. Secure 1 screws (M2*3L (K)) to se cure cables. I M2*3L 7. Turn over the NB and connect the LA NCH cable and touchpad FFC on top case. LANCH cable T ouchpad FFC 3 - 15[...]

  • Seite 51

    Assembly procedure 8. Install the both hinge Cover. HINGE COVER ASSEMABLY 9. Install the MIDDLE cover. 3 - 16[...]

  • Seite 52

    Assembly procedure Assembling K eyboar d KEYBOARD The illustrations below show how to assemble and install the Keyboard of the notebook. KEYBOARD ASSEMBLY 1. Place the Keyboard module on front side of the top case. Then connect Keyboard FPC Cable with a pai r of tweezers. 2. Install Keyboard properly and note the lower side shoul d inset first. Pus[...]

  • Seite 53

    Assembly procedure ODD Module ODD MODULE The illustrations below show how to asse mble and install the ODD Module of the notebook. 1. Insert the ODD module. ODD MODULE INSTALLATION 2. Secure 1 screw (M2. 5*4L (K)) to secure it. M2.5*4L CPU Module Assembl y CPU MODULE The illustration below shows how to install CPU and the CPU he at sink of the note[...]

  • Seite 54

    Assembly procedure 2. T urn the non-removable screw here 180 degrees clockwise to lock the CPU. 3 . Inst all the CPU therna l module gently and connect the fan cable then secure 2 screws (M2.5*4L (K)) to secure it. 4. Secure 4 screws (M2*3L (K)) by order . 5. Install the CPU door and secure 2 screws (M2.5*4L (K)) to secure it. Loc k L O M2.5*4L 2 3[...]

  • Seite 55

    Assembly procedure Assembling Memor y Module The illustrations below show how to assemb le and install the memory module to the notebook . MEMORY MODULE 1. Insert the Memory modul e into the memory socket by an angle of 30 degree, and push down to latch t he memory module. MEMORY INSTALLATION o 30 2. Install the DIMM door a nd secure 2 screws (M2.5[...]

  • Seite 56

    Assembly procedure 2. Connect the MAIN & AUX antenna and paste 1 piece of tape to secure antennas. HDD Module HDD MODULE The illustrations below show how to assemb le and install the HDD module of the notebook 1. Secure 4 screws [M3 * 4(L) ] to fix HDD into HDD housing. HDD INSTALLATION M3*4L 2. Insert the HDD module to connect the FPC connecto[...]

  • Seite 57

    Assembly procedure 3. Install the bottom case and secure 3 screws (M2.5*4L(K )) to fix it. M2.5*4L Ba tter y Module BATTERY MODULE The illustrations below show how to install battery module of the notebook. 1. Install the battery module. Slide the battery latch to cl ose the battery l ock. BATTERY INSTALLATION 3 - 22[...]

  • Seite 58

    Upgrade & Replacement 4 – 1 Chapter 4 Upg r ade & R eplacement F ollow the indi vidual pr ocedur es in this chapter to perfor m the notebook’ s upgrade and r e placement of various major components. sus S62F Series Notebook is a 2 spindles p roduct, which means there are less options for you to upgrade to. The key upgradeable an d repla[...]

  • Seite 59

    Upgrade & Replacement 4 - 2 CPU Upgr ade CPU TheS62F Series Notebook comes standar d with a Intel® Mi cro-FCPGA Socket on the motherboard, which means it can support all Intel Micro-FCPGA CPUs up to 2.13 GHz . Upgrading CPU Remove battery modu le 1. Unlock and hold the latch No (1). 1 2. Slide the battery lock (No. 2) and pull the battery pack[...]

  • Seite 60

    Upgrade & Replacement 4 - 3 Removing CPU Module CPU REMOVAL 1. Remove 2 screws (M2.5*4L (K )), then remove the CPU door. 2. Remove 4 screws (M 2*3L (K)) by order. 1 2 3 4 M2.5*4L M2*3L 3. Disconnect the Fan cable and remove 2 screws (M 2.5*4L (K)) then take away the CPU thermal module. M2.5*4L[...]

  • Seite 61

    Upgrade & Replacement 4 - 4 4. Turn the non-remo vable screw here 180 degrees counter-clockwise to loosen the CPU. 5. Squeeze the vacuum handling pump and use it to lift the CPU away. Installing CPU The illustration below shows how to in stall CPU and the heat sink of the notebook. 1. Squeeze the vacuum handling pump and use it to install the C[...]

  • Seite 62

    Upgrade & Replacement 4 - 5 3. Install the CPU thermal module gent ly and connect the fan cable then secure 2 screws (M2.5*4L (K)) to secure it. M2.5*4L 4. Secure 4 screws (M2*3L (K)) by order . 1 2 3 4 M2*3L 5. Install the CPU door and secure 2 screws (M2.5*4L (K)) to secure it. M2.5*4L Install battery module 1. Install the battery module. Sli[...]

  • Seite 63

    Upgrade & Replacement 4 - 6 Second Memor y Upgr ade MEMORY The S62F Series Notebook does not have RAM onboard. There are two SO- DIMM sockets for installing SO-DIMM RA M. It can upgrade the total memory size up to 1GB with a 512MB module on each socket. Upgrading Memory Module Remove battery modu le 1. Unlock and hold the latch No (1). 1 2. Sli[...]

  • Seite 64

    Upgrade & Replacement 4 - 7 Removing Memory mo dule MEMORY REMOVAL 1. Remove 2 screws (M2.5*4L (K )), then remove the DIMM door. M2.5*4L 2. Open the 2 latches asi de (No. 1, 2), which will pop the memory module up to an angle of 30 ° , then pull out the memory modul e in that angle (No. 3). 1 3 Installing Memory Mod ule 1. Insert the Memory m [...]

  • Seite 65

    Upgrade & Replacement 4 - 8 2. Install the DIMM door and secure 2 screws (M2.5* 4L (K)) to secure it. M2.5*4L Install battery module 3. Install the battery modu le. Slide the battery latch to close the battery lock. BATTERY INSTALLATION[...]

  • Seite 66

    Upgrade & Replacement 4 - 9 HDD Upgr ade HDD The S62F Series Notebook uses an industry-standar d 2½” HDD with IDE interface. You can replace the HDD to any capacity of your choice within our approval and prior test. Upgrading HDD Remove battery modu le 1. Unlock and hold the latch No (1). 1 2. Slide the battery lock (No. 2) and pull the batt[...]

  • Seite 67

    Upgrade & Replacement 4 - 10 Removing HDD Module HDD MODULE REMOVAL 1. Remove 3 screws (M2.5*4L (K )), then remove the HDD door. M2.5*4L 2. Lift the HDD module a nd then remove it. 3. Remove 4 screws [M3 * 4(L)] to separate HDD from HDD housing. M3*4L[...]

  • Seite 68

    Upgrade & Replacement 4 - 11 Installing new HDD module 4. Secure 4 screws [M3 * 4(L) ] to fix HDD into HDD housing. HDD INSTALLATION M3*4L 5. Insert the HDD module to connect t he FPC connector until it’s installed properly. 6. Install the bottom case and secure 3 screws (M2. 5*4L(K)) to fix it. M2.5*4L Install battery module 7. Install the b[...]

  • Seite 69

    Upgrade & Replacement 4 - 12 W ir eless LAN Module WIRELESS The illustration below shows how to remove the Wireless LAN module. LAN Replacing WLAN Remove battery modu le WALN 1. Unlock and hold the latch No (1). REMOVAL 1 2. Slide the battery lock (No. 2) and pull the battery pack out. 2 3. Pull the battery pack out.[...]

  • Seite 70

    Upgrade & Replacement 4 - 13 Removing WALN Module 1. Remove 1 piece of tape and disconnect the MAIN & AUX antenna. ODD REMOVAL 2. And open the two latches to pop the MINI PCI MODULE up then pull it out. Installing new WALN module WALN MODULE INSTALLATION 3. Install the MINI PCI module into t he socket by an angle of 30 degree, and push down[...]

  • Seite 71

    Upgrade & Replacement 4 - 14 4. Connect the MAIN & AU X antenna and paste 1 piece of tape to secure antennas. Install battery module 1. Install the battery module. Slide the battery latch to clos e the battery l ock. BATTERY INSTALLATION[...]

  • Seite 72

    Upgrade & Replacement 4 - 15 ODD R eplacement ODD The S62F Series Notebook can suppor t DVD-ROM (8x DVD), COMBO (CD-R 24x/ CD-RW 24x / DV D-ROM 8x/ CD 24x), and DVD- Dual (DVD-R/RW: 4x/2x, DVD+R/RW: 4x/2.4x, CD-R/RW: 24x/ 10x, DVD: 8x, CD: 24x). Replacing ODD Remove battery modu le ODD REMOVAL 1. Unlock and hold the latch No (1). 1 2. Slide the[...]

  • Seite 73

    Upgrade & Replacement 4 - 16 Removing ODD Module 1. Remove 1 screw (M2.5*4L (K )). ODD REMOVAL M2.5*4L 2. Push the ODD Module out by a pair of tweezers. Installing new ODD module 3. Insert the ODD module. ODD MODULE INSTALLATION[...]

  • Seite 74

    Upgrade & Replacement 4 - 17 4. Secure 1 screw (M2 .5*4L (K)) to secure i t. M2.5*4L Install battery module 5. Install the battery module. Slide the battery latch to clos e the battery l ock. BATTERY INSTALLATION[...]

  • Seite 75

    HARDWARE SPECIFICATION 5- 1 Har d war e Specifica tions You can enjoy and utilize the S62 series Notebook more effectively with a better compr ehension of detailed hardware specifications of the notebook. his chapter lists the detail ed specifications of the notebook’s main system and modules. Please refer to this section when you ne ed to find o[...]

  • Seite 76

    HARDWARE SPECIFICATION 5- 2 1 MARKETING SPEC S62F Specification (Two-Spindle Design) Product Family S62F Dimension 328 x 288x 27-38mm Weight 2.4 Color Silver-Gray CPU Type Intel Yonah 1M/2M Speed 1.66G,1.83G,2.0G,2.16G Package Micro-PGA 479M Socketable L2 Cache Yes Size 2M On-die cache memory Memory Type DDR II SDRAM without ECC Base Memory None Ex[...]

  • Seite 77

    HARDWARE SPECIFICATION 5- 3 North Bridge INTEL 945GM South Bridge INTEL ICH7M Super IO SMSC LPC47N217 Thermal Sensor ADT7461ARMZ Micro-Processo r ITE8510E KBC ITE8510E Flash ROM (ISA) SST 4Mb Graphic Accelerator Intel 950 internal GPU 3D Yes Controller Intel Internal graphic AGP Support No Dual view/Dual App Yes Graphic Memory Share Memory TV Out S[...]

  • Seite 78

    HARDWARE SPECIFICATION 5- 4 Spec 56K I/F Azalia MDC Jack RJ-11 RJ-11 port ACPI Yes V.90 Yes Voice Phone No Digital Line Protection Yes Wake On Ring Yes BT No Controller CSR BT-183 I/F USB ANT Chip anten na LAN Jack RJ-45 RJ-45 port Wake On LAN YES Controller RealTEK RTL8110SB Internal Keyboard Vendor Key 88 Keys (W/ MS-Windows function keys) Stroke[...]

  • Seite 79

    HARDWARE SPECIFICATION 5- 5 PC Speaker Volume Fn + F11 Volume de crease Number Lock Fn + Ins Scroll Lock Fn + Del Instant Keys Power Saving Power 4 Gear E-mail Direct button Internet Browser Direct button Disable TouchPad Direct button Status Indication 8 LEDs (Machine Base x 8) Power Status Yes (Green on LED when Power on. Blinking when in SUSPEND[...]

  • Seite 80

    HARDWARE SPECIFICATION 5- 6 Reset/Force Off Yes (Force O f f switch) I/O Port All ports support hot-plug Parallel NO CRT Yes 15-pin D-sub Port Bar port III Yes Mouse/Keyboa rd N O IrDA Port NO Fax/Modem Yes RJ11 LAN Jack Yes RJ45 Line In NO Mic In Jack Yes Mono Head Phone Jack Yes Stereo out USB port Yes 4 Ports DC-In Yes 2-pin type/65W Heat Soluti[...]

  • Seite 81

    HARDWARE SPECIFICATION 5- 7 PM On TBD. Power Management AMI BIOS LCD Close/Open Yes LCD Back-light Yes Suspend/Resume Yes Hibernation (S2D) Yes Thermal Control Yes DTS/Thermal diode ACPI Yes DMI 2.0 Yes Support DMI BIOS 2.1 Security Password Yes Password overridden by Master passwo rd Security Lock Kensington Lock Hole TPM Infineon TPM 1.2 Option S[...]

  • Seite 82

    HARDWARE SPECIFICATION 5- 8 LAN Port Yes[...]

  • Seite 83

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 9 2 CHIPSET LIST Chipset Summary Table Function S62F HW ACPI/PC99 CPU Intel Yonah Not required SRAM (L2 Cache) 2M Not required North Bridge Intel 945GM YES South Bridge Intel ICH7M YES MEMORY DDR II SDRAM Not required BIOS ROM SST 4Mb Not required VGA Intel interna[...]

  • Seite 84

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 10 2.1 CPU Processor Type: Intel Yonah Processor Processor frequency: 1.66 /1.83 /2.0/2.16 GHz Construction method: u-PGA479 wi th socket Supply voltage: Code:1.25V(High_Frequency_Mode )~0.725V(lowest _Freque ncy_Mode) Function feature: On-die , primary 32-KB instr[...]

  • Seite 85

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 11 2.2 CHIPSET 2.2.1 North Bridge Function: Full support 32bits AGTL+ host bus addressing Supports 400/533/667 DDR2 devi ce Integrates the graphic controller Support Intel Rapid Memory power management DMI x2/x4 Interface connect to ICH Vendor: Intel Parts Number :[...]

  • Seite 86

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 12 2.3.2 EXPANSION MEMORY Number of sockets: Bus: Supply voltage: Functional features: Hardware features: Two 200 pin SO-DIMM socket 64-bit data path 1.8V Supports up to 16 simultan eous open pages Supports DDR2 400/533/667 DDR devices Maximum of 2GB of syst em mem[...]

  • Seite 87

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 13 2.6 I/O INTERFACE Controller Function: Full ACPI 1.0 and PC98/99 compliant Support 10 IRQ channel options Integrated PC/AT Floppy Disk Controller Support 5.25”/3.5”/2.5” FDD Support 3-mode FDD Integrated Serial Port RS- 232C Controller Integrated Infrared [...]

  • Seite 88

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 14 2.7 PCMCIA Controller Function: PC99, ACPI 1.0 and PCI bus power management 1.1 Design co mpliant Integrated PC Card Controller Support 1995 PC Card (PCMCIA 2.2) Integrated Card Bus Cont roller PC98/99/2001 compliant Single Chip PCI-CardBus/1394 Bridge Compliant[...]

  • Seite 89

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 15 2.9 AUDIO CODEC Function features: Fully Compliant HD Audio Com pliant. 20-bit Stereo Digital to Analog Converters. 18-bit Stereo Analog to Digital Converters. High-quality pseudo-Differe ntial CD in put. Meets or exceeds the Microsoft PC99 Audio Performance req[...]

  • Seite 90

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 16 Vendor: Parts Number : Package: Realtek RTL8110SB 128-Pin LQFP 2.11.2 MODEM Function features: V.90 and K56 flex support Integrated PnP functionality PC99 compliant Support both APM and ACPI power management Support Wake-on-ring functionality Vendor: Parts Numbe[...]

  • Seite 91

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 17 3 KEY PARTS LIST Key Parts Summary: S62F Project Keyparts List Priority Vendor Model No. ASUS Part No. CPU 1 Intel INT CO667 DC 2.16G T2600 L8VN 1 Intel INT CO667 DC 2.0G T2500 L8VP Intel INT CO667 DC 1.83G T2400 L8VQ Intel INT CO667 DC 1.66G T2300 L8VR LCD 14.1[...]

  • Seite 92

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 18 MDC 1 ASUS MODEM 56K Azalia(Green) 61-BMM011-01 CMOS Camera Module 1 YA HSIN N03P1BG_SM9 04G370030100 CHICONY CM N5622 04G3700300 00 HDD 1 HGST HTS421260H9AT00 17G01 313 1708 1 HGST HTS421280H9AT00 17G013132708 1 HGST HTS421210H9AT00 17G01 313 4701 1 Fujitsu MHV[...]

  • Seite 93

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 19 1 Delta SADP65KB-BFJ REV:01 04G266003163 SO-DIMM 512MB DDR2 533 1 UNIFOSA GU33512AGHYQ612L3P C 04G001616673 1 NANYA NT512T64UH8A1FN-37B 04G001616619 1GB DDR2 533 1 NANYA NT1GT64U8HA0BN-37B 04G0 016 17633 512MB DDR2 667 Infineon M470T6554CZ3-CE 6 04G0 0161662F Na[...]

  • Seite 94

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 20 3.1 Display WXGA Technology: Active color (TFT: Thin Film Transistor) Size: 14.1”W Resolution: WXGA (1280 X 800) Dimension: Pixel Pitch: 0.279mm x 0.279mm Display Colors: 262,144 Vendor: AUO/CMO/Hansstar WXGA + Technology: Active color (TFT: Thin Film Transist[...]

  • Seite 95

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 21 Hardware features: Vendor/Model: Standard I/O addresses: 1F0h to 1F7h and 3F 6h Support of minimum IRQ 14 Support of at least 3 DMA channels, if DMA is supported Easily removable and ex changeable for u ser’s future upgrade HGST/ HTS421260H9AT00 , HTS421280H9A[...]

  • Seite 96

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 22 3.5 Touch Pad Dimensions: Sensor effective areas: Interface: X/Y position resolution: Customizing: 65 mm(W) x 49 mm(H) x 2.82 mm(T) 62.5 mm(W) x 46.5 mm(H) PS/2 40 points / mm (graphics mode) Custom color can be printed on the sensor pad. Functional features: Ac[...]

  • Seite 97

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 23 Chemistry: Voltage: Capacity: Vendor: Duration: Charge Metho d: Charging Source: Gas-gauge: Li-ion rechargeable b attery Nominal 11.1V (= 3.7V cell 3pcs in se rial , 2pcs in parallel) 2400mAH/Cell Celxpert Minimum 4 hour (w/o PMU) Fast Charge: 2.5A, 3.0 hou r (w[...]

  • Seite 98

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 24 Regulatory: EMI: Safety: FCC Class B CISPR 22 Class B .Dimension: (L) 114.5 x (W) 49.5 x (H) 29 mm[...]

  • Seite 99

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 25 4 SYSTEM 4.1 System diagram[...]

  • Seite 100

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 26 4.2 Main components block diagrams[...]

  • Seite 101

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 27 4.3 System resource 4.3.1 IRQ Map IRQ# Description IRQ 0 System Timer IRQ 1 Keyboard IRQ 2 [Cascade] IRQ 3 IrDA IRQ 4 USB Controller IRQ 5 VGA / USB Controller IRQ 6 Available IRQ 7 Parallel Port IRQ 8 System CMOS/RTC IRQ 9 ACPI IRQ Holder IRQ10 Available IRQ11 [...]

  • Seite 102

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 28 4.3.3 PCI INT Map INT Description INTA Giga LAN Chip INTB CARDBUS, 1394, INTC INTD 4.3.4 PCI Bus Master Map REQ Description REQ0 CARDBUS, 1 394 REQ1 REQ2 LAN REQ3 Non e REQ4 Non e 4.3.5 IDSEL IDSEL CHIPSET AD23 LAN AD17 CARDBUS,1394[...]

  • Seite 103

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 29 5 I/O PORT PIN ASSIGNMENT No FUNCTION DESCRIPTION .CRT Display (Analog) HDD ODD LCD KEYBOARD TOUCHPAD&LED 1 ST BATTERY .DC IN Adapter Input .AUDIO Headphone, Microphone-I n .FAN .INVERTER .MDC .1394 .USB Universal Serial Bus Port Bar 3 USB, CRT, Parallel Por[...]

  • Seite 104

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 30 3 BLUE Video (analog) Blue this DAC analog output drives the CRT interface. 4 MONITOR ID Bit 2 NC 5 GROUND Ground 6 RED Return (ground) Ground 7 GREEN Return (ground) Ground 8 BLUE Return (ground) Ground 9 KEY NC 10 SYNC Return (ground) Ground 11 MONITOR ID Bit [...]

  • Seite 105

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 31 5.2 Hard disk pin assignment Vendor Part No. Pin No. ALLTOP C17851-144A1-L 44 Pin (SMT) No. Signal Description Typ e 44 IDERST#_5S Reset primary disk O 43 GND Ground P 42 PDD7 Primary disk data 7 I/O 41 PDD8 Primary disk data 8 I/O 40 PDD6 Primary disk data 6 I/[...]

  • Seite 106

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 32 19 GND Ground P 18 PIORDY_3S Primary disk IO channel ready I 17 CSEL Cable select (device configuration) O 16 PDDACK#_3S Primary DMA acknowled ge O 15 GND Ground P 14 IRQ14_3S Primary disk interrupt I 13 HIOCS16# Indication to the host I 12 PDA1_3S Primary disk [...]

  • Seite 107

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 33 13. IDE_PDD4 14. IDE_PDD12 15. IDE_PDD3 16. IDE_PDD13 17. IDE_PDD2 18. IDE_PDD14 19. IDE_PDD1 20. IDE_PDD15 21. IDE_PDD0 22. IDE_PDDREQ 23. GND 24. IDE_PDI OR# 25. IDE_PDIOW# 26. GND 27. IDE_PIORDY 28. IDE_PDDACK# 29. INT_IRQ15# 30. IDE_PIOCS16# 31. IDE_PDA1 32.[...]

  • Seite 108

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 34 5.4 LCD pin assignment Vendor Part No. Pin No. ENTERY 3761-Q30C-01R 30 Pin (SMT) No. Signal Description Type 1 LVDS_U1N Data channel 1- of Channel A O 2 LVDS_L0N Data channel 0+ of Channel B O 3 LVDS_U1P Data chan nel 1+ of Channel A O 4 LVDS_L0P Data channel 0-[...]

  • Seite 109

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 35 26 EDID_CLK EDID Clock I 27 PID_0 Panel ID bit 0 I 28 EDID_DAT EDID DATA I 29 LCD_VCC +3V power supply P 30 LCD_VCC +3V power supply P[...]

  • Seite 110

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 36 5.5 Internal keyboard pin assignment Vendor Part No. Pin No. ENTERY 6905-E28N-00R 28 Pin (SMT) No Signal Description Typ e 1 KSI1 Keyboard matrix column 1 I 2 KSO7 Keyboard matrix row 7 O 3 KSI7 Keyboard matrix column 7 I 4 KSO0 Keyboard matrix row 0 O 5 KSI6 Ke[...]

  • Seite 111

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 37 26 KEYDETECT0 Keyboard ID bit 0 I 27 GND Ground GND 28 KEYDETECT1 Keyboard ID bit 1 I 5.6 Internal Touch Pad Pin assignment Vendor Part No. Pin No. ENTERY 6701-20 10 Pin (SMT) No Signal Description Typ e 1 +5VS Power P 2 +5VS Power P 3 TPAD_DAT PS/2 DATA I/O 4 T[...]

  • Seite 112

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 38 5.7 1 ST Battery pin assignment No Signal Description Type 1 BAT_CON Battery input/output voltage P 2 BAT_CON Battery input/output voltage P 3 BAT1_CNT1# NVDC control pin 1 I 4 BAT1_CNT2# NVDC control pin 2 I 5 SMCLK_BAT SMB Bus Clock I/O 6 SMDATA_BAT SMB Bus DA[...]

  • Seite 113

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 39 2 INTSPKR- Internal spea ker left sound negative O 3 INTSPKL+ Internal speaker signal channel positive O 4 INTSPKL- Internal speaker left sound negative O 5.9.2 Headphone Jack Vendor Part No. Pin No. SINGATRON 2SJ-A373-001 10 Pin (DIP) No Signal Description Type[...]

  • Seite 114

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 40 5.10 Fan Pin Assignment Vendor Part No. Pin No. ACES 85205-03701 3 Pin (SMT) No Signal Description Type 1 +5VS_FAN 5V Power Supply P 2 FANSP1 FAN speed signal inp ut I 3 GND Ground P 5.11 Inverter pin assignment Vendor Part No. Pin No. E&T 3753-20 20 Pin (SM[...]

  • Seite 115

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 41 17 GND Ground P 18 INTMIC_A _GND Audio Ground P 19 GND Ground P 20 INVMIC_A Internal MIC I *** 5.12 MDC signal Vendor Part No. Pin No. AMP 1-17939 7-2 12 Pin (SMT) No Signal Description Typ e 1 GND Ground NC 2 NC None NC 3 SDOUT DATA OUT I 4 NC None NC 5 GND Gro[...]

  • Seite 116

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 42 4 LTPA0+ Twisted-pair cabl e A positi ve I/O 5.14 USB pin assignment Vendor Part No. Pin No. SUYIN 020122MR008S523ZA 8 Pin (DIP) No Signal Description Type 1 +5V_USB01 USB 5V power P 2 USB_P0- USB port 0 negative signal I/O 3 USB_P0+ USB port 0 positive signal I[...]

  • Seite 117

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 43 ALLTOP C10089-112A4-Y 12 Pin (DIP) No Signal Description Type 1 None None NC 2 RJ11_RING Modem signal I/O 3 RJ11_TIP Modem signal I/O 4 None None NC 5 LAN_TXP Transmit data positive sig n al O 6 LAN_TXN Transmit data negative signal O 7 LAN_RXP Receive data posi[...]

  • Seite 118

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 44 12 MS_CD 13 MS_DATA3 14 SD_CMD 15 MS_SCLK 16 MS_VCC 17 SD_DAT3 18 GND 19 SD_DAT2 20 SD_WP 21 SD_CD 6 POWER MANAGEMENT 6.1 System power plane Power Group Power Control Pin Controlled Dev i ces +12V SUSC# Control +5V SUSC# PCMCIA Slot 5V, USB +3.3V SUSC# NB, DDR, [...]

  • Seite 119

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 45 6.2 Power management mode 6.2.1 Full-On mode All system devices are not power manag ed and the sy stem can respond to applications with maximum performance. 6.2.2 Doze mode The CPU clock is slo w do wn but all oth er devices are full on. 6.2.3 Stand by mode A su[...]

  • Seite 120

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 46 IRQ 1-15 Stand by Stand by Time out Stand by hot key pressed Predefined Memory/IO range access Battery Warning Battery Low Ring Indicator Keystroke Mouse movement Schedule Alarm STR Suspend Time out STR hot key pressed Suspend button Battery Low Power Button Rin[...]

  • Seite 121

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 47 6.3.1 Lid switch Display mode State Lid close Lid open Full on LCD OFF No action Stand by LCD OFF No action LCD STR/STD LCD OFF No action Full on No action No action Stand by No action No action CRT STR/STD No action No action Full on LCD OFF/CRT ON No action St[...]

  • Seite 122

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 48 Super I/O ON Power down Powe r Off Power Off Audio CODEC ON ON Power Off Power Off Audio Amplifier ON Power down Power Off Power Off LCD Backlight ON Power Off Power Off Power Off LAN ON Power down Power down Power down Modem ON Power down Power Off Power Off[...]

  • Seite 123

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 49 6.4.1 Device PM control duri ng Stand By mode Device Po wer Controlled by Description CPU Ha rdware Controlled by LDTSTP# PCMCIA Controller Software Enter PCI PM D3Hot state Super I/O Chip Working Keyboard Controller Working M3885 7 support power down command US[...]

  • Seite 124

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 50 6.4.2 Device PM control duri ng STR mode Device P owe r D own Contro lled by Description Super I/O Hardware Power Down HDD Hardware Power Off CD-ROM Hardwar e Power Off Internal Modem Software Power Off LAN Software Power Down USB FDD Hardware Power Down Audio C[...]

  • Seite 125

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 51 6.4.3 Device PM control duri ng STD mode Device P owe r D own Controlled by Description Core Logic Hardware Power off (except Resume Well) Super I/O Hardware Power off VGA Chip Hardware Power off HDD Hardware Power off CD-ROM Hardwar e Power off PCMCIA Controlle[...]

  • Seite 126

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 52 7 MODULE SPECIFICATION 7.1 Overall System The notebook system consists of the follo w ing PCB assembly and modules. 7.1.1 Board assembly Processor Upgradeable CPU (u-PGA 479) Main Board Main System board Inverter Board LCD Module Back-light TOUCH PAD 5 LED Indic[...]

  • Seite 127

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 53 7.3 Main board 7.3.1 Main system module spec Feature: CPU socket, Intel 945GM, Intel ICH7M, Clock generator, SDRAM & its expansion sockets, PC/AT compatible syst em (RTC, DMA, INT, Timer, … etc) IDE controller with PIO Mode 4 & Ultra-33/66/100, PCMCIA [...]

  • Seite 128

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 54 7.3.2 DC/DC module spec Controller: MAX1987, TPS5130, LTC37 28, TL494 Input voltage: 8-20V Output voltage/current: Voltage Current Ripple Regulation +5V/+5VS 4.5A 75mV +-3% +3.3V/+3.3VS 4.5A 75mV +-3% +12V/+12VS 150mA 200mV +-5% +3VALWAYS 50mA 75mV +-5% +1.5VALW[...]

  • Seite 129

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 55 Input: Adapter Contain Min Typ. Max Charge c urrent (3S3P) Charge c urrent (3S2P) Ripple & Noise 500mV Efficiency 90% 7.4 Inverter Board Inverter spec Input voltage: 12~20V Output current: 6.5mA(max) Start voltage: 1500Vrms(min) Efficiency: 80%(min) Brightne[...]

  • Seite 130

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 56 7.5 Adapter spec 7.5.1 Input Input voltage: 90~240VAC, Full range Input frequency: 47~63Hz Input current: 1.5A(max)/100VAC Inrush current: 60A(max)/100VAC, 120A(max)/2 40VAC Efficiency: 80%(min) 7.5.2 Output 65W power output Output Voltage/Current: 18.05~19.95V/[...]

  • Seite 131

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 57 7.7 LAN Spec Controller: REALTEK RTL8110SB Interface: PCI Compliant to PCI 2.2 Support ACPI , PCI power management Support for Wake-On-LA N duri ng S3,S4 Integrated IEEE 802.3x 10BASE-T and 100 BASE-TX and Giga LAN compatibl e PHY and transceiver in one chip Ful[...]

  • Seite 132

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 58 8 MISCELLANEOUS 8.1 Indicators Power LED Feature: Type: Color: Show System power status 5 ψ LED Green Indication: On: System in ON Mode Flash (0.3Hz): System in SUSPEND Mode Off: System in OFF Mode Location: On board Charging LED Feature: Type: Color: Show Batt[...]

  • Seite 133

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 59 Indication: On: RF on Off: No ststus Location: On board Hard Disk Driv e LED Feature: Type: Color: Location: On: While HDD Read/Write acc ess 5 ψ LED Green LED Board (in top of System) Caps LOCK LED Feature: Type: Color: Location: On: While CAP Lock activate 5 [...]

  • Seite 134

    S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 60 Europe P-CORD 1.8m 250V 2.5A EUR 2-PIN WS-027 -T Well shin Austria P-CORD 1.8m 250V 2.5A AUS 2-PIN WS-027-T Well shin South Asia P-CORD 1.8m 125V 7A WS016+WS027 WS-027-T Well shin 8.3 Safety/ EMI Appliance (TBD): Agency Approv al EMC CE Mark (Europe) BCIQ (Taiwa[...]

  • Seite 135

    BIOS SPECIFICA TION 6-1 Softw ar e Specifica tions Get to know more ab out theS62Fseries Notebook with a detailed look at the software specifications. he informatio n contained in the chapter c an be quite useful w hen you are troubles hooting the syste m’s hardware. Each item has its individu al usage for you to understand the so ftwar e side of[...]

  • Seite 136

    BIOS SPECIFICA TION 6-2 1. General Description The specification is a guid eline for BIOS development on S62F pl atform. Anyone who needs the informat ion of s ystem BIOS c an re ad it for r efer ence. The general device s pecification, SMBUS, PC I Devices IRQ Routing T able, GP IO pins definition and so on are subjected to be depicte d in this doc[...]

  • Seite 137

    BIOS SPECIFICA TION 6-3 2. Summary of Hardware Configuration 2.1 KEY COMPONENTS LIST The key components used on S62F are lis ted below . T able 2-1 Key components Item V endor Part’ s Name R evisio n CPU Intel Y onah 1.6G/1.8G/2.0G/2.16G North Bridge Intel Calitoga-945 GM South Bridge Intel ICH7-M VGA Intel Calitoga-945 GM Audio Intel High Defini[...]

  • Seite 138

    BIOS SPECIFICA TION 6-4 One IEEE 1394 B Type Jack One PCMCIA One Memory card reader(SD /MMC/MS) Power Supply AC adapter : Output : 19 VDC, 3.4 2A, 65W , Input : 100~240V AC, 50/60Hz universal Battery Pack : Main : Li-I on 6 cells, 1 4. 8V , 4800mAh, 65W battery pack Run-do wn life 5.5hrs Charging tim e, 2hrs Quick ch arge 90% (Pow er off) / 4hrs (P[...]

  • Seite 139

    BIOS SPECIFICA TION 6-5 USB1 Intel 0 29 1 8086h 27C9h 1043h 1297h USB2 Intel 0 29 2 8086h 27CAh 1043h 1297h USB3 Intel 0 29 3 8086h 27CBh 1043h 1297h U S B 2 . 0 Intel 0 29 7 8086h 27CCh 1043h 1297h PCI2PCI Br idge Intel 0 30 0 8086h 2448h 1043h 1297h LPC Bridge Intel 0 31 0 8086h 27B9h 1043h 1297h IDE Controller Intel 0 31 1 8086h 27DFh 1043h 1297[...]

  • Seite 140

    BIOS SPECIFICA TION 6-6 3. Summary of BI OS R equirements Item Description BIOS V endor AMI Revision 8.0 Implemented Specification PCI Express 1.0 , ACPI 1.0b/2.0, PCI BIOS 2. 0, PnP 1 .0a, SMBIOS (DMI ) 2.3.3, SMB us BIOS 1.0, PXE 2.0, Qui ck Boot , BIOS Bo ot Flag, En hanced BI OS Servic es for Di sk Drive, Bo otabl e CD-RO M F ormat, A T API Rem[...]

  • Seite 141

    BIOS SPECIFICA TION 6-7 4. BIOS Features 4.1 SYSTEM SECURITY The functions of all passwords are listed in following table. T able 4-1 Password Function Password Function User Supervisor Hard Disk Access all setup items V Access only part of se tup items V Enter system V Unlock a hard disk V Disable “lock” of a hard disk V Here are some other ru[...]

  • Seite 142

    BIOS SPECIFICA TION 6-8 The configuration index /data I/O ports are 2Eh/2Fh. And only Parall el Port function is enabled b y BIOS. The Parallel Port Mode can be adjusted in BIOS SETUP MENU during POST . T able 4.4 shows all modes supported by BIOS. T able 4. 4 Parallel Port Mode supported by BIOS Parallel Port Mode 1 SPP/Bi-Directional 2 EPP/SPP 3 [...]

  • Seite 143

    BIOS SPECIFICA TION 6-9 LA N Con tr oll er Dynamic D800~ D8FF IRQ16 FE8FEC00~ FE8FECF F Wirel ess (802.1 1abg) St a tic IRQ 17 FDFFF000~ FDFFFFFF Ricoh MS Dynamic IRQ19 FE8FF000~ FE8FF0F F Ricoh SD Dynamic IRQ19 FE8FF400~ FE8FF4F F Note: The resources of dynamic devic es will be changed if users c hange the settings. The IRQ 9 is reserv ed for SCI [...]

  • Seite 144

    BIOS SPECIFICA TION 6-10 Power Scheme AC P ow er DC Power Home/office Desk N one Adap tiv e Portable/Laptop Adaptive Adaptiv e Presentation Adaptive Degrade Al ways On Non e None Minimal Power Management Ad aptive Adaptive Max Battery Adaptive Degrade Three control methods that are im plemented to support Windows XP Native Processor Performance Con[...]

  • Seite 145

    BIOS SPECIFICA TION 6-1 1 THRM Throttle On Threshold 95 CPU THRM_ON THRM Throttle Off Threshold 90 CPU THRM_OFF Fan Failure T emp Point 65 CPU F ANERR Fan S top Threshold 50 CPU FSP STEP T rip Point 1 55 CPU TS1 STEP T rip Point 2 60 CPU TS2 STEP T rip Point 3 65 CPU TS3 STEP T rip Point 4 70 CPU TS4 STEP T rip Point 5 75 CPU TS5 STEP T rip Point 6[...]

  • Seite 146

    BIOS SPECIFICA TION 6-12 4.8 NUMERIC P AD CO NT RO L There is a control switch in setup menu item for enabli ng or disabling numeric pad lock of an internal keyboard. 4.9 T OUCH P AD CONTROL In ACPI environment, BIOS will notify A TK0100 to enable/disable T ouch Pad when the T ouch Pad Enable/Di sa ble in st ant ke y is presse d . 4.10 HOTKEY USAGE[...]

  • Seite 147

    BIOS SPECIFICA TION 6-13 5. GPIO Pin A s si gnment The following tables are the definition of GPIO pins . Some of GPIO pins need to be initialized by system BIOS and some of them need the driver to sup port. Please check the Description column for reference. T able 5-1. ICH7-M GPIO Definition GPIO Ty p e Name Usage Power Description 0 I GPIO00/BM_B[...]

  • Seite 148

    BIOS SPECIFICA TION 6-14 41 N/A GPIO41 N/A N/A N/A 42 N/A GPIO42 N/A N/A N/A 43 N/A GPIO43 N/A N/A N/A 44 N/A GPIO44 N/A N/A N/A 45 N/A GPIO45 N/A N/A N/A 46 N/A GPIO46 N/A N/A N/A 47 N/A GPIO47 N/A N/A N/A 48 O GPIO48/GNT4# GNT4# M Native Function 49 O CPUP WRGD H_PWRGD M Processor I/F power well 1. Power fi eld: M -> m ain power wi ll, R-> [...]

  • Seite 149

    BIOS SPECIFICA TION 6-15 T able 5-2. KBC GPIO Definition Port I/O Ty p e Input Pin Pull-up/down Name Output Pin Default V alue Description A.0 O BRIGHT_PWM Low Used to adjust LCD backlight A.1 NC A.2 O BA T 1_CNT 1# High BA T1 _CNT1# s ignal to b atter y A.3 NC A.4 O CHG_LED_UP# H igh When batter y is charging, charging LED will be turned on by thi[...]

  • Seite 150

    BIOS SPECIFICA TION 6-16 G. 0 A FA 1 6 T o FLASH I/F G. 1 A FA 1 7 T o FLASH I/F G. 2 A FA 1 8 T o FLASH I/F G. 3 NC G. 4 O THRM_CPU# Lo w THRM_CPU# signal from exter nal thermal sensor G. 5 NC G. 6 I PMTHERM# Low PMTHERM# signal to ICH7-M G. 7 NC H.0 O VSUS_ON Low VSUS_ON signal to power circuit H.1 I VSUS_GD# VSUS_GD# signal from power circuit H.[...]

  • Seite 151

    BIOS SPECIFICA TION 6-17 T able 5-3. Super I/O GPIO Definition PIN# GPI O I/O T ype Name Ac ti vat ed Level Description 23 40 I NC NC N/A 24 41 I NC NC N/A 25 42 I NC NC N/A 27 43 I NC NC N/A 28 44 I NC NC N/A 29 45 I NC NC N/A 30 46 I NC NC N/A 31 47 I NC NC N/A 32 10 I NC NC N/A 33 1 1 I N/A NC N/A 34 12 O SIOSMI# Low N/A 35 13 I NC NC N/A 36 14 [...]

  • Seite 152

    BIOS SPECIFICA TION 6-18 6. Devices 6.0 CPU The CPU supported by S62F s ystem is Intel mobile Y onah dual core process or . The supported frequency is from 1.66GHz to 2.16GHz. 6.1 NOR TH BRIDGE (C ALIST OGA) 6.1.1 DRB Registers (dram row boundary registers) The DRAM Row Boundary Register defines the upper b oundary address of each pair of DRAM rows[...]

  • Seite 153

    BIOS SPECIFICA TION 6-19 001 -> IRQ10 010 -> IRQ1 1 01 1 -> R eser ved 100 -> IRQ20(Only available if APIC enabled) 101 -> IRQ21(Only available if APIC enabled) 1 10 -> IRQ 22(Only available if APIC enabl ed) 1 1 1 -> IRQ23(Onl y available if APIC enabled) 6.2.2.2.2 PIRQ[A,C,D,E,F ,G ,H] Routing Control PIRQA Routing Control Re[...]

  • Seite 154

    BIOS SPECIFICA TION 6-20 6.2.3 IDE Controller 6.2.3.1 Function and Feature The ICH7-M IDE controller features two sets of interface signals(Primary and Secondary) that can be independently enabled, tri- stated or driven low . The ICH7-M IDE controller supports both legacy mode and native mode IDE interfac e. In native mode, the IDE c ontroller is a[...]

  • Seite 155

    BIOS SPECIFICA TION 6-21 same register , c ausing the USB 1.1 controller t o see a connect event and the EHC to see an ‘electrical’ disconnect event. The UHCI driver and hardware handle the connection and initializatio n process from that point on. The EHCI driver and hardware handle the perceiv ed disconnect. 4. Configure Flag = 1 a nd an USB [...]

  • Seite 156

    BIOS SPECIFICA TION 6-22 7. CMOS Setup Utility S 62F system BIOS allo ws users to change some s ystem hardware/function setti ngs during POST (power on self test) stage, users may hit F2 key to enter SETU P m ode in POST , the setup feature is categorized into 7 menus described as belo w: 7.1 M AIN M ENU 7.1.1 M ain menu: Main menu describes s yste[...]

  • Seite 157

    BIOS SPECIFICA TION 6-23 7.2 ADV ANCED MENU : In advanced menu, users can configure I/O device resourc e such as I/O base, interrupt vector or DMA(Direct Memory Acc ess) channel, some auxiliar y settings may be changed as well. Detailed I/O device setting s are describ ed below: Core Multi-Processing :[Enable] -> enable /disable dual core functi[...]

  • Seite 158

    BIOS SPECIFICA TION 6-24 7.2.1 IDE Configuration: 7.2.1.1 Primary Master/Slave IDE At system boot, the Intel Ultra A T A S torage Driv er configures each A T A/A T API device to trans fer data at particular transfer modes. These transfer modes are defined b y A T A standards, and are either Programmed I/O (PIO) or Direct Memory Ac cess (DMA or Ultr[...]

  • Seite 159

    BIOS SPECIFICA TION 6-25 7.2.2 SuperIO Configuration: Users can enable/disable Parallel por t function and set Parallel Port mode in this page. The Parallel Port modes supported by this system are listed below. 1. SPP/Bi-Directional 2. EPP/SPP 3. ECP 4. ECP/EPP[...]

  • Seite 160

    BIOS SPECIFICA TION 6-26 7.3 SECURITY MENU: BIOS supports two levels of password for security protection: Supervisor p assword : Users may set, change or e rase system password, the password data is saved in non-volatile device (CMOS), s ystem password check is done during POST(Power On Self T est). The BIOS will prompt a dialog message to ask user[...]

  • Seite 161

    BIOS SPECIFICA TION 6-27 7.4 POWER MENU: LCD Power Sa ving : LCD exhausts the most part of power while the system is operatin g. S1A notebook s ystem BIOS support auto backlight sav ing mode. When the system BIO S detects AC adapter removal, t he LCD brightness is tuned down to 80 ﹪ of its ori ginal setting, and back to normal when AC adapter is [...]

  • Seite 162

    BIOS SPECIFICA TION 6-28 7.5 BOOT MENU: In this menu users c an decide the boot sequence, as long as t he device with highest boot pri ority exists, system BIOS will boot from it, device boot priorit y is adjusted by pressing “+”,”-“ or space ke y on the selected (highlight ed) item. 3 bootable devices for S62F system are listed in this men[...]

  • Seite 163

    BIOS SPECIFICA TION 6-29 7.6 EXIT MENU: Exit BIOS setu p, users ma y make final decision if they want to sa ve the chan ge just ma de, or load BIOS defau lt setting, lists a re: Save changes and Exit Discard changes and Exit Discard changes Load optimal Default s Load manufacture Defaults[...]

  • Seite 164

    BIOS SPECIFICA TION 6-30 8. BIOS Flash Utility There are two utilities f or updating S62F BIOS. One is DO S mode utility and the other is Windo ws mode utility . The detailed information is in T able 8-1. T able 8-1: BIOS Flash Utilities Utility Name Supported O S Revision Aflash2 DOS 2.10 and later Winf lash Wi ndo ws 2. 18 an d lat er[...]

  • Seite 165

    BIOS SPECIFICA TION 6-31 9. Embedded Controller (EC) 9.1 HOTKEYS S62F support ed Fn+Hotkeys are listed i n following table. T able 9-1 Fn+ Hotkey T able Fn+ Hotkey L egacy AC PI Descri ption Fn+F1 N/A SC I St andby In ACPI OS, user need s to set sleep but ton behavior t o “S tandby” in pro pe rty o f Power Option. Fn+F2 N/A SCI Wirel ess con s [...]

  • Seite 166

    BIOS SPECIFICA TION 6-32 When press ing Internet instant key , BIOS will notify A TK to la unch Internet browser applicatio n. 9.3.3 Email Key When pr essing Email instant key , BIOS will noti fy A TK to launc h email application. 9.3.5 T ouch Pad Enab le/D isable Key When pressing T ouch Pad Enabl e/Disable instant key , BIOS will notify A TK to e[...]